JP2010251755A - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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Publication number
JP2010251755A
JP2010251755A JP2010091521A JP2010091521A JP2010251755A JP 2010251755 A JP2010251755 A JP 2010251755A JP 2010091521 A JP2010091521 A JP 2010091521A JP 2010091521 A JP2010091521 A JP 2010091521A JP 2010251755 A JP2010251755 A JP 2010251755A
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Prior art keywords
heat
container
heat dissipation
dissipation device
wick
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Japanese (ja)
Inventor
Ching-Bai Hwang
清白 黄
Jin-Gong Meng
勁功 孟
Jui-Wen Hung
鋭▲ウェン▼ 洪
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Furui Precise Component Kunshan Co Ltd
Foxconn Technology Co Ltd
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Furui Precise Component Kunshan Co Ltd
Foxconn Technology Co Ltd
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Publication of JP2010251755A publication Critical patent/JP2010251755A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat dissipation device having superior cooling efficiency. <P>SOLUTION: The heat dissipation device includes: a heat conductor 10 having a hollow structure, in which a wick and a suitable amount of working fluid are charged; and a heat dissipation body. The heat conductor includes: an evaporation container 14; and a cooling container 16 which extends upward from the evaporation container and penetrates the heat dissipation body to mutually communicate with evaporation container. The wick 18 includes: a horizontal portion 181 provided in the evaporation container; and a raised portion 182 extending upward from the horizontal portion into the cooling container. An evaporation passage for moving steam is formed between a periphery of the raised portion and an inner wall of the cooling container. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は放熱装置に係り、特に電子部品を冷却するための放熱装置に関するものである。   The present invention relates to a heat dissipation device, and more particularly to a heat dissipation device for cooling an electronic component.

電子技術の急速な発展に伴い、電子部品（特に中央処理装置）の集積回路がますます複雑になり、発生する熱量もますます増加している。前記電子部品を冷却するために、放熱装置を前記電子部品に装着する。   With the rapid development of electronic technology, integrated circuits of electronic components (especially central processing units) are becoming more and more complex, and the amount of heat generated is also increasing. In order to cool the electronic component, a heat dissipation device is mounted on the electronic component.

従来の放熱装置は、電子部品に接触するソリッドの基板と、放熱器と、前記基板と前記放熱器との間に位置するヒートパイプと、を備える。前記電子部品で発生した熱量が前記基板によって前記ヒートパイプの一端に伝導し、さらに前記ヒートパイプによって前記ヒートパイプの他端に接触する前記放熱器に伝導し、前記放熱器によって外界へ放散される。前記放熱装置においては、前記ヒートパイプと前記基板との間の熱抵抗が大きいため、前記放熱装置の冷却効率に影響する。   A conventional heat radiating device includes a solid substrate in contact with an electronic component, a radiator, and a heat pipe positioned between the substrate and the radiator. The amount of heat generated in the electronic component is conducted by the substrate to one end of the heat pipe, further conducted by the heat pipe to the radiator that contacts the other end of the heat pipe, and dissipated to the outside by the radiator. . In the heat radiating device, since the thermal resistance between the heat pipe and the substrate is large, the cooling efficiency of the heat radiating device is affected.

以上の問題点に鑑み、本発明は、冷却効率が優れた放熱装置を提供することを目的とする。 In view of the above problems, an object of the present invention is to provide a heat dissipation device having excellent cooling efficiency.

中空構造であり、その内部にはウイック（ｗｉｃｋ）と適量の作動流体が封入される熱伝導体と、放熱体と、を備えてなる放熱装置であって、前記熱伝導体は、蒸発コンテナと、前記蒸発コンテナから上に向かって伸び出して前記放熱体を貫き且つ前記蒸発コンテナと互いに連通する冷却コンテナと、を備え、前記ウイックは、前記蒸発コンテナの内部に設けられる水平部と、前記水平部から上に向かって前記冷却コンテナ内に伸び出す直立部と、を備え、前記直立部の周囲と前記冷却コンテナの内壁との間には、蒸気を移動させる蒸気通路が形成される。   A heat dissipation device having a hollow structure, including a heat conductor in which a wick and an appropriate amount of working fluid are enclosed, and a heat dissipator, wherein the heat conductor includes an evaporation container and A cooling container extending upward from the evaporating container and penetrating through the heat dissipating body and communicating with the evaporating container, the wick includes a horizontal portion provided inside the evaporating container, and the horizontal An upright portion extending upward from the portion into the cooling container, and a steam passage for moving the steam is formed between the periphery of the upright portion and the inner wall of the cooling container.

