US20170314870A1 - Heat dissipating structure and water-cooling heat dissipating apparatus including the structure - Google Patents

Heat dissipating structure and water-cooling heat dissipating apparatus including the structure Download PDF

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Publication number
US20170314870A1
US20170314870A1 US15/143,509 US201615143509A US2017314870A1 US 20170314870 A1 US20170314870 A1 US 20170314870A1 US 201615143509 A US201615143509 A US 201615143509A US 2017314870 A1 US2017314870 A1 US 2017314870A1
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Prior art keywords
heat dissipating
vapor chamber
section
base section
hollow slot
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Abandoned
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US15/143,509
Inventor
Chun-Hung Lin
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Taiwan Microloops Corp
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Taiwan Microloops Corp
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Priority to US15/143,509 priority Critical patent/US20170314870A1/en
Assigned to TAIWAN MICROLOOPS CORP. reassignment TAIWAN MICROLOOPS CORP. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIN, CHUN-HUNG
Publication of US20170314870A1 publication Critical patent/US20170314870A1/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283—Means for filling or sealing heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks

Definitions

  • the technical field relates to heat dissipation, more particularly to a heat dissipating structure and a water-cooling heat dissipating apparatus including the structure provided for heat generating electronic components.
  • the conventional heat sink generally comprises a bottom plate and a heat dissipating fin extended from the bottom plate.
  • a heat dissipating structure including a vapor chamber and the aforementioned heat sink has been developed, wherein the heat sink is mounted onto the vapor chamber by a soldering material such as a solder paste, and the vapor chamber comprises an upper casing plate and a lower casing plate, and a capillary tissue is installed in an internal space of the upper and lower casing plates, and then the upper and lower casing plates are engaged with each other by soldering, and a working fluid is filled into the interior of the upper and lower casing plates, and finally the manufacturing processes of removing air and sealing are taken place to complete the manufacture of the heat sink.
  • soldering material such as a solder paste
  • the conventional heat dissipating structure has the effects of conducting and dissipating heat, its actual application still has the following problems. Since the vapor chamber is limited by space, and thus is capable of dispersing heat by a traverse flow way, so that the thermal conduction and dissipation cannot be enhanced effectively. In addition, a soldering material is coated onto the interface of the vapor chamber and the heat sink, and such material may hinder the heat transfer. Obviously, the conventional heat sink requires improvements.
  • this disclosure provides a heat dissipating structure, comprising a vapor chamber, a plurality of heat pipes and a heat dissipating member, wherein the vapor chamber has a hollow slot penetrating through the vapor chamber, and the vapor chamber further has a cavity; each heat pipe is vertically installed to the vapor chamber and communicated with the cavity; and the heat dissipating member comprises a substrate and a plurality of fins integrally extended from the substrate, and the heat dissipating member seals the hollow slot by the substrate.
  • this disclosure further provides a water-cooling heat dissipating apparatus, comprising a heat dissipating structure and a cover, wherein the heat dissipating structure comprises a vapor chamber, a plurality of heat pipes and a heat dissipating member, and the vapor chamber has a hollow slot penetrating through the vapor chamber, and the vapor chamber also has a cavity; each heat pipe is vertically installed to the vapor chamber and communicated with the cavity; the heat dissipating member comprises a substrate and a plurality of fins integrally extended from the substrate, and the heat dissipating member seals the hollow slot by the substrate; the cover is covered onto the vapor chamber and a liquid cavity is formed between the cover and the vapor chamber, and each heat pipe and each fin are formed in the liquid cavity, and the cover has a water inlet and a water outlet, both communicated with the liquid cavity.
  • the heat dissipating structure comprises a vapor chamber, a plurality of heat pipes and a heat
  • the vapor chamber is communicated with the heat pipe, so that the internal working fluid can be used for dispersing heat by transverse and longitudinal gas flowing ways.
  • Both vapor chamber and substrate are used simultaneously for conducting heat from a heat generating source to conduct and dissipate heat quickly with the feature of low thermal resistance.
  • the heat dissipating member is formed at a middle area of the vapor chamber to maximize the effect of conducting heat from the largest heat area of the heat generating source, so as to dispersing and dissipating heat of the heat generating source effectively.
