CN109780903A - Radiator - Google Patents
Radiator Download PDFInfo
- Publication number
- CN109780903A CN109780903A CN201711106851.4A CN201711106851A CN109780903A CN 109780903 A CN109780903 A CN 109780903A CN 201711106851 A CN201711106851 A CN 201711106851A CN 109780903 A CN109780903 A CN 109780903A
- Authority
- CN
- China
- Prior art keywords
- capillary structure
- radiator
- heat pipe
- temperature
- uniforming plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000002347 injection Methods 0.000 claims description 11
- 239000007924 injection Substances 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 8
- 239000000835 fiber Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 6
- 238000010276 construction Methods 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 210000001736 capillary Anatomy 0.000 description 86
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000012530 fluid Substances 0.000 description 4
- 238000003325 tomography Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Abstract
The present invention provides a kind of radiator, including heat pipe and temperature-uniforming plate.Heat pipe has a closed end and an open end and one first capillary structure.First capillary structure extends outwardly from open end.Temperature-uniforming plate has a upper housing and a lower case, and a room is collectively formed in upper housing and lower case, and the inner bottom surface of lower case has one second capillary structure.First capillary structure protrudes into room and is stacked and placed on the second capillary structure.The capillary structure of the capillary structure of heat pipe and temperature-uniforming plate can be consolidated and is combined together by the present invention, it is ensured that the smooth transmitting or mobile of working media therebetween.
Description
Technical field
The present invention is about a kind of radiator, especially with regard to the radiator of a kind of combination heat pipe and temperature-uniforming plate.
Background technique
The radiator of combined type is common to be combined together by different types of heat dissipation element such as heat pipe and temperature-uniforming plate,
Expectation can have both the advantages of the two and play better heat dissipation, for example, TaiWan, China patent TWM534370 is just disclosed
A kind of heat pipe and temperature-uniforming plate combined design.But, have not due to heat pipe with the capillary structure inside temperature-uniforming plate
With characteristic, if therefore as patent TWM534370 design, only merely the capillary structure of the two is linked together
Words, it is easy to it will can not be successfully there is a situation where working media and flow or transmit even generation tomography between the two, therefore,
Heat pipe links design with the capillary structure of temperature-uniforming plate in existing radiator, and there are still the spaces that is greatly improved.
Summary of the invention
The technical problem to be solved in the present invention is that for above-mentioned heat pipe of the existing technology combined with temperature-uniforming plate when not
The capillary structure of the two can firmly be connected and be easy to happen the deficiency that working media can not smoothly transmit between capillary structure,
A kind of capillary structure by heat pipe is provided and consolidates combined radiator with the capillary structure of temperature-uniforming plate, it is ensured that work is situated between
The smooth transmitting or mobile of matter therebetween.
The technical problem to be solved in the present invention is that In view of the above shortcomings of the prior art, providing one kind can keep away
Exempt to vacuumize the radiator that recess or deformation occur with heat pipe in injection process.
The technical solution adopted by the present invention to solve the technical problems is to provide a kind of radiator, which includes
Heat pipe and temperature-uniforming plate.Heat pipe has a closed end and an open end, and heat pipe further includes one first capillary structure, the first capillary knot
Structure extends outwardly from open end.Temperature-uniforming plate has a upper housing and a lower case, and a room is collectively formed in upper housing and lower case,
The inner bottom surface of lower case has one second capillary structure.First capillary structure protrudes into room and is stacked and placed on the second capillary structure.
In an embodiment of the present invention, lower case has an opening, and the open end of heat pipe is inserted into the opening.
In an embodiment of the present invention, an opening is collectively formed in upper housing and lower case, and the open end of heat pipe is inserted into this and is opened
In mouthful.
In an embodiment of the present invention, temperature-uniforming plate further includes a third capillary structure, which is formed in
The confluce of one capillary structure and the second capillary structure.
In an embodiment of the present invention, third capillary structure is stacked and placed on the first capillary structure and the second capillary structure.
In an embodiment of the present invention, the first capillary structure is located between the second capillary structure and third capillary structure.
In an embodiment of the present invention, third capillary structure is sintered by metal powder, mesh grid or fibre bundle.
