TWM522331U - Heat pipe and heat spreader assembly structure - Google Patents

Heat pipe and heat spreader assembly structure Download PDF

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Publication number
TWM522331U
TWM522331U TW105202756U TW105202756U TWM522331U TW M522331 U TWM522331 U TW M522331U TW 105202756 U TW105202756 U TW 105202756U TW 105202756 U TW105202756 U TW 105202756U TW M522331 U TWM522331 U TW M522331U
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Taiwan
Prior art keywords
heat pipe
open end
equalizing plate
assembly structure
temperature equalizing
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TW105202756U
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Chinese (zh)
Inventor
Chun-Hung Lin
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Taiwan Microloops Corp
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Priority to TW105202756U priority Critical patent/TWM522331U/en
Publication of TWM522331U publication Critical patent/TWM522331U/en

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Description

熱管和均溫板組接結構Heat pipe and temperature equalizing plate assembly structure

本創作係有關一種導熱技術,尤指一種熱管和均溫板組接結構。This creation is related to a heat conduction technology, especially a heat pipe and a uniform temperature plate assembly structure.

隨著電子元件的運算速度不斷提昇,其所產生的熱量亦越來越高,為了有效地解決此高發熱量的問題,業界已將具有良好導熱特性的均溫板和熱管進行廣泛性的使用,但是此等均溫板和熱管不論是其導熱效能、製作成本和製作容易度等皆存在有尚待加以改善的空間。As the computing speed of electronic components continues to increase, the heat generated by them is becoming higher and higher. In order to effectively solve the problem of high heat generation, the industry has widely used uniform temperature plates and heat pipes with good thermal conductivity characteristics. However, such a temperature equalizing plate and a heat pipe have room for improvement, such as heat conductivity, production cost, and ease of manufacture.

習知的均溫板和熱管組接結構,主要是將熱管立設在均溫板上,二者的內部空間互不相通,僅能透過熱傳導方式來進行熱量的導離和散逸,前述結構並無法達到均溫板和熱管均溫效果,進而使其熱導效果大打折扣。業界為了解決前述問題,在均溫板上開設有供熱管連接的穿孔,但在製作過程中卻存在著製程繁瑣和複雜,且內部工作流體的循環效果亦不佳等問題,亟待加以改善者。The conventional uniform temperature plate and heat pipe assembly structure mainly sets the heat pipe on the temperature equalization plate, and the internal spaces of the two are not connected to each other, and only the heat conduction method can be used for heat conduction and dissipation, and the foregoing structure is The uniform temperature plate and the heat pipe uniform temperature effect cannot be achieved, and the heat conduction effect is greatly reduced. In order to solve the above problems, the industry has a perforation for the connection of the heating pipe on the temperature equalizing plate. However, in the manufacturing process, there are problems such as cumbersome and complicated processes, and the circulation effect of the internal working fluid is also poor, which needs to be improved.

本創作之一目的,在於提供一種熱管和均溫板組接結構,其不僅可簡化製程更能夠有效地提昇導熱和散熱效能。One of the aims of the present invention is to provide a heat pipe and a temperature equalizing plate assembly structure, which not only simplifies the process, but also effectively improves the heat conduction and heat dissipation performance.

為了達成上述之目的,本創作係提供一種熱管和均溫板組接結構,包括一均溫板、一熱管、一多孔性燒結組織及一工作流體,該均溫板包括一下殼體和對應該下殼體封合連接的一上殼體,在該上殼體和該下殼體之間形成有一容腔,該上殼體設有一穿孔及自該穿孔周緣延伸而出的一環牆;該熱管具有一開口,該熱管以該開口對應該環牆立設並與該穿孔連通,在該熱管靠近該開口的位置成形有一止擋部;該多孔性燒結組織形成在該穿孔至該止擋部之間;該工作流體填注在該容腔內。In order to achieve the above object, the present invention provides a heat pipe and a temperature equalizing plate assembly structure, including a temperature equalizing plate, a heat pipe, a porous sintered structure and a working fluid, the temperature equalizing plate including a lower casing and a pair An upper casing sealingly connected to the lower casing, a cavity formed between the upper casing and the lower casing, the upper casing being provided with a perforation and a ring wall extending from the periphery of the perforation; The heat pipe has an opening, the heat pipe is erected corresponding to the ring wall and communicates with the through hole, and a stop portion is formed at a position of the heat pipe near the opening; the porous sintered structure is formed in the through hole to the stop portion Between; the working fluid is filled in the cavity.

