TW202238063A - Heat dissipation module - Google Patents

Abstract

A heat dissipation module is used to solve the problem of poor heat dissipation efficiency of the conventional vapor chamber. The heat dissipation module includes a shell, a working liquid and a heat cooling set. The shell surrounds an accommodating space, and the accommodating space has an opening at two ends in a ventilation direction. The shell has a circulation chamber surrounding the accommodating space, and the circulation chamber is divided into an upper cavity and a lower cavity. The working liquid is filled in the lower cavity. The heat cooling set is located in the accommodating space.

Description

Cooling module

The invention relates to a cooling module, in particular to a cooling module used in electronic devices.

In order to avoid local overheating of the electronic device, the heat dissipation method of the current electronic device is mainly to install a vapor chamber inside the electronic device, and the vapor chamber can be attached to a heating area of the electronic device. The temperature plate can have an upper plate body and a lower plate body, and the upper plate body and the lower plate body are combined to form a cavity, which can be used to fill a working liquid; thereby, the heat generated by the heating area It can be diffused to the uniform temperature plate to effectively prevent heat energy from gathering in the heating area and achieve the effect of heat dissipation.

In the above known vapor chamber, even if the heating area can heat the working liquid and vaporize the working liquid, the gaseous working liquid evaporates to the side far away from the heating area and then condenses, taking away the heat from the heating area However, since the vapor chamber only dissipates heat through the gas-liquid phase change of the working liquid, the heat dissipation effect of the vapor chamber on the heating area is limited, resulting in poor heat dissipation efficiency.

In view of this, it is necessary to improve the conventional temperature chambers.

In order to solve the above problems, the object of the present invention is to provide a heat dissipation module with good heat dissipation performance.

Another object of the present invention is to provide a heat dissipation module that is easy to assemble.

Another object of the present invention is to provide a cooling module which is easy to use.

Another object of the present invention is to provide a heat dissipation module which can reduce the manufacturing cost.

Directionality or similar terms used throughout the present invention, such as "front", "rear", "left", "right", "upper (top)", "lower (bottom)", "inner", "outer" , "side", etc., mainly refer to the directions of the attached drawings, and each direction or its approximate terms are only used to assist in explaining and understanding the various embodiments of the present invention, and are not intended to limit the present invention.

The elements and components described throughout the present invention use the quantifier "a" or "an" only for convenience and to provide the usual meaning of the scope of the present invention; in the present invention, it should be interpreted as including one or at least one, and singular The notion of also includes the plural unless it is obvious that it means otherwise.

Approximate terms such as "combination", "combination" or "assembly" mentioned throughout the present invention mainly include forms that can be separated without destroying the components after connection, or that the components cannot be separated after connection, etc., which are common knowledge in the art. One can be selected according to the material of the components to be connected or assembly requirements.

The heat dissipation module of the present invention comprises: a casing surrounding and forming an accommodating space, and two ends of the accommodating space in a ventilation direction respectively have an opening, and the casing has a circulation chamber surrounding the accommodating space Placed outside the space, the circulation chamber is divided into an upper chamber and a lower chamber; a working liquid is filled in the lower chamber; and a cooling fin group is located in the accommodating space.

Accordingly, the cooling module of the present invention utilizes the circulation chamber to surround the accommodating space, and the working liquid is filled in the lower cavity; when the cooling module is in operation, the working fluid in the lower cavity can The liquid absorbs the heat energy of the heat source, and the working liquid in the lower chamber can absorb heat energy from the liquid state and evaporate into a gaseous state, and the working liquid in the gaseous state can enter the upper chamber upwards or upwards. The working liquid in the upper cavity can quickly condense from a gaseous state to a liquid state and then return to the lower cavity, so that the working liquid can fully absorb the heat energy of the heat source, and through the arrangement of the cooling fin group, the circulation The thermal energy in the chamber can have a larger contact area with the heat dissipation fin group, which has the effect of improving good heat dissipation performance.

Wherein, the casing may have an outer shell surrounding at least one inner shell, and the circulation chamber may be located between the outer shell and the inner shell. In this way, the structure is simple and easy to manufacture, and has the effect of reducing manufacturing cost.