従来の技術に比べて、前記放熱装置は、熱伝導体を電子部品に直接に接触して、前記電子部品からの熱量が前記熱伝導体内部のウイック及び作動流体によって伝導されるため、従来の放熱装置のソリッドの基板に比べて、熱抵抗が小さくなり、熱伝導機能が上がる。 Compared with the prior art, the heat dissipation device directly contacts the heat conductor with the electronic component, and the amount of heat from the electronic component is conducted by the wick and the working fluid inside the heat conductor. Compared to the solid substrate of the heat dissipation device, the thermal resistance is reduced and the heat conduction function is improved.

本発明の実施形態に係る放熱装置の組立図である。It is an assembly drawing of the thermal radiation apparatus which concerns on embodiment of this invention. 図１に示す放熱装置の分解図である。FIG. 2 is an exploded view of the heat dissipation device shown in FIG. 1. 図２に示す熱伝導体の分解図である。FIG. 3 is an exploded view of the heat conductor shown in FIG. 2. 図１に示す放熱装置のＩＶ線−ＩＶ線に沿う断面図である。It is sectional drawing which follows the IV line-IV line of the thermal radiation apparatus shown in FIG. 図１に示す放熱装置のＶ線−Ｖ線に沿う断面図である。It is sectional drawing which follows the V line-V line of the thermal radiation apparatus shown in FIG.

以下、図面を参照して、本発明に係る具体的な実施例の構成を詳細に説明する。   Hereinafter, the configuration of a specific embodiment according to the present invention will be described in detail with reference to the drawings.

図１及び図２に示したように、本発明の実施形態に係る放熱装置は、熱伝導体１０と、放熱体２０と、を備える。   As shown in FIGS. 1 and 2, the heat dissipating device according to the embodiment of the present invention includes a heat conductor 10 and a heat dissipating body 20.

前記放熱体２０は、互いに平行且つ等間隔に配置される複数の放熱フィン２２を順次に重ねて構成する。前記放熱フィン２２は、略矩形の板状であって、その中部には、２つの狭長な円孔２２２が設けられる。前記２つの円孔２２２は、対向設置されており、且つ略「ハ」字状を呈す。各々の放熱フイン２２の円孔２２２は互いに対応するため、前記放熱体２０を貫通する２つの貫通孔が形成される。前記円孔２２２の周縁から上に向かって環縁２２４が突出する。   The heat dissipating body 20 is formed by sequentially stacking a plurality of heat dissipating fins 22 arranged in parallel and at equal intervals. The heat radiating fins 22 have a substantially rectangular plate shape, and two narrow circular holes 222 are provided in the middle thereof. The two circular holes 222 are opposed to each other and have a substantially “C” shape. Since the circular holes 222 of the heat radiating fins 22 correspond to each other, two through holes that penetrate the heat radiating body 20 are formed. An annular edge 224 protrudes upward from the periphery of the circular hole 222.

図３乃至図５を同時に参考すると、前記熱伝導体１０は中空構造であり、その内部にはウイック１８と適量の作動流体が封入される。前記熱伝導体１０は、銅などのような伝熱性能が優れる金属から製造される。前記作動流体は、水、アルコールなどの低沸点を有する液体である。   Referring to FIGS. 3 to 5 at the same time, the heat conductor 10 has a hollow structure, in which a wick 18 and an appropriate amount of working fluid are enclosed. The heat conductor 10 is manufactured from a metal having excellent heat transfer performance such as copper. The working fluid is a liquid having a low boiling point such as water or alcohol.