本創作還具有以下功效,利用多孔性燒結組織連接第一毛細組織和第二毛細組織,進而能夠達成內部工作流體的良好循環效果。The present invention also has the effect of connecting the first capillary structure and the second capillary structure by the porous sintered structure, thereby achieving a good circulation effect of the internal working fluid.

有關本創作之詳細說明及技術內容,配合圖式說明如下,然而所附圖式僅提供參考與說明用,並非用來對本創作加以限制者。The detailed description and technical content of the present invention are described below with reference to the drawings, but the drawings are only for reference and explanation, and are not intended to limit the creation.

請參閱圖1至圖6所示,本創作提供一種熱管和均溫板組接結構,其製作方法包括以下步驟:Referring to FIG. 1 to FIG. 6 , the present invention provides a heat pipe and a temperature equalizing plate assembly structure, and the manufacturing method thereof comprises the following steps:

首先,備一金屬板11a,對金屬板11a加工形成有一穿孔111及一環牆112;請參閱圖1及圖2所示,在此步驟中的金屬板11a可為鋁、銅或其合金所製成,以一成型模具(圖未示出)對金屬板11a進行沖孔和延伸的加工製程,以在金屬板11a上形成有複數穿孔111和分別自各穿孔111周緣延伸而出的一環牆112,穿孔111的數量可依實際需求來進行選用,對於微型散熱器亦可以單一穿孔111來進行設置。First, a metal plate 11a is prepared, and a through hole 111 and a ring wall 112 are formed on the metal plate 11a. Referring to FIG. 1 and FIG. 2, the metal plate 11a in this step may be made of aluminum, copper or an alloy thereof. Forming a punching and extending process for the metal plate 11a by a molding die (not shown) to form a plurality of through holes 111 and a ring wall 112 extending from the periphery of each of the through holes 111, respectively, on the metal plate 11a. The number of perforations 111 can be selected according to actual needs, and the micro heat sink can also be set by a single through hole 111.

其次,備一熱管20,熱管20具有一開口211,對熱管20加工形成有一止擋部24;請參閱圖3所示,此步驟可在前述步驟之前或之後施行,此步驟中的熱管20可以是鋁、銅或其合金所製成,其具有一開口端21和遠離開口端21的一封閉端22,開口端21具有一開口211,此熱管20的內部佈設有一第二毛細組織23,此第二毛細組織23可為一金屬編織網、多孔性粉末燒結物或槽溝。以一成型治具(圖未示出)在熱管20的開口端21靠近開口211的位置成形有一止擋部24,此止擋部24的位置與開口端21的端邊相距約在0.5~10mm之間,本實施例的止擋部24為一環形凹槽。Next, a heat pipe 20 is prepared. The heat pipe 20 has an opening 211. The heat pipe 20 is formed with a stopper 24; as shown in FIG. 3, this step can be performed before or after the foregoing steps, and the heat pipe 20 in this step can be It is made of aluminum, copper or an alloy thereof, and has an open end 21 and a closed end 22 away from the open end 21, the open end 21 has an opening 211, and the inside of the heat pipe 20 is provided with a second capillary structure 23, The second capillary structure 23 can be a metal woven mesh, a porous powder sinter or a trench. A stop portion 24 is formed at a position where the open end 21 of the heat pipe 20 is close to the opening 211 by a forming fixture (not shown). The position of the stop portion 24 is about 0.5 to 10 mm from the end edge of the open end 21. The stop portion 24 of the embodiment is an annular groove.

