CN114885576A

CN114885576A - Heat dissipation system and electronic component

Info

Publication number: CN114885576A
Application number: CN202210434930.2A
Authority: CN
Inventors: 杨洪武
Original assignee: Dalian Bonded Area Jinbaozhi Electronics Co ltd
Current assignee: Dalian Bonded Area Jinbaozhi Electronics Co ltd
Priority date: 2022-04-24
Filing date: 2022-04-24
Publication date: 2022-08-09

Abstract

A heat dissipation system and an electronic component are provided, the heat dissipation system is suitable for a heating element with a horizontal heat dissipation surface, the heat dissipation system comprises a plurality of panels which are arranged in a stacking mode, the panels are perpendicular to the horizontal heat dissipation surface, and a temperature equalization plate and a heat dissipation assembly are arranged among the panels; the heat dissipation assembly is arranged adjacent to the temperature equalizing plate, at least part of the temperature equalizing plate is positioned at the bottom of the heat dissipation system along the vertical direction, and at least part of the heat dissipation assembly is positioned at the top of the heat dissipation system along the vertical direction; the heat dissipation assembly comprises a refrigerant inlet, a refrigerant outlet and a micro-channel, wherein the refrigerant inlet and the refrigerant outlet are respectively positioned at the edges of the heat dissipation assembly which are oppositely arranged; the microchannel is positioned between the refrigerant inlet and the refrigerant outlet, and the microchannel is communicated with the refrigerant inlet and the refrigerant outlet. The heat dissipation device has a good heat dissipation effect, and is particularly suitable for high-power heating parts with small horizontal heat dissipation surfaces.

Description

Heat dissipation system and electronic component

Technical Field

The present disclosure relates to electronic devices, and particularly to a heat dissipation system and an electronic device.

Background

The heat pipe is an element for improving the heat transfer capacity of the heat dissipation system by utilizing latent heat of vaporization carried by the phase change process of liquid, and the heat dissipation system with the heat pipe is widely applied to the electronic engineering field.

In the related art, a heat dissipation system with heat pipes includes a heat absorption bottom plate, heat pipes, and heat dissipation fins, the heat absorption bottom plate is connected to a heat dissipation surface of a heat generating member, a plurality of heat pipes are disposed on a side of the heat absorption bottom plate away from the heat dissipation surface, heat absorption ends of the plurality of heat pipes are connected to the heat absorption bottom plate, heat dissipation ends of the plurality of heat pipes are away from the heat generating member, and the heat dissipation fins are connected to the heat dissipation ends of the heat pipes.

However, the heat dissipation system with the heat pipe has a poor heat dissipation effect.

Disclosure of Invention

In view of the above problems, the present application provides a heat dissipation system and an electronic component, which have good heat dissipation effects and are particularly suitable for high-power heating elements with small horizontal heat dissipation surfaces.

In order to achieve the above purpose, the present application provides the following technical solutions:

a first aspect of an embodiment of the present application provides a heat dissipation system, which is suitable for a heat generating component having a horizontal heat dissipation surface, and includes a plurality of panels stacked together, where the plurality of panels are perpendicular to the horizontal heat dissipation surface;

a temperature equalizing plate and a heat dissipation assembly are arranged among the panels, the heat dissipation assembly is arranged adjacent to the temperature equalizing plate, at least part of the temperature equalizing plate is positioned at the bottom of the heat dissipation system along the vertical direction, and at least part of the heat dissipation assembly is positioned at the top of the heat dissipation system along the vertical direction;

the heat dissipation assembly comprises a refrigerant inlet, a refrigerant outlet and a micro-channel, wherein the refrigerant inlet and the refrigerant outlet are respectively positioned at the edges of the heat dissipation assembly which are oppositely arranged; the microchannel is positioned between the refrigerant inlet and the refrigerant outlet, and the microchannel is communicated with the refrigerant inlet and the refrigerant outlet.

In an implementation manner, the microchannel is provided with a plurality of microchannels, the microchannels are all arranged in parallel, and each microchannel is communicated between the refrigerant inlet and the refrigerant outlet.

In an implementation manner, the microchannel is provided with a plurality of microchannels, the microchannels are arranged in a net shape and communicated with each other, at least one microchannel is communicated with the refrigerant inlet, and at least one microchannel is communicated with the refrigerant outlet.

In one possible implementation, the vapor chamber is located at the top of the heat dissipation system in the vertical direction;

the extension plane of the condensate liquid pool is parallel to the horizontal heat dissipation surface, the extension direction of the steam cavity is perpendicular to the extension plane of the condensate liquid pool, and the bottom of the steam cavity in the vertical direction is communicated with the condensate liquid pool;

at least part of the heat dissipation assembly is positioned at the top of the heat dissipation system along the vertical direction, and the heat dissipation assembly and the steam cavity are arranged in an adjacent mode.

In an implementation manner, the vapor chamber micro channel is provided with a plurality of channels, and the plurality of channels are located on the wall of the vapor chamber;

each steam cavity micro-channel extends along the extending direction of the steam cavity, and the bottom end of each steam cavity micro-channel along the vertical direction is communicated with the condensate tank.

In one realized implementation mode, the steam cavity comprises a plurality of sub-steam cavities which are arranged at intervals along the direction parallel to the horizontal heat dissipation surface;

the bottom of the plurality of sub-steam cavities in the vertical direction is communicated with each other and is communicated with the condensate tank, and the top of the plurality of sub-steam cavities in the vertical direction is communicated with each other.