Wherein, the inner shell part may have a liquid-guiding surface adjacent to the upper chamber part, and the liquid-guiding surface may be inclined and form an included angle with a horizontal plane. In this way, when the working fluid in the upper cavity is condensed from a gaseous state to a liquid state, the working fluid can easily flow from the high place to the two lower sides so as to return to the lower cavity, which has the effect of smooth flow conduction.

Wherein, the number of the inner shell parts may be several, and the several inner shell parts are arranged at intervals up and down. In this way, the structure is simple and easy to manufacture, and has the effect of reducing manufacturing cost.

Wherein, a middle chamber part of the circulation chamber may be formed between two adjacent inner shell parts, and the middle chamber part may be located between the upper chamber part and the lower chamber part. In this way, when the working liquid in the lower cavity is converted into a gaseous state and goes upwards, part of it can condense back to a liquid state in the middle cavity and return down to the lower cavity, while the rest can continue to be located in the middle cavity Until enough energy is accumulated, it vaporizes into the upper chamber, condenses from gaseous state to liquid state and then returns to the lower chamber, so that the working liquid can fully absorb the heat energy of the heat source, which has a good heat dissipation effect.

Wherein, the casing can be surrounded by a single flat tube to form a C shape, and the two ends of the flat tube can be connected by a connecting piece, or the two ends of the flat tube can be welded together. In this way, the structure is simple and easy to assemble, which has the effect of convenient assembly.

Wherein, the casing can be surrounded by several flat tubes to form a ring, and the two adjacent ends of the several flat tubes can be connected by a connecting piece, or the two adjacent ends of the flat tubes can be welded together . In this way, the structure is simple and easy to assemble, which has the effect of convenient assembly.

Wherein, the shell can have a heat absorbing area opposite to the lower cavity, and the heat absorbing area can be combined with an assembly plate, and the assembly plate can be used for thermally connecting a heat source. In this way, the structure is simple and easy to manufacture, and has the effect of reducing manufacturing cost.

Wherein, the assembly plate may have a groove, and a shell part of the shell may have a through hole, and the through hole may communicate with the groove and the lower cavity. In this way, the working liquid can be filled in the space from the groove to the lower cavity, so that more working liquid can be filled, and the heat energy of the heat source can be quickly absorbed, which has a better heat dissipation effect.

Wherein, the assembling board can have an upper board combined with a lower board, the upper board can have a perforation, the perforation and the lower board can jointly form the groove, and the lower board can be used for thermally connecting a heat source. In this way, the structure is simple and easy to assemble, which has the effect of convenient assembly.

Wherein, the lower plate can be made of metal material with high thermal conductivity such as copper or aluminum. In this way, it has better heat conduction effect.

Wherein, the assembly plate may have a groove, several shells are arranged side by side on the assembly plate, and the heat absorption area of each shell may be located in the groove of the assembly plate. In this way, the structure is simple and easy to assemble, which has the effect of convenient assembly.

Wherein, the assembling board may have several assembling holes, and the assembling board is locked and combined at a predetermined position through the several assembling holes. In this way, the assembly board can be easily thermally connected with the heat source, which has the effect of convenience in use.

The heat dissipation module of the present invention may further include an auxiliary heat dissipation element, and the auxiliary heat dissipation element may be connected to a shell portion of the casing. In this way, the auxiliary cooling element can take away the heat energy in the circulation chamber, so that the gaseous working liquid can be cooled and condensed in the upper chamber more easily to return to a liquid state, which further achieves the effect of cooling the heat source.

Wherein, an outer shell portion of the shell can have a heat absorbing area, an assembly cover can be arranged outside the shell, and the heat absorbing area is exposed to be thermally connected to a heat source. In this way, the structure is simple and easy to assemble, which has the effect of convenient assembly.

Wherein, the assembly cover may have several assembly holes, and the assembly cover is locked and combined at a predetermined position through the several assembly holes. In this way, the casing can be easily combined at the predetermined position through the assembly cover, which has the effect of convenience in use.

Wherein, the shell can have an outer shell surrounding an inner shell, and the outer shell and the inner shell can respectively form a closed ring shape, and the two covers can be respectively combined on two sides of the shell, and each The cover can be abutted against the outer shell portion and the inner shell portion by a plug portion. In this way, the structure is simple and easy to manufacture, and has the effect of reducing manufacturing cost.

