CN105526813A - Microchannel heat radiator - Google Patents
Microchannel heat radiator Download PDFInfo
- Publication number
- CN105526813A CN105526813A CN201510908843.6A CN201510908843A CN105526813A CN 105526813 A CN105526813 A CN 105526813A CN 201510908843 A CN201510908843 A CN 201510908843A CN 105526813 A CN105526813 A CN 105526813A
- Authority
- CN
- China
- Prior art keywords
- fluid
- heat exchange
- unit
- heat exchanger
- exchanger fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/22—Arrangements for directing heat-exchange media into successive compartments, e.g. arrangements of guide plates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/22—Arrangements for directing heat-exchange media into successive compartments, e.g. arrangements of guide plates
- F28F2009/222—Particular guide plates, baffles or deflectors, e.g. having particular orientation relative to an elongated casing or conduit
- F28F2009/228—Oblique partitions
Abstract
The invention relates to the technical field of heat radiation, particularly relates to a microchannel heat radiator and aims at further increasing the efficiency of the existing heat radiating device of an electronic device. The microchannel heat radiator comprises an upper cover plate, a lower cover plate, a fluid feeding unit, a fluid discharging unit and a plurality of heat exchange units, wherein each heat exchange unit is formed by reversely overlapping two heat exchange plates; each heat exchange plate is internally provided with a plurality of partition plates among which runners for allowing fluids to flow are formed; and the adjacent partition plates are intercrossed to form cavities. The partition plates of the adjacent heat exchange plates are crossed to form crossed and interconnected runners, so that the fluids can pass through different heat exchange plates; and due to the adoption of the flowing way, the flow paths of the fluids in the heat radiator are increased, flow routes are optimized, and heat exchange is more sufficient. In addition, due to the adoption of the design, the fluids in different runners can be mutually converged, hedged and dragged, the interaction between every two fluids can be enhanced, and the heat exchange effect can be improved.
Description
Technical field
The present invention relates to technical field of heat dissipation, be specifically related to a kind of microchannel heat sink.
Background technology
Along with making rapid progress of science and technology, no matter be at electronics or refrigeration plant, high integrated more and more obvious with the trend of densification, the cooling requirements matched with it is also more and more higher.Compared with traditional heat exchangers, micro-channel heat exchanger has higher heat exchange efficiency and more economical working medium consumption, now obtains research and apply widely gradually.
Traditional microchannel heat sink be by with microchannel heat dissipation cold plate, fill and the pump of pumping liquid, cooler and connect the pipeline of these equipment.Fluid is injected into the microchannel of heat dissipation cold plate by pump, and fluid flows and absorbs the heat of thermal source in microchannel, flows out heat dissipation cold plate afterwards and takes away heat, completing heat transmission.This shows, microchannel heat dissipation cold plate is the equipment of most critical in radiator, and fluid flows in cold drawing and the heat transfer effect of radiator has very large relation.
Present heat dissipation cold plate adopts individual layer microchannel to design mostly, and such fluid is in microchannel, and liquid form is more single, flow process is shorter, absorption of fluids heat is insufficient, causes the heat exchange efficiency of radiator not high, or needs more working medium charge to reach certain cooling requirements.
Application number: 201310513130.0 patents provide a kind of microchannel heat sink for power electronic device heat radiation, the present invention by microchannel to be put on the spot by a series of rectangle and form, the fresh cold-producing medium that temperature is low imports radiator from the heat radiation central area that temperature is the highest, working medium flows out from the inner side outlet being arranged on radiator outer wall, but which employs the design of individual layer microchannel, the flow process of working medium in microchannel is shorter, and heat exchange efficiency is lower.
Application number: 201210104582.9 patents provide a kind of micro-channel heat exchanger and comprise the air-conditioner of this micro-channel heat exchanger, the linear pattern microchannel be parallel to each other is arranged between the collector tube of upper and lower two ends, working medium flow channel flowing out from another collector tube from a collector tube.This design of heat exchanger has following shortcoming: 1, this heat exchanger only comprises individual layer microchannel and passage is linear pattern, working medium in the channel the time of staying shorter, if be applied to the duty of vertically placing, because of Action of Gravity Field, its time of staying in pipe will be shorter, working medium cannot fully heat exchange, and heat exchange efficiency is not high.2, each passage is spaced apart from each other, and the fluid of different passage is without any disturbance each other in the process flowing through heat exchanger, and liquid form is single, and heat transfer intensity is restricted.
