CN114121847A

CN114121847A - Three-dimensional heat transfer structure and device

Info

Publication number: CN114121847A
Application number: CN202010873253.5A
Authority: CN
Inventors: 石保生; 洪宇平
Original assignee: Huawei Machine Co Ltd
Current assignee: Huawei Machine Co Ltd
Priority date: 2020-08-26
Filing date: 2020-08-26
Publication date: 2022-03-01

Abstract

The application provides a three-dimensional heat transfer structure and device, concretely relates to heat dissipation field. The heat dissipation device is used for solving the problem that the cross-sectional area of a flow channel is small when working media flow back to a temperature-uniforming plate from the inside of a heat pipe, and the heat dissipation performance of a high-power-consumption chip is improved. The three-dimensional heat transfer structure comprises a temperature-equalizing plate and a heat pipe, wherein the temperature-equalizing plate comprises a first cavity, the heat pipe comprises a second cavity, the second cavity is communicated with the first cavity, and the heat pipe is hermetically connected with the temperature-equalizing plate. The inner wall of the first cavity is provided with a VC capillary structure, the second cavity is internally provided with a hollow heat pipe capillary structure, the outer wall of the heat pipe capillary structure is attached to the inner wall of the second cavity, and one end of the heat pipe capillary structure is connected with the VC capillary structure. The hollow part of the heat pipe capillary structure is provided with a capillary connection structure, and the capillary connection structure at least comprises a first surface connected with the inner wall of the heat pipe capillary structure and a second surface connected with the VC capillary structure.

Description

Three-dimensional heat transfer structure and device

Technical Field

The application relates to the field of heat dissipation, in particular to a three-dimensional heat transfer structure and a device.

Background

The performance of current electronic products is gradually improved, and the increasing demands of consumers are met. The performance of the electronic product is greatly influenced by the capability of the chip, and generally, the higher the calculation speed of the chip is, the stronger the performance is, but the larger the heat generation amount of the chip is. If the heat of the chip cannot be effectively dissipated, the chip may be over-heated, which may cause the chip to work down or even burn out.

The temperature equalization plate (VC) is a common structure for solving the problem of chip heat dissipation at present, the VC can be used for solving the problem of two-dimensional heat diffusion, the equivalent thermal conductivity coefficient of the VC is more than 10 times that of pure copper, heat concentrated on a chip can be transferred to the VC, and then the heat is transferred to the air through fins on the VC, so that the working temperature of the chip is kept in a given requirement environment.

A three-Dimensional Vapor Chamber (3-Dimensional Vapor Chamber, 3DVC) is a Vapor Chamber that can solve the problem of three-Dimensional heat dissipation, and comprises a housing plate, a housing tube, a capillary structure and a working fluid, the structure and the working principle of which are shown in fig. 1, an arrow outside the housing plate indicates the diffusion direction of heat, an arrow in the cavity indicates the flow direction of Vapor, and an arrow in the capillary structure indicates the backflow direction of the working fluid. Working fluid absorbs heat and evaporates afterwards, steam is at shell plate and shell intraductal internal cooling, form three-dimensional heat dissipation, in the 3DVC structure, steam is after the shell intraductal cooling becomes working fluid, in working fluid flows back to the shell plate from the shell pipe, but it is relatively poor with the intraductal capillary structure connection quality of shell to have the capillary structure in the shell plate among the current 3DVC structure, thereby influence in working fluid gets back to the shell plate from the shell intraductal internal flow, lead to heat dispersion relatively poor, can't satisfy the heat dissipation demand of high-power consumption chip.

Disclosure of Invention

The embodiment of the application provides a three-dimensional heat transfer structure and a device, and can solve the problem that the cross-sectional area of a flow channel is small when a working medium flows back to a temperature-uniforming plate from the inside of a heat pipe, so that the heat dissipation performance of a high-power-consumption chip is improved.

In order to achieve the purpose, the technical scheme is as follows:

in a first aspect of the present application, a three-dimensional heat transfer structure is provided, where the three-dimensional heat transfer structure includes a temperature equalization plate and a heat pipe, the temperature equalization plate includes a first cavity, the heat pipe includes a second cavity, the second cavity is communicated with the first cavity, and the heat pipe is connected with the temperature equalization plate in a sealing manner. The inner wall of the first cavity is provided with a VC capillary structure, the second cavity is internally provided with a hollow heat pipe capillary structure, the outer wall of the heat pipe capillary structure is attached to the inner wall of the second cavity, and one end of the heat pipe capillary structure is connected with the VC capillary structure. The hollow part of the heat pipe capillary structure is provided with a capillary connection structure, and the capillary connection structure at least comprises a first surface connected with the inner wall of the heat pipe capillary structure and a second surface connected with the VC capillary structure.

Based on the three-dimensional heat transfer structure, the first cavity is communicated with the second cavity, circulation of steam after heat absorption and evaporation of working media in the first cavity and the second cavity and backflow of the working media after condensation of the steam can be achieved, the connection position between the heat pipe and the temperature-equalizing plate is in sealing connection, and outflow of the steam formed after heat absorption of the working media can be avoided. The VC capillary structure, the heat pipe capillary structure and the capillary connecting structure can absorb working media, and the heat pipe capillary structure is attached to the inner wall of the second cavity and can absorb the working media condensed on the inner wall of the second cavity as much as possible. The VC capillary structure is arranged on the inner wall of the first cavity, so that the VC capillary structure can absorb working media condensed on the inner wall of the first cavity as much as possible. The heat pipe capillary structure and the VC capillary structure are connected through the capillary connecting structure, the heat pipe capillary structure and the VC capillary structure are connected in a surface connection mode, the contact area is increased, a large-area capillary structure connecting channel is formed between the heat pipe capillary structure and the VC capillary structure, the liquid return resistance of the capillary structure connecting position is reduced, the evaporation area, where condensed working media on the inner wall of the second cavity body flow back to the first cavity body, is favorable for continuing to be heated and gasified to take away heat, and therefore the heat dissipation performance of the three-dimensional heat transfer structure is improved.

Optionally, the first surface of the capillary connection structure includes a curved surface corresponding to the inner wall of the heat pipe capillary structure, and the second surface of the capillary connection structure includes a plane adaptively connected to the VC capillary structure.

Under the condition, the first surface of the capillary connection structure comprises a curved surface which is arranged corresponding to the inner wall of the heat pipe capillary structure, so that the capillary connection structure and the heat pipe capillary structure can be attached more tightly and connected more sufficiently, and the working medium can flow back to the capillary connection structure from the heat pipe capillary structure; the second surface of the capillary connection mechanism comprises a plane adaptive to and connected with the VC capillary structure, the planar capillary structure is convenient to process, the plane and the plane are connected, the fitting degree is high, the connection degree between the capillary connection structure and the VC capillary structure is improved, and the working medium can flow back to the VC capillary structure from the capillary connection structure, so that the capillary connection structure is a better working medium backflow channel.

Optionally, the height of the portion where the capillary connection structure is connected to the inner wall of the capillary structure of the heat pipe is less than or equal to the height of the second cavity. In this case, the higher the height of the portion of the capillary connection structure connected to the inner wall of the heat pipe capillary structure is, the larger the contact area between the capillary connection structure and the heat pipe capillary structure is, and the more favorable the backflow of the working medium is, so that the highest height of the portion of the capillary connection structure connected to the inner wall of the heat pipe capillary structure can be the height of the second cavity. In this embodiment, the specific height of the portion where the capillary connection structure and the inner wall of the heat pipe capillary structure are connected is not limited, and may be determined according to the contact area between the capillary connection structure and the inner wall of the heat pipe capillary structure, the weight or the cost of the capillary connection structure, and other factors in practical situations.