Wherein, the number of the casing and the cooling fin group can be several, and the several casings are arranged along the ventilation direction, or along a windshield direction perpendicular to the ventilation direction. In this way, the heat dissipation module can be used in various installation occasions, and has the effect of convenient installation.

Wherein, the several casings are arranged along the ventilation direction, and the several connecting pieces are arranged in a staggered manner to connect the several casings. In this way, the arrangement length of the several shells can be reduced, so that the overall volume of the cooling module can be reduced, which has the effect of space utilization.

Wherein, the circulation chamber can be filled with at least one working fluid. In this way, by virtue of the different boiling points of the at least one working liquid, the circulation speed of the gas-liquid phase of the working liquid can be increased, which has the effect of heat dissipation.

Wherein, the working liquid may be a non-conductive liquid. In this way, even if the working liquid leaks, it will not cause the circuit of the system to be short-circuited.

In order to make the above and other purposes, features and advantages of the present invention more comprehensible, the preferred embodiments of the present invention are specifically cited below, together with the accompanying drawings, as follows:

Please refer to Figures 1 and 3, which is the first embodiment of the heat dissipation module of the present invention, which includes a shell 1, a working liquid 2 and a heat dissipation fin set 3, and the working liquid 2 is filled in the shell The casing 1 , the cooling fin set 3 is located in an accommodating space S of the shell casing 1 .

Please refer to Figures 2 and 3, the housing 1 surrounds the accommodating space S, and the two ends of the accommodating space S in a ventilation direction D1 respectively have an opening 11, and the housing 1 has a The circulation chamber C surrounds the accommodating space S outside. Specifically, the shell 1 may have an outer shell portion 1a and at least one inner shell portion 1b, the outer shell portion 1a may surround the at least one inner shell portion 1b, the outer shell portion 1a and the inner shell portion 1b may cooperate The circulation chamber C is formed so that the circulation chamber C can be located between the outer casing part 1a and the inner casing part 1b.

In addition, the circulation chamber C can be divided into an upper cavity part C1 and a lower cavity part C2, and the upper cavity part C1 and the lower cavity part C2 can be communicated with each other. Wherein, the forming method of the casing 1 is not limited by the present invention. In this embodiment, the casing 1 can be surrounded by a single flat tube T to form a C shape, and the flat tube T can be, for example, copper, titanium, Made of heat-conducting materials such as stainless steel or aluminum, the two ends T1 of the flat tube T are based on the principle that they can be connected to form the circulation chamber C. The connection method of the two ends T1 of the flat tube T is based on this The invention is not limited, nor is it limited to the drawings disclosed in this embodiment. In this embodiment, the two ends T1 of the flat tube T can be connected by a connecting piece 4 so that the upper chamber C1 can communicate with the lower chamber C2.

Please refer to Figure 3, and the shell 1 can have a heat absorption zone Z, the heat absorption zone Z is located in the shell part 1a, and the heat absorption zone Z can be located in the lower cavity part C2, and the heat absorption zone Z can be Combined with an assembly board 5, and the assembly board 5 can be used to thermally connect a heat source H, the heat source H can be, for example, a central processing unit of a server, a computer or other electrical products, or a circuit board that generates heat due to operation. Chips and other electronic components.

Wherein, the assembly board 5 can be made of metal materials with high thermal conductivity such as copper or aluminum. Heat source H. Specifically, the assembly plate 5 can have a groove 51, the shell 1 can be set in the groove 51 of the assembly plate 5, and the heat absorption zone Z of the shell 1 is located in the groove 51 of the assembly plate 5, system can improve the convenience of assembly. The assembling plate 5 can also have several assembling holes 52 , and the assembling plate 5 can be locked and combined at a predetermined position through the several assembling holes 52 , so that the assembling plate 5 can be thermally connected with the heat source H easily.