前記熱伝導体１０は、水平の蒸発コンテナ１４と、前記蒸発コンテナ１４に直交する２つの冷却コンテナ１６と、を備える。前記蒸発コンテナ１４は、中空平板状であり、対向設置される下側枠体１４４及び上側枠体１４２を備える。前記上側枠体１４２と前記下側枠体１４４との間には、収容空間が形成される。前記上側枠体１４２の頂面の中部には、２つの狭長な収容孔１４０が形成され、且つ前記２つの収容孔１４０の周縁から上に向かって前記上側枠体１４２に直交する２つの環状の凸壁１４１が突出する。前記２つの凸壁１４１は対向設置されており、且つ略「ハ」字状を呈す。前記２つの冷却コンテナ１６は、頂端が密封され且つ底端が開放した細長い中空扁平状である。前記２つの冷却コンテナ１６の底端は、それぞれ前記蒸発コンテナ１４の２つの凸壁１４１内に収容され、且つ前記凸壁１４１の内壁に溶接などにより密着される。前記蒸発コンテナ１４の内部は前記冷却コンテナ１６の内部と互いに連通して、密閉キャビティが形成される。   The heat conductor 10 includes a horizontal evaporation container 14 and two cooling containers 16 orthogonal to the evaporation container 14. The evaporation container 14 has a hollow flat plate shape, and includes a lower frame body 144 and an upper frame body 142 that are disposed to face each other. A storage space is formed between the upper frame 142 and the lower frame 144. Two narrow housing holes 140 are formed in the middle of the top surface of the upper frame body 142, and two annular holes orthogonal to the upper frame body 142 from the periphery of the two housing holes 140 upward. The convex wall 141 protrudes. The two convex walls 141 are opposed to each other and have a substantially “C” shape. The two cooling containers 16 have an elongated hollow flat shape with the top end sealed and the bottom end open. The bottom ends of the two cooling containers 16 are respectively accommodated in the two convex walls 141 of the evaporation container 14 and are in close contact with the inner walls of the convex walls 141 by welding or the like. The interior of the evaporation container 14 communicates with the interior of the cooling container 16 to form a sealed cavity.

前記ウイック１８は、前記熱伝導体１０の輪郭に相似し、水平部１８１と、前記水平部１８１に直交し且つ前記水平部１８１と一体に成型される２つの直立部１８２と、を備える。前記ウイック１８の水平部１８１は、板状であり、前記蒸発コンテナ１４の内部に設けられる。前記ウイック１８の水平部１８１は、前記蒸発コンテナ１４の下側枠体１４４に接触する。前記ウイック１８の水平部１８１と前記上側枠体１４２との間には、蒸気を移動させる蒸気空間１４７が形成されている。前記ウイック１８の２つの直立部１８２は、板状であり、別々に前記水平部１８１の中部から上に向かって前記冷却コンテナ１６の頂部まで伸び出す。前記ウイック１８の２つの直立部１８２は、それぞれ前記２つの冷却コンテナ１６の内壁に接触していなく所定の間隔で離れているため、前記ウイック１８の２つの直立部１８２の周囲と前記２つの冷却コンテナ１６の内壁との間に蒸気通路１４８が形成される。前記蒸気通路１４８は前記蒸気空間１４７と連通する。前記ウイック１８は網状である。   The wick 18 is similar to the outline of the heat conductor 10 and includes a horizontal portion 181 and two upright portions 182 that are orthogonal to the horizontal portion 181 and are integrally formed with the horizontal portion 181. The horizontal portion 181 of the wick 18 has a plate shape and is provided inside the evaporation container 14. The horizontal portion 181 of the wick 18 contacts the lower frame 144 of the evaporation container 14. A steam space 147 for moving steam is formed between the horizontal portion 181 of the wick 18 and the upper frame 142. The two upright portions 182 of the wick 18 are plate-like and extend separately from the middle portion of the horizontal portion 181 to the top of the cooling container 16. Since the two upright portions 182 of the wick 18 are not in contact with the inner walls of the two cooling containers 16 and are separated from each other by a predetermined interval, the two upright portions 182 of the wick 18 and the two cooling portions 182 are separated. A steam passage 148 is formed between the inner wall of the container 16. The steam passage 148 communicates with the steam space 147. The wick 18 has a net shape.

前記放熱装置を組み立てる時、前記熱伝導体１０の２つの冷却コンテナ１６を前記放熱体２０の２つの貫通孔内に穿設させ、且つ前記熱伝導体１０の環縁２２４と溶接によって固定される。   When assembling the heat dissipating device, the two cooling containers 16 of the heat conductor 10 are drilled into the two through holes of the heat dissipator 20 and fixed to the ring edge 224 of the heat conductor 10 by welding. .