Optionally, the shape of the capillary connection structure includes one or more of an "L" shape, a "convex" shape, and a columnar shape. Under the condition, the L-shaped, convex or columnar capillary connection structure is adopted, the side part and the bottom part of the capillary connection structure can be arranged into larger surfaces, and the capillary connection structure in the shape can be conveniently connected with the inner wall of the heat pipe capillary structure, meanwhile, the bottom part of the capillary connection structure can be conveniently connected with the top part or the bottom part of the VC capillary structure, so that the contact area between the capillary connection structure and the heat pipe capillary structure as well as the contact area between the capillary connection structure and the VC capillary structure can be favorably improved, and a large-area capillary structure connection channel can be formed.

The shape of the capillary connection structure does not affect the realization of the purpose of the application, the shape of the capillary connection structure can be set according to the connection requirement or other requirements, and the specific shape of the capillary connection structure is not limited in the embodiment of the application.

Optionally, the hollow part of the capillary structure of the heat pipe is provided with one or more capillary connection structures. Under this condition, capillary connection structure is a capillary structure linking channel that supplies the working medium backward flow between heat pipe capillary structure and the VC capillary structure, sets up one or more capillary connection structure, is favorable to reducing the liquid resistance that returns of working medium at the capillary structure junction, improves the liquid speed and the liquid volume of returning of working medium to realize the promotion of heat dispersion. A plurality in this application includes two.

In one possible design, the VC capillary structures include a VC upper layer capillary structure at the top of the first cavity and a VC lower layer capillary structure at the bottom of the first cavity. The heat pipe positioned in the first cavity is provided with a gas passage port for gas to flow through, and the first cavity is communicated with the second cavity through the gas passage port. The heat pipe capillary structure is connected with the VC lower-layer capillary structure, the first surface of the capillary connecting structure is attached to the inner wall of the heat pipe capillary structure, and the second surface of the capillary connecting structure is connected with the VC lower-layer capillary structure.

Under the condition, the first cavity is communicated with the second cavity by arranging the gas channel port, so that steam generated after the working medium in the first cavity absorbs heat and is evaporated can enter the second cavity for heat dissipation. The heat pipe capillary structure is connected with the VC lower-layer capillary structure, so that the heat pipe capillary structure and the VC lower-layer capillary structure are directly connected, and the working medium can directly flow back to the VC lower-layer capillary structure from the heat pipe capillary structure; through the first face with capillary connection structure and heat pipe capillary structure's inner wall connection, directly link to each other capillary connection structure's second face and VC lower floor capillary structure, make during working medium directly flow back to the VC lower floor capillary structure that is closer to the evaporation zone from the heat pipe capillary structure through capillary connection structure, and adopt the mode of face connection, the area of contact between the capillary structure has been increased, the backward flow passageway of working medium has been increased, and the connection of large tracts of land between the capillary structure has reduced the resistance that the working medium flows back, be favorable to the working medium to flow back to the evaporation zone, thereby realize the improvement of heat dispersion.

Optionally, the bottom of the capillary structure of the heat pipe protrudes out of the bottom of the heat pipe, and the bottom of the capillary connection structure protrudes out of the bottom of the heat pipe. Under the condition, when the heat pipe capillary structure is connected with the VC capillary structure and the capillary connection structure is connected with the VC capillary structure, the bottom of the heat pipe capillary structure and the bottom of the capillary connection structure are partially protruded out of the bottom of the heat pipe due to the high strength of the heat pipe, the heat pipe capillary structure and the capillary connection structure are lower in strength compared with the heat pipe and are easier to extrude, and insufficient connection between the heat pipe capillary structure and the VC capillary structure and insufficient connection between the capillary connection structure and the VC capillary structure caused by inclination of the heat pipe can be prevented.

In another possible design, the VC capillary structure comprises a VC upper layer capillary structure located on top of the first cavity. The heat pipe positioned in the first cavity is provided with a gas passage port for gas to flow through, and the first cavity is communicated with the second cavity through the gas passage port. The heat pipe capillary structure is connected with the VC upper-layer capillary structure, the first surface of the capillary connecting structure is attached to the inner wall of the heat pipe capillary structure, and the second surface of the capillary connecting structure is connected with the VC upper-layer capillary structure.

Under this condition, through linking to each other heat pipe capillary structure and VC upper capillary structure, the first face with capillary connection structure and the inner wall laminating of heat pipe capillary structure, capillary connection structure's second face and VC upper capillary structure directly link to each other, area of contact's increase between heat pipe capillary structure and the VC upper capillary structure has been realized, the effect of working medium backward flow has been promoted, and the working medium can get back to the evaporation zone in the first cavity through VC upper capillary structure and absorb heat, such setting has also realized the promotion to three-dimensional heat transfer structure heat dispersion.

Optionally, the capillary connection structure is in an "L" shape, a vertical portion of the capillary connection structure is attached to the inner wall of the capillary structure of the heat pipe, and a horizontal portion of the capillary connection structure is connected to the bottom of the upper-layer capillary structure of the VC. Under this condition, through setting capillary connection structure to "L" type, accord with the spatial structure who forms between heat pipe capillary structure's the inner wall and the VC upper capillary structure, make capillary connection structure's first face and heat pipe capillary structure's inner wall more laminate, simultaneously, make capillary connection structure's second face and VC upper capillary structure also more laminate, promoted the connectivity between the above-mentioned capillary structure, be favorable to reducing the backflow resistance of working medium, thereby realize the promotion to heat dispersion.

In yet another possible design, the VC capillary structures include a VC upper layer capillary structure at the top of the first cavity and a VC lower layer capillary structure at the bottom of the first cavity. The heat pipe capillary structure is connected with the VC upper-layer capillary structure, the capillary connection structure is in a convex shape, the upper side part of the capillary connection structure is attached to the inner wall of the heat pipe capillary structure, and the bottom of the capillary connection structure is connected with the VC lower-layer capillary structure. The capillary connection structure is provided with a gas passage port for gas circulation, and the first cavity is communicated with the second cavity through the gas passage port.

Under this condition, through setting up the capillary connection structure of "protruding" type, the basal area of the capillary connection structure of "protruding" type is great, can increase the area of contact between capillary connection structure and the VC lower floor's capillary structure to increase the interface channel between heat pipe capillary structure and the VC capillary structure, promote the backward flow ability of working medium, promote the heat-sinking capability. In addition, the convex capillary connection structure can be connected with the VC upper-layer capillary structure and the VC lower-layer capillary structure at the same time, the contact area between the capillary connection structure and the VC upper-layer capillary structure and the VC lower-layer capillary structure is increased, and the heat dissipation capacity of the whole three-dimensional heat transfer structure is improved. And through set up the gas channel mouth on capillary connection structure, can realize the intercommunication between first cavity and the second cavity, realize the circulation of working medium steam.

