TW201730498A - Communication-type thermal conduction device - Google Patents

Abstract

A communication-type thermal conduction device includes a vapor chamber, at least one heat pipe, and at least one third capillary structure. The vapor chamber has a bottom board, and a first capillary structure is disposed on an inner surface of the bottom board. A second capillary structure is disposed in the heat pipe. One end portion of the heat pipe is connected to the bottom board, and the end portion has an open portion in communication with the heat pipe and the vapor chamber. The second capillary structure has a connected portion exposed by means of the open portion. The third capillary structure is connected to the first capillary structure and the connected portion, so that the first and second capillary structures are in communication with each other. Accordingly, holistic thermal conduction can be achieved, and the vapor chamber incorporating the heat pipe can fully provide the desired heat dissipation effect.

Description

Connected heat transfer device

The present invention relates to a heat transfer device, and more particularly to a communication type heat transfer device capable of connecting and communicating the capillary structures of the temperature equalizing plate and the heat pipe.

With regard to heat transfer, in order to dissipate the heat generated by the heating element, the existing heat transfer device uses a heat conducting plate with a heat pipe to transfer heat, and uses a heat sink (for example, a fin and a fan) for heat dissipation, which is roughly as follows:

The heat conducting plate is in contact with the heat generating component, and the heat pipe is connected between the heat conducting plate and the heat sink to transfer the heat generated by the heat generating component to the heat conducting plate, and then the heat is transferred to the heat sink through the heat pipe to dissipate heat.

However, the heat conducting plate and the heat pipe in the existing heat transfer device are operated independently, and the capillary structure of the heat conducting plate is not connected with the capillary structure of the heat pipe, so that the heat conducting plate or the heat pipe is only the heat conducting plate and the heat pipe. Heat transfer, not integral heat transfer, in other words, the heat dissipation effect has not yet been fully realized.

Therefore, how to design a invention which can improve the above-mentioned defects is a major problem that the inventors of the present invention are trying to solve.

The object of the present invention is to provide a connected heat transfer device which can communicate the capillary structure of the heat pipe and the capillary structure of the temperature equalizing plate to achieve the overall heat transfer purpose, and fully utilize the heat dissipation of the temperature equalizing plate and the heat pipe. effect.

In order to achieve the above object, the present invention provides a communication type heat transfer device comprising: a temperature equalizing plate having a bottom plate having a first capillary structure on an inner surface thereof; and a heat pipe having a second capillary structure therein One end of the heat pipe is connected to the bottom plate, the end portion has an opening portion connected between the heat pipe and the temperature equalizing plate, and the second capillary structure has a bridged portion exposed by the opening portion And a third capillary structure that is connected to the first capillary structure and the bridged portion to allow the first capillary structure and the two capillary structures to communicate with each other.

Compared with the prior art, the present invention has the following effects: the second capillary structure of the heat pipe can be connected and communicated with the first capillary structure of the temperature equalizing plate, thereby achieving the purpose of integral heat transfer, and fully exerting the temperature equalizing plate plus the heat pipe Should have the cooling effect.

The detailed description and technical content of the present invention are set forth below with reference to the accompanying drawings.

The present invention provides a connected heat transfer device, which is a first embodiment of the present invention as shown in FIGS. 1 to 7, and is a second embodiment of the present invention as shown in FIGS. 8 to 10.

As shown in FIG. 1 to FIG. 7, the first embodiment of the communication type heat transfer device of the present invention comprises: a temperature equalizing plate 1 and at least one heat pipe 2, and of course, including flowing in the temperature equalizing plate 1 and the heat pipe 2; A working fluid (not shown).

The temperature equalizing plate 1 has a bottom plate 11 and a cover plate 12 opposed to each other, and a combination of the bottom plate 11 and the cover plate 12 forms a chamber 10 (see Fig. 6). The temperature equalizing plate 1 may be an integrally formed structure or a combined forming structure. In the present embodiment, the combined forming structure is taken as an example, that is, the cover plate 12 may be combined with the bottom plate 11 to form a fitting. The temperature equalization plate 1 of the chamber 10.

The inner surface of the bottom plate 11 is provided with a first capillary structure 13, and the inner surface of the cover plate 12 is provided with a fourth capillary structure 14 (see Fig. 6). The first and fourth capillary structures 13, 14 are opposed to each other. The first and fourth capillary structures 13 and 14 may be a powder sintered body, a ceramic sintered body, a metal mesh, a fiber bundle assembly or a metal groove, etc., and the invention is not limited thereto. Here, the fiber bundle component refers to a structure in which a plurality of fiber bundles are adjacent to each other. However, in some embodiments, the inner surface of the cover plate 12 is not provided with the fourth capillary structure 14, that is, only the inner surface of the bottom plate 11 is provided with a capillary structure (i.e., the first capillary structure 13).