The working liquid 2 is filled in the lower chamber C2 of the circulation chamber C, and the working liquid 2 in the lower chamber C2 can face the heat source H, so that the heat can be absorbed by the working liquid 2 in the lower chamber C2 Heat energy from source H. The working liquid 2 can be water, alcohol or other liquids with low boiling points; preferably, the working liquid 2 can be a non-conductive liquid, so that even if the working liquid 2 leaks, the system circuit will not be damaged. In the case of a short circuit, the working liquid 2 can absorb heat energy from the liquid state and evaporate into a gaseous state, and then use the gas-liquid phase change mechanism of the working liquid 2 to achieve heat energy transfer; and because the circulation chamber C is in a closed state, the system can To prevent the working liquid 2 from dissipating after forming a gaseous state, and to prevent the interior from being compressed into the space after the working liquid 2 is formed into a gaseous state due to air occupation, thereby affecting the heat dissipation efficiency.

It is particularly noted that the working liquid 2 can be at least one, for example: the lower chamber C2 can be filled with one, two or more than three kinds of working liquids 2; thus, by virtue of the different boiling points of the at least one working liquid 2, The circulation speed of the gas-liquid phase of the working liquid 2 can be increased, which can provide a better heat dissipation effect. In addition, the working liquid 2 in the lower chamber C2 can be filled with working liquids 2 with different boiling points according to the requirements of the heat source H; thus, when the heat dissipation demand is not high, you can choose a relatively cheap working liquid 2, system can achieve cost savings.

Please refer to Figures 1 and 3, the heat dissipation fin set 3 is located in the accommodating space S, the heat dissipation fin set 3 can be formed by bending a single piece of fins, or stacked with multiple fins. The present invention is not limited to the snap-fit combination, and the cooling fin set 3 can be made of a metal material with high thermal conductivity, so as to improve the thermal conductivity.

Please refer to Figures 2 and 3, when the heat dissipation module is in operation, the heat absorption zone Z of the shell 1 can be thermally connected to the heat source H, and the working fluid 2 in the lower cavity C2 can absorb heat energy from the liquid state and evaporate into a gaseous state, so that the working liquid 2 in the lower cavity C2 absorbs the heat energy at the heat source H; then, the working liquid 2 formed in a gaseous state can enter the upper cavity C1 upwards or upwards, and the upwards or downwards The working liquid 2 entering the upper chamber C1 can quickly condense from a gaseous state to a liquid state and then return to the lower chamber C2, so that the working liquid 2 can fully absorb the heat energy of the heat source H, and can provide good heat dissipation performance and through the setting of the heat dissipation fin group 3, the thermal energy in the circulation chamber C can have more contact area with the heat dissipation fin group 3, and the heat dissipation effect can be improved.

Please refer to Figures 4 and 5, which are the second embodiment of the heat dissipation module of the present invention. The shell 1 can be surrounded by several flat tubes T to form a ring shape. The two phases of the several flat tubes T Adjacent ends T1 can be connected by a connecting piece 4; in this embodiment, the number of the flat tubes T is described as two, and the two adjacent ends T1 of the two flat tubes T can be connected by two connecting pieces 4 connected. In addition, the inner shell part 1b may have a liquid-guiding surface 12 adjacent to the upper cavity part C1 of the circulation chamber C. The liquid-guiding surface 12 is preferably inclined so that the liquid-guiding surface 12 adjacent to the upper cavity part C1 The inner shell part 1b can be formed in such a way that the middle is higher than the two sides, or one side is higher than the other side. In this embodiment, the inner shell part 1b adjacent to the upper chamber C1 is in a state where the middle is higher than the two sides. For illustration, the liquid guide surface 12 can form an angle θ with a horizontal plane P; thus, when the working liquid 2 in the upper cavity C1 is condensed from a gaseous state to a liquid state, the working liquid 2 can easily flow from a high place to two The low side flows to return to the lower cavity portion C2.

Please refer to Figure 6, which is the third embodiment of the heat dissipation module of the present invention. The number of the inner shell parts 1b can be several, and the several inner shell parts 1b can be arranged at intervals up and down, and two adjacent A middle cavity part C3 can be formed between the inner shell parts 1b, and the middle cavity part C3 can be located between the upper cavity part C1 and the lower cavity part C2; thus, when the working fluid 2 in the lower cavity part C2 is converted into When the gaseous state goes upwards, part of it can condense back to the liquid state in the middle cavity part C3 and return to the lower cavity part C2 downwards, while the remaining part can continue to be located in the middle cavity part C3 until it accumulates enough energy to vaporize and enter the upper cavity part C3. In the cavity C1, the working liquid 2 located in the upper cavity C1 can be condensed from a gaseous state to a liquid state and then returned to the lower cavity C2, so that the working liquid 2 can fully absorb the heat energy of the heat source H, and the system can To achieve the role of providing good heat dissipation performance.