In another possible design, the VC capillary structures include a VC upper layer capillary structure located at the top of the first cavity and a VC lower layer capillary structure located at the bottom of the first cavity. And a gas passage port for gas circulation is arranged on the heat pipe positioned in the first cavity, and the first cavity is communicated with the second cavity through the gas passage port. The hollow part of the heat pipe capillary structure is provided with at least one first capillary connection structure and at least one second capillary connection structure. The lateral part of the first capillary connection structure is attached to the inner wall of the heat pipe capillary structure, and the bottom of the first capillary connection structure is connected with the VC upper-layer capillary structure. The side part of the second capillary connection structure is attached to the inner wall of the heat pipe capillary structure, and the bottom of the second capillary connection structure is connected with the VC lower-layer capillary structure.

Under the condition, at least two capillary connection structures are arranged in the hollow part of the heat pipe capillary structure, the two capillary connection structures are attached to the side wall of the heat pipe capillary structure, one of the capillary connection structures is connected with the VC upper-layer capillary structure, the other capillary connection structure is connected with the VC lower-layer capillary structure, through the at least two capillary connection structures, the contact area between the heat pipe capillary structure and the VC upper-layer capillary structure is increased, the contact area between the heat pipe capillary structure and the VC lower-layer capillary structure is increased, so that the connection channel between the heat pipe capillary structure and the VC capillary structure is increased, the backflow capacity of the working medium is improved, and the improvement of the heat dissipation performance is realized.

Optionally, the gas channel port is a hole formed in the side surface of the heat pipe, the heat pipe capillary structure located at the gas channel port is flush with the gas channel port, and the heat pipe capillary structure is connected with the VC lower layer capillary structure. Under the condition, the gas channel port is arranged to be a hole in the side face of the heat pipe, the bottom end of the heat pipe capillary structure is a complete circle, when the heat pipe capillary structure is connected with the VC capillary structure, the heat pipe capillary structure can be connected with the VC capillary structure in a full perimeter mode, the contact area of the heat pipe capillary structure and the VC capillary structure in the axial direction of the heat pipe is maximized, and the heat dissipation performance is favorably improved.

Optionally, the first capillary connection comprises an "L" shaped capillary connection and the second capillary connection comprises a pillar-shaped and/or a boss-shaped capillary connection. In this case, the L-shaped capillary connection structure is more attached to the space structure between the inner wall of the heat pipe capillary structure and the VC upper-layer capillary structure, which is beneficial to improving the connection tightness between the inner wall of the heat pipe capillary structure and the VC upper-layer capillary structure; the columnar and/or boss-shaped capillary connection structure is beneficial to improving the connection tightness between the capillary connection structure and the inner wall of the heat pipe capillary structure and the VC lower-layer capillary structure.

Optionally, the bottom of the second capillary connection projects beyond the bottom of the heat pipe. Under the condition, the bottom of the second capillary connection structure protrudes out of the bottom of the heat pipe, so that the second capillary connection structure and the VC capillary structure are prevented from being insufficiently connected due to inclination of the heat pipe, and the tightness of connection between the second capillary connection structure and the VC capillary structure is favorably improved.

Optionally, one or more gas passage openings are provided in the heat pipe located in the first cavity. Under this condition, through setting up one or more gas passage mouth, be favorable to promoting the degree of connectivity between first cavity and the second cavity, realize that steam is in first cavity and second cavity.

Optionally, a portion of the heat pipe located outside the vapor chamber is flat. Under the condition, the flat heat pipes are adopted, so that the windward area of the heat pipes can be reduced, the windward resistance of the heat pipes can be reduced, the air quantity passing through the heat pipes is increased, and the heat dissipation performance is improved.

A second aspect of the present application provides a three-dimensional heat transfer device comprising fins and the three-dimensional heat transfer structure of any one of claims 1 to 14, the fins being disposed between heat pipes of the three-dimensional heat transfer structure. The fins are metal sheets with strong heat conductivity and are added on the surface of the heat exchange device for heat transfer so as to increase the heat exchange surface area of the heat exchange device, and the three-dimensional heat transfer device has the same technical effect as the three-dimensional heat transfer structure provided by the embodiment, and is not described in detail herein.

Optionally, the heat pipe heat exchanger further comprises a working medium, and the working medium is injected into the VC capillary structure, the heat pipe capillary structure and the capillary connecting structure in the three-dimensional heat transfer structure. The injection amount of the working medium is less than or equal to the sum of the absorption amounts of the VC capillary structure, the heat pipe capillary structure and the capillary connection structure to the working medium. Under the condition, the injection amount of the working medium is controlled not to exceed the sum of the absorption amounts of all the capillary structures, so that the working medium can be kept in the VC capillary structure in the evaporation area, the evaporation of the working medium cannot be influenced due to too much working medium, and the heat dissipation of the working medium is facilitated.

Drawings

Fig. 1 is a schematic diagram of an internal structure of a 3DVC provided in the prior art;

fig. 2 is a schematic structural diagram of a three-dimensional heat dissipation structure according to an embodiment of the present disclosure;

fig. 3 is a cross-sectional view of a vapor chamber in a three-dimensional heat dissipation structure according to an embodiment of the present disclosure;

fig. 4 is a schematic connection diagram of a three-dimensional heat dissipation structure according to an embodiment of the present disclosure and a cross-sectional view of a heat pipe in a direction a-a;

fig. 5 is a second connection diagram of a three-dimensional heat dissipation structure provided by the embodiment of the present application and a cross-sectional view of a heat pipe in a direction a1-a 1;

fig. 6 is a third schematic connection diagram of a three-dimensional heat dissipation structure provided in the present application and a cross-sectional view of a heat pipe in a direction a2-a 2;

FIG. 7 is a cross-sectional view of a heat pipe in the direction A3-A3 and four connection diagrams of a three-dimensional heat dissipation structure according to an embodiment of the present application;

FIG. 8 is a fifth schematic view of a connection of a three-dimensional heat dissipation structure and a cross-sectional view of a heat pipe in the direction A4-A4 according to an embodiment of the present application;

fig. 9 is a sixth schematic connection diagram of a three-dimensional heat dissipation structure according to an embodiment of the present application and a cross-sectional view of a heat pipe in a direction a5-a 5.

In the figure: 1-a temperature-equalizing plate; an 11-VC cover plate; a 12-VC backplane; 13-a first cavity; 14-cover plate interface; a 2-VC capillary structure; a 21-VC upper layer capillary structure; 22-VC lower layer capillary structure; 3-a heat pipe; 31-gas passage port; 32-a second cavity; 4-a heat pipe capillary structure; 5-capillary connection structure.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.

Herein, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.

Further, where directional terms such as "upper", "lower", etc., are defined herein with respect to a schematically-disposed orientation of a structure in the drawings, it is to be understood that such directional terms are relative concepts that are used for descriptive and clarity purposes relative to the structure, and that they may vary accordingly depending on the orientation in which the structure is disposed.

In addition, in the embodiments of the present application, words such as "exemplarily", "for example", etc. are used for indicating as examples, illustrations or explanations. Any embodiment or design described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Rather, the term using examples is intended to present concepts in a concrete fashion.