  • FIG. 1 is a perspective exploded view of a heat dissipating structure in accordance with a first preferred embodiment of the present invention
  • FIG. 2 is a perspective exploded view of a heat dissipating structure in accordance with the first preferred embodiment of the present invention
  • FIG. 3 is a cross-sectional view of a heat dissipating structure in accordance with the first preferred embodiment of the present invention
  • FIG. 4 is a perspective exploded view of a heat dissipating structure in accordance with a second preferred embodiment of the present invention.
  • FIG. 5 is a perspective exploded view of a heat dissipating structure in accordance with the second preferred embodiment of the present invention.
  • FIG. 6 is a perspective exploded view of a heat dissipating structure in accordance with a third preferred embodiment of the present invention.
  • FIG. 7 is a perspective exploded view of a heat dissipating structure in accordance with the third preferred embodiment of the present invention.
  • FIG. 8 is a perspective view of a water-cooling heat dissipating apparatus of this disclosure.
  • the heat dissipating structure 1 comprises a vapor chamber 10 , a plurality of heat pipes 20 and a heat dissipating member 30 .
  • the vapor chamber 10 has a cavity 11 formed therein, and a first capillary tissue 12 such as a woven mesh or a sintered metal and a support member (not shown in the figure) such as a spring or a pillar are placed into the cavity 11 , and a working fluid 13 such as pure water is filled, and the vapor-liquid phase change of the working fluid 13 is used to achieve the effect of thermal conduction, and the vapor chamber 10 of this embodiment is substantially a rectangular object. It is noteworthy that vapor chamber 10 of this disclosure is not limited to the rectangular shape only, but a circular shape or any other shape may be used instead.
  • the external bottom side of the vapor chamber 10 has a heated surface 14 , and a hollow slot 15 formed at a middle area of the vapor chamber 10 penetrates through the vapor chamber 10 , and the vapor chamber 10 installed at the external periphery of the hollow slot 15 has a stepped upper receiving section 16 disposed at the top of the vapor chamber.
  • the heat pipe 20 has a cavity 21 formed therein, and the cavity 21 is filled with a second capillary tissue 22 composed of woven meshes, ditches, or sintered metals.
  • each heat pipe 20 is vertically installed to the vapor chamber 10 , and each cavity 21 is communicated with the cavity 11 , and each second capillary tissue 22 is coupled to the first capillary tissue 12 to achieve a good circulation effect of the internal working fluid 13 .
  • the heat dissipating member 30 may be made of copper, aluminum, or their alloys, and the heat dissipating member 30 comprises a rectangular substrate 31 and a plurality of fins 32 , and the substrate 31 has a bottom side 311 .
  • the substrate 31 of this embodiment includes a base section 312 , a vertical plate section 313 bent and extended upwardly from both sides of the base section 312 , and a bridging section 314 bent and extended from the vertical plate section 313 in a horizontal direction, and the bottom side 311 is formed outside the base section 312 .
  • Each fin 32 is formed with an interval apart from the base section 312 and the bridging section 314 by extruding or chipping.
  • the heat dissipating member 30 is installed at a position corresponsive to the hollow slot 15 of the vapor chamber 10 , wherein the base section 312 seals the bottom of the hollow slot 15 , and the bridging section 314 is attached to the respective upper receiving section 16 , and the vertical plate section 313 is attached onto the inner wall of the hollow slot 15 , and a conductive medium (not shown in the figure) is applied and fixed between the bridging section 314 and the upper receiving section 16 and between the vertical plate section 313 and the inner wall of the hollow slot 15 , so that the bottom side 311 of the substrate 31 and the heated surface 14 form a common surface structure A, and the common surface structure A is provided for attaching and contacting a heat generating source (not shown in the figure).
  • the heat dissipating structure 1 further includes a plurality of heat dissipating fins 40 , and each heat dissipating fin 40 has a plurality of through holes 41 configured to be corresponsive to each other, and a circular wall 42 is extended form the periphery of each through hole 41 , and the heat dissipating fin 40 is coupled to the heat pipe 20 through the through hole 41 , and the heat dissipating fins 40 are stacked on one another, such that a liquid channel 43 is formed between any two adjacent heat dissipating fins 40 .
  • the bottom side 311 of the substrate 31 and the heated surface 14 of the vapor chamber 10 are in contact with the heat generating source, wherein some of the heat is transferred along the base section 312 to the fin 32 and dispersed to the outside, and some of the heat is dissipated quickly through a vapor-liquid phase of the vapor chamber 10 , and then dispersed through each heat pipe 20 and each heat dissipating fin 40 to the outside, so as to enhance the cooling performance.