In an embodiment, at least part of the sub-steam chambers are located between part of the panels, which comprise a plurality of first series of panels and a plurality of second series of panels, which are alternately distributed in sequence;

a plurality of first longitudinal through holes are formed in the first sequence panel and distributed at intervals in the direction parallel to the horizontal radiating surface, and a first longitudinal support is formed at the solid part between the adjacent first longitudinal through holes;

a plurality of second longitudinal through holes are formed in the second sequence panel and are distributed at intervals in the direction parallel to the horizontal radiating surface, and second longitudinal supports are formed at solid parts between the adjacent second longitudinal through holes;

the first longitudinal through hole and the second longitudinal through hole are communicated with each other along the thickness direction of the panel; the first longitudinal support positioned in the middle of the first longitudinal through hole in the vertical direction and the second longitudinal support positioned in the middle of the second longitudinal through hole are connected with each other; the first longitudinal supports located at the two ends of the first longitudinal through hole in the vertical direction and the second longitudinal supports located at the two ends of the second longitudinal through hole in the vertical direction are at least partially arranged in a staggered mode.

In one possible implementation, the vapor chamber further comprises an auxiliary vapor chamber located between the heat dissipation assembly and the condensate pool;

the bottom of the auxiliary steam cavity in the vertical direction is communicated with the condensate tank, and the side part of the auxiliary steam cavity is communicated with the steam cavity.

In an embodiment, the condensate bath comprises a plurality of microchannels, which are parallel to each other in the extension plane of the condensate bath, and which communicate with each other via the vapor chamber and the auxiliary vapor chamber.

In an implementation, the heat dissipation assemblies include two heat dissipation assemblies, and the two heat dissipation assemblies are located on two opposite sides of the extending direction of the steam cavity.

In an implementation mode, the device further comprises a refrigerant leading-in port and a refrigerant leading-out port;

the refrigerant inlet is positioned on one side of the heat dissipation assembly close to the steam cavity; the refrigerant introducing port is positioned on the panel forming the steam cavity, is positioned on one side of the temperature equalizing plate close to the refrigerant inlet, and is communicated with the refrigerant inlet;

the refrigerant outlet is positioned on one side of the heat dissipation assembly close to the steam cavity; the refrigerant outlet is positioned on the panel forming the steam cavity, positioned on one side of the temperature-equalizing plate close to the refrigerant inlet and communicated with the refrigerant outlet.

A second aspect of the embodiments of the present application provides an electronic component, including generating heat and foretell cooling system, the piece that generates heat has horizontal cooling surface, cooling system set up in the piece that generates heat is close to one side of horizontal cooling surface.

The embodiment of the application provides a heat dissipation system and an electronic element, and particularly relates to a heat dissipation system and an electronic element. The heat dissipation system is provided with the temperature equalizing plate and the heat dissipation assembly, so that one end of the temperature equalizing plate, which is relatively close to the horizontal heat dissipation surface, forms an evaporation end to absorb the heat of the heating element, and one end of the temperature equalizing plate, which is relatively far away from the horizontal heat dissipation surface, forms an evaporation end to dissipate the heat through the adjacent heat dissipation assembly; the panels are perpendicular to the horizontal radiating surface, so that the panels form a layered structure, heat of the heating part flows along layers on two sides of each panel, the flow resistance is smaller, the heat can be quickly diffused to one end far away from the horizontal radiating surface from one end close to the horizontal radiating surface, the radiating efficiency is higher, and the radiating effect is better; the heat dissipation assembly is arranged on the panel and is arranged adjacent to the temperature equalizing plate, and the temperature equalizing plate and the heat dissipation assembly are separated by only one wall, so that the thermal contact resistance and the structural redundancy caused by the connection of a solid structure are avoided, and the heat can be quickly diffused along the panel; through setting up the microchannel, make the refrigerant flow through the microchannel and to generating heat the heat dissipation of piece through the temperature-uniforming plate, the dwell time of refrigerant in radiator unit has been prolonged to the structure of microchannel, has increased the heat that the refrigerant can take away, has promoted the radiating effect. The electronic element comprises the heat dissipation system and has the same beneficial effects.

The construction and other objects and advantages of the present application will be more apparent from the description of the preferred embodiments taken in conjunction with the accompanying drawings.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic diagram of a heat dissipation system according to an embodiment of the present disclosure;

FIG. 2 is a schematic diagram of the detailed structure at A in FIG. 1;

FIG. 3 is a schematic diagram of the structure at B in FIG. 1;

fig. 4 is a schematic structural diagram of a first panel of a heat dissipation system according to an embodiment of the present disclosure;

fig. 5 is a schematic structural diagram of a second panel of the heat dissipation system according to the embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of a third panel of the heat dissipation system according to the embodiment of the present application;

fig. 7 is a schematic structural diagram of a fourth panel of the heat dissipation system according to the embodiment of the present application;

fig. 8 is a schematic structural diagram of a fifth panel of the heat dissipation system according to the embodiment of the present application;

fig. 9 is a schematic structural diagram of a sixth panel of the heat dissipation system according to the embodiment of the present application;

fig. 10 is a schematic structural diagram of a seventh panel of the heat dissipation system according to the embodiment of the present application;

fig. 11 is a schematic structural diagram of an eighth panel of the heat dissipation system according to the embodiment of the present application;

fig. 12 is a schematic structural diagram of a ninth panel of the heat dissipation system according to the embodiment of the present application;

fig. 13 is a schematic structural diagram of a tenth panel of the heat dissipation system according to the embodiment of the present application;

fig. 14 is a schematic structural diagram of an eleventh panel of the heat dissipation system according to the embodiment of the present application;

fig. 15 is a schematic structural diagram of a twelfth panel of the heat dissipation system according to the embodiment of the present application;

fig. 16 is a schematic structural diagram of a thirteenth panel of the heat dissipation system according to the embodiment of the present application;

fig. 17 is a schematic structural diagram of a fourteenth panel of the heat dissipation system according to the embodiment of the present application.