Referring to fig. 2 and 4, fig. 2 is a schematic structural diagram of a three-dimensional heat dissipation structure provided in an embodiment of the present application, and fig. 4 is a schematic connection diagram of a three-dimensional heat dissipation structure provided in an embodiment of the present application, and a cross-sectional view of a heat pipe 3 in a direction a-a. As shown in fig. 2 and 4, the three-dimensional heat transfer structure includes a temperature-uniforming plate 1 and a heat pipe 3, the temperature-uniforming plate 1 includes a first cavity 13, the heat pipe 3 includes a second cavity 32, the second cavity 32 is communicated with the first cavity 13 to form a three-dimensional cavity, and the heat pipe 3 is hermetically connected with the temperature-uniforming plate 1. The VC capillary structure 2 is arranged on the inner wall of the first cavity 13, the hollow heat pipe capillary structure 4 is arranged in the second cavity 32, the outer wall of the heat pipe capillary structure 4 is attached to the inner wall of the second cavity 32, and one end of the heat pipe capillary structure 4 is connected with the VC capillary structure 2. The hollow part of the heat pipe capillary structure 4 is provided with a capillary connection structure 5, and the capillary connection structure 5 at least comprises a first surface connected with the inner wall of the heat pipe capillary structure 4 and a second surface connected with the VC capillary structure 2. As shown in fig. 4, the heat pipe capillary structure 4, the capillary connection structure 5, and the VC capillary structure 2 form an integrated three-dimensional capillary structure within the three-dimensional cavity.

The working principle of the three-dimensional heat dissipation structure is as follows: and the three-dimensional cavity is vacuumized and then is filled with the working medium, and the working medium is adsorbed into the three-dimensional capillary structure due to the capillary force of the three-dimensional capillary structure. The bottom of the temperature-uniforming plate 1 is contacted with the chip, the place where the temperature-uniforming plate 1 is contacted with the chip is called an evaporation area, the chip generates heat when in work, the heat is led into the temperature-uniforming plate 1, working media in the evaporation area are heated and evaporated due to the heat conduction of the temperature-uniforming plate 1 and the heat conduction of a capillary structure in the temperature-uniforming plate 1, and the evaporated gas-phase working media are filled in the whole three-dimensional cavity. Because the heat pipe 3 is usually provided with fins for cooling, the temperature of the heat pipe 3 is lower, when the gas-phase working medium contacts the cooler area of the heat pipe 3, the gas-phase working medium is condensed into liquid-phase working medium on the wall of the heat pipe 3, and simultaneously, the heat is released to realize heat dissipation. The liquid phase working medium condensed on the inner wall of the heat pipe 3 is sucked back to the three-dimensional capillary structure due to the capillary force generated by the capillary structure in the hollow cavity of the heat pipe 3, and then returns to the evaporation area through the three-dimensional capillary structure to be continuously heated and gasified to take away heat, so that the continuous heat dissipation of the chip is realized. Through setting up not co-altitude heat pipe 3, the heat that the chip produced can be transmitted to the fin of heat pipe 3 corresponding height through this three-dimensional heat radiation structure, then is taken away by the air, realizes the normal work of chip. The working medium in the embodiment of the application is a liquid with high latent heat of vaporization, such as simple substances of water, methanol, acetone and the like or a mixture thereof.

Based on the three-dimensional heat transfer structure, the first cavity 13 is communicated with the second cavity 32, circulation of steam after heat absorption and evaporation of working media in the first cavity 13 and the second cavity 32 and backflow of the working media after condensation of the steam can be achieved, the connection position between the heat pipe 3 and the temperature-equalizing plate 1 is in sealing connection, and outflow of the steam formed after heat absorption of the working media can be avoided. VC capillary structure 2, heat pipe capillary structure 4 and capillary connection 5 all can absorb the working medium, and through laminating setting up heat pipe capillary structure 4 on the inner wall of second cavity 32, heat pipe capillary structure 4 can absorb the working medium that condenses on the inner wall of second cavity 32 as much as possible. By arranging the VC capillary structure 2 on the inner wall of the first cavity 13, the VC capillary structure 2 can absorb working media condensed on the inner wall of the first cavity 13 as much as possible. Connect heat pipe capillary structure 4 and VC capillary structure 2 through setting up capillary connection structure 5, and capillary connection structure 5 all adopts the mode of face connection between heat pipe capillary structure 4 and the VC capillary structure 2, the area of contact has been increased, capillary structure connected passage of large tracts of land has been formed between heat pipe capillary structure 4 and VC capillary structure 2, reduce the liquid return resistance of capillary structure junction, be favorable to the working medium that condenses on second cavity 32 inner wall to flow back to the evaporation zone of first cavity 13 and continue to be heated gasification and take away the heat, thereby promote this three-dimensional heat transfer structure's heat dispersion.

In an embodiment of the present application, the vapor chamber 1 may be a two-dimensional heat dissipation structure, which is a plate-shaped structure or a box-shaped structure having a vacuum cavity. Referring to fig. 2 and 3, fig. 2 is a schematic structural diagram of a three-dimensional heat dissipation structure provided in an embodiment of the present application, and fig. 3 is a cross-sectional view of a vapor chamber 1 in the three-dimensional heat dissipation structure provided in the embodiment of the present application. As shown in fig. 2 and 3, the temperature equalization plate 1 comprises a VC cover plate 11 and a VC base plate 12, and the VC cover plate 11 and the VC base plate 12 are hermetically connected to form a vacuum chamber. The heat pipe 3 can be arranged perpendicular to the temperature-uniforming plate 1, a cover plate interface 14 for connecting the heat pipe 3 is arranged on the VC cover plate 11, the heat pipe 3 is connected with the temperature-uniforming plate 1 through the cover plate interface 14, and the heat pipe 3 is connected with the cover plate interface 14 in a sealing mode. The interior of the heat pipe 3 is a hollow second cavity 32, which is communicated with the first cavity 13 in the temperature-uniforming plate 1 to form a three-dimensional cavity. The VC capillary structure 2 comprises a VC upper-layer capillary structure 21 and a VC lower-layer capillary structure 22, the VC upper-layer capillary structure 21 is attached to the bottom of the VC cover plate 11, and the VC lower-layer capillary structure 22 is attached to the top of the VC base plate 12.

The temperature equalizing plate 1 is arranged to be of a box-shaped structure consisting of the VC cover plate 11 and the VC bottom plate 12, production and processing are facilitated, the VC cover plate 11 and/or the VC bottom plate 12 can be arc-shaped plates with certain radian, and the edge parts of the VC cover plate 11 and/or the VC bottom plate 12 are directly connected in a sealing mode to form the box-shaped structure with the vacuum cavity. The VC cover plate 11 and the VC base plate 12 can also be two flat plates, and the peripheries of the two flat plates are hermetically connected through side plates to form a box-shaped structure with a vacuum cavity. The VC cover plate 11 is provided with a cover plate interface 14 to facilitate the connection of the heat pipe 3 and the vapor chamber 1, and the sealing connection in the embodiment of the present application may be a welding connection. The VC upper-layer capillary structure 21 is attached to the bottom of the VC cover plate 11, so that the VC upper-layer capillary structure 21 can better absorb the liquid-phase working medium condensed on the VC cover plate 11, the VC lower-layer capillary structure 22 is attached to the top of the VC base plate 12, and the VC lower-layer capillary structure 22 can better absorb the liquid-phase working medium condensed on the VC base plate 12.

In an embodiment of the present application, the first surface of the capillary connection structure 5 includes a curved surface corresponding to the inner wall of the heat pipe capillary structure 4, and the second surface of the capillary connection structure 5 includes a flat surface adapted to be connected to the VC capillary structure 2.

