CN217985782U - Phase change energy storage cooling system and electronic element - Google Patents

Abstract

A phase change energy storage cooling system and electronic component, the phase change energy storage cooling system is suitable for the heating element with horizontal cooling surface, the said phase change energy storage cooling system includes multiple panels set up in a cascade, multiple said panels are all perpendicular to the said horizontal cooling surface; a temperature equalizing plate and a heat dissipation assembly are arranged among the panels, the heat dissipation assembly is arranged adjacent to the temperature equalizing plate, at least part of the temperature equalizing plate is positioned at the bottom of the heat dissipation system along the vertical direction, and at least part of the heat dissipation assembly is positioned at the top of the heat dissipation system along the vertical direction; the heat dissipation assembly comprises a phase-change material inlet and a channel, wherein the phase-change material inlet is located at the top of the heat dissipation assembly in the vertical direction, the channel is located inside the heat dissipation assembly, and the channel is provided with a plurality of channels which are communicated with the phase-change material inlet. This application can promote the radiating effect to the piece that generates heat of periodic or pulsed work.

Description

Phase change energy storage cooling system and electronic element

Technical Field

The application relates to the technical field of electronic elements, in particular to a phase-change energy storage heat dissipation system and an electronic element.

Background

The heat pipe is an element for improving the heat transfer capacity of the heat dissipation system by utilizing latent heat of vaporization carried by the phase change process of liquid, and the heat dissipation system with the heat pipe is widely applied to the electronic engineering field.

In the related art, a heat dissipation system with heat pipes includes a heat absorption bottom plate, heat pipes, and heat dissipation fins, the heat absorption bottom plate is connected to a heat dissipation surface of a heat generating member, a plurality of heat pipes are disposed on a side of the heat absorption bottom plate away from the heat dissipation surface, heat absorption ends of the plurality of heat pipes are connected to the heat absorption bottom plate, heat dissipation ends of the plurality of heat pipes are away from the heat generating member, and the heat dissipation fins are connected to the heat dissipation ends of the heat pipes.

However, the heat dissipation system with the heat pipe has a poor heat dissipation effect on the heat generating member.

SUMMERY OF THE UTILITY MODEL

In view of the above problems, the present application provides a phase change energy storage heat dissipation system and an electronic component, which can improve the heat dissipation effect of a heat generating component.

In order to achieve the above purpose, the present application provides the following technical solutions:

a first aspect of an embodiment of the present application provides a phase change energy storage cooling system, which is suitable for a heating element having a horizontal cooling surface, and includes a plurality of stacked panels, where the plurality of panels are perpendicular to the horizontal cooling surface;

a temperature equalizing plate and a heat dissipation assembly are arranged among the panels, the heat dissipation assembly is arranged adjacent to the temperature equalizing plate, at least part of the temperature equalizing plate is positioned at the bottom of the heat dissipation system along the vertical direction, and at least part of the heat dissipation assembly is positioned at the top of the heat dissipation system along the vertical direction;

the heat dissipation assembly comprises a phase-change material inlet and a channel, wherein the phase-change material inlet is located at the top of the heat dissipation assembly in the vertical direction, the channel is located inside the heat dissipation assembly, and the channel is multiple and communicated with the phase-change material inlet.

In an implementation, the plurality of channels are arranged in a net shape and are communicated with each other, and at least one channel is communicated with the phase-change material inlet.

In an achievable embodiment, a plurality of the channels are arranged in parallel, and each of the channels extends in a vertical direction; the top of each channel along the vertical direction is communicated with the phase change material inlet, and the bottom of each channel along the vertical direction is communicated with each other.

In one implementation, the phase-change material distributor further comprises a uniform distribution pool and a partition plate, wherein the uniform distribution pool and the partition plate are located between the phase-change material inlet and the channel;

the uniform distribution tank is positioned on one side of the partition board close to the phase-change material inlet and is communicated with the phase-change material inlet;

the baffle is provided with a plurality of through-holes, the through-holes intercommunication the equipartition pond with the passageway.

In an achievable embodiment, the temperature equalizing plate comprises a condensate pool and a steam cavity, the condensate pool is positioned at the bottom of the heat dissipation system in the vertical direction, and the steam cavity is positioned at the top of the heat dissipation system in the vertical direction;

the extension plane of the condensate liquid pool is parallel to the horizontal heat dissipation surface, the extension direction of the steam cavity is perpendicular to the extension plane of the condensate liquid pool, and the bottom of the steam cavity in the vertical direction is communicated with the condensate liquid pool;

at least part of the heat dissipation assembly is positioned at the top of the heat dissipation system along the vertical direction, and the heat dissipation assembly and the steam cavity are arranged in an abutting mode.

In one possible embodiment, the condensate bath comprises a plurality of microchannels, which are parallel to one another in the plane of extension of the condensate bath, adjacent microchannels being in communication with one another via the vapor chamber.

In an implementation manner, the vapor chamber further comprises a plurality of vapor chamber micro channels, and the plurality of vapor chamber micro channels are located on the wall of the vapor chamber;

each steam cavity micro-channel extends along the extending direction of the steam cavity, and the bottom end of each steam cavity micro-channel along the vertical direction is communicated with the condensate tank.

In one realized implementation mode, the steam cavity comprises a plurality of sub-steam cavities which are arranged at intervals along the direction parallel to the horizontal heat dissipation surface;

and the bottom of each sub-steam cavity in the vertical direction is communicated with the bottom of the corresponding condensate pool, and the tops of the sub-steam cavities in the vertical direction are communicated with each other.