  • the heat dissipating structure 1 a comprises a stepped lower receiving section 18 disposed at the bottom of the vapor chamber 10 installed at the external periphery of the hollow slot 15
  • the substrate 31 of the heat dissipating member 30 a includes a base section 312 and a bridging section 314 extended from both sides of the base section 312 in a horizontal direction, wherein the base section 312 seals the bottom of the hollow slot 15 , and each bridging section 314 is attached to each respective lower receiving section 18 , and a thermal conductive medium is applied and fixed between the bridging section 314 and the lower receiving section 18 , so that the bottom side 311 of the substrate 31 and the heated surface 14 form a common surface structure A.
  • the base section 312 seals the bottom of the hollow slot 15 , and the fins 32 on both sides are attached to the inner wall of the hollow slot 15 , and a thermal conductive medium is applied and fixed between the fin 32 and the inner wall of the hollow slot 15 , so that the bottom side 311 of the substrate 31 and the heated surface 14 form a common surface structure A.
  • the water-cooling heat dissipating apparatus comprises a heat dissipating structure 1 and a cover 5 , wherein the cover 5 is covered onto the vapor chamber 10 , and the bottom edge of the cover 5 is embedded into the insert slot 17 for sealing, and a liquid cavity B is formed between the cover 5 and the vapor chamber 10 , and each heat pipe 20 , each fin 32 , and each heat dissipating fin 40 are formed in the liquid cavity B, and the cover 5 has a water inlet 51 and two water outlets 52 which are communicated with the liquid cavity B.
  • the water-cooling heat dissipating apparatus of this disclosure further comprises a water inlet pipe 6 , two water outlet pipes 7 and a partition plate 8 , wherein the water inlet pipe 6 is coupled to the water inlet 51 correspondingly, and each water outlet pipe 7 is coupled to the water outlet 52 correspondingly, and the partition plate 8 is clamped between each heat pipe 20 and the top of each fin 32 and the top plate of the cover 5 , and a liquid channel 81 is formed at the middle of the partition plate 8 corresponsive to the water inlet pipe 6 .
  • the fluid After the fluid has entered through the water inlet pipe 6 into the liquid cavity B, the fluid impacts each fin 32 and the base section 312 and carries away the primary heat of each fin 32 and the base section 312 , and then continues flowing through each heat pipe 20 on both sides and each heat dissipating fin 40 to carry away the secondary heat.
  • the fluid flows through the channel formed by the partition plate 8 and the top plate of the cover 5 and out from each water outlet pipe 7 , so as to achieve the effect of flowing the fluid in the water-cooling heat dissipating apparatus.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipating structure and a water-cooling heat dissipating apparatus including the structure are disclosed. The heat dissipating structure includes a vapor chamber, plural heat pipes and a heat dissipating member, and the vapor chamber has a hollow slot penetrating through the vapor chamber, and the vapor chamber also has a cavity. Each heat pipe is vertically installed to the vapor chamber and communicated with the cavity. The heat dissipating member includes a substrate and plural fins integrally extended from the substrate and seals the hollow slot by a substrate, so as to improve the thermal conduction and dissipation of the heat dissipating structure and the water-cooling heat dissipating apparatus.

Description

    FIELD OF THE INVENTION
  • The technical field relates to heat dissipation, more particularly to a heat dissipating structure and a water-cooling heat dissipating apparatus including the structure provided for heat generating electronic components.
    • BACKGROUND OF THE INVENTION
  • As the computing speed of electronic components becomes increasingly higher, the heat generated by the electronic components also becomes greater. To overcome the high heat issue effectively, manufacturers have used heat sinks, heat pipes or vapor chambers made of aluminum and copper alloys extensively, but such heat dissipating structures still require further improvements on their thermal conduction and manufacturability.
  • The conventional heat sink generally comprises a bottom plate and a heat dissipating fin extended from the bottom plate. Although such conventional heat sink has the feature of good heat dissipation, the thermal conductivity of the heat sink cannot be improved. Therefore, a heat dissipating structure including a vapor chamber and the aforementioned heat sink has been developed, wherein the heat sink is mounted onto the vapor chamber by a soldering material such as a solder paste, and the vapor chamber comprises an upper casing plate and a lower casing plate, and a capillary tissue is installed in an internal space of the upper and lower casing plates, and then the upper and lower casing plates are engaged with each other by soldering, and a working fluid is filled into the interior of the upper and lower casing plates, and finally the manufacturing processes of removing air and sealing are taken place to complete the manufacture of the heat sink.