In addition, in this embodiment, the heat dissipation module of the present invention may further include an auxiliary heat dissipation element 6, which may be connected to the shell portion 1a of the casing 1, and the auxiliary heat dissipation element 6 may move away from the shell Extending in the direction of the sleeve 1, the auxiliary heat sink 6 can be made of a metal material with high thermal conductivity. With the setting of the auxiliary heat sink 6, the auxiliary heat sink 6 can take away the heat energy in the circulation chamber C, so that The gaseous working fluid 2 can be cooled and condensed more easily in the upper chamber C1 to become a liquid, which can further achieve the effect of cooling the heat source H.

Please refer to Figure 7, which is the fourth embodiment of the heat dissipation module of the present invention, the number of the shell 1 and the heat dissipation fin group 3 is several, and the lower chambers C2 of the several shells 1 are respectively filled There are their own working liquids 2, and the working liquids 2 in the lower chambers C2 are not connected to each other. The several casings 1 can be arranged side by side in the groove 51 of the assembly plate 5, and the arrangement can be based on actual needs. Make adjustments, for example: as shown in Figure 7, it can be arranged along the ventilation direction D1, so that the several openings 11 can form a relative position; or, as shown in Figure 8, it can also be arranged along the direction perpendicular to the ventilation direction A windshield direction D2 of D1 is arranged so that the plurality of openings 11 can be exposed, so that the cooling module can be used in various installation situations. Wherein, when the several casings 1 are arranged along the ventilation direction D1, the several connecting parts 4 are preferably arranged in a staggered manner, which can reduce the arrangement length of the several casings 1, thereby reducing the The overall volume of the cooling module can play a role in space utilization.

Please refer to Figure 9, which is the fifth embodiment of the heat dissipation module of the present invention, the heat dissipation module may further include an assembly cover 7, the assembly cover 7 may be arranged outside the casing 1, the assembly cover 7 It can roughly form an Ω shape, and the assembly cover 7 can be set on the shell 1 from the side adjacent to the upper chamber C1 (as shown in Figure 3), and the heat absorption zone Z can be exposed to thermally connect the heat generating Source H (shown in Figure 3). Wherein, the assembling cover 7 may have several assembling holes 71; in this way, the shell 1 can be easily combined at the predetermined position through the assembling cover 7, which can be used conveniently.

Please refer to Figure 10, which is the sixth embodiment of the heat dissipation module of the present invention, the two adjacent ends T1 of the two U-shaped flat tubes T can form a connection, and the connection can be snap-fit, buckle bonded or glued together. In this embodiment, the two adjacent ends T1 of the two flat tubes T can be combined by welding (for example: reflow welding or lightning welding) to form a connected arrangement. For example, the communication can be selected to make the inner diameter width of the end T1 of one of the flat tubes T greater than or equal to the outer diameter width of the end T1 of the other flat tube T as shown in Figures 12 and 13, and then the Two adjacent ends T1 of the two flat tubes T are welded together, so that the upper cavity C1 can communicate with the lower cavity C2. In other embodiments, as shown in FIG. 11 , a single flat tube T can be used to form a C shape, and the two ends T1 of the flat tube T can be combined by the above-mentioned welding method.

Please refer to Figures 14 and 15, which are the seventh embodiment of the heat dissipation module of the present invention. The shell part 1a of the shell 1 may have a through hole 13, which is adjacent to the lower cavity part C2. The hole 13 can communicate with the groove 51 of the assembly plate 5 and the lower cavity C2, so that the working liquid 2 can be filled in the space between the groove 51 and the lower cavity C2, so that more working fluid can be filled. The liquid 2 can quickly absorb the heat energy of the heat source H, thereby providing a better heat dissipation effect.

Please refer to Figure 16, which is the eighth embodiment of the heat dissipation module of the present invention. The assembly plate 5 may have an upper plate 5a and a lower plate 5b. The upper plate 5a is combined with the lower plate 5b. The upper plate 5a is combined with the lower plate 5b. The plate 5a can be located between the shell 1 and the lower plate 5b, the upper plate 5a can have a through hole 53, the through hole 53 and the lower plate 5b can jointly form the groove 51, and the lower plate 5b can be used for The heat source H is thermally connected; in this way, only the lower plate 5b can be selected to be made of metal material with high thermal conductivity such as copper or aluminum, which can reduce the manufacturing cost.