In an embodiment, at least part of the sub-steam chambers are located between part of the panels, which comprise a plurality of first series of panels and a plurality of second series of panels, which are alternately distributed in sequence;

a plurality of first longitudinal through holes are formed in the first sequence panel and distributed at intervals in the direction parallel to the horizontal radiating surface, and a first longitudinal support is formed at the solid part between the adjacent first longitudinal through holes;

a plurality of second longitudinal through holes are formed in the second sequence panel and distributed at intervals in the direction parallel to the horizontal radiating surface, and a solid part between every two adjacent second longitudinal through holes forms a second longitudinal support;

the first longitudinal through hole and the second longitudinal through hole are communicated with each other along the thickness direction of the panel; the first longitudinal support located at the middle of the first longitudinal through hole in the vertical direction and the second longitudinal support located at the middle of the second longitudinal through hole are connected with each other; the first longitudinal supports located at the two ends of the first longitudinal through hole in the vertical direction and the second longitudinal supports located at the two ends of the second longitudinal through hole in the vertical direction are at least partially arranged in a staggered mode.

In an implementation manner, a plurality of steam cavities are arranged and distributed at intervals, and the bottom ends of the steam cavities in the vertical direction are communicated with each other and communicated to the condensate liquid pool;

the heat dissipation assembly comprises a first heat dissipation assembly, and the first heat dissipation assembly is located among the plurality of steam cavities.

In one implementation, the heat dissipation assembly further includes a second heat dissipation assembly located at least one side of the plurality of vapor chambers, and the second heat dissipation assembly and the first heat dissipation assembly are communicated with each other.

A second aspect of the embodiments of the present application provides an electronic component, including generating heat and the above-mentioned cooling system, the piece that generates heat has a horizontal cooling surface, cooling system set up in the piece that generates heat is close to one side of horizontal cooling surface.

The embodiment of the application provides a phase change energy storage cooling system and an electronic element, and the phase change energy storage cooling system is particularly suitable for a heating element with a horizontal cooling surface and working periodically or in a pulse mode. The energy storage phase change heat dissipation system is provided with the temperature equalizing plate and the heat dissipation assembly, so that one end of the temperature equalizing plate, which is relatively close to the horizontal heat dissipation surface, forms an evaporation end to absorb heat of the heating part, and one end of the temperature equalizing plate, which is relatively far away from the horizontal heat dissipation surface, forms an evaporation end to dissipate heat through the adjacent heat dissipation assembly; the panels are perpendicular to the horizontal radiating surface, so that the panels form a layered structure, heat of the heating part flows along the layers where the panels are located, the flow resistance is smaller, the heat can be quickly diffused to the end far away from the horizontal radiating surface from the end close to the horizontal radiating surface, the radiating efficiency is higher, and the radiating effect is better; the heat dissipation assembly is arranged on the panel and is arranged adjacent to the temperature equalizing plate, and the temperature equalizing plate and the heat dissipation assembly are separated by only one wall, so that the thermal contact resistance and the structural redundancy caused by the connection of a solid structure are avoided, and the heat can be quickly diffused along the panel; by arranging the channel, when in use, the phase-change material is filled in the channel, the phase-change material can absorb the heat of the temperature equalizing plate and store latent heat in the working period of the heating element, and can exchange heat with the surrounding environment and release the latent heat in the non-working period of the heating element, and the circulation is carried out in such a way that the phase-change material periodically or impulsively dissipates the heat of the heating element to the surrounding environment along with the heating element; the phase-change material is divided by the plurality of channels, so that the heat transfer area between the temperature-equalizing plate and the phase-change material is expanded, the heat transfer effect between the temperature-equalizing plate and the phase-change material is enhanced, and the heat dissipation capability of the heat dissipation system is improved. The electronic element comprises the heat dissipation system and has the same beneficial effects.

The construction and other objects and advantages of the present application will be more apparent from the description of the preferred embodiments taken in conjunction with the accompanying drawings.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following descriptions are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic diagram of a phase change energy storage heat dissipation system according to an embodiment of the present disclosure;

FIG. 2 is a top view of FIG. 1;

FIG. 3 isbase:Sub>A schematic view of the detailed structure along line A-A in FIG. 1;

FIG. 4 is a partial enlarged view of FIG. 3 at B;

FIG. 5 is a partial enlarged view of the area C in FIG. 3

FIG. 6 is a view from direction D-D of FIG. 1;

FIG. 7 is an enlarged view of a portion of FIG. 6 at E;

FIG. 8 is an enlarged view of a portion of FIG. 6 at F;

fig. 9 is a schematic structural diagram of a first panel of a phase change energy storage heat dissipation system according to an embodiment of the present disclosure;

fig. 10 is a schematic structural diagram of a second panel of the phase change energy storage heat dissipation system according to an embodiment of the present disclosure;

fig. 11 is a schematic structural diagram of a third panel of a phase change energy storage heat dissipation system according to an embodiment of the present disclosure;

fig. 12 is a schematic structural diagram of a fourth panel of the phase change energy storage heat dissipation system according to an embodiment of the present disclosure;

fig. 13 is a schematic structural diagram of a fifth panel of a phase change energy storage heat dissipation system according to an embodiment of the present disclosure;

fig. 14 is a schematic structural view of a sixth panel of the phase change energy storage heat dissipation system according to an embodiment of the present disclosure;

fig. 15 is a schematic structural diagram of a seventh panel of the phase change energy storage heat dissipation system according to an embodiment of the present disclosure;

fig. 16 is a schematic structural diagram of an eighth panel of the phase change energy storage heat dissipation system according to an embodiment of the present disclosure;

fig. 17 is a schematic structural diagram of a ninth panel of a phase change energy storage heat dissipation system according to an embodiment of the present application;

fig. 18 is a schematic structural diagram of a tenth panel of a phase change energy storage heat dissipation system according to an embodiment of the present disclosure;

fig. 19 is a schematic structural diagram of an eleventh panel of a phase change energy storage heat dissipation system according to an embodiment of the application.