The heat pipe 2 is a hollow tube, and a second capillary structure 21 is disposed therein. One end portion 20 of the heat pipe 2 is bridged on the bottom plate 11, and the end portion 20 has an open portion 22, and the open portion 22 communicates with the hollow portion of the heat pipe 2. The inside of the chamber and the chamber 10 of the temperature equalizing plate 1 are supplied with steam, and the second capillary structure 21 has a bridged portion 211 exposed by the opening portion 22.

The third capillary structure 3 (see Fig. 3) is then bridged between the first capillary structure 13 and the bridged portion 211 of the second capillary structure 21 to allow the first and second capillary structures 13, 21 to communicate with each other. In this way, the first capillary structure 13 disposed in the temperature equalizing plate 1 and the second capillary structure 21 disposed in the heat pipe 2 can be brought into contact with each other, thereby achieving the purpose of integral heat transfer, and fully utilizing the proper function. Cooling effect.

In this embodiment, the bottom of the bottom plate 11 is surrounded by a coaming plate 15, the heat pipe 2 can be inserted into the end portion 20 and communicate with the coaming plate 15 (not shown), so that the heat pipe 2 is arranged side by side on the temperature equalizing plate 1; Alternatively, a notch 151 may be formed in the louver 15, and the end portion 20 of the heat pipe 2 is bridged on the inner bottom surface of the bottom plate 11 via the notch 151 (see FIG. 2), so that the heat pipe 2 is arranged side by side with the temperature equalizing plate 1. In detail, the side-by-side arrangement is described by taking the heat pipe 2 substantially parallel to the temperature equalizing plate 1 as an example. Thus, the bridged portion 211 of the second capillary structure 21 is also juxtaposed with the first capillary structure 13 to have It is more advantageous for the effect of bridging; and after bridging the third capillary structure 3, the first, second and third capillary structures 13, 21, 3 are arranged side by side for each other, so as to be suitable for the thinned uniform temperature plate 1 and in a flat shape. Tube shaped heat pipe 2.

Furthermore, the open portion 22 of the heat pipe 2 may include an opening 221, and the opening 221 is opened at one end of the heat pipe 2 (ie, one end of the two pipe ends of the heat pipe 2), and the bridge portion 211 is opened through the opening 221 and exposed. In detail, the so-called exposure is described by taking the bridging portion 211 not protruding from the opening 221 as an example. The opening 221 of the heat pipe 2 is in communication with the chamber 10 of the temperature equalizing plate 1, and in addition to the flow of steam, it also facilitates the bridging of the third capillary structure 3.

The third capillary structure 3 can be formed by powder sintering or ceramic sintering and bridged between the first capillary structure 13 and the bridged portion 211 (see FIGS. 3-6); or, the third capillary structure 3 may also be a metal mesh structure or a fiber bundle assembly (not shown), and the invention is not limited.

Further, as shown in FIGS. 4, 5, and 7, the cover 12 is sealed to an open end of the enclosure 15 to close the temperature equalization panel 1 to create the chamber 10. A gap G is formed between the two sides of the end portion 20 and the corresponding plate 15 at the position of the corresponding notch 151. The cover plate 12 is respectively provided with a filling body 1211 corresponding to the position of each gap G, so that the filling bodies 1211 are stuffed with Within each gap G. In the present embodiment, each of the plug bodies 1211 is formed by recessing at two places of the cover body 12. Specifically, the cover plate 12 has an inner side surface 121 and an outer side surface 122 corresponding to each other. The outer side surface 122 of the 12 is recessed with a recessed portion 1221 corresponding to each of the gaps G, and oppositely, the inner side surface 121 of the cover 12 integrally extends with two plug bodies 1211, and each plug body 1211 is respectively filled in each gap G. In order to make the heat pipe 2 more suitable for the notch 151 of the temperature equalizing plate 1, the effect of being easier to weld is obtained. Of course, the packing body 1211 may also be a gap filler which is additionally filled in the recessed portion 1221. In other words, the present invention does not limit the filling body 1211 to be a structure formed by the concave portion, and it may be a separate gap. Filler.

7 to 10 show a second embodiment of the communication type heat transfer device of the present invention. The second embodiment is substantially the same as the first embodiment, and the difference is only the end of the heat pipe 2 of the second embodiment. 20a is different from the end portion 20 of the first embodiment, and the first embodiment is different from the temperature equalizing plate 1 of the second embodiment, and the details are as follows.

