CN107403775B - Micro-channel heat dissipation device and electronic equipment - Google Patents
Micro-channel heat dissipation device and electronic equipment Download PDFInfo
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- CN107403775B CN107403775B CN201710606766.8A CN201710606766A CN107403775B CN 107403775 B CN107403775 B CN 107403775B CN 201710606766 A CN201710606766 A CN 201710606766A CN 107403775 B CN107403775 B CN 107403775B
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- heat dissipation
- cooling medium
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- teeth
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a micro-channel heat dissipation device and electronic equipment. The heat dissipation device comprises a shell, a cover plate and a plurality of heat dissipation teeth; the casing has upper end open-ended inner chamber in, the apron lid is located the casing upper end is in order to seal the opening, the casing both sides be provided with respectively with the coolant import and the coolant export of inner chamber intercommunication, the apron lower extreme is provided with a plurality ofly the heat dissipation tooth, it is a plurality of the heat dissipation tooth is the rectangular array and arranges, and two are adjacent heat dissipation tooth is 0.2 to 1 times of the different side edge distance on horizontal for the different side edge distance on vertical. The micro-channel heat dissipation device provided by the invention can improve the heat dissipation effect on high-heat-flow electronic devices and improve the performance and reliability of electronic equipment.
Description
Technical Field
The invention relates to the technical field of integrated circuits, in particular to a micro-channel heat dissipation device and electronic equipment.
Background
The rapid development of integrated circuits has led to a rapid increase in the heat flux density of electronic devices, limited heat dissipation capability of conventional air cooling and liquid cooling, and the development of microchannel heat dissipation technology. The microchannel heat dissipation device is characterized in that: the space between the radiating teeth is small, the flow boundary layer between the teeth is thin, and the heat exchange area of unit volume is large. The heat dissipation teeth of the conventional micro-channel heat dissipation device are mostly long-strip-shaped rectangular teeth, cooling media flow in the fluid channel between two adjacent long-strip-shaped rectangular teeth, and the heat dissipation teeth are simple in design. However, when the cooling device works, the boundary layer between the teeth is fully developed, the flow of the cooling medium is stable, and the heat dissipation effect of the rear section of the heat dissipation device is not ideal.
Disclosure of Invention
The invention provides a micro-channel heat dissipation device and electronic equipment, aiming at improving the heat dissipation effect on high-heat-flow electronic devices and improving the performance and reliability of the electronic equipment.
In one aspect, the present invention provides a microchannel heat sink comprising a housing, a cover plate, and a plurality of heat dissipating teeth; the casing has upper end open-ended inner chamber in, the apron lid is located the casing upper end is in order to seal the opening, the casing both sides be provided with respectively with the coolant import and the coolant export of inner chamber intercommunication, the apron lower extreme is provided with a plurality ofly the heat dissipation tooth, it is a plurality of the heat dissipation tooth is the rectangular array and arranges, and two are adjacent heat dissipation tooth is 0.2 to 1 times of the different side edge distance on horizontal for the different side edge distance on vertical.
The invention has the beneficial effects that: the invention arranges a plurality of heat dissipation teeth in the microchannel heat dissipation device, the interval between two adjacent heat dissipation teeth in the longitudinal direction is a main fluid channel, the interval in the transverse direction is an auxiliary fluid channel, a cooling medium mainly flows in the main fluid channel in the process of flowing from an inlet to an outlet, secondary flow is continuously generated under the drive of pressure, the secondary flow mainly flows in the auxiliary fluid channel, and as the width of the auxiliary fluid channel and the width of the main fluid channel have a certain proportional relation, the boundary layer between the teeth develops again, more heat can be taken away, and the heat dissipation effect is obviously improved.
On the basis of the technical scheme, the invention can be further improved as follows.
Further, the heat dissipation teeth are quadrangular prisms with rhombic cross sections, and one internal angle of each rhombic shape ranges from 30 degrees to 70 degrees.
The beneficial effect of adopting the further scheme is that: the heat dissipation teeth are arranged to be of a rhombic columnar structure, one internal angle of the rhombus is arranged to be within a certain range, namely, the included angle between the auxiliary fluid channel and the main fluid channel is arranged to be 30-70 degrees, so that the heat dissipation effect is better, and through testing, the heat dissipation effect can be improved by about 20 percent.
Further, the shell and the cover plate are fixedly connected through vacuum brazing.
