CN104165538B - Heat abstractor - Google Patents
Heat abstractor Download PDFInfo
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- CN104165538B CN104165538B CN201410406702.XA CN201410406702A CN104165538B CN 104165538 B CN104165538 B CN 104165538B CN 201410406702 A CN201410406702 A CN 201410406702A CN 104165538 B CN104165538 B CN 104165538B
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- radiating subassembly
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Abstract
The invention provides a kind of heat abstractor, comprise: at least one heat-sink unit for dispelling the heat, and be installed on the heat-sink unit left and right sides, for refrigeration working medium flow into and flow out heat-sink unit enter matter unit and pledge unit, heat-sink unit comprises the first stacked radiating subassembly and the second radiating subassembly, first radiating subassembly comprises many first dividing plates, second radiating subassembly comprises many second partitions, article two, between adjacent first dividing plate or second partition, form the runner for allowing refrigeration working medium flow wherein, intersection in definite shape between first dividing plate and second partition, form the cavity allowing refrigeration working medium pass therethrough, heat abstractor provided by the invention, the dividing plate of multiple radiating subassembly adopts the form of intersecting to connect, not only make the compact conformation of heat abstractor, and make its radiating effect be greater than the disconnected multilayer microchannel heat sink of individual layer microchannel heat sink and layer and layer.
Description
Technical field
The invention belongs to electronic radiation field, be specifically related to a kind of heat abstractor.
Background technology
The heat radiation of refrigeration system and electronic device all be unable to do without heat exchanger, and the integrated level along with electronic device and refrigeration system equipment is more and more higher and all kinds of electronic component volume is more and more less, and the requirement for heat exchanger is also more and more higher.Especially in high-frequency microwave circuit, the physical dimension comprising unit interval, inter-module distance etc. is very little, be subject to strict restriction, design for heat abstractor brings very large difficulty, simultaneously, by the impact of its operating frequency, high-frequency microwave assembly is more responsive compared with other assembly to temperature, so also need more high efficiency heat exchanger.
In prior art, the microchannel heat sink of individual layer can not meet the radiating requirements day by day increased, multilayer microchannel heat sink just mechanically welds together multiple individual layer microchannel heat sink, be not communicated with between microchannel heat sink every layer, effective heat exchange efficiency increases very limited.
Application number is that the patent of 201410157782.X proposes a kind of idle call micro-channel parallel flow evaporator, comprising upper and lower header and the microchannel being connected two headers, operation principle is the input and output passage that two headers are respectively refrigeration working medium, and refrigeration working medium carries out heat exchange in microchannel.In use there is following shortcoming in the heat exchanger in this technology: 1. two thicker microchannel cold plates of header are then very thin, and only configuration one piece of microchannel cold plates can cause the utilization on volume incomplete undoubtedly; 2. although this patent employs double row flat tubular construction, can extend the flowing time of refrigeration working medium in runner, single time expand, can not improve the heat exchange efficiency of refrigeration working medium well.
Application number be 201310734806.9 patent propose a kind of multilayer micro-channel condenser, comprise header, solid plate, fin and microchannel, the centre of every two micro-channel tubes is welded with aluminum fin-stock and forms a heat-sink unit, total header is processed with after the docking port be connected with multiple heat-sink unit welds and forms condenser.In use there is following shortcoming in the heat exchanger in this technology: although 1. this patent employs multilayer microchannel cold plates structure, two micro-channel tubes and a fin are as a heat-sink unit, but not contact between adjacent radiant module, this can cause the degree of heat radiation of each heat-sink unit differ and cause the heat radiation of element uneven; 2. the refrigeration working medium in this patent condenser vertically stays along its microchannel cold plates, causes the flowing time of refrigeration working medium in runner too short, and working medium cannot fully heat exchange in runner, directly causes heat exchange efficiency to decline.
Summary of the invention
The present invention carries out for solving the problem, and object is by providing a kind of multilayer cross-current heat abstractor, improves the efficiency of existing electronic device radiating device further.
Present invention employs following technical scheme:
The invention provides a kind of heat abstractor, it is characterized in that, comprise: at least one heat-sink unit for dispelling the heat, heat-sink unit is for filling refrigeration working medium, heat-sink unit comprises the first stacked radiating subassembly and the second radiating subassembly, first radiating subassembly comprises many first dividing plates, second radiating subassembly comprises many second partitions, article two, between adjacent first dividing plate or second partition, form the runner for allowing refrigeration working medium flow wherein, intersection in definite shape between first dividing plate and second partition, forms the cavity allowing refrigeration working medium pass therethrough; And be installed on the heat-sink unit left and right sides, for refrigeration working medium flow into and flow out heat-sink unit enter matter unit and pledge unit.
