TWI802834B - Fluid cooling type heat dissipation module - Google Patents

Abstract

A fluid cooling type heat dissipation module is used to solve the problem of poor heat dissipation efficiency of the conventional vapor chamber. The fluid cooling type heat dissipation module includes a body and two conveying parts. The body with a plurality of first laminated plates and a plurality of second laminated plates arranged in layers, and a chamber is provided between any two adjacent first and second laminated plates. The several chambers are connected at intervals, so that several of the connected chambers form a phase change chamber, and the phase change chamber is in a closed state and filled with a phase change liquid, and several other communicating chambers form a fluid chamber. The two conveying parts are communicated with the fluid chamber.

Description

Fluid Cooling Thermal Module

The present invention relates to a heat dissipation module, in particular to a fluid-cooled heat dissipation module that conducts heat energy to a circulating fluid through a phase change fluid, and takes away the heat energy through the circulating fluid.

In order to avoid local overheating of the electronic device, the heat dissipation method of the current electronic device is mainly to install a vapor chamber inside the electronic device, and the vapor chamber can be attached to a heating area of the electronic device. The temperature plate can have an upper plate body and a lower plate body, and the upper plate body and the lower plate body are combined to form a cavity, which can be used to fill a working liquid; thereby, the heat generated by the heating area It can be diffused to the uniform temperature plate to effectively prevent heat energy from gathering in the heating area and achieve the effect of heat dissipation.

In the above known vapor chamber, even if the heating area can heat the working liquid and vaporize the working liquid, the gaseous working liquid evaporates to the side far away from the heating area and then condenses, taking away the heat from the heating area However, since the vapor chamber only dissipates heat through the gas-liquid phase change of the working liquid, the heat dissipation effect of the vapor chamber on the heating area is limited, resulting in poor heat dissipation efficiency.

In view of this, it is necessary to improve the conventional fluid cooling heat dissipation module.

In order to solve the above problems, the object of the present invention is to provide a fluid-cooled heat dissipation module, which can improve the heat dissipation performance.

Another object of the present invention is to provide a fluid-cooled heat dissipation module, which can improve the convenience of assembly.

Another object of the present invention is to provide a fluid cooling heat dissipation module, which can reduce the manufacturing cost.

Another object of the present invention is to provide a fluid-cooled heat dissipation module, which can improve heat exchange efficiency.

Directionality or similar terms used throughout the present invention, such as "front", "rear", "left", "right", "upper (top)", "lower (bottom)", "inner", "outer" , "side", etc., mainly refer to the directions of the attached drawings, and each direction or its approximate terms are only used to assist in explaining and understanding the various embodiments of the present invention, and are not intended to limit the present invention.

The elements and components described throughout the present invention use the quantifier "a" or "an" only for convenience and to provide the usual meaning of the scope of the present invention; in the present invention, it should be interpreted as including one or at least one, and singular The notion of also includes the plural unless it is obvious that it means otherwise.

Approximate terms such as "combination", "combination" or "assembly" mentioned throughout the present invention mainly include forms that can be separated without destroying the components after connection, or that the components cannot be separated after connection, etc., which are common knowledge in the art. One can be selected according to the material of the components to be connected or assembly requirements.

The fluid-cooled heat dissipation module of the present invention includes: a main body, with several first laminated plates and several second laminated plates stacked, and any two adjacent first laminated plates and second laminated plates have a A chamber, the several chambers communicate at intervals, so that several of the connected chambers jointly form a phase change chamber, the phase change chamber is airtight and filled with a phase change liquid, and several other connected chambers The connected chambers jointly form a fluid chamber; and the two fluid transfer parts communicate with the fluid chamber.