Because the heat pipe 3 is generally ring-shaped, the inner wall of the heat pipe 3 is a ring-shaped cambered surface, the first surface of the capillary connection structure 5 comprises a curved surface which is arranged corresponding to the inner wall of the heat pipe capillary structure 4, namely, the surface of the capillary structure, which is in contact with the inner wall of the heat pipe 3, is arranged as a ring-shaped cambered surface with the same diameter as the inner wall of the heat pipe 3, so that the capillary connection structure 5 and the heat pipe capillary structure 4 are more tightly attached and more fully connected, and the working medium can flow back to the capillary connection structure 5 from the heat pipe capillary structure 4; the second surface of the capillary connection mechanism comprises a plane adaptive to the VC capillary structure 2, the planar capillary structure is convenient to process, the plane is connected with the plane, the fitting degree is high, the connection degree between the capillary connection structure 5 and the VC capillary structure 2 is improved, and the working medium can flow back to the VC capillary structure 2 from the capillary connection structure 5, so that the capillary connection structure 5 can be a better working medium backflow channel.

It should be noted that, in this embodiment, specific shapes of the first surface and the second surface are not specifically limited, and it is only required that the first surface is attached to the inner wall of the heat pipe 3 and the second surface is attached to the connection surface of the VC capillary structure 2, which is connected to the second surface, and the first surface and the second surface are specifically configured adaptively according to the shape of the inner wall of the heat pipe 3 and the shape of the VC capillary structure 2. If the heat pipe 3 is a square pipe, the first surface may be a plane or a surface formed by two perpendicular planes. If the surface of the VC capillary structure 2 connected to the capillary connection structure 5 is a curved surface, the second surface is also set to be a curved surface correspondingly.

In an embodiment of the present application, the height of the portion where the capillary connection structure 5 is connected to the inner wall of the heat pipe capillary structure 4 is less than or equal to the height of the second cavity 32. In this case, the higher the height of the portion of the capillary connection structure 5 connected to the inner wall of the heat pipe capillary structure 4 is, the larger the contact area between the capillary connection structure 5 and the heat pipe capillary structure 4 is, and the more favorable the backflow of the working medium is, so that the height of the portion of the capillary connection structure 5 connected to the inner wall of the heat pipe capillary structure 4 can be the highest height of the second cavity 32. In this embodiment, the specific height of the portion where the capillary connection structure 5 and the inner wall of the heat pipe capillary structure 4 are connected is not limited, and may be determined according to the contact area between the capillary connection structure and the heat pipe capillary structure, the weight or the cost of the capillary connection structure 5, and other factors in practical situations.

In one embodiment of the present application, the shape of the capillary connection structure 5 includes one or more of an "L" shape, a "convex" shape, and a columnar shape. The shape of the capillary structure of the "L" type may be as shown in fig. 5, 9, the shape of the capillary structure of the convex "type may be as shown in fig. 7, 8, and the shape of the capillary structure of the columnar type may be as shown in fig. 4, 6, or 9. Adopt "L" type, "protruding" type or cylindrical capillary connection structure 5, its lateral part and bottom all can set up to great face, and capillary connection structure 5 of shape like this, its lateral part can conveniently be connected with the inner wall of heat pipe capillary structure 4, and meanwhile, its bottom can conveniently be connected with the top or the bottom of VC capillary mechanism, be favorable to promoting the area of contact between capillary connection structure 5 and heat pipe capillary structure 4 and VC capillary structure 2 to form the capillary structure connected passage of large tracts of land.

The shape of the capillary connection structure 5 does not affect the achievement of the object of the present application, the shape of the capillary connection structure 5 can be set according to the connection requirement or other requirements, and the specific shape of the capillary connection structure 5 is not limited in the embodiment of the present application.

In an embodiment of the present application, the hollow part of the heat pipe capillary structure 4 is provided with one or more capillary connection structures 5. Capillary connection structure 5 is a capillary structure linking channel that supplies the working medium backward flow between heat pipe capillary structure 4 and VC capillary structure 2, sets up a capillary structure for the area of contact between heat pipe capillary structure 4 and the VC capillary structure 2 can satisfy the requirement of working medium backward flow, is favorable to reducing the liquid resistance of returning of working medium at the capillary structure junction like this, improves the liquid speed and the volume of returning of working medium, thereby realizes the promotion of heat dispersion. And set up a plurality of capillary structures, can promote the area of contact between heat pipe capillary structure 4 and VC capillary structure 2 better to realize the backward flow of working medium better, its purpose is also to realize better heat dispersion. When a plurality of capillary structures are arranged, a certain channel needs to be reserved to realize the communication between the first cavity 13 and the second cavity 32 and realize the normal flow of the gas-phase working medium.

In an embodiment of the present application, referring to fig. 4, fig. 4 is a schematic connection diagram of a three-dimensional heat dissipation structure provided in the embodiment of the present application, and a cross-sectional view of a heat pipe 3 in a direction a-a, where arrows in the diagram indicate a flow direction of a gas-phase working medium. As shown in fig. 4, the VC capillary structure 2 includes a VC upper layer capillary structure 21 at the top of the first cavity 13 and a VC lower layer capillary structure 22 at the bottom of the first cavity 13. The VC upper layer capillary structure 21 and the VC lower layer capillary structure 22 can be integrally formed; or two independent capillary structures can be connected together to form the VC capillary structure 2. The heat pipe 3 located in the first cavity 13 is provided with a gas passage port 31 for gas to flow through, and the gas passage port 31 connects the first cavity 13 and the second cavity 32. The gas channel opening 31 in this embodiment may be a gas through hole formed in the sidewall of the heat pipe 3, or may be a notch formed by removing a portion of the bottom of the sidewall of the heat pipe 3. The present embodiment does not limit the specific form of the gas passage port 31, and the gas passage port 31 only needs to communicate the first cavity 13 with the second cavity 32, so that the gas passage port 31 includes an opening on the heat pipe 3 and an opening on the heat pipe capillary structure 4. The heat pipe capillary structure 4 is connected with the VC lower-layer capillary structure 22, so that the heat pipe capillary structure 4 is directly contacted with the VC capillary structure 2, and the liquid-phase working medium flows. The first surface of the capillary connection structure 5 is attached to the inner wall of the heat pipe capillary structure 4, and the second surface of the capillary connection structure 5 is connected with the VC lower-layer capillary structure 22. In this embodiment, as shown in fig. 3, the first surface of the capillary connecting structure 5 refers to a left side surface of the capillary structure, the left side surface is a curved surface in a circular arc shape, and the second surface of the capillary structure refers to a bottom surface of the capillary structure, and the bottom surface is a plane. The left side surface of the capillary structure is attached to the inner wall of the heat pipe 3, and the bottom surface of the capillary structure is attached to the VC lower-layer capillary structure 22, so that the contact area between the heat pipe capillary structure 4 and the VC lower-layer capillary structure 22 is indirectly increased.

In this embodiment, the first cavity 13 is communicated with the second cavity 32 by providing the porous gas passage port 31, so that the steam generated by the heat absorption and evaporation of the working medium in the first cavity 13 can enter the second cavity 32 for heat dissipation. The heat pipe capillary structure 4 is connected with the VC lower-layer capillary structure 22, so that the heat pipe capillary structure 4 and the VC lower-layer capillary structure 22 are directly connected, and the working medium can directly flow back into the VC lower-layer capillary structure 22 from the heat pipe capillary structure 4; through the first face with capillary connection structure 5 and the inner wall connection of heat pipe capillary structure 4, connect capillary connection structure 5's second face and VC lower floor capillary structure 22 directly, make during working medium directly flow back to VC lower floor capillary structure 22 that is closer to the evaporation zone from heat pipe capillary structure 4 through capillary connection structure 5, and adopt the mode of face joint, the area of contact between the capillary structure has been increased, the backward flow channel of working medium has been increased, and the connection of large tracts of land between the capillary structure has reduced the resistance that the working medium flows back, be favorable to the working medium to flow back to the evaporation zone, thereby realize the improvement of heat dispersion.