前記放熱装置を使う場合、前記熱伝導体１０の蒸発コンテナ１４の底面を電子部品に接触させて、前記電子部品から生じる熱量は前記蒸発コンテナ１４の内部に伝導されて前記蒸発コンテナ１４内の作動流体を蒸発させて蒸気になり、該蒸気が前記蒸発コンテナ１４の蒸気空間１４７から前記冷却コンテナ１６の蒸気通路１４８に沿って流動するとともに熱量を前記冷却コンテナ１６によって前記放熱フィン２２に輸送し、前記放熱フィン２２によって熱量が外界に放熱されるため、前記冷却コンテナ１６の温度が下がり、前記冷却コンテナ１６内の蒸気が液化凝結し、且つ前記冷却コンテナ１６の内部に設けられるウイック１８の直立部１８２による毛細管圧力によって、凝結した液相の作動流体が前記蒸発コンテナ１４の水平部１８１に回流し、このように作動流体が絶えずに蒸発気化/液化凝結するため、前記電子部品からの熱量を絶えずに外部に伝導する。   When the heat dissipation device is used, the bottom surface of the evaporation container 14 of the heat conductor 10 is brought into contact with an electronic component, and the amount of heat generated from the electronic component is conducted into the evaporation container 14 to operate in the evaporation container 14. The fluid is evaporated to become steam, and the steam flows from the steam space 147 of the evaporation container 14 along the steam passage 148 of the cooling container 16 and transports heat to the radiation fins 22 by the cooling container 16; Since the amount of heat is radiated to the outside by the radiation fins 22, the temperature of the cooling container 16 is lowered, the vapor in the cooling container 16 is liquefied and condensed, and the upright portion of the wick 18 provided inside the cooling container 16. The condensed liquid-phase working fluid is caused to flow into the horizontal portion 181 of the evaporation container 14 by the capillary pressure due to the pressure 182. Flow, because this way the working fluid is vaporized / liquefied condense constantly, conducted to the outside constantly the amount of heat from the electronic component.

前記放熱装置において、前記熱伝導体１０を電子部品に直接に接触して、前記電子部品からの熱量が前記熱伝導体１０内部のウイック１８及び作動流体によって伝導されるため、従来の放熱装置のソリッドの基板に比べて、熱抵抗が小さくなり、熱伝導機能が上がる。前記熱伝導体１０の冷却コンテナ１６は扁平状であり、且つ前記円孔２２２の周縁に環縁２２４が形成されるから、前記冷却コンテナ１６と前記放熱フィン２２との間の接触面積が増大し、熱伝導効率を向上して、さらに放熱効率を向上する。前記熱伝導体１０の冷却コンテナ１６は略「ハ」字状を呈すから、前記放熱装置の一側に放熱ファンが配置される場合、前記放熱ファンからの気流を案内することができる。   In the heat dissipating device, the heat conductor 10 is brought into direct contact with the electronic component, and the amount of heat from the electronic component is conducted by the wick 18 and the working fluid inside the heat conductor 10. Compared to a solid substrate, the thermal resistance is reduced and the heat conduction function is improved. Since the cooling container 16 of the heat conductor 10 has a flat shape and an annular edge 224 is formed at the periphery of the circular hole 222, the contact area between the cooling container 16 and the radiation fins 22 increases. , Improve the heat conduction efficiency, further improve the heat dissipation efficiency. Since the cooling container 16 of the heat conductor 10 has a substantially “C” shape, when a heat radiating fan is disposed on one side of the heat radiating device, the air flow from the heat radiating fan can be guided.

本実施例において、前記冷却コンテナ１６の数量は２つであるが、他の実施例において、前記冷却コンテナ１６の数量を適当に変化させることができる。   In the present embodiment, the number of the cooling containers 16 is two. However, in other embodiments, the number of the cooling containers 16 can be appropriately changed.