Description of reference numerals:

100-a phase change energy storage heat dissipation system;

101-a first panel; 102-a second panel; 103-a third panel; 104-a fourth panel; 105-a fifth panel; 106-a sixth panel; 107-seventh panel; 108-an eighth panel; 109-ninth panel; 110-tenth panel; 111-eleventh panel;

210-condensate tank; 211-microchannels;

220-a steam chamber; 221-sub-steam cavity; 222-a first longitudinal through hole; 223-a first lateral via; 224-first connecting pin hole; 225-a second longitudinal through hole; 226-a second lateral via;

227-second connecting pin holes;

301-a first heat dissipating component; 302-a second heat dissipation assembly;

310-phase change material inlet;

320-uniformly distributing tanks;

330-a separator;

340-a channel; 331-a first microwell; 332-a second microwell;

q-heat; an X-phase change material; y-condensate; z-steam.

Detailed Description

In the related art, a heat dissipation system having a heat pipe includes a heat absorption base plate, a heat pipe, and heat dissipation fins. The heat absorbing bottom plate is connected to the heat dissipating surface of the heating member through an interface material for reducing contact thermal resistance. One side of the heat absorption bottom plate, which is far away from the heat dissipation surface, is provided with a plurality of heat pipes. The heat pipes are U-shaped, and the two ends of each U-shaped heat pipe are respectively a heat absorption end and a heat dissipation end. The heat absorption end of each U-shaped heat pipe is clamped on the heat absorption bottom plate, and the heat dissipation end of each U-shaped heat pipe is positioned on one side far away from the heating element and is arranged at intervals with the heat absorption bottom plate. The plurality of radiating fins are arranged in parallel at intervals and are riveted at the radiating end of the U-shaped heat pipe.

However, in the above technical solution, the manufacturing method of separately connecting the heat dissipation fins and the heat pipe increases the contact thermal resistance, which causes unnecessary material redundancy, and not only the manufacturing process is complicated, the consumption is large, but also the heat dissipation effect on the heating element working periodically or in a pulse manner is poor.

In view of the above technical problems, the embodiments of the present application provide a phase change energy storage heat dissipation system and an electronic device, where the phase change energy storage heat dissipation system is particularly suitable for a heating element with a horizontal heat dissipation surface that works periodically or in a pulse manner. The energy storage phase change heat dissipation system is provided with the temperature equalizing plate and the heat dissipation assembly, so that an evaporation end is formed at one end of the temperature equalizing plate, which is relatively close to the horizontal heat dissipation surface, to absorb the heat of the heating part, and an evaporation end is formed at one end of the temperature equalizing plate, which is relatively far away from the horizontal heat dissipation surface, to dissipate the heat through the adjacent heat dissipation assembly; the panels are perpendicular to the horizontal radiating surface, so that the panels form a layered structure, heat of the heating part flows along the layers where the panels are located, the flow resistance is smaller, the heat can be quickly diffused to the end far away from the horizontal radiating surface from the end close to the horizontal radiating surface, the radiating efficiency is higher, and the radiating effect is better; the heat dissipation assembly is arranged on the panel and is adjacent to the temperature equalizing plate, and the temperature equalizing plate and the heat dissipation assembly are separated by only one wall, so that the thermal contact resistance and the structural redundancy caused by the connection of a solid structure are avoided, and the heat can be quickly diffused along the panel; by arranging the channel, the phase-change material is filled in the channel when in use, the phase-change material can absorb the heat of the temperature equalizing plate and store latent heat in the working period of the heating element, and can exchange heat with the surrounding environment and release the latent heat in the non-working period of the heating element, and the circulation is performed in such a way that the phase-change material periodically or impulsively emits the heat of the heating element to the surrounding environment along with the heating element; the phase-change material is divided by the channels, so that the heat transfer area between the temperature-equalizing plate and the phase-change material is expanded, the heat transfer effect between the temperature-equalizing plate and the phase-change material is enhanced, and the heat dissipation capability of the heat dissipation system is improved. The electronic element comprises the heat dissipation system and has the same beneficial effects.

In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions in the embodiments of the present application will be described in more detail below with reference to the accompanying drawings in the preferred embodiments of the present application. In the drawings, the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The embodiments described are some, but not all embodiments of the disclosure. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The electronic components provided in the embodiments of the present application will be described below.

The embodiment of the application provides an electronic component, including generating heat and cooling system, the piece that generates heat that the piece has the periodic or the work of impulse nature of horizontal cooling surface, cooling system sets up in the one side that the piece that generates heat is close to horizontal cooling surface.

The electronic component may include a circuit board, and the heat generating member may include a chip on the circuit board. The application range of the electronic element can comprise the scenes of aviation and aerospace thermal control, power battery thermal management, electronic device thermal management, building thermal management and the like. The heating element can be a heating element which works periodically or in a pulse mode, and the heating element can comprise a heating element with large space, low power and low heat flow density, and particularly can comprise a heating element with large power and high heat flow density in a narrow space. For example, the circuit board may include a circuit board in a lunar vehicle, and the heat generating element of the circuit board has a periodic operation characteristic. The circuit board can also be a circuit board in a missile electronic system, and the heating element of the circuit board has the characteristic of pulse operation.

It will be appreciated that as the position and attitude of the electronic component changes during use, the position and attitude of the horizontal heat-dissipating surfaces change, i.e., the horizontal heat-dissipating surfaces may have an inclined or vertical state. The embodiment of the present application does not strictly limit that the horizontal heat dissipation surface is kept horizontal at any time, but means that the horizontal heat dissipation surface may have a horizontal state in a normal condition.

The phase change energy storage heat dissipation system 100 provided by the embodiment of the present application will be described below with reference to fig. 1 to 19.

The embodiment of the application provides a phase change energy storage cooling system 100, is applicable to the piece that generates heat that has the periodic or pulse nature work of horizontal cooling surface, and phase change energy storage cooling system 100 is including a plurality of panels of range upon range of setting, and the equal perpendicular to horizontal cooling surface of a plurality of panels.

A temperature equalizing plate and a heat dissipation assembly are arranged among the panels, the heat dissipation assembly is arranged adjacent to the temperature equalizing plate, at least part of the temperature equalizing plate is located at the bottom of the heat dissipation system in the vertical direction, and at least part of the heat dissipation assembly is located at the top of the heat dissipation system in the vertical direction.