Description of reference numerals:

100-a heat dissipation system;

101-a first panel; 102-a second panel; 103-a third panel; 104-a fourth panel; 105-a fifth panel; 106-a sixth panel; 107-seventh panel; 108-an eighth panel; 109-a ninth panel; 110-tenth panel; 111-an eleventh panel; 112-a twelfth panel; 113-a thirteenth panel; 114-a fourteenth panel;

210-condensate tank; 211-microchannels;

220-a steam chamber; 221-sub-steam cavity; 222-a first longitudinal through hole; 223-a first lateral via; 224-first connecting pin hole; 225-a second longitudinal through hole; 226-a second lateral via;

227-second connecting pin holes;

230-an auxiliary steam chamber;

240-refrigerant leading-in port;

250-refrigerant outlet;

310-refrigerant inlet;

320-refrigerant outlet;

330-a microchannel; 331-a first microwell; 332-second microwell;

400-screw holes;

q-heat; an L-refrigerant; y-condensate; z-steam.

Detailed Description

In the related art, a heat dissipation system having a heat pipe includes a heat absorption base plate, a heat pipe, and heat dissipation fins. The heat absorbing bottom plate is connected to the heat dissipating surface of the heating member through an interface material for reducing contact thermal resistance. One side of the heat absorption bottom plate, which is far away from the heat dissipation surface, is provided with a plurality of heat pipes. The heat pipes are U-shaped, and the two ends of each U-shaped heat pipe are respectively a heat absorption end and a heat dissipation end. The heat absorption end of each U-shaped heat pipe is clamped on the heat absorption bottom plate, and the heat dissipation end of each U-shaped heat pipe is positioned on one side far away from the heating element and is arranged at intervals with the heat absorption bottom plate. The radiating fins are arranged in parallel at intervals and are riveted at the radiating end of the U-shaped heat pipe.

However, in the above technical solution, the manufacturing method of separately connecting the heat dissipation fins and the heat pipe increases the contact thermal resistance therebetween, which causes unnecessary material redundancy, not only the manufacturing process is complicated and the consumption is large, but also the heat dissipation effect is greatly reduced.

In view of the above technical problems, embodiments of the present application provide a heat dissipation system and an electronic component, where the heat dissipation system is particularly suitable for a high-power heating element with a small water-level heat dissipation surface. The heat dissipation system is provided with the temperature equalizing plate and the heat dissipation assembly, so that one end of the temperature equalizing plate, which is relatively close to the horizontal heat dissipation surface, forms an evaporation end to absorb the heat of the heating element, and one end of the temperature equalizing plate, which is relatively far away from the horizontal heat dissipation surface, forms an evaporation end to dissipate the heat through the adjacent heat dissipation assembly; the panels are perpendicular to the horizontal radiating surface, so that the panels form a layered structure, heat of the heating part flows along layers on two sides of each panel, the flow resistance is smaller, the heat can be quickly diffused to one end far away from the horizontal radiating surface from one end close to the horizontal radiating surface, the radiating efficiency is higher, and the radiating effect is better; the heat dissipation assembly is arranged on the panel and is arranged adjacent to the temperature equalizing plate, and the temperature equalizing plate and the heat dissipation assembly are separated by only one wall, so that the thermal contact resistance and the structural redundancy caused by the connection of a solid structure are avoided, and the heat can be quickly diffused along the panel; through setting up the microchannel, make the refrigerant flow through the microchannel and to generating heat the heat dissipation of piece through the temperature-uniforming plate, the dwell time of refrigerant in radiator unit has been prolonged to the structure of microchannel, has increased the heat that the refrigerant can take away, has promoted the radiating effect. The electronic element comprises the heat dissipation system and has the same beneficial effects.

In order to make the objects, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be described in more detail below with reference to the accompanying drawings in the preferred embodiments of the present application. In the drawings, the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The described embodiments are a subset of the embodiments in the present application and not all embodiments in the present application. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The electronic components provided in the embodiments of the present application will be described below.

The embodiment of the application provides an electronic component, including generating heat and cooling system, generate heat and have horizontal cooling surface, cooling system sets up in the one side that generates heat and be close to horizontal cooling surface.

The electronic component may include a circuit board, and the heat generating member may include a chip on the circuit board. The heating element can not only comprise a heating element with low power and low heat flux density in a large space, but also comprise a heating element with high power and high heat flux density in a narrow space. Illustratively, the circuit board can be a circuit board in a laser device or a radio frequency device, and the heat flow density of a chip of the circuit board is up to 1000W/cm ² Above, the heat exchange quantity per unit volume is more than or equal to 10W/cm ³ The heat exchange quantity per unit weight is more than or equal to 5 kW/kg.

It will be appreciated that as the position and attitude of the electronic component changes during use, the position and attitude of the horizontal heat-dissipating surfaces changes, i.e., the horizontal heat-dissipating surfaces may have an inclined or vertical state. The present embodiment does not strictly limit the horizontal heat dissipating surface to be kept horizontal at all times, but means that the horizontal heat dissipating surface may have a horizontal state in a normal state.