Application number: 201310734806 patents propose a kind of multilayer micro-channel condenser, the two ends mouth of pipe on micro-channel tubes is separately installed with unit header, although this heat exchanger have employed the design of multilayer microchannel, but each passage is separated by fin, in different passage, the flowing of fluid is relatively independent, without the impact that interacts, the disturbance between fluid is less, and heat transfer intensity is not high.
Summary of the invention
The present invention carries out for solving the problem, and object is by providing a kind of multilayer cross-current heat abstractor, improves the efficiency of existing electronic device radiating device further.
To achieve the above object of the invention, technical scheme of the present invention is by realizing in the following manner:
A kind of microchannel heat sink, comprises upper cover plate, lower cover, fluid enters matter unit, fluid pledge unit and some heat exchange units.Wherein, described heat exchange unit is oppositely stacked by two panels heat exchanger fin and forms, and is provided with some dividing plates in described heat exchanger fin, and form the runner for fluid flowing between described dividing plate, adjacent described dividing plate intersects to form cavity mutually.
Further, described heat exchanger fin comprises the passage for cold-producing medium turnover, and all enters matter unit with described fluid and described fluid pledge unit communicates.
Further, run through and be provided with gusset between described dividing plate, the thickness of described gusset is less than the thickness of described heat exchanger fin.
Further, described fluid enters matter unit and described fluid pledge unit and is provided with fluid and enters matter and pledge mouth, described fluid enters matter from described fluid and pledge mouth flows into described heat exchanger fin, enter matter from described fluid carry out heat exchange in described heat exchanger fin after and pledge mouth flows out described heat exchanger fin, then flow out heat exchange from described fluid pledge unit.
Further, the position of intersecting between described dividing plate forms a flow-disturbing node.
Preferably, between described dividing plate, described dividing plate and described heat exchange unit and adopting between described dividing plate with described cover plate spreads and merges the mode of welding and be connected.
Preferably, the shape of described heat exchanger fin is rectangle.
Owing to have employed technique scheme, so the present invention has following useful technique effect:
1, in the present invention, the dividing plate of adjacent plate is arranged crosswise, and form the runner of intersection intercommunication, fluid can be shuttled back and forth in various heat exchange sheet, and such liquid form adds fluid flow process in heat exchanger, and optimize flow path, heat exchange is more abundant.In addition, such design makes the fluid in different runner mutually can converge, liquidate, draw, and the interphase interaction of fluid and fluid increases, and heat transfer effect is enhanced.
2, in the present invention, the dividing plate of adjacent plate is arranged crosswise, and crosspoint is node, can produce flow-disturbing when fluid flow to node, increases heat exchange efficiency.
3, in the present invention, the flow process of each runner is identical, and fluid fully, can flow sufficiently through each runner.The heat exchange problem of non-uniform caused because flow process is different can be avoided like this.
Accompanying drawing explanation
Fig. 1 is the structural representation of heat-exchanger rig in embodiments of the invention;
Fig. 2 is the exploded perspective view of heat-exchanger rig in of the present invention example;
Fig. 3 is the side view of microchannel in embodiments of the invention;
Fig. 4 is heat exchanger fin schematic diagram in embodiments of the invention;
Fig. 5 is the A-A partial enlarged drawing of heat exchanger fin in embodiments of the invention;
Fig. 6 is heat exchange unit schematic diagram in embodiments of the invention;
Fig. 7 is heat-sink unit partial enlarged drawing in embodiments of the invention.
Detailed description of the invention
Below in conjunction with accompanying drawing, embodiments of the invention are described in detail, but the multitude of different ways that the present invention can be defined by the claims and cover is implemented.
Can be seen by Fig. 1, Fig. 2, the radiator in this example enters matter unit 1, fluid pledge unit 2, upper cover plate 3, lower cover 4 by fluid, and the first heat exchanger fin 5 be rectangle and the second heat exchanger fin 6 form.A heat-sink unit is oppositely stacked by two panels heat exchanger fin and forms, and this example adopts heat exchange unit more than one as seen from the figure.