Heat abstractor provided by the invention, such feature can also be had: wherein, first radiating subassembly and the second radiating subassembly also comprise: be positioned at runner both sides enter for refrigeration working medium and flow out runner multiple enter matter mouth and multiple pledge mouth, enter matter mouth and pledge mouth respectively with enter matter unit and pledge unit is connected.
Heat abstractor provided by the invention, can also have such feature, also comprise: cover plate, covers the both sides up and down of heat-sink unit.
Heat abstractor provided by the invention, can also have such feature: the runner of radiating subassembly is herringbone.
Heat abstractor provided by the invention, can also have such feature: wherein, all adopts diffusion to merge solder technology and connect between the dividing plate of heat-sink unit and between heat-sink unit and cover plate.
Heat abstractor provided by the invention, can also have such feature: the hydraulic diameter scope of the runner in heat-sink unit is any one in grade and micron order.
Invention effect and effect
Heat abstractor provided by the invention, comprise the heat-sink unit that at least one is made up of the first radiating subassembly and the second radiating subassembly, for refrigeration working medium flow into and flow out heat-sink unit enter matter unit and pledge unit, according to heat abstractor provided by the invention, second partition in heat-sink unit in the first dividing plate of the first radiating subassembly and the second radiating subassembly is the intersection of definite shape, form the cavity allowing refrigeration working medium pass therethrough, can longitudinally be flowed in the first radiating subassembly and the second radiating subassembly by cavity refrigeration working medium, the crosspoint of the first dividing plate and second partition is that the flowing of refrigeration working medium provides disturbance, increase heat exchange efficiency, simultaneously intersect make the runner of heat abstractor in the present invention wriggle spiral, add the length of heat transfer process, improve heat transfer effect, in addition, in heat abstractor provided by the invention, the runner of each radiating subassembly is herringbone, enter matter mouth place's runner and vertical direction angled, the runner entering matter mouth of adjacent two radiating subassemblies is also angled, make the refrigeration working medium formation convection current to a certain degree entering two radiating subassemblies, further raising heat transfer effect.
Accompanying drawing explanation
Fig. 1 is the surface structure schematic diagram of heat abstractor in embodiments of the invention;
Fig. 2 is the explosive view of heat abstractor in embodiments of the invention;
Fig. 3 is the explosive view of heat-sink unit group in embodiments of the invention;
Fig. 4 is the plan structure schematic diagram of heat-sink unit in embodiments of the invention;
Fig. 5 is the schematic enlarged-scale view of heat-sink unit in Fig. 4 in embodiments of the invention;
Fig. 6 is the structural representation of the heat-sink unit group observed along A direction in Fig. 3.
Detailed description of the invention
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described.
Fig. 1 is the surface structure schematic diagram of heat abstractor in the present embodiment.
As shown in Figure 1, heat abstractor 100 comprises: cover plate 1, covered the heat-sink unit group 2 of upper and lower surface by cover plate 1, for refrigeration working medium flow into and flow out heat-sink unit enter matter unit 3 and pledge unit 4, the cover plate 1 of heat-sink unit group 2 both sides all can place electronic device.
Fig. 2 is the explosive view of heat abstractor in the present embodiment.
Fig. 3 is the explosive view of heat-sink unit in the present embodiment.
As shown in Figures 2 and 3, heat-sink unit group 2 in heat abstractor 100 comprises three heat-sink units 5, heat-sink unit 5 is made up of the first radiating subassembly 51 and the second radiating subassembly 52, first radiating subassembly 51 comprises many first dividing plates 511, the runner 512 being used for refrigeration working medium flowing is formed between adjacent two first dividing plates 511, first radiating subassembly 51 also comprise be positioned at runner 512 both sides enter for refrigeration working medium and flow out runner enter matter mouth 513 and pledge mouth 514, enter matter mouth 513 and pledge mouth 514 respectively with enter matter unit 3 and be connected with pledge unit 4, ensure smooth and easy inflow and the outflow of refrigeration working medium, the structure of the second radiating subassembly 52 is identical with the structure of the first radiating subassembly 51, comprises many second partitions 521, forms the runner 522 being used for refrigeration working medium flowing between adjacent two second partitions 521.