１０ 熱伝導体
１４ 蒸発コンテナ
１６ 冷却コンテナ
１８ ウイック
２０ 放熱体
２２ 放熱フィン
１４０ 収容孔
１４１ 凸壁
１４２ 上側枠体
１４４ 下側枠体
１４７ 蒸気空間
１４８ 蒸気通路
１８１ 水平部
１８２ 直立部
２２２ 円孔
２２４ 環縁 DESCRIPTION OF SYMBOLS 10 Thermal conductor 14 Evaporation container 16 Cooling container 18 Wick 20 Radiator 22 Radiation fin 140 Housing hole 141 Convex wall 142 Upper frame body 144 Lower frame body 147 Steam space 148 Steam passage 181 Horizontal part 182 Upright part 222 Circular hole 224 Ring edge

Claims (8)

中空構造であり、その内部にはウイックと適量の作動流体が封入される熱伝導体と、放熱体と、を備えてなる放熱装置であって、
前記熱伝導体は、蒸発コンテナと、前記蒸発コンテナから上に向かって伸び出して前記放熱体を貫き且つ前記蒸発コンテナと互いに連通する冷却コンテナと、を備え、
前記ウイックは、前記蒸発コンテナの内部に設けられる水平部と、前記水平部から上に向かって前記冷却コンテナ内に伸び出す直立部と、を備え、前記直立部の周囲と前記冷却コンテナの内壁との間には、蒸気を移動させる蒸気通路が形成されることを特徴とする放熱装置。 A heat dissipation device comprising a hollow structure, a heat conductor in which a wick and an appropriate amount of working fluid are enclosed, and a heat dissipator,
The heat conductor includes an evaporating container, and a cooling container extending upward from the evaporating container, penetrating the heat radiating body and communicating with the evaporating container.
The wick includes a horizontal portion provided inside the evaporation container, and an upright portion extending upward from the horizontal portion into the cooling container, the periphery of the upright portion and the inner wall of the cooling container, A heat dissipation device is characterized in that a steam passage for moving the steam is formed between them. 前記ウイックの水平部と前記蒸発コンテナの内壁との間には、前記蒸気通路と連通する蒸気空間が形成されることを特徴とする請求項１に記載の放熱装置。   The heat radiating device according to claim 1, wherein a steam space communicating with the steam passage is formed between a horizontal portion of the wick and an inner wall of the evaporation container. 前記冷却コンテナは、２つであり、略「ハ」字状を呈すことを特徴とする請求項２に記載の放熱装置。   The heat dissipation device according to claim 2, wherein the number of the cooling containers is two and has a substantially “C” shape. 前記ウイックの直立部は、前記水平部に直交することを特徴とする請求項１に記載の放熱装置。   The heat dissipation device according to claim 1, wherein the upright portion of the wick is orthogonal to the horizontal portion. 前記ウイックの直立部は、前記水平部と一体に成型されることを特徴とする請求項１に記載の放熱装置。   The heat dissipation device according to claim 1, wherein the upright portion of the wick is formed integrally with the horizontal portion. 前記蒸発コンテナは、対向設置される下側枠体及び上側枠体を備え、前記上側枠体と前記下側枠体との間に収容空間が形成され、前記上側枠体には、２つの収容孔が形成され、且つ前記２つの収容孔の周縁から上に向かって２つの環状の凸壁が突出され、前記２つの冷却コンテナは、頂端が密封され且つ底端が開放された細長い中空扁平状であり、前記２つの凸壁１内に収容され、且つ前記凸壁の内壁に溶接などにより密着されることを特徴とする請求項１に記載の放熱装置。   The evaporation container includes a lower frame and an upper frame that are installed opposite to each other, and an accommodation space is formed between the upper frame and the lower frame, and the upper frame has two accommodations. A hole is formed, and two annular convex walls protrude upward from the peripheral edges of the two receiving holes, and the two cooling containers have an elongated hollow flat shape with the top end sealed and the bottom end open. The heat dissipation device according to claim 1, wherein the heat dissipation device is housed in the two convex walls 1 and is in close contact with the inner wall of the convex wall by welding or the like. 前記放熱体は、互いに平行且つ等間隔に配置される複数の放熱フィンが順次に重ねて構成することを特徴とする請求項１〜請求項６のいずれか一項に記載の放熱装置。   The heat radiating device according to any one of claims 1 to 6, wherein the heat radiating member includes a plurality of heat radiating fins arranged in parallel with each other at equal intervals in order. 前記放熱体には、前記冷却コンテナを穿設させる円孔が設けられ、前記円孔の周縁から上に向かって環縁が突出することを特徴とする請求項７に記載の放熱装置。   The heat radiating device according to claim 7, wherein the heat radiating body is provided with a circular hole for drilling the cooling container, and an annular edge protrudes upward from a peripheral edge of the circular hole.
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Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103217036A (en) * 2012-01-18 2013-07-24 张跃 Heat fin
CN103900411B (en) * 2014-03-26 2017-02-08 江苏项瑛农机有限公司 Efficient heat pipe
CN203934263U (en) * 2014-07-04 2014-11-05 讯凯国际股份有限公司 There is the heat abstractor of capillary member
TWI535990B (en) * 2014-07-22 2016-06-01 A larger heat pipe at one end and a manufacturing method thereof
CN106714509B (en) * 2015-11-17 2019-06-07 奇鋐科技股份有限公司 Radiator
US10119766B2 (en) * 2015-12-01 2018-11-06 Asia Vital Components Co., Ltd. Heat dissipation device
CN105371214A (en) * 2015-12-16 2016-03-02 广州共铸科技股份有限公司 LED automobile head lamp
CN107044790A (en) * 2016-02-05 2017-08-15 讯凯国际股份有限公司 Solid heat transferring device
CN107771003A (en) * 2016-08-17 2018-03-06 奇鋐科技股份有限公司 Radiating subassembly
CN108151565B (en) * 2016-12-02 2019-12-03 讯凯国际股份有限公司 Three-dimensional temperature equalization system
CN109780903A (en) * 2017-11-10 2019-05-21 双鸿电子科技工业(昆山)有限公司 Radiator
US11039549B2 (en) * 2018-01-26 2021-06-15 Htc Corporation Heat transferring module
US20190343021A1 (en) * 2018-05-07 2019-11-07 Asia Vital Components Co., Ltd. Heat dissipation unit connection reinforcement structure
CN108633160A (en) * 2018-07-28 2018-10-09 中国原子能科学研究院 A kind of proton precessional magnetometer beam cooling device
CN112304138B (en) * 2019-08-02 2022-07-26 营邦企业股份有限公司 Loop type thermosiphon heat sink
CN113053841B (en) * 2021-03-12 2022-11-25 深圳市飞荣达科技股份有限公司 Three-dimensional VC temperature-equalizing device
CN214426509U (en) * 2021-03-18 2021-10-19 广东英维克技术有限公司 Heat sink device
CN113340139A (en) * 2021-07-07 2021-09-03 佛山宇仁智能科技有限公司 Hot shell component
CN116263309A (en) * 2021-12-15 2023-06-16 亚浩电子五金塑胶（惠州）有限公司 Three-dimensional heat transfer device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50113862A (en) * 1974-02-18 1975-09-06
JPH08264694A (en) * 1995-03-20 1996-10-11 Calsonic Corp Cooling device for electronic parts
JP2007317876A (en) * 2006-05-25 2007-12-06 Fujitsu Ltd Heat sink