A heat dissipation system 100 provided in an embodiment of the present application will be described below with reference to fig. 1 to 17.

The embodiment of the present application provides a heat dissipation system 100, which is suitable for a heat generating component (not shown) with a horizontal heat dissipation surface. The heat dissipation system 100 includes a plurality of panels arranged in a stack, each of the plurality of panels being perpendicular to a horizontal heat dissipation surface.

A temperature equalizing plate and a heat dissipation assembly are arranged among the panels, the heat dissipation assembly is arranged adjacent to the temperature equalizing plate, at least part of the temperature equalizing plate is positioned at the bottom of the heat dissipation system 100 along the vertical direction, and at least part of the heat dissipation assembly is positioned at the top of the heat dissipation system 100 along the vertical direction.

The heat dissipation assembly comprises a refrigerant inlet 310, a refrigerant outlet 320 and a micro-channel 330, wherein the refrigerant inlet 310 and the refrigerant outlet 320 are respectively positioned at the opposite edges of the heat dissipation assembly; the micro channel 330 is located between the refrigerant inlet 310 and the refrigerant outlet 320, and the micro channel 330 is communicated with the refrigerant inlet 310 and the refrigerant outlet 320.

The panel may comprise a ceramic, metal or composite material piece, among others. Illustratively, the panel may be a copper alloy sheet or a stainless steel sheet. The plurality of panels may have the same shape and size, so that orthographic projections of the plurality of panels on each other are all overlapped with each other, and the plurality of panels may be welded and fixed.

The multiple panels are perpendicular to the horizontal radiating surface, so that the multiple panels form a layered structure, heat Q of the heating part flows along the layers on the two sides of each panel, and the flow resistance is smaller. The heat can be from the one end that is close to horizontal radiating surface, and the rapid diffusion is to the one end of keeping away from horizontal radiating surface, and the radiating efficiency is higher, and the radiating effect is better.

The vapor chamber is a heat pipe structure formed in a plurality of panels. On one hand, the temperature equalizing plate has better heat transfer and heat dissipation effects by means of the arrangement mode that the panel is perpendicular to the horizontal heat dissipation surface. On the other hand, at least part of the temperature equalizing plate is located at the bottom of the heat dissipating system 100 along the vertical direction, the part of the temperature equalizing plate relatively close to the horizontal heat dissipating surface forms an evaporating end to absorb the heat Q of the heating element, one end of the temperature equalizing plate relatively far away from the horizontal heat dissipating surface forms a condensing end, and the heat transferred to the condensing end is dissipated through the adjacent heat dissipating assembly.

The heat dissipation assembly is formed among the plurality of panels. On one hand, the heat dissipation assembly has better heat transfer and heat dissipation effects by means of the arrangement mode that the panel is perpendicular to the horizontal heat dissipation surface. On the other hand, the heat dissipation assembly is arranged adjacent to the temperature equalizing plate, and the temperature equalizing plate and the heat dissipation assembly are separated by only one wall, so that the thermal contact resistance and the structural redundancy caused by the connection of a solid structure are avoided, and the heat can be quickly diffused along the panel.

The heat dissipation assembly is provided with a refrigerant inlet 310 and a refrigerant outlet 320 for introducing a refrigerant L for dissipating heat from the temperature equalization plate, and the refrigerant inlet 310 and the refrigerant outlet 320 may be respectively located at two opposite edges of the heat dissipation assembly, or may be distributed at two opposite sides of the edge of the heat dissipation assembly. The refrigerant L may include gas or liquid. The refrigerant flows through the micro-channel 330 to dissipate heat of the vapor chamber, so as to take away the heat Q of the condensation end, promote the heat exchange circulation of the condensate in the vapor chamber, and improve the heat dissipation effect of the heating element. The structure of the micro-channel 330 can prolong the retention time of the refrigerant L in the heat dissipation assembly, enhance the heat exchange effect between the refrigerant and the condensate in the temperature equalization plate, and improve the heat dissipation effect.

In the embodiment of the present application, the micro channel 330 is provided with a plurality of micro channels 330, and the plurality of micro channels 330 may include the following two arrangements:

in a first possible arrangement, as shown in fig. 2, a plurality of microchannels 330 are arranged in a mesh shape and communicated with each other, at least one microchannel 330 is communicated with the refrigerant inlet 310, and at least one microchannel 330 is communicated with the refrigerant outlet 320.

Thus, a plurality of interconnected microchannel segments can be formed between the refrigerant inlet 310 and the refrigerant outlet 320, which can expand the heat dissipation area of the microchannel 330, prolong the retention time of the refrigerant in the microchannel 330, and improve the heat dissipation effect. Moreover, the micro-channel 330 structure is not only suitable for gas refrigerants, but also suitable for liquid refrigerants.

In one possible embodiment, the microchannels 330 may be formed by sequential overlap welding of multiple panels as shown in fig. 5-14.

With the serial numbers in the names of the panels as reference, the panels with the serial numbers even in the names are called even panels, and the panels with the serial numbers odd in the names are called odd panels. Illustratively, the second panel 102 is numbered two, the second panel 102 is referred to as an even panel, the third panel 103 is numbered three, and the third panel 103 is referred to as an odd panel.

A plurality of first micro holes 331 are formed in the even-numbered panel, each first micro hole 331 extends in a direction parallel to the horizontal heat dissipation surface, and the plurality of first micro holes 331 are distributed at intervals in a direction perpendicular to the horizontal heat dissipation surface. The odd-numbered panel is provided with a plurality of second micro holes 332, each second micro hole 332 extends along a direction perpendicular to the horizontal heat dissipation surface, and the plurality of second micro holes 332 are distributed at intervals along a direction parallel to the horizontal heat dissipation surface.