  • Although the conventional heat dissipating structure has the effects of conducting and dissipating heat, its actual application still has the following problems. Since the vapor chamber is limited by space, and thus is capable of dispersing heat by a traverse flow way, so that the thermal conduction and dissipation cannot be enhanced effectively. In addition, a soldering material is coated onto the interface of the vapor chamber and the heat sink, and such material may hinder the heat transfer. Obviously, the conventional heat sink requires improvements.
  • In view of the aforementioned problems of the prior art, the discloser of this disclosure based on years of experience in the related industry to conduct extensive researches and experiments, and finally provided a feasible solution to overcome the problems of the prior art.
    • SUMMARY OF THE INVENTION
  • It is a primary objective of this disclosure to provide a heat dissipating structure and a water-cooling heat dissipating apparatus including the structure and to use the vapor chamber communicated with the heat pipe and a heat dissipating member assembled to the vapor chamber to improve the thermal conduction and dissipation of the heat dissipating structure and the water-cooling heat dissipating apparatus effectively.
  • To achieve the aforementioned and other objectives, this disclosure provides a heat dissipating structure, comprising a vapor chamber, a plurality of heat pipes and a heat dissipating member, wherein the vapor chamber has a hollow slot penetrating through the vapor chamber, and the vapor chamber further has a cavity; each heat pipe is vertically installed to the vapor chamber and communicated with the cavity; and the heat dissipating member comprises a substrate and a plurality of fins integrally extended from the substrate, and the heat dissipating member seals the hollow slot by the substrate.
  • To achieve the aforementioned and other objectives, this disclosure further provides a water-cooling heat dissipating apparatus, comprising a heat dissipating structure and a cover, wherein the heat dissipating structure comprises a vapor chamber, a plurality of heat pipes and a heat dissipating member, and the vapor chamber has a hollow slot penetrating through the vapor chamber, and the vapor chamber also has a cavity; each heat pipe is vertically installed to the vapor chamber and communicated with the cavity; the heat dissipating member comprises a substrate and a plurality of fins integrally extended from the substrate, and the heat dissipating member seals the hollow slot by the substrate; the cover is covered onto the vapor chamber and a liquid cavity is formed between the cover and the vapor chamber, and each heat pipe and each fin are formed in the liquid cavity, and the cover has a water inlet and a water outlet, both communicated with the liquid cavity.
  • This disclosure further provides the following effects. Since the vapor chamber is communicated with the heat pipe, so that the internal working fluid can be used for dispersing heat by transverse and longitudinal gas flowing ways. Both vapor chamber and substrate are used simultaneously for conducting heat from a heat generating source to conduct and dissipate heat quickly with the feature of low thermal resistance. The heat dissipating member is formed at a middle area of the vapor chamber to maximize the effect of conducting heat from the largest heat area of the heat generating source, so as to dispersing and dissipating heat of the heat generating source effectively.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a perspective exploded view of a heat dissipating structure in accordance with a first preferred embodiment of the present invention;
  • FIG. 2 is a perspective exploded view of a heat dissipating structure in accordance with the first preferred embodiment of the present invention;
  • FIG. 3 is a cross-sectional view of a heat dissipating structure in accordance with the first preferred embodiment of the present invention;
  • FIG. 4 is a perspective exploded view of a heat dissipating structure in accordance with a second preferred embodiment of the present invention;
  • FIG. 5 is a perspective exploded view of a heat dissipating structure in accordance with the second preferred embodiment of the present invention;
  • FIG. 6 is a perspective exploded view of a heat dissipating structure in accordance with a third preferred embodiment of the present invention;
  • FIG. 7 is a perspective exploded view of a heat dissipating structure in accordance with the third preferred embodiment of the present invention; and
  • FIG. 8 is a perspective view of a water-cooling heat dissipating apparatus of this disclosure.
    •  DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • The technical contents of this disclosure will become apparent with the detailed description of preferred embodiments accompanied with the illustration of related drawings as follows. It is intended that the embodiments and figures disclosed herein are to be considered illustrative rather than restrictive.