繼之,將熱管20對應於環牆112立設,從而使開口211與穿孔11連通;請參閱圖4所示,此步驟是在熱管20的開口端21外周壁塗覆一黏著劑(如錫膏,圖未示出)後,再將熱管20的開口端21對應於環牆112穿接,從而使開口211與穿孔111相互連通,此實施例的開口端21是容置在環牆112內部。Then, the heat pipe 20 is erected corresponding to the annular wall 112 so that the opening 211 communicates with the through hole 11; as shown in FIG. 4, this step is to apply an adhesive (such as tin) to the outer peripheral wall of the open end 21 of the heat pipe 20. After the paste is not shown, the open end 21 of the heat pipe 20 is connected to the annular wall 112 so that the opening 211 and the through hole 111 communicate with each other. The open end 21 of this embodiment is accommodated inside the ring wall 112. .

繼之,將一芯棒8從穿孔111插入並被止擋部24所阻擋;請參閱圖4所示,此步驟是將一芯棒8從穿孔111及熱管20的開口端21插入開口211內並被前述止擋部24所阻擋而定位。Then, a mandrel 8 is inserted from the perforation 111 and blocked by the stopper 24; as shown in FIG. 4, this step is to insert a mandrel 8 from the perforation 111 and the open end 21 of the heat pipe 20 into the opening 211. And is positioned by the stop portion 24 to be positioned.

繼之,將一金屬粉末9從穿孔111填入從而形成在芯棒8外周圍;請參閱圖5所示,此步驟是將一金屬粉末9從穿孔111填入從而形成在芯棒8外周圍和熱管20的開口端21內壁之間,同時亦可在金屬板10的內壁灑上前述的金屬粉末9,藉以製作成一第一毛細組織13,此第一毛細組織13為一多孔性粉末燒結物。Next, a metal powder 9 is filled from the perforations 111 to be formed around the outer periphery of the mandrel 8; as shown in FIG. 5, this step is to fill a metal powder 9 from the perforations 111 to form an outer periphery of the mandrel 8. The metal powder 9 may be sprinkled between the inner wall of the open end 21 of the heat pipe 20 and the inner wall of the metal plate 10 to form a first capillary structure 13, which is a porous structure. Powder sinter.

繼之,對經前一步驟的半成品進行一燒結加工,從而在穿孔111至止擋部24之間形成有一多孔性燒結組織30,並構成一上殼體11;請參閱圖5所示,此步驟是將已進行前述填入金屬粉末9和灑上金屬粉末9的半成品,送入一加熱設備(圖未示出)進行一燒結加工,完成燒結加工後必須將芯棒8移除,從而在穿孔111的周圍至止擋部24之間形成有一多孔性燒結組織30(如圖6所示),並構成一上殼體11,完成此製程後的多孔性燒結組織30是連接第一毛細組織13和第二毛細組織23。Then, a semi-finished product of the previous step is subjected to a sintering process to form a porous sintered structure 30 between the through hole 111 and the stopper portion 24, and constitutes an upper casing 11; as shown in FIG. The step is to carry out the foregoing semi-finished product filled with the metal powder 9 and sprinkled with the metal powder 9 and sent to a heating device (not shown) for a sintering process. After the sintering process, the mandrel 8 must be removed, thereby A porous sintered structure 30 (shown in FIG. 6) is formed between the periphery of the through hole 111 and the stopper portion 24, and constitutes an upper casing 11. After the process, the porous sintered structure 30 is connected to the first capillary structure. 13 and second capillary tissue 23.