After the even-numbered panels and the odd-numbered panels are sequentially stacked, the positions of the first micro-holes 331 and the second micro-holes 332 are communicated with each other, and the micro-channels 330 which are communicated with each other in a net-shaped arrangement are formed. Moreover, the solid portions between the first micro holes 331 of the even numbered panels and the solid portions between the second micro holes 332 of the odd numbered panels are connected to each other, so that the heat sink assembly can have sufficient structural strength.

As shown in fig. 7-14, a part of the structure of the temperature equalization plate needs to be disposed at the bottom of the part of the even-numbered panel and the part of the odd-numbered panel near the vertical direction, so that the extension lengths of the first micro-hole 331 and the second micro-hole 332 at the corresponding positions are slightly different, but the first micro-hole 331 and the second micro-hole 332 at other positions are not affected to communicate with each other and form the micro-channel 330. The extension lengths of the first micro holes 331 and the second micro holes 332 are not limited in the embodiment of the present application, as long as the first micro holes 331 and the second micro holes 332 staggered on the adjacent panels can be communicated with each other, and can provide a flow channel for the refrigerant.

In some embodiments, multiple sets of adjacent even and odd numbered panels may be provided in order to provide a heat sink assembly of sufficient thickness to form more microchannels 330. For example, 20 sets of the combined structure of the second panel 102 and the third panel 103 may be provided, and then 3 sets of the combined structure of the fourth panel 104 and the fifth panel 105 may be provided, which are stacked and welded.

In a second possible arrangement, the microchannels 330 are all disposed in parallel, and each microchannel 330 is connected between the refrigerant inlet 310 and the refrigerant outlet 320.

Thus, a plurality of air-through microchannels 330 are formed between the refrigerant inlet 310 and the refrigerant outlet 320, and the heat dissipation effect can be improved by the heat dissipation device with higher heat transfer coefficient. Moreover, the micro-channel 330 structure is not only suitable for liquid refrigerants, but also suitable for gas refrigerants.

In one possible embodiment, the first micro-holes 331 may be formed in a plurality of stacked panels, and the first micro-holes 331 of adjacent panels are communicated with each other to form a plurality of micro-channels 330 arranged in parallel. Moreover, the solid portions between the first micro holes 331 of each panel are connected with the solid portions between the first micro holes 331 of the adjacent panels, so that the heat dissipation assembly has sufficient structural strength.

In one possible embodiment, as shown in fig. 16 and 17, the vapor chamber 220 includes a condensate pool 210 and a vapor chamber 210, the condensate pool 210 is located at the bottom of the heat dissipation system 100 in the vertical direction, and the vapor chamber 220 is located at the top of the heat dissipation system 100 in the vertical direction.

The extension plane of the condensate pool 210 is parallel to the horizontal heat dissipation surface, the extension direction of the steam cavity 220 is perpendicular to the extension plane of the condensate pool 210, and the bottom of the steam cavity 220 along the vertical direction is communicated with the condensate pool 210.

At least a portion of the heat dissipation assembly is located at the top of the heat dissipation system 100 along the vertical direction, and the heat dissipation assembly is disposed adjacent to the steam chamber 220.

The condensate pool 210 is disposed near the horizontal heat dissipation surface, and the condensate Y in the condensate pool 210 absorbs heat of the horizontal heat dissipation surface and is vaporized to change into steam Z. The phase-changed steam Z enters the steam cavity 220 and flows toward one end of the steam cavity 220 away from the horizontal heat dissipation surface. During the flowing process of the steam Z, the cold energy absorbed and transferred by the heat dissipation assembly is changed into condensate. The phase-changed condensate flows back to the condensate tank 210 along the wall of the steam cavity 220, and the heat Q of the heating element is circularly and continuously dissipated out through the heat dissipation assembly in a reciprocating manner.

The extension plane of the condensate pool 210 is distributed on the whole horizontal heat dissipation surface, so that the contact area of the condensate and the horizontal heat dissipation surface can be increased, and heat dissipation is formed at each position of the horizontal heat dissipation surface. The heat dissipation assembly is arranged adjacent to the steam cavity 220, and can transmit cold to the steam cavity 220 to the maximum extent.

In one implementation, the vapor chamber further includes a plurality of vapor chamber microchannels (not shown), and the plurality of vapor chamber microchannels are located on the wall of the vapor chamber 220.

Each steam cavity microchannel all extends along the extending direction of steam cavity 220, and the bottom along the vertical direction of each steam cavity microchannel communicates with condensate sump 210.

Therefore, the condensate Y in the condensate pool 210 can enter the steam cavity 220 by means of the steam micro-channel, and the condensate Y in the steam micro-channel can be heated and gasified in the steam cavity 220, so that the heat dissipation area of the condensate Y is further increased, and the heat dissipation efficiency is improved.

It is understood that the steam microchannels may be grooved in the middle in the thickness direction of the panel to form a microchannel structure, and also grooved in the sides in the thickness direction of the panel to form a microchannel structure together with the adjacent panels.

In one possible embodiment, as shown in fig. 16 and 17, the steam chamber 220 includes a plurality of sub-steam chambers 221, and the plurality of sub-steam chambers 221 are arranged at intervals in a direction parallel to the horizontal heat radiating surface.

The bottoms of the plurality of sub-steam cavities 221 in the vertical direction are all communicated with each other and are communicated with the condensate tank 210, and the tops of the plurality of sub-steam cavities 221 in the vertical direction are all communicated with each other.