In an embodiment of the present invention, heat pipe has an inner top surface and an inner bottom surface, the first capillary structure and inner top surface and
Inner bottom surface contacts and is a support construction.
In an embodiment of the present invention, the thickness of the first capillary structure, equal to the distance of inner top surface to inner bottom surface.
In an embodiment of the present invention, the area of section of the first capillary structure, account for the 30% of heating pipe interior profile area to
70%.
In an embodiment of the present invention, the first capillary structure is metal net.
In an embodiment of the present invention, the first capillary structure is fibre bundle.
In an embodiment of the present invention, the first capillary structure is powder sintered.
In an embodiment of the present invention, temperature-uniforming plate further includes a liquid injection port.
In an embodiment of the present invention, the closed end of heat pipe is in the unclosed preceding liquid injection port for radiator.
In an embodiment of the present invention, which further includes a working media, the working media be filled in heat pipe with
In temperature-uniforming plate.
In an embodiment of the present invention, temperature-uniforming plate has a widened opening with heat pipe junction.
First capillary structure of heat pipe and the second capillary structure of temperature-uniforming plate are mutually stacked connection by the present invention, it can be ensured that are filled out
Fill in heat pipe with the working media in temperature-uniforming plate be able to successfully between the first capillary structure and the second capillary structure transmitting or
It is mobile, it there is a situation where tomography or will not interrupt.The present invention also further passes through the setting and its formation of third capillary structure
Mode enables the first capillary structure more be fixedly combined together with the second capillary structure and will not separate.In addition, the present invention can
First capillary structure is configured as to the support construction of heat pipe, generates change during vacuumizing and fluid injection to avoid heat pipe
Shape or extruding, the case where even rupturing.
Detailed description of the invention
Figure 1A to Fig. 1 D is the three-dimensional knot of the assembling process of radiator provided by first embodiment according to the present invention
Structure schematic diagram.
Fig. 2A to Fig. 2 D is the section knot of the assembling process of radiator provided by first embodiment according to the present invention
Structure schematic diagram.
Fig. 3 A be radiator provided by the present invention temperature-uniforming plate on be formed with the stereoscopic schematic diagram of liquid injection port.
Fig. 3 B and Fig. 3 C is the structural schematic diagram of the inside heat pipe of radiator provided by the present invention.
Fig. 4 is the structural schematic diagram of the another embodiment of the temperature-uniforming plate of radiator provided by the present invention.
Specific embodiment
It is that the first embodiment of the present invention provides heat dissipation dress referring to Figure 1A to Fig. 1 D and Fig. 2A to Fig. 2 D
Set the schematic perspective view and the schematic diagram of the section structure of assembling process.Radiator 1 includes a heat pipe 2 and a temperature-uniforming plate
3.Heat pipe 2 has a closed end 21 and an open end 22, and the first capillary structure 23 is additionally provided with inside heat pipe 2.From figure
The stereoscopic schematic diagram that heat pipe 2 shown in 1A is not yet assembled with temperature-uniforming plate 3 is it is observed that the first capillary structure 23 is opening from heat pipe
Mouth end 22 extends outwardly, and protrudes from except heat pipe 2.And temperature-uniforming plate 3 then has a upper housing 31 and a lower case 32, the two is total
With forming a room 33, and temperature-uniforming plate 3 32 is formed with an opening 321 in lower case.And by three-dimensional signal shown in figure 1A
Figure is it is observed that the present embodiment on the inner bottom surface 322 of 3 lower case 32 of temperature-uniforming plate, can be pre-formed with one second capillary knot
Structure 34, the second capillary structure can be sintered by powder, mesh grid or fibre bundle.