On the basis of any of the above embodiments, the bottom of the heat pipe capillary structure 4 protrudes out of the bottom of the heat pipe 3, and the bottom of the capillary connection structure 5 protrudes out of the bottom of the heat pipe 3. When the heat pipe capillary structure 4 is connected with the VC capillary structure 2 and the capillary connection structure 5 is connected with the VC capillary structure 2, since the strength of the heat pipe 3 is large, if the heat pipe 3 is inclined at a certain angle when being set, the heat pipe capillary structure 4 and the capillary connection structure 5 cannot be sufficiently connected with the VC capillary structure 2, resulting in a reduction in contact area. If the bottom of the heat pipe capillary structure 4 and the bottom of the capillary connection structure 5 are partially protruded out of the bottom of the heat pipe 3, the strength of the heat pipe capillary structure 4 and the strength of the capillary connection structure 5 are smaller than that of the heat pipe 3, so that the heat pipe capillary structure 4 and the VC capillary structure 2 are easier to extrude, the insufficient connection of the heat pipe capillary structure 4 and the VC capillary structure 2 and the insufficient connection of the capillary connection structure 5 and the VC capillary structure 2 caused by the inclination of the heat pipe 3 can be prevented, the contact area between the heat pipe capillary structure 4 and the capillary connection structure 5 as well as the VC capillary structure 2 is increased, the reflux capacity of the working medium is improved, and the heat dissipation capacity is improved.

In an embodiment of the present application, referring to fig. 6, fig. 6 is a third schematic connection diagram of a three-dimensional heat dissipation structure provided in the embodiment of the present application, and a cross-sectional view of the heat pipe 3 in a direction a2-a 2. As shown in fig. 6, the VC capillary structure 2 includes a VC upper layer capillary structure 21 located on the top of the first cavity 13, and the VC upper layer capillary structure 21 is the VC capillary structure 2 located on the upper wall of the first cavity 13. The heat pipe 3 located in the first cavity 13 is provided with a gas passage port 31 for gas to flow through, and the gas passage port 31 connects the first cavity 13 and the second cavity 32. The gas passage opening 31 may be a gas through hole formed in the sidewall of the heat pipe 3, a notch formed by removing a portion of the bottom of the sidewall of the heat pipe 3, or a bottom opening of the second cavity 32 in the heat pipe 3, where the gas passage opening 31 in this embodiment is the bottom opening of the second cavity 32. The heat pipe capillary structure 4 is connected with the VC upper layer capillary structure 21, so that the direct connection between the heat pipe capillary structure 4 and the VC capillary structure 2 is realized, and the liquid phase working medium can directly flow back to the VC capillary structure 2 from the heat pipe capillary structure 4. The first surface of the capillary connection structure 5 is attached to the inner wall of the heat pipe capillary structure 4, the second surface of the capillary connection structure 5 is connected with the VC upper-layer capillary structure 21, at the moment, the VC upper-layer capillary structure 21 exceeds a part of the heat pipe 3, and the capillary connection structure 5 is directly connected to the top surface of the VC capillary structure 2. In the present embodiment, the capillary connecting structure 5 has a column shape as shown in fig. 6, the first surface is a left side surface of the capillary connecting structure 5, and the left side surface is a curved surface in a circular arc shape; the second face is the bottom face of the capillary connection 5, which is a plane.

Under this condition, through linking to each other heat pipe capillary structure 4 and VC upper capillary structure 21, the first face with capillary connection structure 5 and the inner wall laminating of heat pipe capillary structure 4, the second face and the VC upper capillary structure 21 of capillary connection structure 5 directly link to each other, the increase of area of contact between heat pipe capillary structure 4 and the VC upper capillary structure 21 has been realized, the effect of working medium backward flow has been promoted, and the working medium can get back to the evaporating zone in first cavity 13 through VC upper capillary structure 21 and absorb heat, such setting has also realized the promotion to three-dimensional heat transfer structure heat dispersion.

On the basis of the above embodiments, referring to fig. 5, fig. 5 is a second schematic connection diagram of a three-dimensional heat dissipation structure provided in the embodiments of the present application, and a cross-sectional view of the heat pipe 3 in the direction of a1-a 1. As shown in fig. 5, the capillary connection structure 5 is L-shaped, the left side surface of the vertical portion of the capillary connection structure 5 is attached to the inner wall of the heat pipe capillary structure 4, the top surface of the horizontal portion of the capillary connection structure 5 is connected to the bottom of the VC upper layer capillary structure 21, and at this time, the VC upper layer capillary structure 21 located at the connection position of the heat pipe 3 is flush with the inner wall of the heat pipe 3. In this embodiment, the first surface is a left side surface of the vertical capillary structure portion, and the left side surface is a curved surface in a circular arc shape; the second surface is a top surface of the horizontal part of the capillary structure, and the top surface is a plane.

Under this condition, through setting capillary connection structure 5 to "L" type, accord with the spatial structure who forms between inner wall and the VC upper capillary structure 21 of heat pipe capillary structure 4, make capillary connection structure 5's first face more laminate with heat pipe capillary structure 4's inner wall, simultaneously, make capillary connection structure 5's second face also more laminate with VC upper capillary structure 21, the connectivity between the above-mentioned capillary structure has been promoted, be favorable to reducing the backward flow resistance of working medium, thereby realize the promotion to heat dispersion.

In an embodiment of the present application, referring to fig. 7 and 8, fig. 7 is a fourth schematic connection diagram of a three-dimensional heat dissipation structure and a sectional view of a heat pipe 3 in a direction of A3-A3 provided in an embodiment of the present application, and fig. 8 is a fifth schematic connection diagram of a three-dimensional heat dissipation structure and a sectional view of a heat pipe 3 in a direction of a4-a4 provided in an embodiment of the present application. As shown in fig. 7 and 8, the VC capillary structure 2 includes a VC upper layer capillary structure 21 located at the top of the first cavity 13 and a VC lower layer capillary structure 22 located at the bottom of the first cavity 13. The heat pipe capillary structure 4 is connected with the VC upper-layer capillary structure 21, the VC upper-layer capillary structure 21 at the joint of the heat pipe 3 is flush with the inner wall of the heat pipe 3, the capillary connecting structure 5 is in a convex shape, the upper side part of the capillary connecting structure 5 is attached to the inner wall of the heat pipe capillary structure 4, and the bottom of the capillary connecting structure 5 is connected with the VC lower-layer capillary structure 22. The upper side in this embodiment refers to the side of the upper part of the "convex" capillary connection structure 5, and is also the first side of the capillary connection structure 5, in this case, the first side is the side of a cylinder with the same diameter as the diameter of the inner wall of the capillary connection structure 5, and the height of the cylinder is the height of the overlapping part of the heat pipe capillary structure 4 and the capillary connection structure 5. The second surface is the bottom surface of the convex capillary connecting structure 5, the bottom surface is a plane, and the bottom surface can be a circle, a square or other shapes. The capillary connection structure 5 is provided with a gas passage port 31 for gas to flow through, and the gas passage port 31 connects the first cavity 13 and the second cavity 32. The gas passage port 31 in this embodiment is a passage or a plurality of passages in the capillary connecting structure 5, and the shape of the passage may be an inverted "T" shape or an "L" shape.