Accordingly, in the fluid-cooled heat dissipation module of the present invention, the phase-change liquid in the phase-change chamber can absorb heat energy from a liquid state and evaporate into a gaseous state, so that the phase-change liquid in the phase-change chamber can absorb heat from a heat source Heat energy, so that the phase change liquid can use the gas-liquid phase change mechanism to achieve heat transfer, and the circulating fluid in the fluid chamber can quickly absorb the heat energy in the phase change chamber, making the phase change chamber The phase-change liquid can be rapidly condensed from a gaseous state to a liquid state to absorb heat, so that the circulating fluid in the fluid chamber can further cool down the phase-change liquid in the phase-change chamber, which can achieve the effect of improving good heat dissipation performance.

Wherein, the two flow-transmitting parts may be arranged diagonally and connected to the main body. In this way, the circulating fluid has a large flow range, can flow smoothly and take away heat energy, making it difficult for heat energy to stay inside the main body, which has the effect of improving heat dissipation performance.

Wherein, each of the several first laminated boards may have several first protrusions, and the first protrusion may have a first through hole, and each of the several second laminated boards may have several second protrusions. The second protrusion may have a second through hole, any two adjacent first protrusions are connected to the second protrusion and the first through hole communicates with the second through hole, and are located in the phase change chamber. The two first protrusions may additionally have at least one side through hole, and the two second protrusions located in the fluid chamber may additionally have at least one side through hole, so as to be compatible with the first protrusion having the side through hole. The connected second protrusion may not have a side through hole, and the first protrusion connected to the second protrusion having the side through hole may not have a side through hole. In this way, the structure is simple and easy to assemble, which has the effect of improving the convenience of assembly.

Wherein, the several first laminated plates may have several first series connection holes, the several second laminated plates may have several second series connection holes, the body may have several series connection pipes, and the several series connection pipes The first serial connection holes of the plurality of first stacked plates and the second serial connection holes of the plurality of second laminated plates can be penetrated and combined. The tube walls of the plurality of series connection tubes can have several perforations. The several perforations of two of the connection pipes can communicate with the phase change chamber, and the several perforations of the other two of the several series connection pipes can communicate with the fluid chamber. In this way, the structure is simple and easy to assemble, which has the effect of improving the convenience of assembly.

Wherein, the body may have a plurality of first protrusions, and the plurality of first protrusions are connected to the plurality of first laminated plates and located in the phase change chamber. In this way, the contact area between the first laminated plate and the phase change liquid can be increased, the heat exchange efficiency can be improved, and the heat dissipation performance can be improved.

Wherein, the body may have several second protrusions, the several second protrusions are connected to the second laminated plates and located in the fluid chamber, the distribution density of the several second protrusions may be greater than the number The distribution density of the first convex column. In this way, it is avoided that the number of the first protrusions is too large to occupy the space of the phase change chamber, and the contact area between the second laminated plate and the circulating fluid can be increased, and the circulating fluid can be continuously circulated to The thermal energy of the phase change fluid can be taken away, thereby greatly improving the heat exchange efficiency and having the effect of improving heat dissipation performance.

Wherein, the several first laminated plates may have several corrugated portions, and the several second laminated plates may have several corrugated portions. In this way, the contact area between the first laminated plate, the second laminated plate, the phase change liquid, and the circulating fluid can be increased, and the corrugated parts of the several first laminated plates and the number of second laminated plates can be increased. The wave portion can quickly transfer the thermal energy of the phase change fluid to the circulating fluid, which has the effect of improving heat exchange efficiency.

The fluid-cooled heat dissipation module of the present invention can further include several sealing plugs, which can be combined and located on the body, so that the phase change chamber is in a sealed state and the fluid chamber is only communicated with the two flow delivery parts . In this way, the outflow of the phase change liquid can be avoided, which has the effect of reducing the manufacturing cost.

The fluid cooling heat dissipation module of the present invention may further include a heat conduction base, and the heat conduction base may be thermally connected to the bottom end of the main body. In this way, the heat energy of the heat source can be evenly distributed to the plurality of first laminated boards and the plurality of second laminated boards through the heat conduction base, which has the effect of improving the heat dissipation effect.

