CN114698328A - Fluid cooling type heat radiation module - Google Patents

Abstract

The invention provides a fluid cooling type heat dissipation module which is used for solving the problem that the heat dissipation efficiency of the existing temperature equalization plate is poor. The method comprises the following steps: the device comprises a body, a plurality of first laminated plates and a plurality of second laminated plates, wherein the first laminated plates and the adjacent second laminated plates are stacked, a cavity is arranged between each first laminated plate and the corresponding adjacent second laminated plate, the cavities are communicated at intervals, so that the communicated cavities form a phase change cavity together, the phase change cavity is in a closed state and is filled with phase change liquid, and the communicated cavities form a fluid cavity together; and two fluid delivery parts communicating with the fluid chamber.

Description

Fluid cooling type heat radiation module

Technical Field

The present invention relates to a heat dissipation module, and more particularly, to a fluid-cooled heat dissipation module that conducts heat energy to a circulating fluid through a phase change fluid and carries away the heat energy by the circulating fluid.

Background

In order to avoid local overheating of an electronic device, in the current heat dissipation mode of the electronic device, a temperature-equalizing plate is mainly arranged in the electronic device and can be attached to a heating area of the electronic device; therefore, heat energy generated by the heating area can be diffused to the temperature equalizing plate, so that the heat energy is effectively prevented from being gathered in the heating area, and the heat dissipation effect can be realized.

In the conventional temperature equalizing plate, even if the heating area can heat the working liquid and vaporize the working liquid, the gaseous working liquid is evaporated to one side far away from the heating area to release heat and then is condensed and carries away the heat of the heating area; however, since the temperature equalization plate only dissipates heat through the gas-liquid phase change of the working liquid, the heat dissipation effect of the temperature equalization plate on the heating area is limited, resulting in poor heat dissipation efficiency.

Accordingly, there is a need for an improved fluid-cooled heat dissipation module.

Disclosure of Invention

To solve the above problems, an object of the present invention is to provide a fluid cooling type heat dissipation module, which can improve the heat dissipation efficiency.

Another objective of the present invention is to provide a fluid-cooled heat dissipation module, which can improve the assembly convenience.

It is another object of the present invention to provide a fluid-cooled heat dissipation module, which can reduce the manufacturing cost.

It is still another object of the present invention to provide a fluid cooling type heat dissipation module, which can improve heat exchange efficiency.

All directions or similar expressions such as "front", "back", "left", "right", "top", "bottom", "inner", "outer", "side", etc. are mainly referred to the directions of the drawings, and are only used for assisting the description and understanding of the embodiments of the present invention, and are not used to limit the present invention.

The use of the terms a or an for the elements and components described throughout this disclosure are for convenience only and provide a general sense of the scope of the invention; in the present invention, it is to be understood that the singular includes plural unless it is obvious that it is meant otherwise.

The terms "combined", "combined" and "assembled" as used herein include the form of the components being connected and separated without destroying the components, or the components being connected and separated without destroying the components, which can be selected by those skilled in the art according to the materials and assembling requirements of the components to be connected.

The fluid cooling type heat dissipation module of the present invention comprises: the device comprises a body, a plurality of first laminated plates and a plurality of second laminated plates, wherein the first laminated plates and the adjacent second laminated plates are stacked, a cavity is arranged between each first laminated plate and the corresponding adjacent second laminated plate, the cavities are communicated at intervals, so that the communicated cavities form a phase change cavity together, the phase change cavity is in a closed state and is filled with phase change liquid, and the communicated cavities form a fluid cavity together; and two fluid delivery parts communicating with the fluid chamber.

Therefore, in the fluid cooling type heat dissipation module of the present invention, the phase change liquid in the phase change chamber can absorb heat energy from a liquid state and evaporate into a gaseous state, so that the phase change liquid in the phase change chamber can absorb heat energy of a heat source, the phase change liquid can realize heat transfer by using a gas-liquid phase change mechanism, and the circulating fluid in the fluid chamber can rapidly absorb heat energy in the phase change chamber, so that the phase change liquid in the phase change chamber can be rapidly condensed from the gaseous state into the liquid state to absorb heat, the circulating fluid in the fluid chamber can further cool the phase change liquid in the phase change chamber, and the effect of improving the good heat dissipation performance can be achieved.

Wherein, the two fluid transmission parts can be arranged diagonally and connected with the body. Therefore, the circulating fluid has a larger flowing range, can smoothly flow and take away heat energy, so that the heat energy is not easy to stay in the body, and has the effect of improving the heat dissipation efficiency.