  • With reference to FIGS. 1 to 3 for a heat dissipating structure of this disclosure, the heat dissipating structure 1 comprises a vapor chamber 10, a plurality of heat pipes 20 and a heat dissipating member 30.
  • The vapor chamber 10 has a cavity 11 formed therein, and a first capillary tissue 12 such as a woven mesh or a sintered metal and a support member (not shown in the figure) such as a spring or a pillar are placed into the cavity 11, and a working fluid 13 such as pure water is filled, and the vapor-liquid phase change of the working fluid 13 is used to achieve the effect of thermal conduction, and the vapor chamber 10 of this embodiment is substantially a rectangular object. It is noteworthy that vapor chamber 10 of this disclosure is not limited to the rectangular shape only, but a circular shape or any other shape may be used instead. The external bottom side of the vapor chamber 10 has a heated surface 14, and a hollow slot 15 formed at a middle area of the vapor chamber 10 penetrates through the vapor chamber 10, and the vapor chamber 10 installed at the external periphery of the hollow slot 15 has a stepped upper receiving section 16 disposed at the top of the vapor chamber.
  • The heat pipe 20 has a cavity 21 formed therein, and the cavity 21 is filled with a second capillary tissue 22 composed of woven meshes, ditches, or sintered metals. In this embodiment, each heat pipe 20 is vertically installed to the vapor chamber 10, and each cavity 21 is communicated with the cavity 11, and each second capillary tissue 22 is coupled to the first capillary tissue 12 to achieve a good circulation effect of the internal working fluid 13.
  • The heat dissipating member 30 may be made of copper, aluminum, or their alloys, and the heat dissipating member 30 comprises a rectangular substrate 31 and a plurality of fins 32, and the substrate 31 has a bottom side 311. The substrate 31 of this embodiment includes a base section 312, a vertical plate section 313 bent and extended upwardly from both sides of the base section 312, and a bridging section 314 bent and extended from the vertical plate section 313 in a horizontal direction, and the bottom side 311 is formed outside the base section 312. Each fin 32 is formed with an interval apart from the base section 312 and the bridging section 314 by extruding or chipping.
  • The heat dissipating member 30 is installed at a position corresponsive to the hollow slot 15 of the vapor chamber 10, wherein the base section 312 seals the bottom of the hollow slot 15, and the bridging section 314 is attached to the respective upper receiving section 16, and the vertical plate section 313 is attached onto the inner wall of the hollow slot 15, and a conductive medium (not shown in the figure) is applied and fixed between the bridging section 314 and the upper receiving section 16 and between the vertical plate section 313 and the inner wall of the hollow slot 15, so that the bottom side 311 of the substrate 31 and the heated surface 14 form a common surface structure A, and the common surface structure A is provided for attaching and contacting a heat generating source (not shown in the figure).
  • In addition, the heat dissipating structure 1 further includes a plurality of heat dissipating fins 40, and each heat dissipating fin 40 has a plurality of through holes 41 configured to be corresponsive to each other, and a circular wall 42 is extended form the periphery of each through hole 41, and the heat dissipating fin 40 is coupled to the heat pipe 20 through the through hole 41, and the heat dissipating fins 40 are stacked on one another, such that a liquid channel 43 is formed between any two adjacent heat dissipating fins 40.
  • When use, the bottom side 311 of the substrate 31 and the heated surface 14 of the vapor chamber 10 are in contact with the heat generating source, wherein some of the heat is transferred along the base section 312 to the fin 32 and dispersed to the outside, and some of the heat is dissipated quickly through a vapor-liquid phase of the vapor chamber 10, and then dispersed through each heat pipe 20 and each heat dissipating fin 40 to the outside, so as to enhance the cooling performance.
  • With reference to FIGS. 4 and 5 for a heat dissipating structure 1 a of another embodiment of this disclosure, the heat dissipating structure 1 a comprises a stepped lower receiving section 18 disposed at the bottom of the vapor chamber 10 installed at the external periphery of the hollow slot 15, and the substrate 31 of the heat dissipating member 30 a includes a base section 312 and a bridging section 314 extended from both sides of the base section 312 in a horizontal direction, wherein the base section 312 seals the bottom of the hollow slot 15, and each bridging section 314 is attached to each respective lower receiving section 18, and a thermal conductive medium is applied and fixed between the bridging section 314 and the lower receiving section 18, so that the bottom side 311 of the substrate 31 and the heated surface 14 form a common surface structure A.