Wherein, the fluid chamber can be used for circulation of a circulating fluid, and the circulating fluid and the phase change liquid can be different liquids. In this way, suitable circulating fluid and phase change liquid can be selected, and the circulation speed of the gas-liquid phase can be increased, which has the effect of achieving a better heat dissipation effect.

Wherein, the phase change liquid may be a non-conductive liquid, and the circulating fluid may be water. In this way, the phase change fluid and the circulating fluid can be easily obtained, which has the effect of reducing manufacturing costs.

In order to make the above-mentioned and other purposes, features and advantages of the present invention more obvious and understandable, the preferred embodiments of the present invention are specifically cited below, together with the accompanying drawings, and are described in detail as follows:

Please refer to FIG. 1 , which is the first embodiment of the fluid-cooled heat dissipation module of the present invention, which includes a body 1 and two flow parts 2 , and the two flow parts 2 are connected to the body 1 .

Please refer to Figures 1, 2, and 5, the body 1 has several first laminated plates 11 and several second laminated plates 12, and the several first laminated plates 11 and several second laminated plates 12 can be, for example Made of metal materials with high thermal conductivity such as copper or aluminum, the plurality of first laminated plates 11 and the plurality of second laminated plates 12 can be combined by welding (for example: reflow soldering or laser welding) to form a laminated arrangement, And there is a cavity U between any two adjacent first laminated boards 11 and second laminated boards 12 . Wherein, the structure on the chamber U and the first laminated board 11 and the second laminated board 12 can be formed by stamping, die-casting, dry etching, wet etching or plasma etching and other processing methods; , the U depth of the chamber can be precisely controlled in the unit of μm, which can improve the processing precision, and can be applied to electronic products with smaller volumes to ensure the thinning requirements.

Please refer to Figures 3, 4, and 5. In detail, the first laminated boards 11 and the second laminated boards 12 are arranged in a staggered manner, namely the first laminated boards 11 and the second laminated boards 12. , the arrangement of the first laminated plate 11, the second laminated plate 12, the first laminated plate 11, the second laminated plate 12..., the several chambers U are connected at intervals, so that several of the connected chambers U A phase change chamber S1 is jointly formed, and the phase change chamber S1 is in a closed state and filled with a phase change liquid L1, and several connected chambers U jointly form a fluid chamber S2, and the fluid chamber S2 supplies a The circulating fluid L2 circulates; that is, the several chambers U can be divided into two groups, the two groups of chambers U can communicate with each other, and the two groups of chambers U can be the phase change chamber S1 and the fluid chamber respectively. Room S2.

Wherein, the phase-change liquid L1 can be water, alcohol or other liquids with low boiling points; preferably, the phase-change liquid L1 can be a non-conductive liquid, and the phase-change liquid L1 can absorb heat from a liquid state and evaporate into a gaseous state , and then use the gas-liquid phase change mechanism of the phase-change liquid L1 to achieve heat transfer; and by using the phase-change chamber S1 as a closed state, it can prevent the phase-change liquid L1 from being lost after forming a gaseous state, and avoid internal causes Air occupies and is compressed into the space after the phase change liquid L1 forms a gaseous state, thereby affecting heat dissipation efficiency; and the composition of the circulating fluid L2 can be liquid or gas, which is not limited by the present invention. In this embodiment, the The circulating fluid L2 can be water, for example.

Please refer to Figures 2 and 5, it is particularly noted that the plurality of first laminated plates 11 and the plurality of second laminated plates 12 can be stacked on each other to form the phase change chamber S1 and the fluid chamber S2 is the principle, the type and structure of the first laminated board 11 and the second laminated board 12 are not limited by the present invention; in this embodiment, each of the several first laminated boards 11 can have several A protrusion 111, the first protrusion 111 may have a first through hole 112, and the two first protrusions 111 located in the phase change chamber S1 may additionally have at least one side through hole 113; Each of the second laminated plates 12 may have several second protrusions 121, and the second protrusions 121 may have a second through hole 122, and two of the second protrusions 121 located in the fluid chamber S2 may be It also has at least one side through hole 123, any two adjacent first protrusions 111 are connected to the second protrusion 121 and the first through hole 112 is connected to the second through hole 122, the side of the first protrusion 111 The through hole 113 and the side through hole 123 of the second protrusion 121 may not be opposite to each other, that is, the position of the side through hole 113 of the first laminate 11 and the position of the side through hole 123 of the second laminate 12 are different. , so that the second convex portion 121 connected with the first convex portion 111 with the side through hole 113 may not have the side through hole 123, and the first convex portion connected with the second convex portion 121 with the side through hole 123 111 may have no side through hole 113 .