Figure 1B and Fig. 2 B is please referred to, when heat pipe 2 will be assembled with temperature-uniforming plate 3, the open end 22 of heat pipe 2 can be from temperature-uniforming plate
3 insertion of opening 321 (or being placed in opening 321), allows the first capillary structure 23 to be able to protrude into room 33 and be stacked
In on the second capillary structure 34.In the present invention, the first capillary structure 23 of heat pipe 2 be inserted into temperature-uniforming plate 3 opening and
The non-inside for going deep into temperature-uniforming plate 3 avoids the normal operation for influencing temperature-uniforming plate 3.The diagrammatic cross-section as shown in Fig. 2 B can be seen
It observes, radiator 1 provided by the present embodiment, the first capillary structure 23 of heat pipe 2 is second mao that is stacked in temperature-uniforming plate 3
On fine texture 34, that is to say, that the first capillary structure 23 overlaps in the horizontal direction with the second capillary structure 34
, so design can more ensure to be filled in heat pipe 2 in the future with the working media (not shown) in temperature-uniforming plate 3, be able to suitable
Sharp ground transmits between the first capillary structure 23 and the second capillary structure 34 or movement, and the feelings of tomography or interruption will not occur
Condition.
Fig. 1 C and Fig. 2 C is please referred to, when the first capillary structure 23 of heat pipe 2 and the second capillary structure 34 of temperature-uniforming plate 3 are taken
After being connected together, the present embodiment can in temperature-uniforming plate 3 first capillary structure 23 and the second capillary structure 34 confluce, re-form
One third capillary structure 35.This third capillary structure 35 can be stacked and placed on the first capillary structure 23 with the as shown in Fig. 1 C and Fig. 2 C
On two capillary structures 34, that is, in the horizontal direction, third capillary structure 35 can be with the first capillary structure 23 or with second
Capillary structure 34 has the overlapping of part, and so design can allow both the first capillary structure 23 and the second capillary structure 34 more steady
Admittedly be combined together.And from diagrammatic cross-section shown in fig. 2 C, also observe that the first capillary structure for protruding from heat pipe 2
23, the second capillary structure 34 is folded in the design between third capillary structure 35.In the present embodiment, third capillary structure 35
Generation type, may be selected the confluce of the first capillary structure 23 and the second capillary structure 34 be laid with powder, mesh grid or
Fibre bundle, and formed via sintering procedure, it can so allow the first capillary structure 23 and the second capillary structure 34 more steady
Admittedly be combined together and will not separate.
Fig. 1 D and Fig. 2 D are please referred to, when third capillary structure 35 is provided with and makes the first capillary structure 23 with the second capillary
After structure 34 links together, can be allowed again by hard solder or common metal sealed edges processing procedure temperature-uniforming plate 3 upper housing 31 with
Lower case 32 is combined together, and also by the opening 321 of lower case 32 and the gap between heat pipe 2 by pressing, engage glue or
The modes such as filling solder are closed.
After the heat pipe 2 and temperature-uniforming plate 3 of radiator 1 are completed to connect, will do it is subsequent vacuumize and fluid injection program,
Working media (not shown) is injected in radiator provided by the present embodiment.The present invention can be as shown in Figure 3A, by a note
Liquid mouth 36 is arranged on temperature-uniforming plate 3, or the closed end 21 that heat pipe 2 can also be allowed original is first as liquid injection port, and way is to allow heat
The both ends of pipe 2 are open end, and using the open end far from temperature-uniforming plate 3 as liquid injection port, until giving again after the completion of fluid injection
Close and become the closed end 21 of heat pipe 2.
In order to avoid heat pipe 2 is deformed or squeezes during vacuumizing and fluid injection, the feelings even ruptured
Condition, the present invention are especially designed when the first capillary structure 23 is arranged in heat pipe 2 in advance, and target is to allow the first capillary structure 23
It can be used as the support construction of heat pipe 2.In order to reach this purpose, in the material of the first capillary structure 23, the present invention be can be selected
Metal net, fibre bundle or the capillarys type such as powder sintered, are especially formed by capillary structure by powder sintered,
More difficult deformation in shape, is suitable as outwardly extending capillary structure.In the setting rule of capillary structure, with Fig. 3 B or
From the point of view of sectional view shown in Fig. 3 C, the present invention can allow the area of section 231 of the first capillary structure 23, account for 2 pipe interior profile face of heat pipe
The 30% to 70% of product 24, in this way, which the first capillary structure 23 can be resisted against when heat pipe 2 generates deformation or is extruded
The inner top surface 25 and inner bottom surface 26 of heat pipe 2, or contacted with the inner top surface 25 of heat pipe 2 and inner bottom surface 26.In addition, the present invention is mentioned
In the radiator 1 of confession, if if the shape of heat pipe 2 is a flat tube as shown in Figure 3B, in the setting of the first capillary structure 23,
In addition to can arrange to allow the area of section 231 of the first capillary structure 23, account for outside the 30% to 70% of 2 pipe interior profile area 24 of heat pipe,
It can also arrange the distance for allowing the thickness 232 of the first capillary structure 23 to be equal to 2 inner top surface 25 of heat pipe to inner bottom surface 26.And if heat pipe
Shape be as shown in Figure 3 C a more irregular shape for example with the structures such as impression or indent when, distinguished due to more difficult
Inner top surface and inner bottom surface, the at this time setting of the first capillary structure are then still to continue to use to allow the area of section of the first capillary structure 23
231, account for 30% to 70% way of 2 pipe interior profile area 24 of heat pipe.