In the end portion 20a of the second embodiment, the opening portion 22 further includes a breach 222. The breach 222 is formed at the periphery of the end portion 20a (ie, the body of the heat pipe 2), and the breach 222 is adjacent to the aforementioned opening 221 and communicates with each other to make it more convenient and more advantageous for the bridging of the third capillary structure 3. In this way, the end portion 20a can form the lower jaw portion 23 by the opening portion 22, and the bridge portion 211 is located on the inner surface of the lower jaw portion 23, and the bridged portion 211 at this time passes through the opening portion 22 (including The opening 221 and the opening 222) are exposed.

A recessed space 111 is formed around the bottom plate 11a around the shroud 15 , and the bottom plate 11 a further integrally extends outwardly together with the shroud 15 to have a communicating neck 17 , so that the connecting neck 17 communicates between the recessed space 111 and the outside. The heat pipe 2 and the lower jaw portion 23 of the end portion 20a thereof are connected together on the inner bottom surface 171 of the communication neck 17 to have a better heat pipe 2 connection effect.

In addition, as shown in FIG. 1 to FIG. 3, a first support structure 16 is disposed in the temperature equalizing plate 1. In the first and second embodiments, a plurality of support columns 161 are taken as an example for the support. The column 161 is supported between the bottom plate 11 (11a) and the cover plate 12 (12a) so as not to be deformed when the temperature equalizing plate 1 is evacuated.

Furthermore, a second support structure (not shown) may be disposed in the heat pipe 2 to enable the second support structure to be supported in the heat pipe 2 in the shape of a flat tube, thereby preventing the heat pipe 2 from being crushed. There will be a situation of inadvertent crushing. Moreover, the third capillary structure 3 and the first capillary structure 13 (or the third capillary structure 3 and the second capillary structure 21) are an integrated capillary structure, for example, the third and first capillary structures 3 The two (or both the third and second capillary structures 3, 21) are integrated capillary structures formed by powder sintering or ceramic sintering.

In summary, the present invention has the following effects as compared with the prior art: the second capillary structure 21 of the heat pipe 2 can be connected and communicated with the first capillary structure 13 of the temperature equalizing plate 1 to achieve integral heat transfer. , fully play the uniform heat board 1 plus the heat dissipation effect of the heat pipe 2.

Further, the present invention has other effects: the first, second, and third capillary structures 13, 21, and 3 are arranged side by side to each other to be applied to the thinned uniform temperature plate 1 and the heat pipe 2 in the shape of a flat tube. The opening portion 22 is used to facilitate the bridging of the third capillary structure 3, and particularly when the opening portion 22 includes the opening 221 and the opening 222, the lower jaw portion 23 can be formed to be more convenient and more advantageous for the third capillary structure. 3 bridges. The second filling body 1211 extending from the inner side surface 1211 of the cover plate can be relatively filled in the gap G between the heat pipe 2 and the temperature equalizing plate 1 by recessing the two-shaped recessed portion 1221 in the cover plates 12, 12a, thereby allowing The heat pipe 2 is more adapted to the notch 151 of the temperature equalizing plate 1, and has an effect of more easily welding the heat pipe 2 to the temperature equalizing plate 1. A communicating item 17 is further integrally extended by the temperature equalizing plate 1 to have a better heat pipe 2 connecting effect. The first support structure 16 and the second support structure are used to respectively prevent the temperature equalizing plate 1 from being deformed during vacuuming and to prevent the heat pipe 2 from being crushed during pressing.

The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the invention, and the equivalent structural changes of the present invention and the contents of the drawings are all included in the present invention. Within the scope of the rights, it is given to Chen Ming.

1‧‧‧Wall plate

10‧‧‧ chamber

11, 11a‧‧‧ bottom plate

111‧‧‧ recessed space

12, 12a‧‧‧ cover

121‧‧‧ inside

1211‧‧‧ stuffing body

122‧‧‧Outside

1221‧‧‧Notch

13‧‧‧First capillary structure

14‧‧‧Fourth capillary structure

15‧‧‧

151‧‧ ‧ gap

16‧‧‧First support structure

161‧‧‧Support column

17‧‧‧Connected neck

171‧‧‧ inside bottom

2‧‧‧heat pipe

20, 20a‧‧‧ end

21‧‧‧Second capillary structure

211‧‧‧Bounded by

22‧‧‧ Open Department

221‧‧‧ openings

222‧‧‧ breach

23‧‧‧Lower Department

3‧‧‧ Third capillary structure

G‧‧‧ gap

Fig. 1 is an exploded perspective view showing a first embodiment of the present invention.

2 is a perspective assembled view of the first embodiment of the present invention before the cover is assembled.

Figure 3 is a perspective view of the present invention after bridging the third capillary structure according to Figure 2;

Fig. 4 is a cross-sectional view (radially cut heat pipe) of the first embodiment of the present invention after combination, showing the state before the recession.