Like this, set up steam cavity 220 into the structure that a plurality of sub-steam cavities 221 communicate each other, both guaranteed that the steam that condensate bath 210 formed diffuses along sub-steam cavity 221 rapidly, can also form the support at the entity part between adjacent sub-steam cavity 221, support interconnect on the adjacent panel can guarantee the structural strength of samming board.

In one possible embodiment, at least part of sub-vapor chamber 221 is located between partial panels, which comprise a plurality of first series of panels and a plurality of second series of panels, which are alternately distributed in sequence.

The first sequence panel is provided with a plurality of first longitudinal through holes 222 distributed at intervals along the direction parallel to the horizontal heat radiating surface, and solid parts between the adjacent first longitudinal through holes 222 form first longitudinal supports.

The second sequence panel is provided with a plurality of second longitudinal through holes 225 which are distributed at intervals along the direction parallel to the horizontal heat radiating surface, and solid parts between the adjacent second longitudinal through holes 225 form second longitudinal supports.

The first longitudinal through hole 222 and the second longitudinal through hole 225 communicate with each other in the thickness direction of the panel. The first longitudinal support located at the middle of the first longitudinal through hole 222 in the vertical direction and the second longitudinal support located at the middle of the second longitudinal through hole 225 are connected to each other. The first longitudinal supports at both ends of the first longitudinal through hole 222 in the vertical direction and the second longitudinal supports at both ends of the second longitudinal through hole 225 in the vertical direction are at least partially staggered.

In the embodiment of the present application, the vapor chamber 220 may be formed by welding the thirteenth panel 113 (i.e., the first series of panels) shown in fig. 16 and the fourteenth panel 114 (i.e., the second series of panels) shown in fig. 17 in an overlapping manner.

The thirteenth panel 113 is provided with a plurality of first longitudinal through holes 222. Each first longitudinal through hole 222 extends along a direction perpendicular to the horizontal heat dissipation surface, and a gap is provided between each first longitudinal through hole 222 and the condensate tank 210. The first longitudinal through holes 222 are distributed at intervals along the direction parallel to the horizontal radiating surface.

Wherein, the first longitudinal through holes 222 in the odd-numbered rows are provided with first connection pin holes 224 at the bottom in the vertical direction. The first connecting leg hole 224 extends toward the condensate pool 210 and communicates with the condensate pool 210. The first connecting pin hole 224 further extends toward the first longitudinal through hole 222 in the previous even-numbered column, and is spaced from the bottom of the first longitudinal through hole 222 in the previous even-numbered column in the vertical direction. The direction near the refrigerant inlet 310 is referred to as the front direction, and the direction near the refrigerant outlet 320 is referred to as the rear direction. Thus, the first longitudinal supports at the bottom in the vertical direction are interconnected two by two and one of the first longitudinal supports is interconnected with the bottom of the condensate sump 210.

The thirteenth panel 113 is further provided with a first transverse through hole 223. The first transverse through hole 223 is located at the top end of each first longitudinal through hole 222 in the vertical direction, and the first transverse through hole 223 extends in a direction parallel to the horizontal heat dissipation surface. The first lateral through holes 223 are provided with a gap from the top end of each first longitudinal through hole 222 in the vertical direction. Thereby, the first longitudinal supports positioned at the top in the vertical direction are sequentially connected to each other, and the two first longitudinal supports at both ends in the direction parallel to the horizontal heat dissipation surface are respectively connected to the solid portions of the thirteenth panel 113.

The fourteenth panel 114 is provided with a plurality of second longitudinal through holes 225. Each second longitudinal through hole 225 extends in a direction perpendicular to the horizontal heat dissipation surface, and a gap is provided between each second longitudinal through hole 225 and the condensate tank 210. The second longitudinal through holes 225 are distributed at intervals along the direction parallel to the horizontal radiating surface.

Wherein, the second longitudinal through holes 225 located in the odd-numbered columns are provided with second connecting pin holes 227. The second connection pin hole 227 extends toward the condensate pool 210 and communicates with the condensate pool 210. The second connecting pin hole 227 also extends in the direction of the second longitudinal through hole 225 of the adjacent subsequent even column, and is provided with a gap from the bottom of the second longitudinal through hole 225 of the subsequent even column in the vertical direction. Thus, the second longitudinal supports at the bottom in the vertical direction are interconnected two by two and one of the second longitudinal supports is interconnected with the bottom of the condensate sump 210.

The fourteenth panel 114 is further provided with a second transverse through hole 226. The second lateral through-hole 226 is located at the top end of each second vertical micro-hole in the vertical direction, and the second lateral through-hole 226 extends in a direction parallel to the horizontal heat dissipation surface. The second transverse through holes 226 are provided with a gap from the top end of each second longitudinal through hole 225 in the vertical direction. Thus, the second longitudinal supports located at the top in the vertical direction are sequentially connected to each other, and the two second longitudinal supports at the two ends in the direction parallel to the horizontal heat dissipation surface are respectively connected to the solid portions of the fourteenth panel 114.