In this case, by providing the "convex" capillary connection structure 5, the bottom area of the "convex" capillary connection structure 5 is large, and the contact area between the capillary connection structure 5 and the VC lower-layer capillary structure 22 can be increased, so that the connection channel between the heat pipe capillary structure 4 and the VC capillary structure 2 is increased, the backflow capability of the working medium is improved, and the heat dissipation capability is improved, as shown in fig. 8, only the bottom surface of the "convex" capillary structure is connected with the VC capillary structure 2 at this time. In addition, the convex capillary connection structure 5 can be connected with the VC upper layer capillary structure 21 and the VC lower layer capillary structure 22 at the same time, as shown in fig. 7, the top surface and the bottom surface of the lower part of the convex capillary connection structure 5 are connected with the VC capillary structure 2 at the same time, the contact area between the capillary connection structure 5 and the VC upper layer capillary structure 21 and the VC lower layer capillary structure 22 is increased, and the heat dissipation capability of the whole three-dimensional heat transfer structure is improved. And the gas channel port 31 is arranged on the capillary connection structure 5, so that the first cavity 13 and the second cavity 32 can be communicated, and the circulation of working medium steam is realized.

In an embodiment of the present application, referring to fig. 9, fig. 9 is a sixth schematic connection diagram of a three-dimensional heat dissipation structure provided in the embodiment of the present application, and a cross-sectional view of the heat pipe 3 in a direction a5-a 5. As shown in fig. 9, the VC capillary structure 2 includes a VC upper layer capillary structure 21 at the top of the first cavity 13 and a VC lower layer capillary structure 22 at the bottom of the first cavity 13. The heat pipe 3 located in the first cavity 13 is provided with a gas passage port 31 for gas to flow through, the gas passage port 31 connects the first cavity 13 and the second cavity 32, and the gas passage port 31 is a notch formed by removing a part of the bottom of the sidewall of the heat pipe 3 in this embodiment. The hollow part of the heat pipe capillary structure 4 is provided with at least one first capillary connection structure 5 and at least one second capillary connection structure 5. The side part of the first capillary connection structure 5 is attached to the inner wall of the heat pipe capillary structure 4, and the bottom of the first capillary connection structure 5 is connected with the VC upper layer capillary structure 21. The first capillary connection structure 5 may be an "L" type capillary connection structure 5 shown in fig. 5, or may be a pillar type capillary connection structure 5 shown in fig. 6. The side part of the second capillary connection structure 5 is attached to the inner wall of the heat pipe capillary structure 4, the bottom part of the second capillary connection structure 5 is connected to the VC lower layer capillary structure 22, and the second capillary connection structure 5 may be a columnar capillary structure shown in fig. 4, may also be an "L" type capillary connection structure 5, and may also be a capillary connection structure 5 of other shapes.

Under the condition, at least two capillary connection structures 5 are arranged in the hollow part of the heat pipe capillary structure 4, the two capillary connection structures 5 are attached to the side wall of the heat pipe capillary structure 4, one capillary connection structure 5 is also connected with the VC upper-layer capillary structure 21, the other capillary connection structure 5 is also connected with the VC lower-layer capillary structure 22, and through the at least two capillary connection structures 5, the contact area between the heat pipe capillary structure 4 and the VC upper-layer capillary structure 21 is increased, the contact area between the heat pipe capillary structure 4 and the VC lower-layer capillary structure 22 is increased, so that a connection channel between the heat pipe capillary structure 4 and the VC capillary structure 2 is increased, the backflow capacity of working media is improved, and the improvement of heat dissipation performance is realized.

In an embodiment of the present application, the gas channel opening 31 is a hole formed on a side surface of the heat pipe 3, the heat pipe capillary structure 4 located at the gas channel opening 31 is flush with the gas channel opening 31, and the heat pipe capillary structure 4 is connected to the VC lower layer capillary structure 22. Under the condition, the gas channel port 31 is arranged as a hole on the side surface of the heat pipe 3, so that the bottom end of the heat pipe capillary structure 4 is a complete circle, when the heat pipe capillary structure 4 is connected with the VC capillary structure 2, the heat pipe capillary structure 4 can be connected with the VC capillary structure 2 in a full perimeter manner, the contact area of the heat pipe capillary structure 4 and the VC capillary structure 2 in the axial direction of the heat pipe 3 is maximized, and the heat dissipation performance is favorably improved.

In an embodiment of the present application, the first capillary connection structure 5 may be an "L" shaped capillary connection structure 5, and the second capillary connection structure 5 may be a pillar-shaped and/or a boss-shaped capillary connection structure 5. In this case, the "L" -shaped capillary connection structure 5 is more attached to the space structure between the inner wall of the heat pipe capillary structure 4 and the VC upper layer capillary structure 21, which is beneficial to improving the connection tightness between the inner wall of the heat pipe capillary structure 4 and the VC upper layer capillary structure 21; the columnar and/or convex-shaped capillary connecting structures 5 are beneficial to improving the connection tightness between the inner wall of the heat pipe capillary structure 4 and the VC lower-layer capillary structure 22. The shapes of the first capillary connection structure 5 and the second capillary connection structure 5 do not affect the implementation of the object of the present application, and the shapes of the first capillary connection structure 5 and the second capillary connection structure 5 may be set according to processing requirements, connection requirements, or other requirements, which is not limited in the embodiment of the present application.

On the basis of the above embodiment, the bottom of the second capillary connection 5 protrudes beyond the bottom of the heat pipe 3. In this case, by protruding the bottom of the second capillary connection structure 5 from the bottom of the heat pipe 3, the second capillary connection structure 5 and the VC capillary structure 2 may be prevented from being insufficiently connected due to the inclination of the heat pipe 3, which is beneficial to improving the connection tightness between the second capillary connection structure 5 and the VC capillary structure 2.

In one embodiment of the present application, one or more gas passage ports 31 are disposed on the heat pipe 3 located in the first cavity 13. In this case, one or more gas passage openings 31 are provided, which is beneficial to improve the communication degree between the first cavity 13 and the second cavity 32, and thus, the steam is in the first cavity 13 and the second cavity 32. In this embodiment, the bottom opening of the second cavity 32 in the heat pipe 3 is also within the range of one or more gas passage openings 31 provided in the heat pipe 3 in the first cavity 13.

In an embodiment of the present application, a portion of the heat pipe 3 located outside the vapor chamber 1 is flat. The heat pipe 3 in the temperature equalizing plate 1 is circular, and the circular heat pipe 3 and the flat heat pipe 3 are connected through a transition section.

In this case, the flat heat pipes 3 are used, so that the windward area of the heat pipes 3 can be reduced, the windward resistance of the heat pipes 3 can be reduced, the air volume passing through the heat pipes 3 can be increased, and the heat dissipation performance can be improved.

Based on the same inventive concept, an embodiment of the present application provides a three-dimensional heat transfer device, which includes fins and the three-dimensional heat transfer structure provided in any of the above embodiments, wherein the fins are disposed between the heat pipes 3 of the three-dimensional heat transfer structure. The fins are metal sheets with strong heat conductivity and are added on the surface of the heat exchange device for heat transfer so as to increase the heat exchange surface area of the heat exchange device, and the three-dimensional heat transfer device has the same technical effect as the three-dimensional heat transfer structure provided by the embodiment, and is not described in detail herein.