The runner 512 of the first radiating subassembly 51 and the runner 522 of the second radiating subassembly 52 are all in herringbone, enter matter mouth 513 place runner and become 20 ° of angles with vertical direction, when first radiating subassembly 51 and the second radiating subassembly 52 form heat-sink unit 5, adopt form staggered relatively, therefore the runner of the first radiating subassembly 51 and the second radiating subassembly 52 is the angle of 40 °, so two strands of refrigeration working mediums just can be made to become the angle of 40 ° to enter runner, form convection current to a certain degree, and in flowing afterwards, also have identical convection current, refrigeration working medium constantly mixes in this runner replaced, heat transfer effect is higher than common individual layer heat abstractor.
Fig. 4 is the plan structure schematic diagram of heat-sink unit in the present embodiment.
Fig. 5 is the schematic enlarged-scale view of heat-sink unit in Fig. 4.
As shown in Figure 4 and Figure 5, first radiating subassembly 51 takes stacked mode to be connected with the second radiating subassembly 52, first dividing plate 511 of the first radiating subassembly 51 and the second partition 521 of the second radiating subassembly 52 are in X-type cross, form the cavity allowing refrigeration working medium pass therethrough, runner 512 and runner 522 are because of the intersection of dividing plate, mutually overlapping, but not exclusively overlap, define the runner 6 of sinuous spiral fashion, refrigeration working medium arbitrarily can flow between two radiating subassemblies, node 7 is intersection points that the first dividing plate 511 and second partition 521 intersect, the structure of whole heat-sink unit 5 not only can be made more stable, anti-pressure ability is better, can also make refrigeration working medium by during node produce flow-disturbing, increase the flow velocity of fluid, and flow-disturbing can also make the better mixed convection of the fluid in the different runners of each layer, further increase heat exchange efficiency.
During practical application, according to actual conditions, the heat-sink unit 5 of respective numbers can be selected to superpose, also can carry out stacked between each heat-sink unit 5, to increase the heat exchange length of runner further.
Fig. 6 is the structural representation of the heat-sink unit observed along A direction in Fig. 3.
As shown in Figure 6, in the pledge mouth position of the first radiating subassembly 51 and the second radiating subassembly 52, first dividing plate 511 and second partition 521 are cross-linked slightly, not in X-type cross, this kind of structure is mainly in order to fix the first dividing plate 511 and second partition 521 position, make whole system more firm, the convenient dividing plate interconnection away from pledge mouth works.
In the present invention, the technology of the first dividing plate 511 and second partition 521 and all employing diffusion fusion welding between cover plate 1 and heat-sink unit 2 is welded, diffusion is merged solder technology and is processed as newer micro-processing technology both at home and abroad, it relies on storeroom surface produce atoms permeating and be combined with each other as the entirety similar with the fine structure of material own, can realize: 1) bound fraction does not have thermal contact resistance, the microchannel cold plates good airproof performance welded with this, withstand voltage height, can bear high pressure ratio; 2) can realize multilayer Micro Channel Architecture, number of active lanes can be hundreds and thousands of, and layout and large I regulate as required.
Heat abstractor in the present invention is mainly used in dissipation from electronic devices and traditional refrigerating industry field, when being applied to dissipation from electronic devices, the ratio of the contact length of the hydraulic diameter of runner and the effective cross-section sum refrigeration working medium of refrigeration working medium and solid wall surface is 10-1000 μm; When being applied to traditional refrigerating industry system, the hydraulic diameter of runner is 0.6mm to 3mm.
In the present invention, the cross section of the runner of radiating subassembly can be rectangle, the shape such as trapezoidal, and the angle of runner and vertical direction is not limited only to 20 °, under condition easy to process, can choose arbitrarily in the reasonable scope.
Embodiment effect and effect
The heat abstractor that the present embodiment provides, comprise the heat-sink unit that at least one is made up of the first radiating subassembly and the second radiating subassembly, for refrigeration working medium flow into and flow out heat-sink unit enter matter unit and pledge unit, according to the heat abstractor that the present embodiment provides, second partition in heat-sink unit in the first dividing plate of the first radiating subassembly and the second radiating subassembly is the intersection of definite shape, dividing plate between adjacent two heat-sink units also can be the intersection of definite shape, form the cavity allowing refrigeration working medium pass therethrough, crosspoint between dividing plate is that the flowing of refrigeration working medium provides disturbance, increase heat exchange efficiency, simultaneously intersect make the runner of heat abstractor in the present embodiment wriggle spiral, add the length of heat transfer process, improve heat transfer effect, in addition, in the heat abstractor that the present embodiment provides, the runner of each radiating subassembly is herringbone, enter matter mouth place's runner and vertical direction angled, the runner entering matter mouth of adjacent two radiating subassemblies is also angled, make the refrigeration working medium formation convection current to a certain degree entering two radiating subassemblies, further raising heat transfer effect.