Between the thirteenth panel 113 and the fourteenth panel 114, in the middle in the vertical direction, each of the first longitudinal through holes 222 and each of the second longitudinal through holes 225 communicate with each other, and form a sub-steam chamber 221. At the bottom in the vertical direction, the adjacent first longitudinal through holes 222 communicate with each other through the first connecting leg holes 224 and the second longitudinal through holes 225, and the adjacent second longitudinal through holes 225 communicate with each other through the second connecting leg holes 227 and the first longitudinal through holes 222. The distance between the second longitudinal through hole 225 and the condensate sump 210 is smaller than the distance between the first longitudinal through hole 222 and the condensate sump 210 along the top in the vertical direction, the orthogonal projection of the second transverse through hole 226 on the thirteenth panel 113 covers the first transverse through hole 223 and the top end of each first longitudinal through hole 222 in the vertical direction, so that each first longitudinal through hole 222 is communicated with each other through the second transverse through hole 226, and each second longitudinal through hole 225 is communicated with each other through the first longitudinal through hole 222 and the second transverse through hole 226.

In one possible embodiment, as shown in fig. 9-15, the vapor chamber 230 is further comprised by the vapor chamber 230, and the vapor chamber 230 is located between the heat sink assembly and the condensate pool 210.

The bottom of the auxiliary steam chamber 230 in the vertical direction is communicated with the condensate sump 210, and the side of the auxiliary steam chamber 230 is communicated with the steam chamber 220.

Thus, the vapor cavity 220 can be arranged in the middle of the condensate tank 210, and the heat dissipation assembly can be arranged adjacent to the vapor cavity 220, so that the volume of the heat dissipation system 100 is reduced. Can be in the position that sets up radiator unit, through setting up supplementary steam chamber 230 intercommunication steam chamber 220, make condensate bath 210 can extend and set up on whole horizontal cooling surface, increase condensate bath 210 and horizontal cooling surface's area of contact.

The specific structure of the plurality of panels with the auxiliary steam chamber 230 can be designed similarly with reference to the bottom structure of the steam chamber 220.

In one possible embodiment, as shown in fig. 9-17, the condensate bath 210 includes a plurality of microchannels 211, the plurality of microchannels 211 being parallel to each other in the plane of extension of the condensate bath 210, the plurality of microchannels 211 being interconnected by a vapor chamber 220 and an auxiliary vapor chamber 230.

Wherein, each panel can be formed with at least one micro channel 211, two side wall surfaces of the micro channel 211 are parallel to the horizontal heat dissipation surface, and the notch of the micro channel 211 points to one of the adjacent panels. In the micro channel 211 close to the vapor chamber 220, at least one portion of the side wall surface of the side of the micro channel 211 remote from the horizontal heat radiating surface is communicated with the vapor chamber 220. In the micro channels 211 adjacent to the auxiliary vapor chamber 230, at least one portion of a side wall surface of the micro channel 211 on a side away from the horizontal heat dissipation surface is communicated with the auxiliary vapor chamber 230. In this way, the microchannels 211 on adjacent panels may be interconnected by the vapor chamber 220 and the auxiliary vapor chamber 230, facilitating the distribution of condensate within each microchannel 211.

The structure of the plurality of micro-channels 211 can form a micro-channel group, so that the condensate can be uniformly distributed in the micro-channel group, and the heat dissipation area between the condensate and the heating element is expanded.

In order to further extend the heat dissipation area between the condensate and the heat generating member, the thickness of the panel on which the micro channels 211 are formed may be in a range of 0.05mm to 0.1mm, and illustratively, the thickness of the panel may be in a range of 0.05mm, 0.07mm, or 0.1mm, so that the panel may have sufficient structural strength and also form as many micro channels 211 as possible within a certain thickness range. And the thickness range of other panels (such as the second panel 102, the third panel 103, the fourth panel 104 and the fifth panel 105) can be 0.3mm-0.4mm, so that the design requirements can be met, and the cost can be saved.

The microchannels 211 may be formed by a material removing process, for example, the microchannels 211 may be formed by a half-etching technique, i.e., a solid material with a partial thickness is removed from the corresponding position of the thin plate by an etching solution, and the solid material with the partial thickness is remained, and the space where the material is removed forms the microchannels 211. The shape of the cross-section of the microchannels 211 may include triangular, rectangular, trapezoidal, or polygonal.

In one possible embodiment, the heat dissipation system 100 further includes a liquid pouring port (not shown) with a sealing cover, and the liquid pouring port is communicated with the top end of the steam chamber 220 in the vertical direction.

Thus, make-up condensate can be injected into the condensate pool 210 through the injection port.

In one implementation, the heat dissipation assembly includes two heat dissipation assemblies, and the two heat dissipation assemblies are located at two opposite sides of the extending direction of the steam cavity 220.

Thus, the heat dissipation assembly can perform cold transmission on two sides of the steam cavity 220, take away heat transferred by the steam cavity 220, and improve the heat dissipation effect of the heat dissipation system 100.

For example, in the embodiment of the present application, two bilaterally symmetrical heat dissipation assemblies are disposed on two sides of the steam cavity 220. The panels shown in fig. 4-17 are sequentially stacked and welded in sequence to form the left half of the heat dissipation system 100, and the right half is formed by sequentially welding the panels in reverse order and reverse order in a left-right symmetrical manner.

In an embodiment, as shown in fig. 16 and 17, the heat dissipating system further includes a cooling medium inlet 240 and a cooling medium outlet 250.

As shown in fig. 13 and 14, the refrigerant inlet 310 is located at a side of the heat sink assembly close to the steam chamber 220. The refrigerant inlet 240 is located on the panel forming the steam cavity 220, the refrigerant inlet 240 is located on one side of the temperature equalizing plate close to the refrigerant inlet 310, and the refrigerant inlet 240 is communicated with the refrigerant inlet 310.