繼之,備一下殼體12,將下殼體12對應上殼體11封合連接;請參閱圖6所示,在此步驟中下殼體12已預先加工形成有一空腔和佈設在空腔內部的一第三毛細組織14,此第三毛細組織14可為金屬編織網、多孔性粉末燒結物或槽溝等,將此下殼體12對應於前述上殼體11進行焊接封合,從而在上殼體11和下殼體12之間形成有一容腔A。Then, the housing 12 is prepared, and the lower housing 12 is sealed and connected to the upper housing 11; as shown in FIG. 6, in this step, the lower housing 12 has been pre-machined to form a cavity and is disposed in the cavity. a third capillary structure 14 in the interior, the third capillary structure 14 may be a metal woven mesh, a porous powder sinter or a groove, etc., and the lower casing 12 is welded and sealed corresponding to the upper casing 11 A cavity A is formed between the upper casing 11 and the lower casing 12.

最後,對經前一步驟的半成品施以一填液和一除氣封口製程。請參閱圖6所示,在此步驟是將水等液體,透過一輸液除氣管(圖未示出)將一工作流體40填入腔室A內,並進行除氣、封口等加工步驟,進而完成製作。Finally, a semi-finished product and a degassing sealing process are applied to the semi-finished product of the previous step. Referring to FIG. 6, in this step, a liquid such as water is filled into the chamber A through an infusion degassing tube (not shown), and a processing step of degassing, sealing, and the like is performed. Finish the production.

請再參閱圖6所示,本創作提供一種熱管和均溫板組接結構,包括一均溫板(Vapor Chamber)10、一熱管(Heat Pipe)20、一多孔性燒結組織30及一工作流體40,均溫板10包括一下殼體12和對應下殼體12封合連接的一上殼體11,在上殼體11和下殼體12之間形成有一容腔A,於容腔A內部佈設有一第一毛細組織13,上殼體11設有一穿孔111及自穿孔111周緣延伸而出的一環牆112;熱管20具有一開口211及內部佈設有一第二毛細組織23,熱管20以開口211對應環牆112立設並與穿孔111連通,在熱管20靠近開口211的位置成形有一止擋部24;多孔性燒結組織30形成在穿孔111至止擋部24之間並且連接第一毛細組織13和第二毛細組織23;工作流體40填注在容腔A內。Referring to FIG. 6 again, the present invention provides a heat pipe and a uniform temperature plate assembly structure, including a Vapor Chamber 10, a Heat Pipe 20, a porous sintered structure 30, and a work. The fluid 40, the temperature equalizing plate 10 includes a lower casing 12 and an upper casing 11 correspondingly connected to the lower casing 12, and a cavity A is formed between the upper casing 11 and the lower casing 12 in the cavity A. The inner casing 11 is provided with a first capillary structure 13 , and the upper casing 11 is provided with a through hole 111 and a ring wall 112 extending from the periphery of the through hole 111 . The heat pipe 20 has an opening 211 and a second capillary structure 23 is disposed therein, and the heat pipe 20 is opened. 211 corresponding to the annular wall 112 is erected and communicates with the through hole 111, and a stop portion 24 is formed at a position of the heat pipe 20 near the opening 211; the porous sintered structure 30 is formed between the through hole 111 and the stopper portion 24 and connects the first capillary structure 13 and second capillary structure 23; the working fluid 40 is filled in the cavity A.

