CN221487072U - Laser packaging heat management structure - Google Patents
Laser packaging heat management structure Download PDFInfo
- Publication number
- CN221487072U CN221487072U CN202420144274.7U CN202420144274U CN221487072U CN 221487072 U CN221487072 U CN 221487072U CN 202420144274 U CN202420144274 U CN 202420144274U CN 221487072 U CN221487072 U CN 221487072U
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- heat
- heat dissipation
- laser
- management structure
- plate
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 11
- 230000017525 heat dissipation Effects 0.000 claims abstract description 58
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 42
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 23
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 230000001681 protective effect Effects 0.000 claims description 16
- 238000001816 cooling Methods 0.000 claims description 14
- 239000004411 aluminium Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 210000005239 tubule Anatomy 0.000 claims description 7
- 238000011084 recovery Methods 0.000 claims description 3
- AZFKQCNGMSSWDS-UHFFFAOYSA-N MCPA-thioethyl Chemical compound CCSC(=O)COC1=CC=C(Cl)C=C1C AZFKQCNGMSSWDS-UHFFFAOYSA-N 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims description 2
- 230000007306 turnover Effects 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 abstract description 21
- 230000005855 radiation Effects 0.000 abstract description 19
- 230000000694 effects Effects 0.000 abstract description 5
- 238000005452 bending Methods 0.000 description 5
- 230000004907 flux Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a laser packaging heat management structure which comprises a heat radiation protection cover plate, a storage water tank, a miniature water pump and an S-shaped heat radiation pipe, wherein the bottom end of the heat radiation protection cover plate is provided with a heat conduction plate, the S-shaped heat radiation pipe is arranged at the bottom end of the heat conduction plate, the miniature water pump is embedded at one side of the top end of the storage water tank, the output end of the miniature water pump is provided with a plug water pipe, one end of the plug water pipe is communicated with the water inlet end of the S-shaped heat radiation pipe, and one side of the heat radiation protection cover plate is provided with an aluminum heat radiation side plate. According to the utility model, the water storage tank, the miniature water pump, the plug water pipe, the heat conduction plate and the S-shaped radiating pipe are arranged, so that the heat generated by the semiconductor laser can be quickly absorbed and dissipated into the air by utilizing the advantage of larger specific heat capacity of water, and the good conduction and heat exchange effects are achieved by the arranged aluminum radiating side plates, the bent radiating fins and the aluminum radiating side plates, so that the side surfaces of the semiconductor laser can be radiated, and the heat dissipation is accelerated.
Description
Technical Field
The utility model belongs to the technical field of semiconductor lasers, and relates to a laser packaging heat management structure.
Background
The current cooling methods of semiconductor lasers can be broadly divided into three categories, namely radiation heat exchange, conduction heat exchange and convection heat exchange. The radiation heat exchange is mainly aimed at the application of low heat flux density; the conduction heat exchange is mainly realized by means of heat sinks, thermoelectric coolers (TECs) and the like, and the heat flux density is slightly higher than the radiation heat exchange; the heat convection mainly uses fluids such as gas and liquid, such as medium heat flux density heat dissipation technology represented by forced convection air of a fan, namely air cooling, and high heat flux density heat dissipation technology represented by channel water cooling.
The patent number CN202120871826.0 discloses a heat dissipation device of a semiconductor laser, which comprises a heat dissipation box, wherein a placing groove is formed in one side of the heat dissipation box, the semiconductor laser is placed on the inner wall of the placing groove, a fixing component for fixing the semiconductor laser is arranged in the placing groove, a heat dissipation component for enabling the semiconductor laser to dissipate heat is arranged in the heat dissipation box, and mounting boxes are fixedly connected to two symmetrical sides of the heat dissipation box; the utility model has simple structure and convenient use, can fix the semiconductor laser through the spring, thereby ensuring the stability and the safety of the semiconductor laser, and can radiate the semiconductor laser in multiple directions through the water pump, the fan and the fan, thereby ensuring that the semiconductor laser cannot be damaged due to overhigh temperature, and a large amount of dust can be isolated through the filter plate, thereby ensuring the cleanness in the fan.
The heat sink disclosed above has the disadvantages: the cooling efficiency cannot be improved, so that the semiconductor laser cannot rapidly dissipate heat, and the heat dissipation mechanism cannot provide good protection, therefore, a laser packaging heat management structure is designed.
Disclosure of Invention
The present utility model is directed to a thermal management structure for laser package, which solves the above-mentioned problems in the prior art.