The beneficial effect of adopting the further scheme is that: the fixed connection structure enables the structure of the heat dissipation device to be more stable, and influences on electronic devices needing heat dissipation are less.
Further, the shell, the cover plate and the heat dissipation teeth are made of copper or aluminum.
The beneficial effect of adopting the further scheme is that: copper and aluminium all have good radiating efficiency and heat conductivility, can be that heat abstractor's radiating effect is better.
Further, a cooling medium flows into the inner cavity from the cooling medium inlet and flows out of the inner cavity from the cooling medium outlet, and the cooling medium is cooling liquid or cooling air.
The beneficial effect of adopting the further scheme is that: the heat on the heat dissipation teeth in the inner cavity is taken away by flowing cooling media through heat exchange, and different cooling media can be selected according to actual needs to dissipate heat.
In another aspect, the present invention further provides an electronic device, which includes at least one electronic device and the above micro-channel heat dissipation device, wherein the electronic device is welded to the upper end of the cover plate.
The invention has the beneficial effects that: the electronic device is welded at the upper end of the cover plate of the micro-channel heat dissipation device, so that the electronic device is firmly fixed, the thermal contact resistance can be effectively reduced, and the performance and the reliability of the electronic equipment are improved.
Drawings
Fig. 1 is a schematic perspective view of a micro-channel heat dissipation device according to an embodiment of the present invention;
fig. 2 is a schematic perspective view of a housing of a micro-channel heat dissipation device according to an embodiment of the present invention;
fig. 3 is a schematic perspective view of a heat dissipation tooth and a cover plate of a micro-channel heat dissipation device according to an embodiment of the present invention;
fig. 4 is a schematic plan view of a heat dissipation tooth and a cover plate of a micro-channel heat dissipation device according to an embodiment of the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
1. cooling medium import, 2, cooling medium export, 3, casing, 4, apron, 5, heat dissipation tooth.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the invention.
The embodiment of the invention provides a micro-channel heat dissipation device. As shown in fig. 1 to 3, the heat dissipating device includes a housing 3, a cover plate 4, and a plurality of heat dissipating teeth 5. Have upper end open-ended inner chamber in the casing 3, 3 upper ends of casing are located to apron 4 lid, in order to seal the opening, 3 both sides of casing are provided with respectively with the coolant import 1 and the coolant export 2 of inner chamber intercommunication, and 4 lower extremes of apron are provided with a plurality of heat dissipation teeth 5, and a plurality of heat dissipation teeth 5 are the rectangular array and arrange, and two adjacent heat dissipation teeth 5 are 0.2 to 1 times of the different side edge distance on horizontal for different side edge distance on vertical. For example, it may be 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9 or 1 times.
Specifically, when the microchannel heat dissipation device works, a cooling medium enters the inner cavity of the shell 3 through the cooling medium inlet 1, flows through the rhombic columnar heat dissipation teeth 5, exchanges heat with the heat dissipation teeth 5, and then flows out from the cooling medium outlet 2, so that heat of an electronic device mounted on the cover plate 4 can be taken away. The cooling medium may be cooling liquid or cooling air.
As shown in fig. 4, the heat radiation teeth 5 are quadrangular prisms having a rhombic cross section, and one inner angle of the rhombus ranges from 30 ° to 70 °.
Specifically, the interval between two adjacent heat dissipation teeth 5 in the longitudinal direction is a main fluid channel, and the width of the main fluid channel is X, the interval in the transverse direction is an auxiliary fluid channel, and the width of the auxiliary fluid channel is Y. Wherein, the transverse direction is the central connecting line direction of the cooling medium inlet 1 and the cooling medium outlet 2. One inner angle of the rhombic section of the heat dissipation tooth 5 is made to be Z. Wherein, Y is more than or equal to 0.2X and less than or equal to X, and Z is more than or equal to 30 degrees and less than or equal to 70 degrees. The cooling medium flows mainly in the main fluid channel in the process of flowing from the inlet to the outlet, and the secondary flow is continuously generated under the pressure driving, and the secondary flow mainly flows in the auxiliary fluid channel. Through carrying out above-mentioned parameter setting to rhombus column heat dissipation tooth, will make heat dissipation tooth boundary layer develop again, can take away more heats, will make the radiating effect obtain obviously improving, through software simulation and experimental test, the radiating effect can improve about 20%.