As shown in fig. 13 and 14, the refrigerant outlet 320 is located at a side of the heat sink assembly close to the steam chamber 220. The refrigerant outlet 250 is formed on the panel forming the vapor chamber 220, the refrigerant outlet 250 is formed on one side of the temperature equalizing plate adjacent to the refrigerant inlet 310, and the refrigerant outlet 250 is communicated with the refrigerant outlet 320.

In this way, the refrigerant inlet 240 and the refrigerant inlet 310 form a refrigerant inlet relatively close to the center of the side surface of the heat dissipation system 100, and the refrigerant inlet 310 of the heat dissipation assembly is disposed at one side, so that a solid portion is retained at the periphery of the refrigerant inlet of the heat dissipation system 100, and a refrigerant inlet pipe is conveniently connected to the solid portion. Similarly, the refrigerant outlet 250 and the refrigerant outlet 320 form a refrigerant outlet relatively close to the center of the side surface of the heat dissipation system 100, and the refrigerant outlet 320 of the heat dissipation assembly is arranged on one side, so that a solid part is reserved on the periphery of the refrigerant outlet of the heat dissipation system 100, and the solid part is conveniently connected with a refrigerant outlet pipeline.

In one possible embodiment, as shown in fig. 1 and 2 in combination with fig. 7-10, the heat dissipation system 100 further includes two sets of screw holes 400, one set of screw holes 400 is located at the periphery of the refrigerant inlet 310, and the other set of screw holes 400 is located at the periphery of the refrigerant outlet 320.

Four screw holes 400 may be provided at the periphery of the refrigerant inlet 310, and the four screw holes 400 are formed by hollowing out etched through holes or grooves on the respective panels at corresponding positions and overlapping them. The set of screw holes 400 are connected to the refrigerant introduction pipe by screws.

Four screw holes 400 may be provided at the periphery of the refrigerant outlet 320, and the four screw holes 400 are formed by hollowing out etched through holes or grooves on the respective panels at corresponding positions and overlapping them. The set of screw holes 400 is connected to the refrigerant outlet pipe by screws.

Therefore, other structures do not need to be connected, the screw hole 400 is directly formed in the panel and connected with the refrigerant pipeline, the structure is simple, and thermal contact resistance and structural redundancy caused by solid structure connection can be avoided.

It should be noted that in the embodiments of the present application, "micro" in "micro channel" means that the structural size of the channel is in the micrometer scale, and for a structure not explicitly shown, such as "through hole", the structural size may be in the millimeter scale or in the micrometer scale, which is not limited herein.

It should be noted that, unless otherwise specifically stated or limited in the description of the embodiments of the present application, the terms "mounted," "connected," and "connected" are to be construed broadly, and may for example be fixed or indirectly connected through intervening media, or may be connected through two elements or in the interaction of two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In the description of the embodiments of the present application, the terms "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application. Further, the term "plurality" means two or more unless specifically stated otherwise.

In the description of the embodiments of the present application, the terms "first," "second," "third," "fourth," and the like (if any) are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipation system is characterized by being suitable for a heating element with a horizontal heat dissipation surface, and the heat dissipation system comprises a plurality of panels which are arranged in a stacked mode, wherein the panels are perpendicular to the horizontal heat dissipation surface;

2. The heat dissipation system as claimed in claim 1, wherein the microchannel has a plurality of micro channels, the plurality of micro channels are arranged in parallel, and each of the micro channels is connected between the refrigerant inlet and the refrigerant outlet.

3. The heat dissipation system as claimed in claim 1, wherein the plurality of microchannels are arranged in a mesh shape and are communicated with each other, at least one microchannel is communicated with the refrigerant inlet, and at least one microchannel is communicated with the refrigerant outlet.

4. The heat dissipation system of any one of claims 1-3, wherein the vapor chamber comprises a condensate pool and a vapor chamber, the condensate pool is located at the bottom of the heat dissipation system in the vertical direction, and the vapor chamber is located at the top of the heat dissipation system in the vertical direction;

5. The heat dissipation system of claim 4, wherein the vapor chamber micro-channel is provided in a plurality of numbers, and the plurality of vapor chamber micro-channels are located on a wall of the vapor chamber;

6. The heat dissipation system of claim 5, wherein the steam cavity comprises a plurality of sub-steam cavities, and the plurality of sub-steam cavities are arranged at intervals along a direction parallel to the horizontal heat dissipation surface;

7. The heat dissipation system of claim 6, wherein at least a portion of the sub-vapor cavities are located between a portion of the panels, the portion of the panels comprising a plurality of first-series panels and a plurality of second-series panels, the plurality of first-series panels and the plurality of second-series panels alternating in sequence;

8. The heat dissipation system of claim 4, wherein the vapor chamber further comprises an auxiliary vapor chamber between the heat dissipation assembly and the condensate sump;

9. The heat dissipation system of claim 8, wherein the condensate pool comprises a plurality of microchannels that are parallel to one another in a plane of extension of the condensate pool, the plurality of microchannels being interconnected by the vapor chamber and the auxiliary vapor chamber.

10. The heat dissipation system of claim 4, wherein the heat dissipation assembly comprises two heat dissipation assemblies, two heat dissipation assemblies being located on opposite sides of the vapor chamber in the direction of extension.

11. The heat dissipation system as claimed in claim 10, further comprising a refrigerant inlet and a refrigerant outlet;

12. An electronic component comprising a heat generating member and the heat dissipating system of any of claims 1-11, wherein the heat generating member has a horizontal heat dissipating surface, and the heat dissipating system is disposed on a side of the heat generating member adjacent to the horizontal heat dissipating surface.