The invention is not restricted to the scope of detailed description of the invention; to those skilled in the art; as long as various change to limit and in the spirit and scope of the present invention determined in described claim; these changes are apparent, and all innovation and creation utilizing the present invention to conceive are all at the row of protection.
Claims (6)
1. a heat abstractor, for the heat radiation of electronic device or refrigeration device, is characterized in that, comprising:
At least one heat-sink unit for dispelling the heat, described heat-sink unit for filling refrigeration working medium,
Described heat-sink unit comprises the first stacked radiating subassembly and the second radiating subassembly,
Described first radiating subassembly comprises many first dividing plates, and described second radiating subassembly comprises many second partitions, forms the runner for allowing described refrigeration working medium flow between two adjacent described first dividing plates or second partition wherein,
Intersection in definite shape between described first dividing plate and described second partition, forms the cavity allowing described refrigeration working medium pass therethrough; And
Be installed on the described heat-sink unit left and right sides, flow into for described refrigeration working medium and flow out described heat-sink unit enter matter unit and pledge unit,
Wherein, between described first dividing plate and described second partition be X-type cross.
2. heat abstractor according to claim 1, is characterized in that:
Wherein, described first radiating subassembly and described second radiating subassembly also comprise: be positioned at described runner both sides enter for described refrigeration working medium and flow out described runner multiple enter matter mouth and multiple pledge mouth, described in enter matter mouth and described pledge mouth respectively with described enter matter unit and described pledge unit be connected.
3. heat abstractor according to claim 2, is characterized in that, also comprises:
Cover plate, covers the both sides up and down of described heat-sink unit.
4. heat abstractor according to claim 1, is characterized in that:
Wherein, the described runner of described radiating subassembly is herringbone.
5. heat abstractor according to claim 3, is characterized in that:
Wherein, all adopt diffusion to merge solder technology between the dividing plate of described heat-sink unit and between described heat-sink unit and described cover plate to connect.
6. heat abstractor according to claim 1, is characterized in that:
Wherein, the hydraulic diameter scope of the described runner in described heat-sink unit is any one in grade and micron order.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410406702.XA CN104165538B (en) | 2014-08-18 | 2014-08-18 | Heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410406702.XA CN104165538B (en) | 2014-08-18 | 2014-08-18 | Heat abstractor |
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| Publication Number | Publication Date |
|---|---|
| CN104165538A CN104165538A (en) | 2014-11-26 |
| CN104165538B true CN104165538B (en) | 2016-03-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410406702.XA Active CN104165538B (en) | 2014-08-18 | 2014-08-18 | Heat abstractor |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105545455A (en) * | 2015-12-08 | 2016-05-04 | 上海理工大学 | Vehicle heat radiator device |
| CN105526813A (en) * | 2015-12-10 | 2016-04-27 | 上海理工大学 | Microchannel heat radiator |
| CN109640601A (en) * | 2019-01-31 | 2019-04-16 | 英特换热设备(浙江)有限公司 | A kind of radiator cooling with medium, and the air conditioning frequency converter with the radiator, electronic equipment |
| CN109611807A (en) * | 2019-02-12 | 2019-04-12 | 乐清市优通软连接有限公司 | A kind of radiating piece for LED illumination lamp |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6988534B2 (en) * | 2002-11-01 | 2006-01-24 | Cooligy, Inc. | Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device |
| JP2009068836A (en) * | 2002-08-07 | 2009-04-02 | Denso Corp | Counter-stream-mode oscillating-flow heat transport apparatus and cooling device |
| CN2660466Y (en) * | 2003-10-15 | 2004-12-01 | 尤晓栋 | Fin type heat exchanging modular |
| CN1317539C (en) * | 2003-11-14 | 2007-05-23 | 张洪 | Counter current or cross flow plate type air heat exchanger formed by injection assembly molding |
| CN102313401B (en) * | 2011-10-18 | 2013-06-19 | 杭州沈氏换热器有限公司 | Microchannel heat exchanger |
| CN204007264U (en) * | 2014-08-18 | 2014-12-10 | 上海理工大学 | Heat abstractor |
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Address after: 200093 Shanghai military road, Yangpu District, No. 516 Co-patentee after: SHANGHAI SUNGLOW PACKAGING TECHNOLOGY CO., LTD. Patentee after: University of Shanghai for Science and Technology Address before: 200093 Shanghai military road, Yangpu District, No. 516 Co-patentee before: Shanghai Sunglow Printing Co., Ltd. Patentee before: University of Shanghai for Science and Technology |