The heat dissipation assembly comprises a phase change material inlet 310 and a channel 340, wherein the phase change material inlet 310 is positioned at the top of the heat dissipation assembly in the vertical direction, the channel 340 is positioned inside the heat dissipation assembly, the number of the channels 340 is multiple, and the multiple channels 340 are all communicated with the phase change material inlet 310.

The panel may comprise a ceramic, metal or composite material piece, among others. Illustratively, the panel may be a copper alloy sheet or a stainless steel sheet. The plurality of panels may have the same shape and size, so that orthographic projections of the plurality of panels on each other are all overlapped with each other, and the plurality of panels may be welded and fixed.

The multiple panels are perpendicular to the horizontal radiating surface, so that the multiple panels form a layered structure, the heat Q of the heating part flows along the layers where the panels are located, and the flow resistance is smaller. Heat Q can be from the one end that is close to horizontal cooling surface, and the one end of keeping away from horizontal cooling surface is diffused rapidly, and the radiating efficiency is higher, and the radiating effect is better.

The vapor chamber is a heat pipe structure formed in a plurality of panels. On one hand, the temperature equalizing plate has better heat transfer and heat dissipation effects by means of the arrangement mode that the panel is perpendicular to the horizontal heat dissipation surface. On the other hand, at least part of the temperature equalizing plate is positioned at the bottom of the heat dissipation system along the vertical direction, the part of the temperature equalizing plate relatively close to the horizontal heat dissipation surface forms an evaporation end so as to absorb the heat Q of the heating part, one end of the temperature equalizing plate relatively far away from the horizontal heat dissipation surface forms a condensation end, and the heat Q transferred to the condensation end is dissipated through the adjacent heat dissipation assembly.

The heat dissipation assembly is formed among the plurality of panels. On one hand, the heat dissipation assembly has better heat transfer and heat dissipation effects by means of the arrangement mode that the panel is perpendicular to the horizontal heat dissipation surface. On the other hand, the heat dissipation assembly is arranged adjacent to the temperature equalizing plate, and the temperature equalizing plate and the heat dissipation assembly are separated by only one wall, so that the thermal contact resistance and the structural redundancy caused by the connection of a solid structure are avoided, and the heat Q can be rapidly diffused along the panel.

The phase change material inlet 310 is used to fill the phase change material X into the channel 340. The phase-change material X has a high latent heat of phase change per unit mass, but many phase-change materials X have poor heat conductivity and low heat conductivity (for example, the heat conductivity coefficient of the phase-change material X paraffin is much lower than that of metals, semiconductors, ceramics, etc.), which will seriously affect the rate of energy storage and energy release of the phase-change material X. The phase-change material X enters the channel 340 and is divided by the plurality of channels 340, so that the heat transfer area between the phase-change material X and the temperature-equalizing plate is expanded, the heat transfer effect between the phase-change material X and the temperature-equalizing plate is enhanced, and the heat dissipation capacity of the heat dissipation system is improved.

The phase change material X undergoes phase change transformation of a substance state by absorbing or releasing a large amount of latent heat, which can realize large-capacity heat Q storage and release at a constant temperature. According to the principle of conservation of energy, for the whole phase change energy storage heat dissipation system 100, the heat Q applied to the phase change material X by the heat equalizing plate by the heating element, the solid sensible heat absorption in the phase change material X, the phase change latent heat absorption in the melting process, the liquid sensible heat absorption, and the heat Q of convection heat dissipation of the phase change material X and the surrounding environment are the same, so that the heat Q in the heating element can be dissipated to the surrounding environment through the heat equalizing plate and the phase change material X in sequence, and the transfer process of the heat Q is realized. And the phase change material X can absorb the heat Q of the temperature equalizing plate and store latent heat in the working period of the heating element, and can exchange heat with the surrounding environment and release latent heat in the non-working period of the heating element, and the circulation is performed in such a way that the phase change material X periodically or impulsively emits the heat Q of the heating element to the surrounding environment along with the heating element. The pulse property can be understood as a special case of periodicity, which has only one working period, and is a non-working period at other times.

For example, the phase change material X may be solid at normal temperature, and when the heating element is in the working cycle, the phase change material X absorbs the heat Q, the temperature of the phase change material X continuously increases, the phase change material X continuously softens, the phase change material X is in a solid-liquid mixed state near the melting point, and the constant temperature is maintained. When the heating element is in a non-working period, the solid-liquid mixed phase-change material X releases heat Q to the surrounding environment and is gradually hardened, and the phase-change material X is solidified again along with the continuous release of the heat Q.

It can be understood that, in order to make the temperature fluctuation of the phase change energy storage heat dissipation system 100 tend to be uniform and avoid the temperature of the heating element from exceeding the allowable temperature in the working period, the heat absorption amount of the phase change material X should be controlled to match the heat generation amount of the heating element, so as to avoid the phase change material X from being completely melted to cause continuous temperature rise. Furthermore, since the phase change material X is in a solid-liquid mixed state during the operation period, in order to prevent the phase change material X from overflowing through the phase change material inlet 310, the phase change material inlet 310 should be provided with a sealing cover (not shown).

It will be appreciated that the dimensions of the channels 340 may be of the conventional millimeter or micron size, all of which may have the technical effect described above. The dimensions of the channels 340 are explained below as being of the order of micrometers.

In the embodiment of the present application, the plurality of channels 340 may include the following two arrangements:

in a first possible arrangement, as shown in fig. 3-8, a plurality of channels 340 are arranged in a mesh and are in communication with each other, with at least one channel 340 being in communication with the phase change material inlet 310.

Therefore, a plurality of mutually communicated channel sections can be formed inside the heat dissipation assembly, the heat transfer area of the phase change material X and the temperature equalizing plate can be expanded, and the heat dissipation effect is improved.