The plurality of first stacked plates may each have a plurality of first protrusions, the first protrusion may have a first through hole, the plurality of second stacked plates may each have a plurality of second protrusions, the second protrusion may have a second through hole, any one of the first protrusions is connected to an adjacent second protrusion and the first through hole is communicated with the second through hole, at least one side through hole may be additionally provided for two of the first protrusions located in the phase change chamber, at least one side through hole may be additionally provided for two of the second protrusions located in the fluid chamber, so that the second protrusion connected to the first protrusion having the side through hole may have no side through hole, and the first protrusion connected to the second protrusion having the side through hole may have no side through hole. Therefore, the structure is simple and convenient to assemble, and has the effect of improving the assembly convenience.

The body may have a plurality of connection pipes, the plurality of connection pipes may penetrate through and combine the first connection holes of the plurality of first stacked plates and the second connection holes of the plurality of second stacked plates, the tube walls of the plurality of connection pipes may have a plurality of through holes, the plurality of through holes of two of the plurality of connection pipes may be communicated with the phase change chamber, and the plurality of through holes of the other two of the plurality of connection pipes may be communicated with the fluid chamber. Therefore, the structure is simple and convenient to assemble, and has the effect of improving the assembly convenience.

The body may have a plurality of first posts connected to the plurality of first stacked plates and located in the phase change chamber. Therefore, the contact area between the first laminated plate and the phase change liquid can be increased, the heat exchange efficiency can be improved, and the heat dissipation efficiency can be improved.

The body may have a plurality of second protruding columns, the plurality of second protruding columns are connected to the plurality of second stacked plates and located in the fluid chamber, and a distribution density of the plurality of second protruding columns may be greater than a distribution density of the plurality of first protruding columns. Therefore, the phase change chamber is prevented from being occupied by too many first convex columns, the contact area between the second laminated plate and the circulating fluid can be increased, and the heat energy of the phase change liquid can be taken away through the continuous circulating flow of the circulating fluid, so that the heat exchange efficiency can be greatly improved, and the heat dissipation effect can be improved.

Wherein the plurality of first stacked plates may have a plurality of undulations and the plurality of second stacked plates may have a plurality of undulations. Therefore, the contact area among the first laminated plate, the second laminated plate, the phase change liquid and the circulating fluid can be increased, and the wave parts of the plurality of first laminated plates and the wave parts of the plurality of second laminated plates can quickly transfer the heat energy of the phase change liquid to the circulating fluid, so that the heat exchange efficiency is improved.

The fluid-cooled heat dissipation module of the present invention may further include a plurality of sealing plugs, which may be combined with the body, so that the phase change chamber is in a sealed state and the fluid chamber is only communicated with the two fluid transmission parts. Therefore, the phase change liquid can be prevented from flowing out, and the manufacturing cost is reduced.

The fluid cooling type heat dissipation module of the invention can additionally comprise a heat conducting seat which can be thermally connected with the bottom end of the body. Therefore, the heat energy of the heating source can be uniformly dispersed to the plurality of first laminated plates and the plurality of second laminated plates through the heat conducting seat, and the heat radiating effect is improved.

The fluid chamber can be used for circulating a circulating fluid, and the circulating fluid and the phase change liquid can be different liquids. Therefore, the circulating fluid and the phase change liquid can be properly selected, the circulating speed of the gas phase and the liquid phase can be increased, and the effect of better heat dissipation is achieved.

The phase change liquid may be a non-conductive liquid, and the circulating fluid may be water. Therefore, the phase change liquid and the circulating fluid can be easily obtained, and the manufacturing cost can be reduced.

Drawings

FIG. 1: an exploded perspective view of a first embodiment of the present invention;

FIG. 2 is a schematic diagram: an enlarged view of a portion of the structure shown in FIG. 1;

FIG. 3: a combined partial sectional perspective view of the first embodiment of the invention;

FIG. 4: an assembled perspective view of the first embodiment of the present invention;

FIG. 5: a cross-sectional view taken along line A-A of FIG. 4;

FIG. 6: a cross-sectional view taken along line B-B of FIG. 5;

FIG. 7 is a schematic view of: the first embodiment of the invention has a partial perspective view of the first convex column and the second convex column;

FIG. 8: an assembled cross-sectional view as shown in fig. 7;

FIG. 9: the first embodiment of the present invention has a combined cross-sectional view of the wave portion;

FIG. 10: an exploded perspective view of a second embodiment of the present invention;

FIG. 11: a combined cross-sectional view of a second embodiment of the invention.