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5629840A (en) * 1992-05-15 1997-05-13 Digital Equipment Corporation High powered die with bus bars
US5412535A (en) * 1993-08-24 1995-05-02 Convex Computer Corporation Apparatus and method for cooling electronic devices
JP3020790B2 (en) * 1993-12-28 2000-03-15 株式会社日立製作所 Heat pipe type cooling device and vehicle control device using the same
JP3216770B2 (en) * 1995-03-20 2001-10-09 カルソニックカンセイ株式会社 Cooling device for electronic components
US6418017B1 (en) * 2000-03-30 2002-07-09 Hewlett-Packard Company Heat dissipating chassis member
US20050173098A1 (en) * 2003-06-10 2005-08-11 Connors Matthew J. Three dimensional vapor chamber
US6793009B1 (en) * 2003-06-10 2004-09-21 Thermal Corp. CTE-matched heat pipe
US6938680B2 (en) * 2003-07-14 2005-09-06 Thermal Corp. Tower heat sink with sintered grooved wick
US7269013B2 (en) * 2006-01-09 2007-09-11 Fu Zhun Prexision Industry (Shan Zhen) Co., Ltd. Heat dissipation device having phase-changeable medium therein
US20080017350A1 (en) * 2006-07-21 2008-01-24 Foxconn Technology Co., Ltd. Heat sink
CN101232794B (en) * 2007-01-24 2011-11-30 富准精密工业(深圳)有限公司 Soaking plate and heat radiating device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50113862A (en) * 1974-02-18 1975-09-06
JPH08264694A (en) * 1995-03-20 1996-10-11 Calsonic Corp Cooling device for electronic parts
JP2007317876A (en) * 2006-05-25 2007-12-06 Fujitsu Ltd Heat sink

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