The shell 3 and the cover plate 4 are fixedly connected through vacuum brazing. The heat dissipation teeth 5 and the cover plate 4 are machined from a metal material.
The materials of the shell 3, the cover plate 4 and the heat dissipation teeth 5 are copper, aluminum or other metals and alloys, and red copper can be preferred.
The embodiment of the invention provides electronic equipment. The electronic equipment comprises at least one electronic device and the micro-channel heat dissipation device, wherein the electronic device is welded at the upper end of the cover plate 4.
The electronic device is welded at the upper end of the cover plate of the micro-channel heat dissipation device, so that the electronic device is firmly fixed, the thermal contact resistance can be effectively reduced, and the performance and the reliability of the electronic equipment are improved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (5)
1. A microchannel heat sink comprises a housing (3), a cover plate (4) and a plurality of heat dissipating teeth (5); an inner cavity with an opening at the upper end is formed in the shell (3), the cover plate (4) is arranged at the upper end of the shell (3) in a covering mode to seal the opening, a cooling medium inlet (1) and a cooling medium outlet (2) which are communicated with the inner cavity are formed in two sides of the shell (3) respectively, a plurality of heat dissipation teeth (5) are arranged at the lower end of the cover plate (4), the heat dissipation teeth (5) are arranged in a rectangular array mode, and the distance between the different side edges of two adjacent heat dissipation teeth (5) in the transverse direction is 0.2-1 time of the distance between the different side edges in the longitudinal direction;
the heat dissipation teeth (5) are quadrangular prisms with rhombic cross sections, and the included angle between the normal direction of the sections of the cooling medium inlet (1) and the cooling medium outlet (2) and one bevel edge of each rhombus is 30-70 degrees;
the plurality of heat dissipation teeth (5) are arranged in a way that the corresponding sides are parallel.
2. The microchannel heat sink according to claim 1, wherein the housing (3) and the cover plate (4) are fixedly connected by vacuum brazing.
3. The microchannel heat sink according to claim 1 or 2, wherein the material of the housing (3), the cover plate (4) and the heat sink teeth (5) is copper or aluminum.
4. The microchannel heat sink according to any one of claims 1 or 2, wherein a cooling medium flows into the inner cavity from the cooling medium inlet (1) and flows out of the inner cavity from the cooling medium outlet (2), and the cooling medium is a cooling liquid or cooling air.
5. An electronic device comprising at least one electronic component and the micro-channel heat sink according to any of claims 1 to 4, wherein the electronic component is soldered to the upper end of the cover plate (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710606766.8A CN107403775B (en) | 2017-07-24 | 2017-07-24 | Micro-channel heat dissipation device and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710606766.8A CN107403775B (en) | 2017-07-24 | 2017-07-24 | Micro-channel heat dissipation device and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN107403775A CN107403775A (en) | 2017-11-28 |
| CN107403775B true CN107403775B (en) | 2020-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710606766.8A Active CN107403775B (en) | 2017-07-24 | 2017-07-24 | Micro-channel heat dissipation device and electronic equipment |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019231399A1 (en) * | 2018-05-28 | 2019-12-05 | National University Of Singapore | A heat sink assembly |
| CN114005800B (en) * | 2021-09-29 | 2024-01-23 | 苏州浪潮智能科技有限公司 | Microchannel structure for heat dissipation of edge server chip |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101026948A (en) * | 2007-03-26 | 2007-08-29 | 山东省科学院能源研究所 | Single-phase ultrahigh heat flow micro-column heat exchanger |
| CN104658992A (en) * | 2015-02-13 | 2015-05-27 | 西安电子科技大学 | Novel micro heat sink provided with pin-fin array |
| CN106601703A (en) * | 2016-10-27 | 2017-04-26 | 湖北工程学院 | Microchannel heat sink adopting secondary backflow cooling mode |
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2017
- 2017-07-24 CN CN201710606766.8A patent/CN107403775B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101026948A (en) * | 2007-03-26 | 2007-08-29 | 山东省科学院能源研究所 | Single-phase ultrahigh heat flow micro-column heat exchanger |
| CN104658992A (en) * | 2015-02-13 | 2015-05-27 | 西安电子科技大学 | Novel micro heat sink provided with pin-fin array |
| CN106601703A (en) * | 2016-10-27 | 2017-04-26 | 湖北工程学院 | Microchannel heat sink adopting secondary backflow cooling mode |
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| CN107403775A (en) | 2017-11-28 |
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