Description of the reference numerals

[ invention ] to provide

1: main body

11: first laminate

111 first convex part

112 the first through hole

113 side through hole

114 wave part

115 first serial port

12: second laminate

121 the second convex part

122 second through hole

123 side through hole

124 wave part

125 second serial hole

13 the first convex column

14: second convex column

15, connecting pipe in series

151 piercing through

2: fluid conveying part

3: sealing plug

4: heat conducting base

H heating source

L1 phase Change liquid

L2 circulating fluid

P is the bottom end

S1 phase Change Chamber

S2 fluid chamber

U is a chamber.

Detailed Description

In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below:

referring to fig. 1, a fluid-cooled heat dissipation module according to a first embodiment of the present invention includes a main body 1 and two fluid transmission parts 2, wherein the two fluid transmission parts 2 are connected to the main body 1.

Referring to fig. 1, 2 and 5, the body 1 includes a plurality of first stacked plates 11 and a plurality of second stacked plates 12, the plurality of first stacked plates 11 and the plurality of second stacked plates 12 may be made of a metal material with high thermal conductivity, such as copper or aluminum, the plurality of first stacked plates 11 and the plurality of second stacked plates 12 may be welded (e.g., reflow or laser welding) to form a stacked arrangement, and a cavity U is formed between any one first stacked plate 11 and an adjacent second stacked plate 12. Wherein, the structure of the chamber U and the first and second laminated plates 11 and 12 can be formed by stamping, die casting, dry etching, wet etching or plasma etching; when the etching processing mode is selected, the depth of the cavity U can be accurately controlled by taking mum as a unit, the processing precision is improved, and the etching processing method can be applied to electronic products with smaller volume so as to ensure the requirement of thinning.

Referring to fig. 3, 4 and 5, in detail, the plurality of first stacked plates 11 and the plurality of second stacked plates 12 are arranged in a staggered manner, that is, the first stacked plates 11, the second stacked plates 12, the first stacked plates 11 and the second stacked plates 12 … are arranged, the plurality of chambers U are communicated at intervals, so that a phase change chamber S1 is formed by the plurality of communicated chambers U together, the phase change chamber S1 is in a sealed state and is filled with a phase change liquid L1, a fluid chamber S2 is formed by the plurality of communicated chambers U together, and a circulating fluid L2 circulates through the fluid chamber S2; that is, the plurality of chambers U may be divided into two groups, the two groups of chambers U may be respectively communicated, and the two groups of chambers U may be the phase change chamber S1 and the fluid chamber S2, respectively.

The phase change liquid L1 may be water, alcohol or other liquid with low boiling point; preferably, the phase change liquid L1 may be a non-conductive liquid, and the phase change liquid L1 may absorb heat from a liquid state to evaporate into a gaseous state, so as to realize heat transfer by using a gas-liquid phase change mechanism of the phase change liquid L1; the phase change chamber S1 is in a closed state, so that the phase change liquid L1 is prevented from losing after being in a gaseous state, and the space of the phase change liquid L1 compressed into the gaseous state due to the occupation of air inside the phase change chamber is prevented from affecting the heat dissipation efficiency; the circulating fluid L2 may be a liquid or a gas, but the invention is not limited thereto, and the circulating fluid L2 may be water, for example.

Referring to fig. 2 and 5, it is specifically described that the first laminated plates 11 and the second laminated plates 12 are laminated to form the phase change chamber S1 and the fluid chamber S2, and the type and structural composition of the first laminated plates 11 and the second laminated plates 12 are not limited in the present invention; in this embodiment, each of the first laminated plates 11 may have a plurality of first protrusions 111, each of the first protrusions 111 may have a first through hole 112, and two of the first protrusions 111 located in the phase change chamber S1 may further have at least one side through hole 113; the plurality of second stacked plates 12 may each have a plurality of second protrusions 121, the second protrusions 121 may have a second through hole 122, and two of the second protrusions 121 located in the fluid chamber S2 may further have at least one side through hole 123, any one of the first protrusions 111 is connected to the adjacent second protrusion 121, and the first through hole 112 is communicated with the second through hole 122, the side through hole 113 of the first protrusion 111 and the side through hole 123 of the second protrusion 121 may not be opposite, that is, the position of the side through hole 113 of the first stacked plate 11 and the position of the side through hole 123 of the second stacked plate 12 are different, so that the second protrusion 121 connected to the first protrusion 111 having the side through hole 113 may not have the side through hole 123, and the first protrusion 111 connected to the second protrusion 121 having the side through hole 123 may not have the side through hole 113.