In an embodiment of the present application, the three-dimensional heat transfer device further includes a working medium, and the working medium is injected into the VC capillary structure 2, the heat pipe capillary structure 4, and the capillary connection structure 5 in the three-dimensional heat transfer structure. The injection amount of the working medium is less than or equal to the sum of the absorption amounts of the VC capillary structure 2, the heat pipe capillary structure 4 and the capillary connecting structure 5 to the working medium.

Under the condition, the injection amount of the working medium is controlled not to exceed the sum of the absorption amounts of all the capillary structures, so that the working medium can be kept in the VC capillary structure 2 in the evaporation area, the evaporation of the working medium cannot be influenced due to too much working medium amount, and the heat dissipation of the working medium is facilitated.

It should be understood that the term "and/or" herein is merely one type of association relationship that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone, wherein A and B can be singular or plural. In addition, the "/" in this document generally indicates that the former and latter associated objects are in an "or" relationship, but may also indicate an "and/or" relationship, which may be understood with particular reference to the former and latter text.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

While preferred embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the true scope of the embodiments of the application.

Finally, it should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The three-dimensional heat transfer structure and the three-dimensional heat transfer device provided by the present application are described in detail, and specific examples are applied herein to illustrate the principles and embodiments of the present application, and the description of the examples is only used to help understand the method and the core concept of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. A three-dimensional heat transfer structure is characterized by comprising a temperature equalizing plate and a heat pipe, wherein the temperature equalizing plate comprises a first cavity, and the heat pipe comprises a second cavity;

the second cavity is communicated with the first cavity, and the heat pipe is hermetically connected with the temperature-equalizing plate;

the inner wall of the first cavity is provided with a VC capillary structure, the second cavity is internally provided with a hollow heat pipe capillary structure, the outer wall of the heat pipe capillary structure is attached to the inner wall of the second cavity, and one end of the heat pipe capillary structure is connected with the VC capillary structure;

the heat pipe capillary structure is characterized in that a capillary connection structure is arranged in the hollow part of the heat pipe capillary structure, and the capillary connection structure at least comprises a first surface connected with the inner wall of the heat pipe capillary structure and a second surface connected with the VC capillary structure.

2. The three-dimensional heat transfer structure of claim 1, wherein the first face of the capillary connection structure comprises a curved surface disposed corresponding to the inner wall of the heat pipe capillary structure, and the second face of the capillary connection structure comprises a flat surface adapted to connect with the VC capillary structure.

3. The three-dimensional heat transfer structure according to claim 1 or 2, wherein a height of a portion where the capillary connection structure and the inner wall of the heat pipe capillary structure are connected is less than or equal to a height of the second cavity.

4. The three-dimensional heat transfer structure according to any one of claims 1 to 3, wherein the shape of the capillary connection structure includes one or more of an "L" shape, a "convex" shape, and a columnar shape.

5. The three-dimensional heat transfer structure according to any one of claims 1 to 4, wherein the hollow portion of the heat pipe capillary structure is provided with one or more capillary connection structures.

6. The three-dimensional heat transfer structure according to any one of claims 1 to 5, wherein the VC capillary structure comprises a VC upper layer capillary structure located at the top of the first cavity and a VC lower layer capillary structure located at the bottom of the first cavity;

a gas channel port for gas to flow is formed in the heat pipe positioned in the first cavity, and the first cavity is communicated with the second cavity through the gas channel port;

the heat pipe capillary structure is connected with the VC lower-layer capillary structure, the first surface of the capillary connecting structure is attached to the inner wall of the heat pipe capillary structure, and the second surface of the capillary connecting structure is connected with the VC lower-layer capillary structure.

7. The three-dimensional heat transfer structure of claim 6, wherein the bottom of the heat pipe capillary structure protrudes the bottom of the heat pipe, and the bottom of the capillary connection structure protrudes the bottom of the heat pipe.

8. The three-dimensional heat transfer structure according to any one of claims 1 to 5, wherein the VC capillary structure comprises a VC upper layer capillary structure located at the top of the first cavity;

the heat pipe capillary structure is connected with the VC upper-layer capillary structure, the first surface of the capillary connecting structure is attached to the inner wall of the heat pipe capillary structure, and the second surface of the capillary connecting structure is connected with the VC upper-layer capillary structure.

9. The three-dimensional heat transfer structure of claim 8, wherein the capillary connection structure is in an "L" shape, the vertical part of the capillary connection structure is attached to the inner wall of the heat pipe capillary structure, and the horizontal part of the capillary connection structure is connected to the bottom of the upper capillary structure of the VC.

10. The three-dimensional heat transfer structure according to any one of claims 1 to 5, wherein the VC capillary structure comprises a VC upper layer capillary structure located at the top of the first cavity and a VC lower layer capillary structure located at the bottom of the first cavity;

the heat pipe capillary structure is connected with the VC upper-layer capillary structure, the capillary connecting structure is in a convex shape, the upper side part of the capillary connecting structure is attached to the inner wall of the heat pipe capillary structure, and the bottom of the capillary connecting structure is connected with the VC lower-layer capillary structure;

and a gas passage port for gas circulation is arranged on the capillary connection structure, and the first cavity is communicated with the second cavity through the gas passage port.

11. The three-dimensional heat transfer structure according to any one of claims 1 to 5, wherein the VC capillary structure comprises a VC upper layer capillary structure located at the top of the first cavity and a VC lower layer capillary structure located at the bottom of the first cavity;

a gas channel opening for gas to flow is formed in the heat pipe positioned in the first cavity, and the first cavity is communicated with the second cavity through the gas channel opening;

the hollow part of the heat pipe capillary structure is provided with at least one first capillary connecting structure and at least one second capillary connecting structure;

the side part of the first capillary connection structure is attached to the inner wall of the heat pipe capillary structure, and the bottom of the first capillary connection structure is connected with the VC upper-layer capillary structure;

the side part of the second capillary connection structure is attached to the inner wall of the heat pipe capillary structure, and the bottom of the second capillary connection structure is connected with the VC lower-layer capillary structure.

12. The three-dimensional heat transfer structure of claim 11, wherein the gas passage opening is a hole formed in the side surface of the heat pipe, the heat pipe capillary structure at the gas passage opening is flush with the gas passage opening, and the heat pipe capillary structure is connected with the VC lower layer capillary structure.

13. The three-dimensional heat transfer structure according to claim 11 or 12, wherein the first capillary connection structure comprises an "L" -shaped capillary connection structure, and the second capillary connection structure comprises a pillar-shaped and/or a boss-shaped capillary connection structure.

14. The three-dimensional heat transfer structure according to any one of claims 11 to 13, wherein the bottom of the second capillary connection protrudes from the bottom of the heat pipe.

15. The three-dimensional heat transfer structure according to any one of claims 6 to 11, wherein one or more gas passage ports are provided on the heat pipe located in the first cavity.

16. The three-dimensional heat transfer structure according to any one of claims 1 to 15, wherein a portion of the heat pipe located outside the temperature-uniforming plate is flat.

17. A three-dimensional heat transfer device comprising fins and the three-dimensional heat transfer structure of any one of claims 1 to 14, the fins being disposed between the heat pipes of the three-dimensional heat transfer structure.

18. The three-dimensional heat transfer device of claim 17, further comprising a working medium injected into the VC capillary structures, the heat pipe capillary structures, and the capillary connection structures in the three-dimensional heat transfer structure;

the injection amount of the working medium is less than or equal to the sum of the absorption amounts of the VC capillary structure, the heat pipe capillary structure and the capillary connection structure to the working medium.