In one possible embodiment, the channel 340 may be formed by alternately welding a plurality of second panels 102 as shown in fig. 10 and a plurality of third panels 103 as shown in fig. 11 in a stacked manner.

The second panel 102 is provided with a plurality of first micro holes 331, each first micro hole 331 extends along a direction parallel to the horizontal heat dissipation surface, and the plurality of first micro holes 331 are distributed at intervals along a direction perpendicular to the horizontal heat dissipation surface. The third panel 103 is provided with a plurality of second micro holes 332, each second micro hole 332 extends along a direction perpendicular to the horizontal heat dissipation surface, and the plurality of second micro holes 332 are distributed at intervals along a direction parallel to the horizontal heat dissipation surface.

After the second panel 102 and the third panel 103 are sequentially stacked, the positions of the first micro-holes 331 and the second micro-holes 332 are communicated with each other, and the channels 340 which are arranged in a mesh shape and are communicated with each other are formed. Moreover, the solid portions between the first micro holes 331 of the second panel 102 and the solid portions between the second micro holes 332 of the third panel 103 are connected to each other, so that the heat dissipation assembly has sufficient structural strength.

In some embodiments, a plurality of second panels 102 may be provided in a stacked arrangement, and then a plurality of third panels 103 may be welded adjacent to each other in a stacked arrangement. The first plurality of micro-apertures 331 in the second panel 102 are interconnected, the second plurality of micro-apertures 332 in the third panel 103 are interconnected, and then the two are intersected to form a set of channel segments. Multiple sets of adjacent channel segments may be provided to form a network of interconnected channels 340.

In some embodiments, as shown in fig. 16-19, at the bottom of the panel partially forming the channel 340 near the vertical direction, a part of the structure of the temperature equalization plate needs to be arranged, so that the extension number and the extension length of the first micro-hole 331 and the second micro-hole 332 at the corresponding positions are slightly different, but the first micro-hole 331 and the second micro-hole 332 at other positions are not affected to communicate with each other and form the channel 340. The extension lengths of the first micro holes 331 and the second micro holes 332 are not limited in the embodiment of the present application, as long as the first micro holes 331 and the second micro holes 332 staggered on the adjacent panels can be communicated with each other, and can provide a flow channel for the refrigerant.

In a second possible arrangement, a plurality of channels 340 are arranged in parallel, and each channel 340 extends in a vertical direction; the top of each channel 340 in the vertical direction communicates with the phase change material inlet 310, and the bottom of each channel 340 in the vertical direction communicates with each other.

In one possible embodiment, the second micro-holes 332 may be formed in a plurality of stacked panels, and the second micro-holes 332 in adjacent panels are connected to each other and form a plurality of channels 340 arranged in parallel. Moreover, the solid portions between the second micro holes 332 of each panel are connected to the solid portions between the second micro holes 332 of the adjacent panels, so that the heat dissipation assembly has sufficient structural strength.

Therefore, the channel 340 can also divide the phase-change material X, increase the heat transfer area between the temperature-equalizing plate and the phase-change material X, and improve the heat dissipation effect.

It should be noted that, in two possible arrangements of the channel 340, the channel 340 may extend along a straight line or along a curved line, which is not limited in this embodiment of the application.

In one implementation, as shown in fig. 3 and 6, the phase change energy storage heat dissipation system 100 further includes a uniform cell 320 and a partition 330, and the uniform cell 320 and the partition 330 are located between the phase change material inlet 310 and the channel 340.

The distribution tank 320 is located at one side of the partition 330 near the phase change material inlet 310, and the distribution tank 320 is communicated with the phase change material inlet 310.

The partition 330 is provided with a plurality of through holes which communicate the uniform distribution tank 320 and the channel 340.

The uniform distribution pool 320 may be formed by communicating through holes formed on a plurality of panels, or may be a structure of the channel 340. The partition 330 may be formed by welding solid portions of a plurality of panels to each other, and through holes are formed in a portion of the panels in a vertical direction so as to communicate the cells 320 and the channels 340.

In this way, the distribution tank 320 and the partition 330 may form a buffer structure between the channel 340 and the phase change material inlet 310, which facilitates uniform distribution of the phase change material X.

In one possible embodiment, as shown in fig. 13-19, the vapor chamber 220 includes a condensate pool 210 and a vapor chamber 210, the condensate pool 210 is located at the bottom of the heat dissipation system in the vertical direction, and the vapor chamber 220 is located at the top of the heat dissipation system in the vertical direction.

The extension plane of the condensate pool 210 is parallel to the horizontal heat dissipation surface, the extension direction of the vapor cavity 220 is perpendicular to the extension plane of the condensate pool 210, and the bottom of the vapor cavity 220 along the vertical direction is communicated with the condensate pool 210.

At least a portion of the heat dissipation assembly is located at the top of the heat dissipation system along the vertical direction, and the heat dissipation assembly is disposed adjacent to the steam chamber 220.

The condensate pool 210 is arranged close to the horizontal radiating surface, and the condensate Y in the condensate pool 210 absorbs the heat Q of the heating part and is vaporized and phase-changed into steam Z. The phase-changed steam Z enters the steam cavity 220 and flows toward one end of the steam cavity 220 away from the horizontal heat dissipation surface. During the flowing process of the steam Z, the heat Q of the steam is absorbed by the phase-change material X in the heat dissipation assembly and is changed into the condensate Y. The phase-changed condensate Y flows back to the condensate pool 210 along the wall of the steam cavity 220, and the heat Q of the heating element is continuously dissipated out through the heat dissipation assembly in a reciprocating manner.

The extended plane of the condensate pool 210 is distributed over the entire horizontal heat-dissipating surface, which can increase the contact area between the condensate Y and the horizontal heat-dissipating surface, and dissipate heat at each position of the horizontal heat-dissipating surface. The heat dissipation assembly is disposed adjacent to the vapor chamber 220, and can absorb the heat Q transferred from the vapor chamber 220 to the maximum extent.