The aim of the utility model can be achieved by the following technical scheme: the utility model provides a laser instrument encapsulation heat management structure, includes heat dissipation protection apron, stores water tank, miniature pump and S type cooling tube, the heat conduction board is installed to heat dissipation protection apron 'S bottom, S type cooling tube sets up in the bottom of heat conduction board, miniature pump inlays and establishes in the one side that stores up water tank top and miniature pump' S output installs the plug water pipe, the one end of plug water pipe and the inlet end intercommunication of S type cooling tube, one side of heat dissipation protection apron is provided with aluminium system heat dissipation curb plate, the zero one side that stores up water tank top is provided with the filling hole stopper, the inside of aluminium system heat dissipation curb plate is provided with a plurality of heat dissipation wing strips of buckling, a plurality of heat exchange hole sites have been seted up to the opposite side of aluminium system heat dissipation curb plate.
In the above-mentioned laser packaging thermal management structure, the opposite side of heat dissipation protection apron is provided with the upset connecting axle, the bottom of upset connecting axle is provided with laser instrument joint curb plate.
In the above-mentioned laser package thermal management structure, a first limit clamping column is disposed on an edge of a top end of the heat dissipation protective cover plate.
In the above-mentioned laser package thermal management structure, a second limiting clamping column is disposed on another side of the top end of the heat dissipation protective cover plate, and a screw adjusting head connected with the heat dissipation protective cover plate is disposed at one end of the second limiting clamping column.
In the above-mentioned laser packaging heat management structure, the water outlet end of the S-shaped radiating tube is provided with a backflow tubule, and one end of the backflow tubule extends to the recovery area of the storage water tank.
In the above-mentioned laser package thermal management structure, a plurality of high thermal conductivity metal columns are embedded and installed on one side of the aluminum heat dissipation side plate, and the high thermal conductivity metal columns are not in contact with the bending heat dissipation fins.
Compared with the prior art, the laser packaging heat management structure has the advantages that: through setting up storage water tank, miniature water pump, plug water pipe, heat conduction board and S type cooling tube, utilize the great advantage of water specific heat capacity, can be quick with the heat absorption of semiconductor laser production and give off in the air to through aluminium system heat dissipation curb plate, the heat dissipation fin that buckles and aluminium system heat dissipation curb plate that set up, play good conduction heat transfer effect, can dispel the heat to semiconductor laser' S side for thermal giving off, through setting up heat dissipation protective cover board, aluminium system heat dissipation curb plate, can play good protective effect.
Drawings
Fig. 1 is a schematic perspective view of a thermal management structure of a laser package according to the present utility model.
Fig. 2 is a schematic structural diagram of an S-shaped heat dissipation tube of a laser package thermal management structure according to the present utility model.
Fig. 3 is a schematic structural diagram of an aluminum heat-dissipating side plate of a laser package thermal management structure according to the present utility model.
In the figure, 1, a heat dissipation protective cover plate; 2. turning over the connecting shaft; 3. the laser is clamped with the side plate; 4. aluminum heat dissipation side plates; 5. a high thermal conductivity metal column; 6. a storage water tank; 7. a micro water pump; 8. a plug water pipe; 9. filling a hole plug; 10. the first limiting clamping column; 11. the second limiting clamping column; 12. a screw adjusting head; 13. a heat conduction plate; 14. s-shaped radiating pipes; 15. reflux tubule; 16. heat exchange hole sites; 17. and bending the heat dissipation fin strip.
Detailed Description
The following are specific embodiments of the present utility model and the technical solutions of the present utility model will be further described with reference to the accompanying drawings, but the present utility model is not limited to these embodiments.
As shown in fig. 1, 2 and 3, a laser package thermal management structure of the present utility model;
Embodiment one: including heat dissipation protection apron 1, store up water tank 6, miniature pump 7 and S type cooling tube 14, heat conduction board 13 is installed to the bottom of heat dissipation protection apron 1, S type cooling tube 14 sets up the bottom at heat conduction board 13, miniature pump 7 inlays and establishes in the output of storing up water tank 6 top one side and miniature pump 7 installs plug water pipe 8, plug water pipe 8 'S one end and S type cooling tube 14' S inlet end intercommunication, one side of heat dissipation protection apron 1 is provided with aluminium system heat dissipation curb plate 4, store up the zero side on water tank 6 top and be provided with filling hole stopper 9, the inside of aluminium system heat dissipation curb plate 4 is provided with a plurality of heat dissipation wing strips 17 of buckling, a plurality of heat exchange hole sites 16 have been seted up to the opposite side of aluminium system heat dissipation curb plate 4.
In this embodiment, in order to better connect the heat dissipation protective cover plate 1, improve heat dissipation protective cover plate 1 and laser instrument firm in connection, the opposite side of heat dissipation protective cover plate 1 is provided with upset connecting axle 2, and the bottom of upset connecting axle 2 is provided with laser instrument joint curb plate 3.