Fluid enters matter and enters matter unit 1 respectively with fluid with pledge mouth 7 and communicate with fluid pledge unit 2, fluid can enter matter unit 1 inflow radiator from fluid, then matter is entered from fluid and pledge mouth 7 flows into heat exchanger fin, carried out heat exchange in radiator after, enter matter from fluid and pledge mouth 7 flows out heat exchanger fin, then flow out radiator from fluid pledge unit 2 and complete heat exchange.
As can be seen from Fig. 3-5, in fin, include many dividing plates 8, form diaphragm structure, between dividing plate 8, form the runner for fluid flowing.In addition in order to anti-swirl pot structure, tibet cinnamon bark plate 9 is through all dividing plates 8, and the thickness of gusset 9 is less than the thickness of heat exchanger fin, and fluid can be passed through smoothly in runner, is unlikely to its flowing and is blocked by gusset 9.
As can be seen from Fig. 6, Fig. 7, fluid enters matter from the fluid be made up of the first dividing plate 11 and pledge mouth enters heat exchanger fin, and fluid is along flow passage.Owing to arranging in reverse stack between heat exchanger fin and heat exchanger fin, first dividing plate 11 crosses one another with second partition 12, form cavity 12, another block fin can be flowed into by cavity 12 when fluid flows in runner 7, returned by cavity flow more afterwards, material is thus formed the liquid form that fluid constantly weaves one's way in various heat exchange sheet.First dividing plate 10 position crossing with second partition 11 forms a flow-disturbing node 13, fluid can produce stronger flow disturbance when node 13, the heat transfer coefficient of radiator will improve, in addition, the existence of flow-disturbing node also improves diaphragm structure stability simultaneously more, extends its service life.
Between dividing plate of the present invention, dividing plate and heat exchange unit and adopting between dividing plate with cover plate spread and merge the mode of welding and be connected.Diffusion is merged solder technology and is processed as newer micro-processing technology both at home and abroad, it relies on storeroom surface produce atoms permeating and be combined with each other as the entirety similar with the fine structure of material own, can realize: 1) bound fraction does not have thermal contact resistance, the microchannel cold plates good airproof performance welded with this, withstand voltage height, can bear high pressure ratio; 2) can realize multilayer Micro Channel Architecture, number of active lanes can be hundreds and thousands of, and layout and large I regulate as required.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. a microchannel heat sink, comprise upper cover plate, lower cover, fluid enter matter unit, fluid pledge unit and some heat exchange units, it is characterized in that: described heat exchange unit is oppositely stacked by two panels heat exchanger fin and forms, some dividing plates are provided with in described heat exchanger fin, form the runner for fluid flowing between described dividing plate, adjacent described dividing plate intersects to form cavity mutually.
2. microchannel heat sink according to claim 1, is characterized in that: described heat exchanger fin comprises the passage for cold-producing medium turnover, and all enters matter unit with described fluid and described fluid pledge unit communicates.
3. microchannel heat sink according to claim 1 and 2, is characterized in that: run through being provided with gusset between described dividing plate, and the thickness of described gusset is less than the thickness of described heat exchanger fin.
4. microchannel heat sink according to claim 1 and 2, it is characterized in that: described fluid enters matter unit and described fluid pledge unit and is provided with fluid and enters matter and pledge mouth, described fluid enters matter from described fluid and pledge mouth flows into described heat exchanger fin, enter matter from described fluid carry out heat exchange in described heat exchanger fin after and pledge mouth flows out described heat exchanger fin, then flow out heat exchange from described fluid pledge unit.
5. microchannel heat sink according to claim 1 and 2, is characterized in that: the position of intersecting between described dividing plate forms a flow-disturbing node.
6. microchannel heat sink according to claim 1 and 2, is characterized in that: between described dividing plate, described dividing plate and described heat exchange unit and adopting between described dividing plate with described cover plate spread and merge the mode of welding and be connected.