Please refer to Fig. 9, in addition, the several first laminated plates 11 can have several corrugated parts 114, and the several second laminated plates 12 can have several corrugated parts 124; The contact area between the laminated plate 11, the second laminated plate 12, the phase change liquid L1, and the circulating fluid L2, the several wavy portions 114 and the several wavy portions 124 can rapidly heat the phase change liquid L1 Transferred to the circulating fluid L2, the heat exchange efficiency can be improved, thereby improving the heat dissipation performance.

Please refer to Figures 7 and 8, and the body 1 can have several first bosses 13 and several second bosses 14, and the first bosses 13 are connected to the first laminated plates 11. and located in the phase change chamber S1; wherein, the first protrusion 13 can be separately manufactured with the first laminated plate 11 and then combined in an assembled manner (for example: welding), or the first laminated plate 11 The first protrusion 13 may be integrally formed, and the present invention is not limited thereto. The arrangement of the plurality of first protrusions 13 can increase the contact area between the first laminated plate 11 and the phase change liquid L1 , which can improve the heat exchange efficiency and further improve the heat dissipation performance.

In addition, the plurality of second protrusions 14 are connected to the plurality of second laminated plates 12 and located in the fluid chamber S2, the second protrusions 14 can be manufactured separately from the second laminated plates 12 and then assembled (for example: welding), or, the second laminated board 12 can be integrally formed with the second boss 14, the present invention is not limited, and the distribution density of the second bosses 14 can preferably be greater than the The distribution density of several first protrusions 13; in this way, the number of the first protrusions 13 is avoided from being too large to occupy the space of the phase change chamber S1, and the second laminated plate 12 and the circulating fluid L2 can be increased The contact area between them, and the heat energy of the phase change liquid L1 can be taken away by the continuous circulation of the circulating fluid L2, so that the heat exchange efficiency can be greatly improved, and the heat dissipation performance can be improved.

Please refer to Figures 1 and 3, the two flow transfer parts 2 are diagonally connected to the body 1, and the two flow transfer parts 2 communicate with the fluid chamber S2; thus, the circulating fluid L2 has a larger flow range , and can flow smoothly and take away heat energy, so that heat energy is not easy to stay inside the body 1. In addition, in other embodiments, the two flow transfer parts 2 can also be located at the same end of the body 1, which is not limited by the present invention. The two flow delivery parts 2 can be connected to a pump (not shown) and a cooling fin (not shown) through a pipe (not shown). When the pump is in operation, the circulating fluid can be driven L2 circulates in the tube and the fluid chamber S2.

The fluid-cooled heat dissipation module of the present invention can also include several sealing plugs 3, which can be combined and located on the body 1, so that the phase change chamber S1 is in a sealed state, and the phase change liquid L1 can be prevented from flowing out. , and the fluid chamber S2 may only be in communication with the two transfer parts 2 .

Please refer to Figures 3 and 5, the fluid cooling heat dissipation module of the present invention may further include a heat conduction seat 4, which can be thermally connected to the bottom end P of the body 1, and the heat conduction seat 4 can correspond to The plurality of chambers U and the heat conduction base 4 can be used to thermally connect a heat source H; thus, the heat energy of the heat source H can be evenly distributed to the plurality of first laminated plates 11 and the plurality of first laminated plates 11 through the heat conduction base 4 The second laminated board 12 has the function of improving the heat dissipation effect.