In this embodiment, in order to further improve the effect of limiting the laser, the stability of installation is ensured, and the side of the top end of the heat dissipation protection cover plate 1 is provided with a first limiting clamping column 10. The other side on the top end of the heat radiation protection cover plate 1 is provided with a second limiting clamping column 11, and one end of the second limiting clamping column 11 is provided with a screw adjusting head 12 connected with the heat radiation protection cover plate 1.
In this embodiment, in order to facilitate the water flow of the S-shaped radiating pipe 14 to flow back to the storage tank 6, a return tubule 15 is installed at the water outlet end of the S-shaped radiating pipe 14, and one end of the return tubule 15 extends to the recovery region of the storage tank 6.
In this embodiment, in order to ensure good heat conduction efficiency, a plurality of high thermal conductivity metal posts 5 are embedded and mounted on one side of the aluminum heat dissipation side plate 4, and the high thermal conductivity metal posts 5 are not in contact with the bent heat dissipation fins 17.
Working principle: the heat radiation protection cover plate 1 is connected with the top of the semiconductor laser, the laser clamping side plate 3 is contacted with one side of the semiconductor laser, the other side of the semiconductor laser is contacted with the aluminum heat radiation side plate 4, the connection stability with the semiconductor laser is further increased through the first limit clamping column 10 and the second limit clamping column 11, the heat radiation protection cover plate can quickly absorb and radiate the heat generated by the semiconductor laser into the air by utilizing the advantage of larger specific heat capacity of water, and plays a good conduction heat exchange effect through the aluminum heat radiation side plate 4, the bending heat radiation fin 17 and the aluminum heat radiation side plate 4, the side face of the semiconductor laser can radiate heat, and the heat radiation is accelerated,
In the utility model, the bent radiating fin 17 is arranged in a three-section bending way, the bending angle is 155 degrees, the whole radiating contact area is increased, and the radiating effect is accelerated.
What is not described in detail in this specification is prior art known to those skilled in the art. The specific embodiments described herein are offered by way of example only to illustrate the spirit of the utility model. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the utility model or exceeding the scope of the utility model as defined in the accompanying claims.
Claims (6)
1. The utility model provides a laser instrument encapsulation heat management structure, includes heat dissipation protective cover board (1), stores water tank (6), miniature pump (7) and S type cooling tube (14), its characterized in that, heat conduction board (13) are installed to the bottom of heat dissipation protective cover board (1), S type cooling tube (14) set up in the bottom of heat conduction board (13), miniature pump (7) inlay and establish one side at storing water tank (6) top and the output of miniature pump (7) install plug water pipe (8), the one end of plug water pipe (8) communicates with the inlet end of S type cooling tube (14), one side of heat dissipation protective cover board (1) is provided with aluminium system heat dissipation curb plate (4), the zero one side at storing water tank (6) top is provided with filling hole stopper (9), the inside of aluminium system heat dissipation curb plate (4) is provided with a plurality of heat dissipation wing strips (17) of buckling, a plurality of heat exchange hole sites (16) have been seted up to the opposite side of aluminium system heat dissipation curb plate (4).
2. The laser packaging heat management structure according to claim 1, wherein a turnover connecting shaft (2) is arranged on the other side of the heat dissipation protective cover plate (1), and a laser clamping side plate (3) is arranged at the bottom end of the turnover connecting shaft (2).
3. The laser packaging heat management structure according to claim 1, wherein a first limit clamping column (10) is arranged on the side of the top end of the heat dissipation protective cover plate (1).
4. The laser packaging heat management structure according to claim 1, wherein a second limiting clamping column (11) is arranged on the other side of the top end of the heat dissipation protective cover plate (1), and a screw adjusting head (12) connected with the heat dissipation protective cover plate (1) is arranged at one end of the second limiting clamping column (11).
5. A laser package thermal management structure according to claim 1, wherein the water outlet end of the S-shaped radiating pipe (14) is provided with a return tubule (15), and one end of the return tubule (15) extends to the recovery region of the storage tank (6).
6. A laser package thermal management structure according to claim 1, wherein a plurality of high thermal conductivity metal posts (5) are embedded and mounted on one side of the aluminum heat dissipation side plate (4), and the high thermal conductivity metal posts (5) are not in contact with the bent heat dissipation fins (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420144274.7U CN221487072U (en) | 2024-01-19 | 2024-01-19 | Laser packaging heat management structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420144274.7U CN221487072U (en) | 2024-01-19 | 2024-01-19 | Laser packaging heat management structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221487072U true CN221487072U (en) | 2024-08-06 |
Family
ID=92368606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420144274.7U Active CN221487072U (en) | 2024-01-19 | 2024-01-19 | Laser packaging heat management structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221487072U (en) |
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2024
- 2024-01-19 CN CN202420144274.7U patent/CN221487072U/en active Active
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