CN103175430A - Annular micro-passage heat exchange plate - Google Patents

Abstract

The invention relates to an annular micro-passage heat exchange plate which comprises micro-passage heat exchange bodies (1) which are arranged in an annular shape and a guide sheet (2). Fluid flows in from one end, is diverted through the guide sheet (2), and then enters an annular micro-passage array. Heat is transmitted in the annular micro-passage array so that heat exchange is realized. Finally, the fluid flows out of the other end. The annular micro-passage heat exchange plate can increase a heat exchange area and prolong staying heat exchange time of the fluid in the passage, and therefore heat exchange effect is improved. The annular micro-passage heat exchange plate is small in size and compact in structure, can be used for heat dissipation of a single heat source, and is used for heat exchange between cold fluid and hot fluid. Moreover, a plurality of heat exchange plates can be combined into a whole after being overlapped.

Description

Annular microchannel heat exchange plate

technical field

The invention relates to a heat exchange plate with an annular microchannel array, which can be widely used in the field of heat dissipation.

Background technique

At present, with the development of science and technology, the integration of electronic products is getting higher and higher, resulting in more and more heat dissipation problems, and the highest heat flux density has exceeded 1×10 ⁶ W/m ² . An increase in temperature will directly lead to a decrease in the performance, reliability, and safety of electronic products. Traditional air-cooling technology has been difficult to meet the requirements, and excellent heat dissipation technology not only saves energy, but also improves the service life of electronic products.

Microchannel heat exchanger is a heat exchange component with multiple microchannels and compact space. Because of its low thermal resistance, high thermal conductivity, and large specific surface area, it is being increasingly widely used. At present, the microchannels of microchannel heat exchangers are mostly linear, such as the Chinese patent "a microchannel heat exchanger" (application number: 201010567766.X) and "compact microchannel heat exchanger" (authorized announcement number: CN201434622Y ). The non-linear microchannel can not only increase the heat exchange area and prolong the heat exchange time of the fluid in the channel, but also promote the turbulence and eddy flow of the fluid due to the constant change of the flow direction when the fluid flows in the channel. As the surfaces collide continuously, the thermal resistance boundary layer will be continuously separated and destroyed, and the heat transfer performance will be significantly enhanced compared with the linear microchannel. For example, the zigzag microchannel radiator in the Chinese patent "Microchannel radiator for electronic components" (authorized announcement number: CN202111976U) has higher heat transfer efficiency than linear microchannels. But so far, there has been no report on heat exchange plates with annular microchannel arrays.

Contents of the invention

In order to overcome the shortcomings of the existing heat exchange plates, such as large volume, small heat transfer area and poor heat transfer performance, the present invention provides an annular microchannel heat exchange plate with small volume, compact structure, large heat transfer area and excellent heat transfer performance.

The purpose of the present invention is achieved through the following technical solutions:

An annular micro-channel heat exchange plate comprises micro-channel heat exchange plates and guide fins distributed in an annular shape. Fluid flows in from one end, diverts through the deflector, and then enters the annular microchannel array. Heat is transferred in the annular microchannel array to achieve heat exchange, and finally flows out from the other end.

The cross-sectional shape of the above-mentioned annular microchannel includes V-shape, trapezoidal shape, rectangular shape, and semi-circular arc shape. The annular microchannel has a depth of 0.1-2 mm, a width of 0.1-1 mm, and a distance of 0.1-1 mm. The heat exchange plate materials used include copper, aluminum, steel, glass or other heat conducting materials. The processing methods used include LIGA, turning, chemical etching, laser etching, and electric discharge machining. The invention can be used for heat dissipation of a single heat source, and can also be used for heat exchange between cold and hot fluids after stacking and connecting multiple heat exchange plates. The stacking methods of the multiple heat exchange plates include series connection and parallel connection. The connection methods of the multi-piece heat exchange plates include welding and bolt connection. The heat exchange mode between cold and hot fluids includes forward flow and counter flow. Baffle materials include copper, aluminum, steel, glass, or other thermally conductive materials.

The present invention has the following advantages:

(1) The heat exchange effect is good. Compared with the linear microchannel, it not only increases the heat exchange area, but also prolongs the heat exchange time of the fluid in the channel, thereby enhancing the heat exchange effect.

