CN215769633U

CN215769633U - Novel computer radiator

Info

Publication number: CN215769633U
Application number: CN202121278564.3U
Authority: CN
Inventors: 林義銘
Original assignee: Guangzhou Zero Degree Heat Dissipation Technology Co ltd
Current assignee: Guangzhou Zero Degree Heat Dissipation Technology Co ltd
Priority date: 2021-06-09
Filing date: 2021-06-09
Publication date: 2022-02-08
Anticipated expiration: 2031-06-09

Abstract

The utility model discloses a novel computer radiator, which comprises a bottom plate, wherein an installation frame is arranged on the outer wall of one side of the bottom plate, a fixed plate is arranged inside the installation frame, a heat conducting sheet is arranged on the outer wall of one side of the fixed plate, sintered heat pipes are arranged on one side of the heat conducting sheet, which is far away from the fixed plate, adjacent sintered heat pipes are parallel to each other, heat radiating fins are fixedly arranged on the outer walls of the sintered heat pipes, the heat conducting sheet is vertical to the fixed plate, a cover plate is fixedly connected to one end, which is far away from the heat conducting sheet, of the sintered heat pipes, a mounting groove is formed in one side wall, which is far away from the installation frame, of the bottom plate, a capillary structure is arranged on the inner wall of each sintered heat pipe, heat can be transferred from all side surfaces of the heat conducting sheet, the contact area with air is increased, so that the heat conduction efficiency is improved, the evaporation efficiency of a refrigerant in each sintered heat pipe is greatly improved, and the capillary structures are arranged on the inner walls of the sintered heat pipes, the liquefying reflux speed of the refrigerant is improved, thereby being beneficial to improving the heat conduction efficiency.

Description

Novel computer radiator

Technical Field

The utility model relates to the technical field of computer heat dissipation, in particular to a novel computer heat sink.

Background

The computer components are largely integrated circuits, as is known, high temperature is a big enemy of integrated circuits, the high temperature can not only cause unstable operation of a system and shorten the service life, but also can even cause burning of some components, so that high-temperature heat is not from the outside of the computer, but from the inside of the computer or the inside of the integrated circuits, the heat radiator has the function of absorbing the heat and then radiating the heat to the inside or the outside of a case, the temperature of the computer components is ensured to be normal, most of the heat radiators are in surface contact with the heating components to absorb the heat, the heat is transmitted to a remote place, such as air in the case, and then the case transmits the hot air to the outside of the case to finish the heat radiation of the computer.

The searched Chinese patent No. CN205103750U discloses a computer radiator based on a heat pipe principle, which comprises a plurality of radiating pipes arranged side by side, wherein one ends of the radiating pipes are inclined downwards, a refrigerant is sealed in the radiating pipes, the lower ends of the radiating pipes are connected with a heat source of a computer, and gaps are reserved between the radiating pipes.

In the use process of the existing computer radiator, due to the limitation of the heat conduction area, the slow backflow speed of the refrigerant and the poor heat dissipation effect, the utility model provides a novel computer radiator.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a novel computer heat sink, so as to solve the problem of poor heat dissipation effect in the background art.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a novel computer radiator, includes the bottom plate, be equipped with the installing frame on one side outer wall of bottom plate, the inside of installing frame is provided with the fixed plate, be equipped with the conducting strip on one side outer wall of fixed plate, the conducting strip is kept away from one side of fixed plate is provided with the sintered heat pipe, and is adjacent be parallel to each other between the sintered heat pipe, fixed mounting has radiating fin on the outer wall of sintered heat pipe.

Preferably, the heat-conducting fins are perpendicular to the fixing plate, and the adjacent heat-conducting fins are parallel to each other.

Preferably, one end of the sintered heat pipe, which is far away from the heat conducting fin, is fixedly connected with a cover plate.

Preferably, a mounting groove is formed in one side wall, far away from the mounting frame, of the bottom plate.

Preferably, a capillary structure is arranged on the inner wall of the sintered heat pipe.

Preferably, the inner wall of the mounting frame is provided with heat-conducting glue.

The utility model has the technical effects and advantages that:

1. through the fixed plate and the heat-conducting fin that set up, all sides of heat-conducting fin all can transmit the heat, have increased the area of contact with the air to improve heat-conduction efficiency, and then improved the evaporation efficiency of the intraductal refrigerant of sintered heat greatly, the effectual radiating efficiency that has improved.

2. The capillary structure arranged on the inner wall of the sintered heat pipe improves the liquefying reflux speed of the refrigerant, thereby being beneficial to improving the heat conduction efficiency and ensuring that the heat dissipation speed is higher.

Drawings

Fig. 1 is an exploded view of the overall structure of the present invention.

Fig. 2 is a combination view of the overall structure of the present invention.

FIG. 3 is an enlarged view of the structure of the present invention at A.