In one possible embodiment, as shown in fig. 5 and 8 in combination with fig. 13 and 14, the condensate bath 210 includes a plurality of microchannels 211, the plurality of microchannels 211 being parallel to each other in the plane of extension of the condensate bath 210, the plurality of microchannels 211 being interconnected by a vapor chamber 220.

Wherein, each panel can be formed with at least one micro channel 211, two side wall surfaces of the micro channel 211 are parallel to the horizontal heat dissipation surface, and the notch of the micro channel 211 points to one panel adjacent to the notch. At least one of the side wall surfaces of the microchannel 211 on the side remote from the horizontal heat dissipating surface is in communication with the vapor chamber 220. In this way, the microchannels 211 on adjacent panels may communicate with one another through the vapor chamber 220, facilitating the distribution of condensate Y within each microchannel 211.

The structure of the plurality of micro-channels 211 can form a micro-channel 211 group, so that the condensate Y can be uniformly distributed in the micro-channel 211 group, and the heat dissipation area between the condensate Y and the heating element is expanded.

In order to further extend the heat dissipation area between the condensate Y and the heat generating member, the thickness of the panel on which the micro channels 211 are formed may be in a range of 0.05mm to 0.1mm, and illustratively, the thickness of the panel may be in a range of 0.05mm, 0.07mm, or 0.1mm, so that the panel may have sufficient structural strength and also form as many micro channels 211 as possible within a certain thickness range. And the thickness of other panels (such as the second panel 102 and the third panel 103) can be in the range of 0.3mm-0.4mm, so that the design requirements can be met, and the cost can be saved.

The microchannels 211 may be formed by a material removing process, for example, the microchannels 211 may be formed by a half-etching technique, in which a portion of the thickness of the solid material at the corresponding position of the thin plate is removed by an etching solution, and the solid material is retained at the corresponding position of the thin plate, and the removed material space forms the microchannels 211. The shape of the cross-section of the microchannels 211 may include triangular, rectangular, trapezoidal, or polygonal.

In one implementation, the vapor chamber further includes a plurality of vapor chamber microchannels (not shown), and the plurality of vapor chamber microchannels are located on the wall of the vapor chamber 220.

Each steam cavity microchannel all extends along the extending direction of steam cavity 220, and the bottom along the vertical direction of each steam cavity microchannel communicates with condensate sump 210.

Therefore, the condensate L in the condensate tank 210 can enter the steam cavity 220 through the steam micro-channel, and the condensate L in the steam micro-channel can be heated and gasified in the steam cavity 220, so that the heat dissipation area of the condensate L is further increased, and the heat dissipation efficiency is improved.

It is understood that the steam microchannels may be grooved in the middle in the thickness direction of the panel to form a microchannel structure, and also grooved in the sides in the thickness direction of the panel to form a microchannel structure together with the adjacent panels.

In one possible implementation, as shown in fig. 13 and 14, the steam cavity 220 includes a plurality of sub-steam cavities 220, and the plurality of sub-steam cavities 220 are arranged at intervals along a direction parallel to the horizontal heat dissipation surface.

The bottoms of the plurality of sub-steam cavities 220 in the vertical direction are all communicated with each other and are communicated with the condensate tank 210, and the tops of the plurality of sub-steam cavities 220 in the vertical direction are all communicated with each other.

Like this, set up steam cavity 220 into the structure that a plurality of sub-steam cavities 220 communicate each other, both guaranteed that the steam Z that condensate pond 210 formed diffuses rapidly along sub-steam cavity 220, can also form the support at the entity part between adjacent sub-steam cavity 220, support interconnect on the adjacent panel can guarantee the structural strength of samming board.

In one possible embodiment, at least part of sub-vapor chamber 221 is located between partial panels, which comprise a plurality of first-sequence panels and a plurality of second-sequence panels, which are alternately distributed in sequence.

The first sequence panel is provided with a plurality of first longitudinal through holes 222 distributed at intervals along the direction parallel to the horizontal heat radiating surface, and solid parts between the adjacent first longitudinal through holes 222 form first longitudinal supports.

The second sequence panel is provided with a plurality of second longitudinal through holes 225 which are distributed at intervals along the direction parallel to the horizontal heat radiating surface, and solid parts between the adjacent second longitudinal through holes 225 form second longitudinal supports.

The first longitudinal through hole 222 and the second longitudinal through hole 225 communicate with each other in the thickness direction of the panel. The first longitudinal support located at the middle of the first longitudinal through hole 222 in the vertical direction and the second longitudinal support located at the middle of the second longitudinal through hole 225 are connected to each other. The first longitudinal supports at both ends of the first longitudinal through hole 222 in the vertical direction and the second longitudinal supports at both ends of the second longitudinal through hole 225 in the vertical direction are at least partially staggered.

In the embodiment of the present application, the vapor chamber 220 may be formed by sequentially and alternately welding the fifth panels 105 (i.e., the first series of panels) shown in fig. 13 and the sixth panels 106 (i.e., the second series of panels) shown in fig. 14.

The fifth panel 105 is provided with a plurality of first longitudinal through holes 222. Each first longitudinal through hole 222 extends along a direction perpendicular to the horizontal heat dissipation surface, and a gap is provided between each first longitudinal through hole 222 and the condensate tank 210. The first longitudinal through holes 222 are distributed at intervals along the direction parallel to the horizontal radiating surface.

Wherein, the first longitudinal through holes 222 located in the odd-numbered rows are provided with first connection pin holes 224 at the bottom in the vertical direction. The first connecting leg hole 224 extends toward the condensate pool 210 and communicates with the condensate pool 210. The first connecting pin hole 224 also extends toward the first longitudinal through hole 222 of the previous even-numbered column and is communicated with the bottom of the first longitudinal through hole 222 of the previous even-numbered column along the vertical direction. The direction of the side close to the refrigerant inlet is referred to as front, and the direction of the side close to the refrigerant outlet is referred to as rear. Thus, the first longitudinal supports at the bottom in the vertical direction are interconnected two by two and one of the first longitudinal supports is interconnected with the bottom of the condensate sump 210.