In addition, radiator 1 provided by the present invention can in order to reduce the whole volume of radiator 1 or thickness
As shown in figure 4, being formed with segment difference structure on temperature-uniforming plate 3, that is, allow temperature-uniforming plate 3 that just there is expansion with 2 junction of heat pipe
Opening 37, it is other do not connect with heat pipe 2 place then maintain relatively thin shape, can so allow radiator 1 volume not
Cause influences the planning using target (such as electronic device) inner space.
In the above-described embodiments, the temperature-uniforming plate 3 of radiator 1 is that with the upper housing 31 of plate and have dented space
Lower case 32 is used as example, but is not limited thereto, the upper housing 31 and lower case 32 of temperature-uniforming plate 3, can also be symmetrical structure,
Both with the inner space of indent, at this point, original opening 321 for being used to connect with heat pipe 2, can also be formed in upper casing
On body 31.In addition, upper housing 31 and lower case 32 can also be each formed with the opening of part in other embodiments, it is thus possible to
Common sandwiched lives heat pipe 2.
Claims (17)
1. a kind of radiator characterized by comprising
Heat pipe, the heat pipe have a closed end and an open end, which further includes one first capillary structure, and wherein this first mao
Fine texture extends outwardly from the open end；And
Temperature-uniforming plate has a upper housing and a lower case, and a room is collectively formed in the upper housing and the lower case, the lower case
Inner bottom surface has one second capillary structure；
Wherein, the first capillary structure protrudes into the room and is stacked and placed on second capillary structure.
2. radiator as described in claim 1, which is characterized in that the lower case has an opening, the opening of the heat pipe
End is inserted into the opening.
3. radiator as described in claim 1, which is characterized in that an opening is collectively formed in the upper housing and the lower case,
The open end of the heat pipe is inserted into the opening.
4. radiator as described in claim 1, which is characterized in that the temperature-uniforming plate further includes a third capillary structure, this
Three capillary structures are formed in the confluce of first capillary structure and second capillary structure.
5. radiator as claimed in claim 4, which is characterized in that the third capillary structure is stacked and placed on first capillary structure
On second capillary structure.
6. radiator as claimed in claim 4, which is characterized in that first capillary structure is located in second capillary structure
Between the third capillary structure.
7. radiator as claimed in claim 4, which is characterized in that the third capillary structure is by metal powder, mesh grid
Or fibre bundle is sintered.
8. radiator as described in claim 1, which is characterized in that the heat pipe has an inner top surface and an inner bottom surface, this
One capillary structure contacts with the inner top surface and the inner bottom surface and is a support construction.
9. radiator as claimed in claim 8, which is characterized in that the thickness of first capillary structure is equal to the inner top surface
To the distance of the inner bottom surface.
10. radiator as described in claim 1, which is characterized in that the area of section of first capillary structure accounts for the heat pipe
The 30% to 70% of pipe interior profile area.
11. radiator as described in claim 1, which is characterized in that first capillary structure is metal net.
12. radiator as described in claim 1, which is characterized in that first capillary structure is fibre bundle.
13. radiator as described in claim 1, which is characterized in that first capillary structure is powder sintered.
14. radiator as described in claim 1, which is characterized in that the temperature-uniforming plate further includes a liquid injection port.