7. microchannel heat sink according to claim 1 and 2, is characterized in that: the shape of described heat exchanger fin is rectangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510908843.6A CN105526813A (en) | 2015-12-10 | 2015-12-10 | Microchannel heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510908843.6A CN105526813A (en) | 2015-12-10 | 2015-12-10 | Microchannel heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105526813A true CN105526813A (en) | 2016-04-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510908843.6A Pending CN105526813A (en) | 2015-12-10 | 2015-12-10 | Microchannel heat radiator |
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| CN (1) | CN105526813A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105934000A (en) * | 2016-06-24 | 2016-09-07 | 无锡市豫达换热器有限公司 | Novel PTC heating heat exchanger |
| CN106705714A (en) * | 2016-12-23 | 2017-05-24 | 珠海格力电器股份有限公司 | Mixed-flow type radiant plate heat exchanger |
| CN108253835A (en) * | 2016-12-28 | 2018-07-06 | 杭州三花家电热管理系统有限公司 | Plate-type heat-exchange core and with its plate heat exchanger |
| CN108759145A (en) * | 2018-06-08 | 2018-11-06 | 上海理工大学 | Backheat orifice union, combined microchannel throttling refrigerator and device |
| CN109084608A (en) * | 2017-06-13 | 2018-12-25 | 杭州沈氏节能科技股份有限公司 | A kind of heat exchanger fin |
| CN109489449A (en) * | 2018-11-20 | 2019-03-19 | 英特换热设备(浙江)有限公司 | A kind of radiator |
| CN110887263A (en) * | 2018-09-10 | 2020-03-17 | 安徽美芝制冷设备有限公司 | Compressor system |
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| US5217788A (en) * | 1992-05-11 | 1993-06-08 | Brentwood Industries | Corrugated sheet assembly |
| CN2755547Y (en) * | 2004-12-07 | 2006-02-01 | 周登利 | Heat recovery exchanger |
| CN101970907A (en) * | 2008-07-10 | 2011-02-09 | 韩国德尔福汽车系统公司 | Oil cooler for transmission |
| CN202032934U (en) * | 2011-04-25 | 2011-11-09 | 厦门铭光机械制造有限公司 | Plate tube for efficient air cooling apparatus |
| CN102308177A (en) * | 2009-02-04 | 2012-01-04 | 阿尔法拉瓦尔股份有限公司 | Plate heat exchanger |
| CN104165538A (en) * | 2014-08-18 | 2014-11-26 | 上海理工大学 | Heat dissipating device |
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2015
- 2015-12-10 CN CN201510908843.6A patent/CN105526813A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5217788A (en) * | 1992-05-11 | 1993-06-08 | Brentwood Industries | Corrugated sheet assembly |
| CN2755547Y (en) * | 2004-12-07 | 2006-02-01 | 周登利 | Heat recovery exchanger |
| CN101970907A (en) * | 2008-07-10 | 2011-02-09 | 韩国德尔福汽车系统公司 | Oil cooler for transmission |
| CN102308177A (en) * | 2009-02-04 | 2012-01-04 | 阿尔法拉瓦尔股份有限公司 | Plate heat exchanger |
| CN202032934U (en) * | 2011-04-25 | 2011-11-09 | 厦门铭光机械制造有限公司 | Plate tube for efficient air cooling apparatus |
| CN104165538A (en) * | 2014-08-18 | 2014-11-26 | 上海理工大学 | Heat dissipating device |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105934000A (en) * | 2016-06-24 | 2016-09-07 | 无锡市豫达换热器有限公司 | Novel PTC heating heat exchanger |
| CN106705714A (en) * | 2016-12-23 | 2017-05-24 | 珠海格力电器股份有限公司 | Mixed-flow type radiant plate heat exchanger |
| CN108253835A (en) * | 2016-12-28 | 2018-07-06 | 杭州三花家电热管理系统有限公司 | Plate-type heat-exchange core and with its plate heat exchanger |
| CN109084608A (en) * | 2017-06-13 | 2018-12-25 | 杭州沈氏节能科技股份有限公司 | A kind of heat exchanger fin |
| CN108759145A (en) * | 2018-06-08 | 2018-11-06 | 上海理工大学 | Backheat orifice union, combined microchannel throttling refrigerator and device |
| CN108759145B (en) * | 2018-06-08 | 2020-02-14 | 上海理工大学 | Backheating throttling assembly, combined micro-channel throttling refrigerator and device |
| CN110887263A (en) * | 2018-09-10 | 2020-03-17 | 安徽美芝制冷设备有限公司 | Compressor system |
| CN110887263B (en) * | 2018-09-10 | 2021-07-13 | 安徽美芝制冷设备有限公司 | Compressor system |
| CN109489449A (en) * | 2018-11-20 | 2019-03-19 | 英特换热设备(浙江)有限公司 | A kind of radiator |
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Application publication date: 20160427 |