Referring to fig. 9, in addition, the first laminated plates 11 may have a plurality of waves 114, and the second laminated plates 12 may have a plurality of waves 124; therefore, the contact area between the first laminated plate 11 and the second laminated plate 12 and the phase change liquid L1 and the circulating fluid L2 can be increased, the plurality of wave parts 114 and the plurality of wave parts 124 can quickly transfer the heat energy of the phase change liquid L1 to the circulating fluid L2, the heat exchange efficiency can be improved, and the heat dissipation efficiency can be further improved.

Referring to fig. 7 and 8, the body 1 may have a plurality of first protruding pillars 13 and a plurality of second protruding pillars 14, and the plurality of first protruding pillars 13 are connected to the plurality of first laminate sheets 11 and located in the phase change chamber S1; the first protruding pillar 13 may be combined with the first laminated plate 11 by an assembling method (e.g., welding) after being manufactured separately, or the first laminated plate 11 may be integrally formed with the first protruding pillar 13, which is not limited in the present invention. By the arrangement of the first protruding columns 13, the contact area between the first laminated plate 11 and the phase change liquid L1 can be increased, so as to improve the heat exchange efficiency and further improve the heat dissipation efficiency.

In addition, the plurality of second studs 14 are connected to the plurality of second stacked plates 12 and located in the fluid chamber S2, the second studs 14 may be assembled (for example, welded) with the second stacked plates 12 after being manufactured, or the second stacked plates 12 may be integrally formed with the second studs 14, which is not limited in the present invention, and the distribution density of the plurality of second studs 14 may be preferably greater than that of the plurality of first studs 13; therefore, the space of the phase change chamber S1 occupied by too many first protruding columns 13 is avoided, the contact area between the second laminated plate 12 and the circulating fluid L2 can be increased, and the heat energy of the phase change liquid L1 can be taken away by the continuous circulating flow of the circulating fluid L2, so that the heat exchange efficiency can be greatly improved, and the heat dissipation performance can be further improved.

Referring to fig. 1 and 3, the two fluid transmission parts 2 are diagonally disposed and connected to the main body 1, and the two fluid transmission parts 2 are communicated with the fluid chamber S2; in this way, the circulating fluid L2 has a wider flowing range and can smoothly flow and take away heat energy, so that the heat energy is not easy to stay inside the main body 1, and in other embodiments, the two fluid transmission parts 2 can be located at the same end of the main body 1, which is not limited in the present invention. The two fluid delivery parts 2 can be connected to a pump (not shown) and a heat sink (not shown) through a pipe (not shown), and the pump can drive the circulating fluid L2 to circulate in the pipe and the fluid chamber S2.

The fluid-cooled heat dissipation module of the present invention may further include a plurality of sealing plugs 3, wherein the plurality of sealing plugs 3 may be combined to the body 1, so that the phase change chamber S1 is in a sealed state, thereby preventing the phase change liquid L1 from flowing out, and the fluid chamber S2 may be only communicated with the two fluid transmission parts 2.

Referring to fig. 3 and 5, the fluid-cooled heat dissipation module of the present invention may further include a heat conducting base 4, wherein the heat conducting base 4 may be thermally connected to the bottom P of the body 1, the heat conducting base 4 may correspond to the plurality of cavities U, and the heat conducting base 4 may be thermally connected to a heat source H; thus, the heat energy of the heat source H can be uniformly dispersed to the plurality of first stacked plates 11 and the plurality of second stacked plates 12 through the heat conducting base 4, which can improve the heat dissipation effect.

Referring to fig. 5 and 6, when the fluid cooling heat dissipation module of the present invention is in operation, the main body 1 can be thermally connected to the heat source H through the heat conducting base 4, and the phase change liquid L1 in the phase change chamber S1 can absorb heat energy from a liquid state and evaporate into a gaseous state, so that the phase change liquid L1 in the phase change chamber S1 can absorb heat energy at the heat source H; then, the circulating fluid L2 in the fluid chamber S2 can rapidly absorb the heat energy in the phase change chamber S1, so that the phase change liquid L1 in the phase change chamber S1 can rapidly condense from a gas state to a liquid state to absorb heat, and the circulating fluid L2 in the fluid chamber S2 can further cool the phase change liquid L1 in the phase change chamber S1, thereby carrying away the heat energy from the heat source H, and achieving the effect of providing good heat dissipation performance.