The fifth panel 105 is further provided with a first lateral through hole 223. The first lateral through holes 223 are located at the top ends of the respective first longitudinal through holes 222 in the vertical direction, and the first lateral through holes 223 extend in a direction parallel to the horizontal heat dissipation surface. The first lateral through holes 223 are provided with a gap from the top end of each first longitudinal through hole 222 in the vertical direction. Thereby, the first longitudinal supports located at the top in the vertical direction are sequentially connected to each other, and the two first longitudinal supports at both ends in the direction parallel to the horizontal heat dissipation surface are respectively connected to the solid portions of the fifth panel 105.

The sixth panel 106 is provided with a plurality of second longitudinal through holes 225. Each second longitudinal through hole 225 extends in a direction perpendicular to the horizontal heat dissipation surface, and a gap is provided between each second longitudinal through hole 225 and the condensate tank 210. The second longitudinal through holes 225 are distributed at intervals along the direction parallel to the horizontal radiating surface.

Wherein, the second longitudinal through holes 225 located in the odd-numbered columns are provided with second connecting pin holes 227. The second connection pin hole 227 extends toward the condensate pool 210 and communicates with the condensate pool 210. The second connecting pin hole 227 also extends in the direction of the second longitudinal through hole 225 of the adjacent subsequent even column, and communicates with the bottom of the second longitudinal through hole 225 of the subsequent even column in the vertical direction. Thus, the second longitudinal supports located at the bottom in the vertical direction are interconnected two by two, and one of the second longitudinal supports is interconnected with the bottom of the condensate tank 210.

The sixth plate 106 is also provided with a second transverse through hole 226. The second lateral through-hole 226 is located at the top end of each second vertical micro-hole in the vertical direction, and the second lateral through-hole 226 extends in a direction parallel to the horizontal heat dissipation surface. The second lateral through holes 226 are provided with a gap from the top end of each second longitudinal through hole 225 in the vertical direction. Thereby, the second longitudinal supports located at the top in the vertical direction are sequentially connected to each other, and the two second longitudinal supports at both ends in the direction parallel to the horizontal heat dissipation surface are respectively connected to the solid portions of the sixth plate 106.

Between the fifth panel 105 and the sixth panel 106, in the middle in the vertical direction, each first longitudinal through hole 222 and each second longitudinal through hole 225 communicate with each other, and form a sub-steam chamber 221. At the bottom in the vertical direction, the adjacent first longitudinal through holes 222 communicate with each other through the first connecting leg holes 224 and the second longitudinal through holes 225, and the adjacent second longitudinal through holes 225 communicate with each other through the second connecting leg holes 227 and the first longitudinal through holes 222. The distance between the second longitudinal through hole 225 and the condensate sump 210 is smaller than the distance between the first longitudinal through hole 222 and the condensate sump 210, the orthographic projection of the second transverse through hole 226 on the fifth panel 105 covers the first transverse through hole 223 and the top end of each first longitudinal through hole 222 in the vertical direction, so that each first longitudinal through hole 222 is communicated with each other through the second transverse through hole 226, and each second longitudinal through hole 225 is communicated with each other through the first longitudinal through hole 222 and the second transverse through hole 226.

In one possible embodiment, the heat dissipation system further includes a liquid injection port (not shown) with a sealing cover, and the liquid injection port is communicated with the top end of the steam chamber 220 in the vertical direction.

Thus, make-up condensate Y can be injected into the condensate reservoir 210 through the injection port.

In an implementation manner, as shown in fig. 3 and 6, a plurality of vapor cavities 220 are provided, the plurality of vapor cavities 220 are distributed at intervals, and bottom ends of the vapor cavities 220 in the vertical direction are communicated with each other and the condensate tank 210.

The heat dissipation assembly includes a first heat dissipation assembly 301, and the first heat dissipation assembly 301 is located between the plurality of vapor chambers 220.

Like this, condensate tank 210 absorbs the heat Q who generates heat and turns into steam Z, and steam Z can flow in different steam cavity 220, with the help of the first radiator unit 301 between steam cavity 220, distributes away heat Q. The first heat dissipation assembly 301 is formed among the plurality of steam cavities 220, so that the first heat dissipation assembly 301 is fully contacted with the steam cavities 220, and the heat dissipation effect is improved.

In one implementation, the heat dissipation assembly further includes a second heat dissipation assembly 302, the second heat dissipation assembly 302 is located at least one side outside the plurality of vapor chambers 220, and the second heat dissipation assembly 302 and the first heat dissipation assembly 301 are communicated with each other.

Thus, the plurality of steam cavities 220 form a common region, the second heat dissipation assembly 302 is disposed on the side surface, far from the center, of the steam cavity 220 located at the edge of the common region, and the second heat dissipation assembly 302 is utilized to assist in absorbing the heat Q of the plurality of steam cavities 220, so that the heat dissipation effect is further improved.

In the embodiment of the present application, two steam cavities 220 are disposed at left and right intervals, and a first heat dissipation assembly 301 is disposed between the two steam cavities 220. The second heat dissipation assembly 302 is disposed on the left side of the left steam chamber 220 and the right side of the right steam chamber 220.

It should be noted that fig. 9-19 only show panels in a partial sequence for forming the phase change energy storage heat dissipation system 100. For example, a set number of the panels shown in fig. 9 to 19 may be sequentially stacked according to design parameters to form the second heat dissipation assembly 302, the vapor cavity 220, and the first heat dissipation assembly 301 of the left portion of the phase change energy storage heat dissipation system 100 shown in fig. 3 and 6, and the vapor cavity 220 and the second heat dissipation assembly 302 on the right side may be symmetrically arranged with reference to the structure of the panels.