使用時液態的工作流體40受熱後將產生蒸發而生成為氣態的工作流體40,此氣態的工作流體40將攜帶大量的熱量朝向各熱管20的開口211處流動,並且到達熱管20的封閉端22,此等氣態的工作流體40在透過熱管20與多數散熱片(圖未示出)的接觸散逸後,將被冷凝為液態的工作流體40並且依序經過第二毛細組織23、多孔性燒結組織30及第一毛細組織13而回流至容腔A內,由於第一毛細組織13和第二毛細組織23是透過多孔性燒結組織30連接,藉以形成一連續性回流路徑進而能夠增加液體的回流速度。When in use, the liquid working fluid 40, upon heating, will evaporate to form a gaseous working fluid 40 that will carry a significant amount of heat toward the opening 211 of each heat pipe 20 and to the closed end 22 of the heat pipe 20. The gaseous working fluid 40 will be condensed into a liquid working fluid 40 and sequentially passed through the second capillary structure 23, porous sintered structure after being dissipated through the heat pipe 20 in contact with a plurality of fins (not shown). 30 and the first capillary structure 13 are returned to the cavity A, since the first capillary structure 13 and the second capillary structure 23 are connected through the porous sintered structure 30, thereby forming a continuous return path and thereby increasing the liquid reflux speed. .

請參閱圖7所示,本創作之熱管和均溫板組接結構除了可以如前述實施例外,亦可在環牆112的外周壁塗覆一黏著劑後,再將熱管20的開口端21對應於環牆112套接,從而使開口211與穿孔111相互連通,此實施例的環牆112是容置在開口端21內部。Referring to FIG. 7 , in addition to the foregoing implementation, the heat pipe and the temperature equalizing plate assembly structure of the present invention may be coated with an adhesive on the outer peripheral wall of the annular wall 112, and then the open end 21 of the heat pipe 20 is correspondingly The ring wall 112 is sleeved so that the opening 211 and the through hole 111 communicate with each other. The ring wall 112 of this embodiment is housed inside the open end 21.

請參閱圖8所示,本實施例的熱管與前述實施例的熱管差異在於其止擋部,本實施例的止擋部24a為在熱管20的開口端21靠近開口211位置沖設有複數凹坑,藉以作為前述芯棒8插入後的阻擋之作用。Referring to FIG. 8 , the heat pipe of the present embodiment is different from the heat pipe of the foregoing embodiment in the stop portion. The stop portion 24 a of the embodiment is provided with a plurality of recesses at the open end 21 of the heat pipe 20 near the opening 211 . The pit serves as a barrier to the insertion of the aforementioned core rod 8.

請參閱圖9所示,本實施例的止擋部24b為在熱管20的開口端21靠近開口211內壁直接成形有一內擋環,藉以作為前述芯棒8插入後的阻擋之作用。Referring to FIG. 9, the stopper portion 24b of the present embodiment directly forms an inner retaining ring near the inner wall of the opening 211 at the open end 21 of the heat pipe 20, thereby acting as a barrier after the insertion of the mandrel bar 8.

綜上所述,本創作之熱管和均溫板組接結構及其方法,確可達到預期之使用目的,而解決習知之缺失,又因極具新穎性及進步性,完全符合新型專利申請要件,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障創作人之權利。In summary, the heat pipe and the isothermal plate assembly structure and method of the present invention can achieve the intended use purpose, and solve the lack of the conventional, and because of the novelty and progress, fully comply with the new patent application requirements. If you apply for an application under the Patent Law, please check and grant the patent in this case to protect the rights of the creator.

10‧‧‧均溫板10‧‧‧Wall plate

11a‧‧‧金屬板11a‧‧‧Metal sheet

11‧‧‧上殼體11‧‧‧Upper casing

111‧‧‧穿孔111‧‧‧Perforation

112‧‧‧環牆112‧‧‧Circle wall

12‧‧‧下殼體12‧‧‧ Lower case

13‧‧‧第一毛細組織13‧‧‧First capillary tissue

14‧‧‧第三毛細組織14‧‧‧ Third capillary tissue

A‧‧‧容腔A‧‧‧ cavity

20‧‧‧熱管20‧‧‧heat pipe

21‧‧‧開口端21‧‧‧Open end

211‧‧‧開口211‧‧‧ openings

22‧‧‧封閉端22‧‧‧closed end

23‧‧‧第二毛細組織23‧‧‧Second capillary tissue

24、24a、24b‧‧‧止擋部24, 24a, 24b‧‧‧ stop

30‧‧‧多孔性燒結組織30‧‧‧Porous sintered structure

40‧‧‧工作流體40‧‧‧Working fluid

8‧‧‧芯棒8‧‧‧ mandrel

9‧‧‧金屬粉末9‧‧‧Metal powder

圖1 係本創作之金屬板剖視圖。Figure 1 is a cross-sectional view of the metal plate of the present invention.