Please refer to Figures 17 and 18, which are the ninth embodiment of the heat dissipation module of the present invention. In this embodiment, the shell 1 can be made of plates with different diameters, which is similar to the aforementioned The casing 1 is formed differently by a flat tube T circle. Specifically, the heat dissipation module may further include two covers 8, and the two covers 8 may respectively have a plug portion 81; and the outer shell portion 1a and the inner shell portion 1b may respectively form a closed ring shape, the The outer shell part 1a surrounds the inner shell part 1b, and the circulation chamber C is formed between the outer shell part 1a and the inner shell part 1b, and is respectively combined with two sides of the shell 1 by the two covers 8, And the plug portion 81 of each cover 8 is abutted against the outer shell portion 1 a and the inner shell portion 1 b to close the circulation chamber C; thus, another way of making the casing 1 is provided.

To sum up, the heat dissipation module of the present invention uses the circulation chamber to surround the accommodation space, and the working liquid is filled in the lower chamber; when the heat dissipation module is in operation, it can The working fluid in the lower cavity absorbs the heat energy of the heat source, the working fluid in the lower chamber can absorb heat energy from the liquid state and evaporate into a gaseous state, and the gaseous working fluid can enter the upper cavity part upwards or upwards. The working liquid entering the upper chamber can quickly condense from gaseous state to liquid state and then return to the lower chamber, so that the working liquid can fully absorb the heat energy of the heat source, and through the setting of the cooling fin group, the The thermal energy in the circulation chamber can have a large contact area with the heat dissipation fin group, which has the effect of improving good heat dissipation performance.

Although the present invention has been disclosed by using the above-mentioned preferred embodiments, it is not intended to limit the present invention. It is still within the scope of this invention for anyone skilled in the art to make various changes and modifications relative to the above-mentioned embodiments without departing from the spirit and scope of the present invention. The technical scope protected by the invention, therefore, the scope of protection of the present invention should be defined by the scope of the appended patent application.

﹝this invention﹞ 1:Shell 1a: shell part 1b: Inner shell 11: opening 12: Liquid guide surface 13: Through hole 2: working liquid 3: cooling fin group 4: Connecting parts 5: Assembling the board 5a: upper plate 5b: Lower plate 51: Groove 52: Assembly hole 53: mouth piercing 6: Auxiliary radiator 7: Assemble the cover 71: Assembly hole 8: Capping 81: Cyprus C: circulation chamber C1: upper cavity C2: lower cavity C3: middle cavity D1: Ventilation direction D2: windshield direction H: heat source P: horizontal plane S: storage space T: flat tube T1: end Z: endothermic zone θ: included angle

[Fig. 1] Partial exploded perspective view of the first embodiment of the present invention. [Picture 2] An exploded perspective view of the casing, cooling fins and connectors of the first embodiment of the present invention. [Fig. 3] A combined sectional view of the first embodiment of the present invention. [Figure 4] The second embodiment of the present invention does not include an exploded perspective view of the assembled board. [Fig. 5] A combined sectional view of the second embodiment of the present invention. [Fig. 6] A combined sectional view of the third embodiment of the present invention. [Fig. 7] A combined perspective view of the fourth embodiment of the present invention. [Figure 8] An exploded perspective view of another aspect of the fourth embodiment of the present invention. [Fig. 9] An exploded perspective view of the fifth embodiment of the present invention. [Fig. 10] A perspective view of the sixth embodiment of the present invention. [Fig. 11] Another perspective view of the sixth embodiment of the present invention. [Figure 12] Sectional view along line A-A in Figure 10. [Figure 13] A cross-sectional view of another form along the A-A line in Figure 10. [Fig. 14] An exploded perspective view of the seventh embodiment of the present invention. [Fig. 15] A combined sectional view of the seventh embodiment of the present invention. [Fig. 16] A combined sectional view of the eighth embodiment of the present invention. [Fig. 17] An exploded perspective view of the ninth embodiment of the present invention. [Fig. 18] A combined sectional view of the ninth embodiment of the present invention.