(2) The pressure drop is small. The fluid in the microchannel is mostly laminar flow, so the flow is smooth and the pressure drop is small.

(3) Small size. Under the condition of the same heat exchange capacity, the volume can be reduced by dozens of times compared with the sleeve heat exchanger being used.

(4) The scope of application is wide. It can be used for heat dissipation of a single heat source, or it can be used for heat exchange between cold and hot fluids after stacking and connecting multiple heat exchange plates.

Description of drawings

Figure 1 is a schematic diagram of an annular microchannel heat exchange plate.

Fig. 2 is a schematic diagram of Embodiment 1 of the present invention.

Fig. 3 is a schematic diagram of Embodiment 2 of the present invention.

In the figure: 1. Heat exchange plate 2. Deflector 3. Cover plate 4. Bolt 5. Nut 6. Inlet 7. Outlet.

Detailed ways

The specific embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings, but the embodiments of the present invention are not limited thereto.

Example 1

As shown in Figures 1 and 2, the annular microchannel heat exchange plate 1, deflector 2 and cover plate 3 are connected by bolts 4 and nuts 5, the fluid flows in through the inlet 6, diverted by the deflector 2, and then enters the annular microchannel array, the heat is transferred in the annular microchannel array, thereby taking away the heat from the external heat source, and finally flows out from the outlet 7.

Example 2

As shown in FIGS. 1 and 3 , the annular microchannel heat exchange plate 1 , the deflector 2 and the cover plate 3 are connected by bolts 4 and nuts 5 . In this embodiment, two annular microchannel heat exchange plates are alternately stacked together, and the two plates respectively form two flow channels. The cold and hot fluids flow in from the two inlets 6 respectively, and then enter the two annular microchannel heat exchange plates 1 respectively. The cold and hot fluids flow separately without mixing, while the hot fluid transfers heat to the Cold fluid, finally cold fluid and hot fluid flow out from two outlets 7 respectively.

Claims (11)

1. an annular Thermal Performance of Micro Channels plate, comprise the Thermal Performance of Micro Channels plate and the flow deflector that distribute ringwise.

2. a kind of annular Thermal Performance of Micro Channels plate according to claim 1, it is characterized in that: fluid flows into from an end, shunts through flow deflector, then enter annular micro channel array, heat transmits in annular micro channel array, thereby realizes heat exchange, flows out from the other end at last.

3. a kind of annular Thermal Performance of Micro Channels plate according to claim 1, it is characterized in that: the heat exchanger plates material that adopts comprises copper, aluminium, steel, glass or other Heat Conduction Materials.

4. a kind of annular Thermal Performance of Micro Channels plate according to claim 1 is characterized in that: the cross sectional shape of described annular microchannel comprises V-arrangement, trapezoidal, rectangle, semicircular arc.

5. according to 4 described a kind of annular Thermal Performance of Micro Channels plates in claim, it is characterized in that: the described annular microchannel degree of depth is 0.1-2mm, and width is 0.1-1mm, and spacing is 0.1-1mm.

6. the described a kind of annular Thermal Performance of Micro Channels plate of any one according to claim 1 to 5, it is characterized in that: the processing method that adopts comprises LIGA, turning, chemical etching, laser ablation, spark machined.

7. a kind of annular Thermal Performance of Micro Channels plate according to claim 1 is characterized in that: can be used for the heat radiation of single thermal source, link into an integrated entity after also can the multi-disc heat exchanger plates is superimposed, be used for the heat exchange between cold and hot fluid.

8. a kind of annular Thermal Performance of Micro Channels plate according to claim 7 is characterized in that: described multi-disc heat exchanger plates connected mode comprises that welding, bolt connect.

9. a kind of annular Thermal Performance of Micro Channels plate according to claim 7, it is characterized in that: the superimposed mode of described multi-disc heat exchanger plates comprises series, parallel.

10. a kind of annular Thermal Performance of Micro Channels plate according to claim 7, it is characterized in that: between cold and hot fluid, heat exchange mode comprises following current, adverse current.

11. a kind of annular Thermal Performance of Micro Channels plate according to claim 1, it is characterized in that: the flow deflector material comprises copper, aluminium, steel, glass or other Heat Conduction Materials.

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