圖2 係本創作之金屬板經成形加工後剖視圖。Figure 2 is a cross-sectional view of the metal sheet of the present invention after forming.

圖3 係本創作之熱管經成形加工後剖視圖。Figure 3 is a cross-sectional view of the heat pipe of the present invention after forming.

圖4 係本創作之金屬板、熱管和芯棒組合剖視圖。Figure 4 is a cross-sectional view of the metal plate, heat pipe and mandrel of the present invention.

圖5 係本創作之金屬粉末填入穿孔及金屬板的內壁剖視圖。Figure 5 is a cross-sectional view of the inner wall of the metal powder filled with perforations and metal sheets.

圖6 係本創作之上殼體和下上殼體組合剖視圖。Figure 6 is a cross-sectional view showing the combination of the upper and lower upper casings of the present invention.

圖7 係本創作之另一實施例組合剖視圖。Figure 7 is a cross-sectional view of another embodiment of the present invention.

圖8 係本創作之熱管之另一實施例外觀圖。Figure 8 is an external view of another embodiment of the heat pipe of the present invention.

圖9 係本創作之熱管之又一實施例剖視圖。Figure 9 is a cross-sectional view showing still another embodiment of the heat pipe of the present invention.

10‧‧‧均溫板 10‧‧‧Wall plate

11a‧‧‧金屬板 11a‧‧‧Metal sheet

11‧‧‧上殼體 11‧‧‧Upper casing

111‧‧‧穿孔 111‧‧‧Perforation

112‧‧‧環牆 112‧‧‧Circle wall

12‧‧‧下殼體 12‧‧‧ Lower case

13‧‧‧第一毛細組織 13‧‧‧First capillary tissue

14‧‧‧第三毛細組織 14‧‧‧ Third capillary tissue

A‧‧‧容腔 A‧‧‧ cavity

20‧‧‧熱管 20‧‧‧heat pipe

21‧‧‧開口端 21‧‧‧Open end

211‧‧‧開口 211‧‧‧ openings

22‧‧‧封閉端 22‧‧‧closed end

23‧‧‧第二毛細組織 23‧‧‧Second capillary tissue

24‧‧‧止擋部 24‧‧‧stop

30‧‧‧多孔性燒結組織 30‧‧‧Porous sintered structure

40‧‧‧工作流體 40‧‧‧Working fluid

Claims (10)