Referring to fig. 10 and 11, which show a second embodiment of the fluid-cooled heat dissipation module of the present invention, the first stacked plates 11 may have a plurality of first serial holes 115, the second stacked plates 12 may have a plurality of second serial holes 125, and the first serial holes 115 of the first stacked plates 11 may be opposite to the second serial holes 125 of the second stacked plates 12; the body 1 may further include a plurality of connection pipes 15, the connection pipes 15 penetrate and are combined with the first connection holes 115 of the first stacked plates 11 and the second connection holes 125 of the second stacked plates 12, the connection pipes 15 may include a plurality of through holes 151, the through holes 151 of two of the connection pipes 15 may be communicated with the phase change chamber S1, the through holes 151 of the other two of the connection pipes 15 may be communicated with the fluid chamber S2, the through holes 151 may be respectively disposed at intervals on the pipe wall of the connection pipe 15, so that the heights of the through holes 151 of different connection pipes 15 may be different, thereby adjusting that a plurality of connected chambers U may jointly form the phase change chamber S1, and another plurality of connected chambers U may jointly form the fluid chamber S2.

In summary, in the fluid-cooled heat dissipation module of the present invention, the phase change liquid in the phase change chamber can absorb heat energy from a liquid state and evaporate into a gaseous state, so that the phase change liquid in the phase change chamber can absorb the heat energy of the heat source, the phase change liquid can realize heat transfer by using a gas-liquid phase change mechanism, and the circulating fluid in the fluid chamber can rapidly absorb the heat energy in the phase change chamber, so that the phase change liquid in the phase change chamber can be rapidly condensed from the gaseous state into the liquid state to absorb heat, and the circulating fluid in the fluid chamber can further cool the phase change liquid in the phase change chamber, thereby achieving the effect of improving the heat dissipation performance.

Claims (11)

1. A fluid-cooled heat dissipation module, comprising:

the device comprises a body, a plurality of first laminated plates and a plurality of second laminated plates, wherein the first laminated plates and the adjacent second laminated plates are stacked, a cavity is arranged between each first laminated plate and the corresponding adjacent second laminated plate, the cavities are communicated at intervals, so that the communicated cavities form a phase change cavity together, the phase change cavity is in a closed state and is filled with phase change liquid, and the communicated cavities form a fluid cavity together; and

two fluid transfer portions communicating with the fluid chamber.

2. The fluid-cooled heat dissipation module of claim 1, wherein the two fluid inlets are diagonally disposed and connected to the body.

3. The fluid-cooled heat dissipation module of claim 1, wherein each of the first stacked plates has a plurality of first protrusions, each of the first protrusions has a first through hole, each of the second stacked plates has a plurality of second protrusions, each of the second protrusions has a second through hole, any one of the first protrusions is connected to an adjacent second protrusion, and the first through hole is connected to the second through hole, and wherein two of the first protrusions located in the phase change chamber further have at least one side through hole, and wherein two of the second protrusions located in the fluid chamber further have at least one side through hole, such that the second protrusion connected to the first protrusion having the side through hole has no side through hole, and the first protrusion connected to the second protrusion having the side through hole has no side through hole.

4. The fluid-cooled heat dissipation module of claim 1, wherein the first plurality of stacked plates has a first plurality of series holes, the second plurality of stacked plates has a second plurality of series holes, the body has a plurality of series tubes, the series tubes extend through and join the first plurality of series holes of the first plurality of stacked plates and the second plurality of series holes of the second plurality of stacked plates, the walls of the series tubes have a plurality of perforations, the perforations of two of the series tubes communicate with the phase change chamber, and the perforations of the other two of the series tubes communicate with the fluid chamber.

5. The fluid-cooled heat dissipation module of claim 1, wherein the body has a plurality of first posts connected to the plurality of first stacked plates and located in the phase change chamber.

6. The fluid-cooled heat dissipation module of claim 5, wherein the body has a plurality of second posts, the plurality of second posts are connected to the plurality of second stacked plates and located in the fluid chamber, and a distribution density of the plurality of second posts is greater than a distribution density of the plurality of first posts.

7. The fluid cooled heat sink module of claim 1, wherein the first plurality of stacked plates has a plurality of undulations and the second plurality of stacked plates has a plurality of undulations.

8. The fluid cooled heat sink module of claim 1, further comprising a plurality of sealing plugs coupled to the body such that the phase change chamber is sealed and the fluid chamber is in communication with only the two fluid inlets.

9. The fluid-cooled heat dissipation module of claim 1, further comprising a thermal pad thermally coupled to the bottom end of the body.

10. The module as claimed in any one of claims 1 to 9, wherein the fluid chamber is for circulating a circulating fluid, the circulating fluid being different from the phase change fluid.

11. The fluid cooled heat sink module of claim 10, wherein the phase change fluid is a non-conductive liquid and the circulating fluid is water.

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