In the figure: 1. a base plate; 2. installing a frame; 3. a fixing plate; 4. a heat conductive sheet; 5. a sintered heat pipe; 6. a heat dissipating fin; 7. a cover plate; 8. and (4) mounting the groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The utility model provides a novel computer radiator as shown in figures 1-3, which comprises a bottom plate 1, when in use, the bottom plate 1 is arranged at a designated position on a computer through a screw, an installation frame 2 is arranged on the outer wall of one side of the bottom plate 1, a fixing plate 3 is arranged inside the installation frame 2, a heat conducting sheet 4 is arranged on the outer wall of one side of the fixing plate 3, the heat conducting sheets 4 are perpendicular to the fixing plate 3, the adjacent heat conducting sheets 4 are parallel to each other, heat generated by the computer in the use process is transferred to the heat conducting sheets 4 through the fixing plate 3, all side surfaces of the heat conducting sheets 4 can transfer heat, so that the contact area with air is increased, the heat transfer speed is higher, a sintered heat pipe 5 is arranged on one side of the heat conducting sheet 4 far away from the fixing plate 3, the adjacent sintered heat pipes 5 are parallel to each other, heat is transferred through the sintered heat pipe 5, and a radiating fin 6 is fixedly arranged on the outer wall of the sintered heat pipe 5, to increase the rate of heat dissipation.

In this embodiment, heat is transferred to the sintered heat pipe 5 so that the refrigerant at the lower portion of the sintered heat pipe evaporates and flows to the upper portion, and the heat is dissipated by the heat dissipation fins 6 during the evaporation and flow of the refrigerant, and then the refrigerant is liquefied and flows back to the lower portion of the sintered heat pipe 5 for recycling, thereby completing the heat dissipation of the computer.

In this embodiment, pure water is used in the sintered heat pipe 5, and since the specific heat capacity of pure water is high, a good heat dissipation effect can be achieved.

In this embodiment, a cover plate 7 is fixedly connected to one end of the sintered heat pipe 5 away from the heat conducting fin 4, and the cover plate 7 and the heat radiating fins 6 have the same shape, so that the sintered heat pipe 5 can be protected to a certain extent, and the aesthetic property of the whole device is improved.

In this embodiment, a mounting groove 8 is formed in a side wall of the bottom plate 1 far away from the mounting frame 2, so that the device can be conveniently clamped.

In this embodiment, the capillary structure is disposed on the inner wall of the sintered heat pipe 5, so that the liquefied reflux speed of the refrigerant can be increased for recycling, and the heat dissipation efficiency is effectively improved.

In this embodiment, be provided with the heat conduction glue on the inner wall of installing frame 2, be favorable to improving heat transfer efficiency like this, can play sealing connection's effect simultaneously, prevent that the dust from getting into.

This practical theory of operation: the utility model relates to a novel computer radiator, which is characterized in that when in use, the novel computer radiator is firstly installed at a designated position on a computer through a bottom plate 1 and screws, heat generated by the computer in the use process is transmitted to a heat conducting fin 4 through a fixing plate 3, all side surfaces of the heat conducting fin 4 can transmit heat, the contact area with air is increased, and the heat conduction efficiency is improved, so that the heat can be rapidly transmitted to a sintered heat pipe 5, a refrigerant at the lower part of the sintered heat pipe 5 evaporates and flows to the upper part, the heat is radiated out through a radiating fin 6 in the flowing process of the refrigerant and then is liquefied and reflows to the lower part of the sintered heat pipe 5, and a capillary structure on the inner wall of the sintered heat pipe 5 can accelerate the liquefying and reflowing speed of the refrigerant to be recycled, thereby effectively improving the heat radiation efficiency.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the utility model.

Claims

1. A novel computer radiator comprises a bottom plate (1), and is characterized in that: the heat pipe is characterized in that an installation frame (2) is arranged on the outer wall of one side of the base plate (1), a fixing plate (3) is arranged inside the installation frame (2), heat conducting fins (4) are arranged on the outer wall of one side of the fixing plate (3), one side, far away from the fixing plate (3), of each heat conducting fin (4) is provided with a sintered heat pipe (5), the adjacent sintered heat pipes (5) are parallel to each other, and heat radiating fins (6) are fixedly installed on the outer wall of each sintered heat pipe (5).

2. The novel computer radiator of claim 1, wherein: the heat-conducting fins (4) are perpendicular to the fixing plate (3), and the adjacent heat-conducting fins (4) are parallel to each other.

3. The novel computer radiator of claim 1, wherein: and one end of the sintered heat pipe (5) far away from the heat conducting fin (4) is fixedly connected with a cover plate (7).

4. The novel computer radiator of claim 1, wherein: and a mounting groove (8) is formed in one side wall of the bottom plate (1) far away from the mounting frame (2).

5. The novel computer radiator of claim 1, wherein: and a capillary structure is arranged on the inner wall of the sintered heat pipe (5).

6. The novel computer radiator of claim 1, wherein: and heat-conducting glue is arranged on the inner wall of the mounting frame (2).