15. radiator as described in claim 1, which is characterized in that the closed end of the heat pipe is unclosed preceding for the heat dissipation
The liquid injection port of device.
16. radiator as described in claim 1, which is characterized in that the radiator further includes working media, which is situated between
Matter is filled in the heat pipe and the temperature-uniforming plate.
17. radiator as described in claim 1, which is characterized in that the temperature-uniforming plate has one to expand with the heat pipe junction
Big opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711106851.4A CN109780903A (en) | 2017-11-10 | 2017-11-10 | Radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711106851.4A CN109780903A (en) | 2017-11-10 | 2017-11-10 | Radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109780903A true CN109780903A (en) | 2019-05-21 |
Family
ID=66484535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711106851.4A Withdrawn CN109780903A (en) | 2017-11-10 | 2017-11-10 | Radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109780903A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115468444A (en) * | 2022-03-25 | 2022-12-13 | 广州华钻电子科技有限公司 | Phase change heat conduction structure and manufacturing method thereof |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101866887A (en) * | 2009-04-16 | 2010-10-20 | 富瑞精密组件（昆山）有限公司 | Heat radiator |
| CN102449423A (en) * | 2009-07-21 | 2012-05-09 | 古河电气工业株式会社 | Flattened heat pipe, and method for manufacturing the heat pipe |
| WO2014013035A1 (en) * | 2012-07-18 | 2014-01-23 | Astrium Sas | Temperature control device |
| CN105716460A (en) * | 2015-12-29 | 2016-06-29 | 华南理工大学 | Fiber bundle capillary core flat heat pipe and preparation method thereof |
| TWM532047U (en) * | 2016-07-21 | 2016-11-11 | Taiwan Microloops Corp | Assembly structure of vapor chamber and heat-pipe |
| TWM545890U (en) * | 2017-04-14 | 2017-07-21 | Taiwan Microloops Corp | Heat conduction structure |
| CN107123628A (en) * | 2016-02-24 | 2017-09-01 | 讯凯国际股份有限公司 | Communicate-type heat transfer unit (HTU) |
| TW201730498A (en) * | 2016-02-25 | 2017-09-01 | 訊凱國際股份有限公司 | Communication-type thermal conduction device |
| CN107278089A (en) * | 2016-04-07 | 2017-10-20 | 讯凯国际股份有限公司 | Heat conductive structure |
-
2017
- 2017-11-10 CN CN201711106851.4A patent/CN109780903A/en not_active Withdrawn
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101866887A (en) * | 2009-04-16 | 2010-10-20 | 富瑞精密组件（昆山）有限公司 | Heat radiator |
| CN102449423A (en) * | 2009-07-21 | 2012-05-09 | 古河电气工业株式会社 | Flattened heat pipe, and method for manufacturing the heat pipe |
| WO2014013035A1 (en) * | 2012-07-18 | 2014-01-23 | Astrium Sas | Temperature control device |
| CN105716460A (en) * | 2015-12-29 | 2016-06-29 | 华南理工大学 | Fiber bundle capillary core flat heat pipe and preparation method thereof |
| CN107123628A (en) * | 2016-02-24 | 2017-09-01 | 讯凯国际股份有限公司 | Communicate-type heat transfer unit (HTU) |
| TW201730498A (en) * | 2016-02-25 | 2017-09-01 | 訊凱國際股份有限公司 | Communication-type thermal conduction device |
| CN107278089A (en) * | 2016-04-07 | 2017-10-20 | 讯凯国际股份有限公司 | Heat conductive structure |
| TWM532047U (en) * | 2016-07-21 | 2016-11-11 | Taiwan Microloops Corp | Assembly structure of vapor chamber and heat-pipe |
| TWM545890U (en) * | 2017-04-14 | 2017-07-21 | Taiwan Microloops Corp | Heat conduction structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115468444A (en) * | 2022-03-25 | 2022-12-13 | 广州华钻电子科技有限公司 | Phase change heat conduction structure and manufacturing method thereof |
| CN115468444B (en) * | 2022-03-25 | 2024-03-26 | 广州华钻电子科技有限公司 | Phase-change heat conduction structure and manufacturing method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190521 |