  • With reference to FIGS. 6 and 7 for a heat dissipating structure 1 b of this embodiment, the base section 312 seals the bottom of the hollow slot 15, and the fins 32 on both sides are attached to the inner wall of the hollow slot 15, and a thermal conductive medium is applied and fixed between the fin 32 and the inner wall of the hollow slot 15, so that the bottom side 311 of the substrate 31 and the heated surface 14 form a common surface structure A.
  • With reference to FIG. 8 for a water-cooling heat dissipating apparatus including the aforementioned heat dissipating structure, the water-cooling heat dissipating apparatus comprises a heat dissipating structure 1 and a cover 5, wherein the cover 5 is covered onto the vapor chamber 10, and the bottom edge of the cover 5 is embedded into the insert slot 17 for sealing, and a liquid cavity B is formed between the cover 5 and the vapor chamber 10, and each heat pipe 20, each fin 32, and each heat dissipating fin 40 are formed in the liquid cavity B, and the cover 5 has a water inlet 51 and two water outlets 52 which are communicated with the liquid cavity B.
  • In addition, the water-cooling heat dissipating apparatus of this disclosure further comprises a water inlet pipe 6, two water outlet pipes 7 and a partition plate 8, wherein the water inlet pipe 6 is coupled to the water inlet 51 correspondingly, and each water outlet pipe 7 is coupled to the water outlet 52 correspondingly, and the partition plate 8 is clamped between each heat pipe 20 and the top of each fin 32 and the top plate of the cover 5, and a liquid channel 81 is formed at the middle of the partition plate 8 corresponsive to the water inlet pipe 6. After the fluid has entered through the water inlet pipe 6 into the liquid cavity B, the fluid impacts each fin 32 and the base section 312 and carries away the primary heat of each fin 32 and the base section 312, and then continues flowing through each heat pipe 20 on both sides and each heat dissipating fin 40 to carry away the secondary heat. The fluid flows through the channel formed by the partition plate 8 and the top plate of the cover 5 and out from each water outlet pipe 7, so as to achieve the effect of flowing the fluid in the water-cooling heat dissipating apparatus.
  • While this disclosure has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of this disclosure set forth in the claims.

Claims (20)

What is claimed is:
1. A heat dissipating structure, comprising:
a vapor chamber, having a hollow slot penetrating through the vapor chamber, and a cavity formed in the vapor chamber;
a plurality of heat pipes, installed in the vapor chamber and communicated with the cavity; and
a heat dissipating member, including a substrate and a plurality of fins integrally extended from the substrate, and the heat dissipating member sealing the hollow slot by the substrate.
2. The heat dissipating structure according to claim 1, wherein the substrate has a bottom side, and the vapor chamber has a heated surface, and the bottom side of the substrate and the heated surface of the vapor chamber form a common surface structure.
3. The heat dissipating structure according to claim 2, further comprising a plurality of heat dissipating fins having a plurality of through holes configured to be corresponsive to each other respectively, and each through hole having a circular wall extended from the periphery of the through hole, and each heat dissipating fin being coupled to each heat pipe through each through hole, and the heat dissipating fins being stacked and coupled to each other through the circular wall, such that a liquid channel is formed between any two adjacent heat dissipating fins.
4. The heat dissipating structure according to claim 2, wherein the hollow slot is formed at a middle area of the vapor chamber.
5. The heat dissipating structure according to claim 4, wherein the vapor chamber installed at the external periphery of the hollow slot has an upper receiving section disposed at the top of the vapor chamber, and the substrate includes a base section, a vertical plate section bent and extended upwardly and separately from both sides of the base section, and a bridging section bent and extended from the vertical plate section in a horizontal direction, and the bottom side is formed outside the base section, and the base section seals the bottom of the hollow slot, and each bridging section is attached to each respective upper receiving section.
6. The heat dissipating structure according to claim 5, wherein each vertical plate section is attached to an inner wall of the respective hollow slot.
7. The heat dissipating structure according to claim 5, wherein each fin is formed with an interval apart from the base section and each bridging section by extruding or chipping.