1:Shell

1a: shell part

1b: Inner shell

2: working liquid

3: cooling fin group

4: Connecting parts

5: Assembling the board

51: Groove

52: Assembly hole

C: circulation chamber

C1: upper cavity

C2: lower cavity

H: heat source

S: storage space

T: flat tube

T1: end

Z: endothermic zone

Claims (21)

A cooling module, comprising: A shell, enclosing and forming an accommodating space, the two ends of the accommodating space in a ventilation direction respectively have an opening, the shell has a circulation chamber surrounding the outside of the accommodating space, and the circulation chamber is divided into are an upper chamber and a lower chamber; a working fluid filled in the lower cavity; and A cooling fin group is located in the accommodating space. The heat dissipation module according to claim 1, wherein the shell has an outer shell surrounding at least one inner shell, and the circulation chamber is located between the outer shell and the inner shell. The heat dissipation module according to claim 2, wherein the inner casing has a liquid guiding surface adjacent to the upper cavity, and the liquid guiding surface is inclined and forms an included angle with a horizontal plane. The heat dissipation module as claimed in claim 2, wherein the number of the inner casings is several, and the several inner casings are arranged at intervals up and down. The heat dissipation module according to claim 4, wherein a middle cavity part of the circulation chamber is formed between two adjacent inner shell parts, and the middle cavity part is located between the upper cavity part and the lower cavity part. The heat dissipation module according to claim 1, wherein the shell is surrounded by a single flat tube to form a C shape, and the two ends of the flat tube are connected by a connecting piece, or the two ends of the flat tube are welded together . Such as the heat dissipation module of claim 1, wherein the shell is surrounded by several flat tubes to form a ring shape, and two adjacent ends of the several flat tubes are connected by a connecting piece, or two of the flat tubes Adjacent ends are welded together. The heat dissipation module according to claim 1, wherein the shell has a heat absorption area opposite to the lower cavity, the heat absorption area is combined with an assembly plate, and the assembly plate is used for thermally connecting a heat source. The heat dissipation module according to claim 8, wherein the assembly plate has a groove, and a shell portion of the casing has a through hole, and the through hole communicates with the groove and the lower cavity. The heat dissipation module according to claim 9, wherein the assembly plate has an upper plate combined with a lower plate, the upper plate has a through hole, the through hole and the lower plate jointly form the groove, and the lower plate is used for thermal connection A heat source. The heat dissipation module as claimed in item 10, wherein the lower plate is made of metal material with high thermal conductivity such as copper or aluminum. The heat dissipation module according to claim 8, wherein the assembly plate has a groove, several shells are arranged side by side on the assembly plate, and the heat absorption area of each shell is located in the groove of the assembly plate. The heat dissipation module according to claim 8, wherein the assembly plate has several assembly holes, and the assembly plate is locked and combined at a predetermined position through the several assembly holes. According to claim 1, the heat dissipation module further includes an auxiliary heat dissipation element, and the auxiliary heat dissipation element is connected to an outer shell portion of the casing. The heat dissipation module according to claim 1, wherein an outer shell of the casing has a heat absorption area, an assembly cover is provided outside the casing, and the heat absorption area is exposed to be thermally connected to a heat source. The heat dissipation module according to claim 15, wherein the assembly cover has several assembly holes, and the assembly cover is locked and combined at a predetermined position through the several assembly holes. The heat dissipation module according to claim 1, wherein the shell has an outer shell surrounding an inner shell, the outer shell and the inner shell respectively form a closed ring shape, and the two covers are respectively combined with the shell The two sides of each cover are abutted against the outer shell and the inner shell by a plug. The heat dissipation module according to claim 1, wherein the number of the casing and the heat dissipation fin group is several, and the several casings are arranged along the ventilation direction, or arranged along a windshield direction perpendicular to the ventilation direction . The heat dissipation module according to claim 18, wherein the plurality of casings are arranged along the ventilation direction, and the plurality of connecting pieces are arranged in a staggered manner to connect the plurality of casings. The heat dissipation module according to claim 1, wherein the circulation chamber is filled with at least one working liquid. The heat dissipation module according to claim 1, wherein the working liquid is a non-conductive liquid.

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