Fig. 5 is a cross-sectional view (radially cut heat pipe) of the first embodiment of the present invention after combination, showing the state after the recession.

Figure 6 is a cross-sectional view (axially cut heat pipe) of the first embodiment of the present invention after combination.

Figure 7 is a perspective assembled view of the first embodiment of the present invention.

Figure 8 is a perspective assembled view of the second embodiment of the present invention before the cover is assembled.

FIG. 9 is a perspective view of the second embodiment of the present invention after combining and bridging the third capillary structure.

Figure 10 is a partial cross-sectional view of the second embodiment of the present invention in accordance with Figure 9.

1‧‧‧Wall plate

10‧‧‧ chamber

11‧‧‧floor

12‧‧‧ Cover

13‧‧‧First capillary structure

14‧‧‧Fourth capillary structure

15‧‧‧

16‧‧‧First support structure

161‧‧‧Support column

2‧‧‧heat pipe

20‧‧‧End

21‧‧‧Second capillary structure

211‧‧‧Bounded by

22‧‧‧ Open Department

221‧‧‧ openings

3‧‧‧ Third capillary structure

Claims (18)

A connected heat transfer device comprising: a temperature equalizing plate having a bottom plate having a first capillary structure on an inner surface thereof; a heat pipe having a second capillary structure therein, one end of the heat pipe being bridged The bottom portion has an open portion communicating between the heat pipe and the temperature equalizing plate, the second capillary structure having a bridge portion exposed by the open portion, and a third capillary structure The first capillary structure and the two capillary structures are connected to each other by bridging the first capillary structure and the bridged portion. The connected heat transfer device of claim 1, wherein the third capillary structure is formed by powder sintering or ceramic sintering and is bridged between the first capillary structure and the bridged portion. The connected heat transfer device of claim 1, wherein the third capillary structure is a metal mesh structure or a fiber bundle assembly. The connected heat transfer device of claim 1, wherein the bridged portion of the second capillary structure and the first capillary structure are juxtaposed to each other. The communication type heat transfer device of claim 1, wherein the bottom of the bottom plate surrounds a surrounding plate, the end portion of the heat pipe is inserted into the surrounding plate, and the heat pipe is arranged side by side on the temperature equalizing plate. The communication type heat transfer device of claim 1, wherein the bottom of the bottom plate surrounds a shroud, the shroud is provided with a notch, and the end of the heat pipe is bridged to the inner bottom surface of the bottom plate via the notch. The heat pipe is arranged side by side on the temperature equalization plate. The communication type heat transfer device of claim 5 or 6, wherein the first capillary structure, the second capillary structure, and the third capillary structure are side by side with each other. The communication type heat transfer device of claim 1, wherein the temperature equalizing plate further has a cover plate, and the periphery of the bottom plate further surrounds a surrounding plate, and the cover plate is sealed to an open end edge of the surrounding plate. The end portion is inserted into the surrounding plate, and a gap is formed between the two sides of the end portion and the surrounding plate. The cover plate is respectively formed with a packing body corresponding to each of the gap positions, and each of the filling bodies is filled in each of the gaps. . The communication type heat transfer device according to claim 8, wherein the cover has an outer side and an inner side corresponding to each other, and each of the plugging systems integrally extends from the inner side, and the outer side corresponds to each of the plugs. Each of them is recessed with a dozen recesses. The connected heat transfer device of claim 1, wherein the open portion includes an opening that is open at one end of the heat pipe. The communication type heat transfer device of claim 10, wherein the opening portion further comprises a break opening at the end, the break being adjacent to the opening and communicating with each other. The communication type heat transfer device according to claim 11, wherein the end portion forms a lower jaw portion by the open portion, and the bridged portion is located on an inner surface of the lower jaw portion and exposed through the open portion. The communication type heat transfer device of claim 12, wherein the bottom plate is surrounded by a shroud to form a recessed space, and the bottom plate extends outwardly along the shroud with a communication neck, the communication neck is connected to the The recessed space and the outside has an inner bottom surface, and the lower jaw portion is bridged on the inner bottom surface of the communicating neck. The connected heat transfer device of claim 1, wherein the temperature equalizing plate is provided with a first supporting structure. The connected heat transfer device of claim 1, wherein the heat pipe is provided with a second support structure. The connected heat transfer device of claim 15, wherein the heat pipe is a flat tube, and the second support structure is supported in the flat tube. The connected heat transfer device of claim 1, wherein the third capillary structure and the first capillary structure or the second capillary structure are an integrated capillary structure. The connected heat transfer device of claim 1, wherein the temperature equalizing plate has only a capillary structure disposed on an inner surface of the bottom plate.