8. The heat dissipating structure according to claim 4, wherein the vapor chamber installed at the external periphery of the hollow slot has a lower receiving section disposed at the bottom of the vapor chamber, and the substrate includes a base section and a bridging section extended from both sides of the base section in a horizontal direction, and the bottom side is formed outside the base section, and the base section seals bottom of the hollow slot, and each bridging section is attached to each respective lower receiving section.
9. The heat dissipating structure according to claim 4, wherein the substrate includes a base section, and the bottom side is formed outside the base section, and the base section seals the bottom of the hollow slot, and each fin is attached onto an inner wall of the respective hollow slot.
10. A water-cooling heat dissipating apparatus, comprising:
a heat dissipating structure, further comprising:
a vapor chamber, having a hollow slot penetrating through the vapor chamber, and further having a cavity;
a plurality of heat pipes, vertically installed to the vapor chamber, and communicated with the cavity; and
a heat dissipating member, including a substrate and a plurality of fins integrally extended from the substrate, and sealing the hollow slot by the substrate; and
a cover, covered onto the vapor chamber, and a liquid cavity being formed between the cover and the vapor chamber, and each heat pipe and each fin being formed in the liquid cavity, and the cover having a water inlet and a water outlet, both being communicated with the liquid cavity.
11. The water-cooling heat dissipating apparatus according to claim 10, wherein the substrate has a bottom side, and the vapor chamber has a heated surface, and the bottom side of the substrate and the heated surface of the vapor chamber form a common surface structure.
12. The water-cooling heat dissipating apparatus according to claim 11, wherein the heat dissipating structure further comprises a plurality of heat dissipating fins, and each heat dissipating fin has a plurality of through holes configured to be corresponsive to one another, and a circular wall extended from the periphery of each through hole, and each heat dissipating fin is coupled to each heat pipe through each through hole and stacked and coupled to one another through each respective circular wall, so as to form a liquid channel between any two adjacent heat dissipating fins.
13. The water-cooling heat dissipating apparatus according to claim 11, wherein the hollow slot is formed at a middle area of the vapor chamber, and the hollow slot has an upper receiving section disposed at the top of the vapor chamber, and the substrate includes a base section, vertical plate section bent and extended upwardly and separately from both sides of the base section, and a bridging section bent and extended from the vertical plate section in a horizontal direction, and the bottom side is formed outside the base section, and the base section seals the bottom of the hollow slot, and each bridging section is attached to each respective upper receiving section.
14. The water-cooling heat dissipating apparatus according to claim 13, wherein each vertical plate section is attached onto an inner wall of the respective hollow slot.
15. The water-cooling heat dissipating apparatus according to claim 13, wherein each fin is formed with an interval apart from the base section and each bridging section by extruding or chipping.
16. The water-cooling heat dissipating apparatus according to claim 11, wherein the hollow slot is formed at a middle area of the vapor chamber, and the vapor chamber installed at the external periphery of the hollow slot has a lower receiving section disposed at the bottom of the vapor chamber, and the substrate includes a base section and a bridging section extended from both sides of the base section in a horizontal direction, and the bottom side is formed outside the base section, and the base section seals the bottom of the hollow slot, and each bridging section is attached to each respective lower receiving section.
17. The water-cooling heat dissipating apparatus according to claim 11, wherein the substrate includes a base section, and the bottom side is formed outside the base section, and the base section seals the bottom of the hollow slot, and each fin is attached onto an inner wall of the respective hollow slot.
18. The water-cooling heat dissipating apparatus according to claim 11, wherein the vapor chamber has a circular insert slot formed at the top of the vapor chamber, and the bottom edge of the cover is embedded into the insert slot for sealing.
19. The water-cooling heat dissipating apparatus according to claim 11, further comprising a water inlet pipe and at least a water outlet pipe, wherein the water inlet pipe is coupled to the water inlet correspondingly, and the water outlet pipe is coupled to the water outlet correspondingly.
20. The water-cooling heat dissipating apparatus according to claim 19, further comprising a partition plate clamped between each heat pipe and the cover, and a liquid channel formed at a position of the partition plate corresponsive to the water inlet pipe.
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CN111403638A (en) * 2020-03-27 2020-07-10 福建华祥电源科技有限公司 Battery box that radiating effect is good
CN112562977A (en) * 2020-12-11 2021-03-26 杭州盛通科技有限公司 Heat radiation structure with top of transformer having penetrating heat radiation effect
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