Please refer to Figures 5 and 6, when the fluid-cooled heat dissipation module of the present invention is in operation, the body 1 can be thermally connected to the heat source H through the heat conducting seat 4, and the phase change liquid L1 in the phase change chamber S1 Heat energy can be absorbed from the liquid state and evaporated into a gaseous state, so that the heat energy at the heat source H can be absorbed by the phase change liquid L1 in the phase change chamber S1; then, the circulating fluid L2 in the fluid chamber S2 can quickly absorb the phase Change the thermal energy in the chamber S1, so that the phase change liquid L1 in the phase change chamber S1 can quickly condense from a gaseous state to a liquid state to absorb heat, so that the circulating fluid L2 in the fluid chamber S2 can further improve the phase change chamber S1 The temperature of the phase-change liquid L1 in the liquid cools down, and then it can take away the heat energy from the heat source H, which can achieve the effect of providing good heat dissipation performance.

Please refer to Figures 10 and 11, which are the second embodiment of the fluid-cooled heat dissipation module of the present invention. The laminated board 12 can have several second serial connection holes 125, and the several first serial connection holes 115 of the several first laminated boards 11 can be connected with the several second serial connection holes 125 of the several second laminated boards 12. Opposite position; also, the body 1 can also have several series connection pipes 15, the several series connection pipes 15 penetrate and combine the first series connection holes 115 of the several first laminated boards 11 with the several second laminated boards 12 The second series connection hole 125, the series connection pipe 15 may have several perforations 151, the several perforations 151 of two of the several series connection pipes 15 can communicate with the phase change chamber S1, the several series connection pipes 15 The other two several perforations 151 can communicate with the fluid chamber S2, and the several perforations 151 can be arranged at intervals on the tube wall of the series connection pipe 15, so that the positions of the several perforations 151 on different series connection pipes 15 can be adjusted in height. Differently, it is adjusted that several of the connected chambers U can jointly form the phase change chamber S1, and the other several connected chambers U can jointly form the fluid chamber S2.

In summary, in the fluid-cooled heat dissipation module of the present invention, the phase change liquid in the phase change chamber can absorb heat energy from a liquid state and evaporate into a gaseous state, so that the heat can be absorbed by the phase change liquid in the phase change chamber The thermal energy of the source, so that the phase change liquid can use the gas-liquid phase change mechanism to achieve heat transfer, and the circulating fluid in the fluid chamber can quickly absorb the heat energy in the phase change chamber, making the phase change chamber The phase change liquid in the chamber can quickly condense from a gaseous state to a liquid state to absorb heat, so that the circulating fluid in the fluid chamber can further cool down the phase change liquid in the phase change chamber, which can achieve the effect of improving good heat dissipation performance.

Although the present invention has been disclosed by using the above-mentioned preferred embodiments, it is not intended to limit the present invention. It is still within the scope of this invention for anyone skilled in the art to make various changes and modifications relative to the above-mentioned embodiments without departing from the spirit and scope of the present invention. The technical scope protected by the invention, therefore, the scope of protection of the present invention should be defined by the scope of the appended patent application.

﹝this invention﹞ 1: Ontology 11: The first laminate 111: the first convex part 112: The first through hole 113: side through hole 114: wave department 115: The first serial connection hole 12: The second laminated board 121: second convex part 122: Second through hole 123: side through hole 124: wave department 125: Second serial connection hole 13: The first boss 14: Second boss 15: Serial connection pipe 151: perforation 2: Transmission Department 3: sealing plug 4: Thermal seat H: heat source L1: phase change fluid L2: circulating fluid P: Bottom S1: phase change chamber S2: Fluid chamber U: chamber

[Fig. 1] An exploded perspective view of the first embodiment of the present invention. [Figure 2] An enlarged view of the local structure as shown in Figure 1. [Fig. 3] A perspective view of a combined partial section of the first embodiment of the present invention. [Fig. 4] An assembled perspective view of the first embodiment of the present invention. [Figure 5] Sectional view along line A-A in Figure 4. [Figure 6] Sectional view along line B-B in Figure 5. [Figure 7] The first embodiment of the present invention has a partial perspective view of the first and second protrusions. [Picture 8] As shown in Fig. 7, the combined section view. [Fig. 9] A combined cross-sectional view of the first embodiment of the present invention having a wave portion. [Fig. 10] An exploded perspective view of the second embodiment of the present invention. [Fig. 11] A combined sectional view of the second embodiment of the present invention.