It should be noted that, unless otherwise specifically stated or limited in the description of the embodiments of the present application, the terms "mounted," "connected," and "connected" are to be construed broadly, and may for example be fixed or indirectly connected through intervening media, or may be connected through two elements or in the interaction of two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In the description of the embodiments of the present application, the terms "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application. Further, the term "plurality" means two or more unless specifically stated otherwise.

In the description of the embodiments of the present application, the terms "first," "second," "third," "fourth," and the like (if any) are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims (12)

1. The phase change energy storage heat dissipation system is characterized by being suitable for a heating element with a horizontal heat dissipation surface, and comprising a plurality of panels which are arranged in a stacked mode and are perpendicular to the horizontal heat dissipation surface;

a temperature equalizing plate and a heat dissipation assembly are arranged among the panels, the heat dissipation assembly is arranged adjacent to the temperature equalizing plate, at least part of the temperature equalizing plate is positioned at the bottom of the heat dissipation system along the vertical direction, and at least part of the heat dissipation assembly is positioned at the top of the heat dissipation system along the vertical direction;

the heat dissipation assembly comprises a phase-change material inlet and a channel, wherein the phase-change material inlet is located at the top of the heat dissipation assembly in the vertical direction, the channel is located inside the heat dissipation assembly, and the channel is multiple and communicated with the phase-change material inlet.

2. The phase-change energy-storage heat-dissipating system according to claim 1, wherein the plurality of channels are arranged in a mesh shape and are communicated with each other, and at least one of the channels is communicated with the phase-change material inlet.

3. The phase change energy storage cooling system according to claim 1, wherein the plurality of channels are arranged in parallel, and each channel extends in a vertical direction; the top of each channel along the vertical direction is communicated with the phase change material inlet, and the bottom of each channel along the vertical direction is communicated with each other.

4. The phase change energy storage cooling system according to any one of claims 1-3, further comprising a uniform distribution pool and a partition, wherein the uniform distribution pool and the partition are both located between the phase change material inlet and the channel;

the uniform distribution tank is positioned on one side of the partition board close to the phase-change material inlet and is communicated with the phase-change material inlet;

the partition board is provided with a plurality of through holes which are communicated with the uniform distribution pool and the channel.

5. The phase-change energy-storage heat dissipation system according to any one of claims 1-3, wherein the temperature equalization plate comprises a condensate pool and a steam cavity, the condensate pool is located at the bottom of the heat dissipation system in the vertical direction, and the steam cavity is located at the top of the heat dissipation system in the vertical direction;

the extension plane of the condensate liquid pool is parallel to the horizontal heat dissipation surface, the extension direction of the steam cavity is perpendicular to the extension plane of the condensate liquid pool, and the bottom of the steam cavity in the vertical direction is communicated with the condensate liquid pool;

at least part of the heat dissipation assembly is positioned at the top of the heat dissipation system along the vertical direction, and the heat dissipation assembly and the steam cavity are arranged in an adjacent mode.

6. The phase-change energy-storage heat-dissipation system according to claim 5, wherein the condensate pool comprises a plurality of microchannels, the microchannels are parallel to each other in an extension plane of the condensate pool, and adjacent microchannels are communicated with each other through the vapor chamber.

7. The phase-change energy-storage heat dissipation system as recited in claim 5, wherein the temperature equalization plate further comprises a plurality of steam chamber micro channels, and the plurality of steam chamber micro channels are located on the wall of the steam chamber;

each steam cavity micro-channel extends along the extending direction of the steam cavity, and the bottom end of each steam cavity micro-channel along the vertical direction is communicated with the condensate tank.

8. The phase-change energy-storage heat dissipation system according to claim 5, wherein the steam cavity comprises a plurality of sub-steam cavities, and the plurality of sub-steam cavities are arranged at intervals along a direction parallel to the horizontal heat dissipation surface;

the bottom of the plurality of sub-steam cavities in the vertical direction is communicated with each other and is communicated with the condensate tank, and the top of the plurality of sub-steam cavities in the vertical direction is communicated with each other.

9. The phase change energy storage heat dissipation system according to claim 8, wherein at least a portion of the sub-vapor cavities are located between a portion of the panels, the portion of the panels including a plurality of first-series panels and a plurality of second-series panels, the plurality of first-series panels and the plurality of second-series panels being sequentially and alternately distributed;

a plurality of first longitudinal through holes are formed in the first sequence panel and distributed at intervals in the direction parallel to the horizontal radiating surface, and a solid part between every two adjacent first longitudinal through holes forms a first longitudinal support;

a plurality of second longitudinal through holes are formed in the second sequence panel and are distributed at intervals in the direction parallel to the horizontal radiating surface, and second longitudinal supports are formed at solid parts between the adjacent second longitudinal through holes;

the first longitudinal through hole and the second longitudinal through hole are communicated with each other along the thickness direction of the panel; the first longitudinal support positioned in the middle of the first longitudinal through hole in the vertical direction and the second longitudinal support positioned in the middle of the second longitudinal through hole are connected with each other; the first longitudinal supports located at the two ends of the first longitudinal through hole in the vertical direction and the second longitudinal supports located at the two ends of the second longitudinal through hole in the vertical direction are at least partially arranged in a staggered mode.

10. The phase-change energy-storage heat dissipation system as recited in claim 5, wherein a plurality of the vapor cavities are arranged and distributed at intervals, and bottom ends of the vapor cavities in the vertical direction are communicated with each other and communicated to the condensate pool;

the heat dissipation assembly comprises a first heat dissipation assembly, and the first heat dissipation assembly is located among the plurality of steam cavities.

11. The phase change energy storage heat dissipation system of claim 10, wherein the heat dissipation assembly further comprises a second heat dissipation assembly located on at least one side of the plurality of vapor chambers, the second heat dissipation assembly and the first heat dissipation assembly being in communication with each other.

12. An electronic component comprising a heat generating member and the heat dissipating system of any of claims 1-11, wherein the heat generating member has a horizontal heat dissipating surface, and the heat dissipating system is disposed on a side of the heat generating member adjacent to the horizontal heat dissipating surface.

Images