一種熱管和均溫板組接結構,包括: 一均溫板,包括一下殼體和對應該下殼體封合連接的一上殼體,在該上殼體和該下殼體之間形成有一容腔,該上殼體設有一穿孔及自該穿孔周緣延伸而出的一環牆; 一熱管,具有一開口,該熱管以該開口對應該環牆立設並與該穿孔連通,在該熱管靠近該開口的位置成形有一止擋部; 一多孔性燒結組織,形成在該穿孔至該止擋部之間;以及 一工作流體,填注在該容腔內。A heat pipe and a temperature equalizing plate assembly structure, comprising: a temperature equalizing plate comprising a lower casing and an upper casing corresponding to a sealing connection of the lower casing, wherein a gap is formed between the upper casing and the lower casing a cavity, the upper casing is provided with a perforation and a ring wall extending from the periphery of the perforation; a heat pipe having an opening, the heat pipe is erected corresponding to the ring wall and communicates with the perforation, the heat pipe is adjacent to the cavity The opening is shaped with a stop; a porous sintered structure formed between the perforations and the stop; and a working fluid filled in the cavity. 如請求項1所述之熱管和均溫板組接結構,其中該容腔內部佈設有一第一毛細組織,該熱管內部佈設有一第二毛細組織,該多孔性燒結組織連接該第一毛細組織和該第二毛細組織。The heat pipe and the temperature equalizing plate assembly structure according to claim 1, wherein a first capillary structure is disposed inside the cavity, and a second capillary structure is disposed inside the heat pipe, and the porous sintered structure is connected to the first capillary structure and The second capillary tissue. 如請求項2所述之熱管和均溫板組接結構,其中該熱管具有一開口端,該開口形成在該開口端,該開口端穿接該環牆,從而使該開口端容置在該環牆內部。The heat pipe and the temperature equalizing plate assembly structure according to claim 2, wherein the heat pipe has an open end, the opening is formed at the open end, and the open end is connected to the ring wall, so that the open end is received in the Inside the ring wall. 如請求項3所述之熱管和均溫板組接結構,其中該多孔性燒結組織形成在該開口端內壁。The heat pipe and the temperature equalizing plate assembly structure according to claim 3, wherein the porous sintered structure is formed on the inner wall of the open end. 如請求項2所述之熱管和均溫板組接結構,其中該熱管具有一開口端,該開口形成在該開口端,該開口端套接該環牆,從而使該環牆容置在該開口端內部。The heat pipe and the temperature equalizing plate assembly structure according to claim 2, wherein the heat pipe has an open end, the opening is formed at the open end, and the open end is sleeved with the ring wall, so that the ring wall is accommodated in the ring wall Inside the open end. 如請求項5所述之熱管和均溫板組接結構,其中該多孔性燒結組織形成在該環牆內壁。The heat pipe and the temperature equalizing plate assembly structure according to claim 5, wherein the porous sintered structure is formed on an inner wall of the ring wall. 如請求項2所述之熱管和均溫板組接結構,其中該止擋部為形成在該熱管的一環形凹槽。The heat pipe and the temperature equalizing plate assembly structure according to claim 2, wherein the stopping portion is an annular groove formed in the heat pipe. 如請求項2所述之熱管和均溫板組接結構,其中該止擋部為形成在該熱管的複數凹坑。The heat pipe and the temperature equalizing plate assembly structure according to claim 2, wherein the stopping portion is a plurality of dimples formed in the heat pipe. 如請求項2所述之熱管和均溫板組接結構,其中該止擋部為形成在該熱管內壁的一內擋環。The heat pipe and the temperature equalizing plate assembly structure according to claim 2, wherein the stopping portion is an inner retaining ring formed on an inner wall of the heat pipe. 如請求項1所述之熱管和均溫板組接結構,其中穿孔、環牆和熱管皆為複數且數量相同。The heat pipe and the temperature equalizing plate assembly structure according to claim 1, wherein the perforation, the ring wall and the heat pipe are plural and the same amount.
TW105202756U 2016-02-26 2016-02-26 Heat pipe and heat spreader assembly structure TWM522331U (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI601934B (en) * 2016-07-26 2017-10-11 邁萪科技股份有限公司 Vapor chamber and heat pipe combined structure and combination method thereof
CN107664451A (en) * 2016-07-27 2018-02-06 迈萪科技股份有限公司 Temperature-uniforming plate and heat pipe combination structure
US10288356B2 (en) 2016-10-14 2019-05-14 Taiwan Microloops Corp. Vapor chamber and heat pipe combined structure and combining method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI601934B (en) * 2016-07-26 2017-10-11 邁萪科技股份有限公司 Vapor chamber and heat pipe combined structure and combination method thereof
CN107664451A (en) * 2016-07-27 2018-02-06 迈萪科技股份有限公司 Temperature-uniforming plate and heat pipe combination structure
US10288356B2 (en) 2016-10-14 2019-05-14 Taiwan Microloops Corp. Vapor chamber and heat pipe combined structure and combining method thereof

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