1: Ontology

11: The first laminate

111: the first convex part

112: The first through hole

113: side through hole

12: The second laminated board

121: second convex part

122: Second through hole

123: side through hole

2: Transmission Department

3: sealing plug

4: Thermal seat

H: heat source

L1: phase change fluid

L2: circulating fluid

P: Bottom

S1: phase change chamber

S2: Fluid chamber

U: chamber

Claims (11)

A fluid cooling heat dissipation module, comprising: A body, with several first laminated plates and several second laminated plates stacked, there is a chamber between any two adjacent first laminated plates and second laminated plates, and the several chambers communicate with each other at intervals wherein several connected chambers jointly form a phase change chamber, the phase change chamber is airtight and filled with a phase change liquid, and the other several connected chambers jointly form a fluid chamber; and The second flow part communicates with the fluid chamber. According to claim 1, the fluid-cooled heat dissipation module, wherein the two flow-transmitting parts are diagonally arranged and connected to the main body. The fluid-cooled heat dissipation module according to claim 1, wherein each of the plurality of first laminated plates has a plurality of first protrusions, the first protrusion has a first through hole, and each of the plurality of second laminated plates There are several second protrusions, the second protrusions have a second through hole, any two adjacent first protrusions are connected to the second protrusions and the first through holes communicate with the second through holes. The two first protrusions located in the phase change chamber also have at least one side through hole, and the two second protrusions located in the fluid chamber also have at least one side through hole, so that the two second protrusions located in the fluid chamber have at least one side through hole. The second convex part connected to the first convex part of the hole has no side through hole, and the first convex part connected to the second convex part with the side through hole has no side through hole. The fluid-cooled heat dissipation module according to claim 1, wherein, the plurality of first stacked plates have several first series connection holes, the plurality of second stacked plates have several second series connection holes, and the body has several a series connection pipe, the several series connection pipes penetrate and combine the first series connection holes of the several first laminated plates and the second series connection holes of the several second laminated plates, the pipe walls of the several series connection pipes have several The several perforations of two of the several series connection tubes communicate with the phase change chamber, and the several perforations of the other two of the several series connection tubes communicate with the fluid chamber. The fluid cooling heat dissipation module according to claim 1, wherein the body has a plurality of first protrusions, and the plurality of first protrusions are connected to the plurality of first stacked plates and located in the phase change chamber. The fluid-cooled heat dissipation module according to claim 5, wherein the body has a plurality of second protrusions, the plurality of second protrusions are connected to the plurality of second laminated plates and are located in the fluid chamber, the plurality of second protrusions The distribution density of the second protrusions is greater than the distribution density of the first protrusions. The fluid-cooled heat dissipation module according to claim 1, wherein the plurality of first laminated plates have several corrugated portions, and the plurality of second laminated plates have several corrugated portions. The fluid-cooled heat dissipation module of claim 1 further includes several sealing plugs, which are combined and located on the body, so that the phase change chamber is in a sealed state, and the fluid chamber is only connected to the two flow parts. connected. According to claim 1, the fluid-cooled heat dissipation module further includes a heat conduction base, and the heat conduction base is thermally connected to the bottom end of the main body. The fluid-cooled heat dissipation module according to any one of claims 1 to 9, wherein the fluid chamber is used for circulating a circulating fluid, and the circulating fluid and the phase change liquid are different liquids. The fluid-cooled heat dissipation module according to claim 10, wherein the phase change liquid is a non-conductive liquid, and the circulating fluid is water.

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