TW202035938A - Integrated vapor chamber and method thereof - Google Patents
Integrated vapor chamber and method thereof Download PDFInfo
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本發明係有關一種散熱技術,尤指一種一體式均溫板及其製作方法。The invention relates to a heat dissipation technology, in particular to an integrated temperature equalizing plate and a manufacturing method thereof.
隨著電子元件的運算速度不斷提昇,其所產生的熱量亦越來越高,為了有效地解決高發熱量的問題,業界已將具有良好導熱特性的均溫板(Vapor Chamber)進行廣泛性的使用,但是現有的均溫板不論是導熱效能、製作成本和製作容易度等皆存在有改善的空間。As the computing speed of electronic components continues to increase, the heat generated by them is also getting higher and higher. In order to effectively solve the problem of high heat generation, the industry has widely used Vapor Chambers with good thermal conductivity. However, there is room for improvement in the existing uniform temperature plate in terms of thermal conductivity, production cost, and ease of production.
習知的均溫板,主要包括一上殼體和一下殼體,並在上殼體和下殼體的內部空間分別裝設有一毛細組織,其後再將上殼體和下殼體對應焊合,再將工作流體填入上殼體和下殼體內部,最後施以除氣封口等製程而完成。The conventional uniform temperature plate mainly includes an upper shell and a lower shell, and a capillary tissue is installed in the inner space of the upper shell and the lower shell respectively, and then the upper shell and the lower shell are correspondingly welded Then, the working fluid is filled into the upper shell and the lower shell, and finally the process is completed by degassing and sealing.
然而,習知的均溫板,雖然具有導熱效能,但在實際的使用上卻存在以下的問題點,由於上殼體和下殼體之間的封合長度幾乎涵蓋上殼體和下殼體的各邊長度,使得焊接封合的製程變得相當繁瑣和加工的不易,另上殼體和下殼體在焊接封合的過程中又常因為溫度過高等問題,而使內部的毛細組織又被再次加溫,而易產生與上殼體和下殼體剝離或脫落的不良情況。又,均溫板內部的腔室在使用過程中是不斷的發生溫度和壓力的交互變化,如此易導致前述的封合焊接處產生洩漏等問題。However, although the conventional temperature equalizing plate has thermal conductivity, it has the following problems in actual use. Because the sealing length between the upper shell and the lower shell almost covers the upper shell and the lower shell The length of each side makes the welding and sealing process very cumbersome and difficult to process. In addition, the upper and lower shells are often due to high temperature during the welding and sealing process, and the internal capillary structure is changed. When heated again, it is easy to peel off or fall off from the upper shell and the lower shell. In addition, the temperature and pressure of the chamber inside the uniform temperature plate are constantly undergoing interactive changes in temperature and pressure during use, which is likely to cause the aforementioned problems such as leakage at the sealing weld.
有鑑於此,本發明人遂針對上述現有技術的缺失,特潛心研究並配合學理的運用,盡力解決上述之問題點,即成為本發明人改良之目標。In view of this, the inventor of the present invention focused on the above-mentioned shortcomings of the prior art, and made great efforts to solve the above-mentioned problems, which became the goal of the present inventor's improvement.
本發明之一目的,在於提供一種一體式均溫板及其製作方法,其不僅製作容易,且具備有良好的散熱效果。One objective of the present invention is to provide an integrated temperature equalizing plate and a manufacturing method thereof, which is not only easy to manufacture, but also has a good heat dissipation effect.
為了達成上述之目的,本發明係提供一種一體式均溫板,包括一殼座、複數散熱鰭片、二封口部及一工作流體,該殼座係以一抽伸方式所形成,該殼座包括一底板、形成在該底板上方的一頂板及分別連接在該底板和該頂板兩側的一邊板,在該底板、該頂板和各該邊板之間圍設有一容腔;各該散熱鰭片係分別自該頂板背向該底板的表面延伸形成;各該封口部係分別形成在該容腔的首、末端;該工作流體係設置在該容腔中。In order to achieve the above objective, the present invention provides an integrated temperature equalizing plate, which includes a shell base, a plurality of heat dissipation fins, two sealing parts and a working fluid. The shell base is formed in a drawing manner, and the shell base includes A bottom plate, a top plate formed above the bottom plate, and side plates connected to both sides of the bottom plate and the top plate respectively, a cavity is enclosed between the bottom plate, the top plate and each of the side plates; each of the radiating fins It is formed by extending from the surface of the top plate away from the bottom plate; each of the sealing parts is respectively formed at the head and the end of the cavity; the workflow system is arranged in the cavity.
為了達成上述之目的,本發明係提供一種一體式均溫板製作方法,其步驟包括:In order to achieve the above objective, the present invention provides a method for manufacturing an integrated temperature equalizing plate, the steps of which include:
a)以一抽伸方式形成有一殼座素材及連接在該殼座素材的複數散熱鰭片素材,並在該殼座素材內部形成有一空腔;a) A shell base material and a plurality of heat dissipation fin materials connected to the shell base material are formed in a drawing manner, and a cavity is formed inside the shell base material;
b)對該殼座素材和各該散熱鰭片素材做一分段切割加工,並在該空腔的首、末端分別形成有一開口;b) Perform a segmental cutting process on the shell base material and each heat dissipation fin material, and form an opening at the first and end of the cavity;
c)對分段後的各該開口做一壓合封口加工,而分別形成有一封口部;以及c) Perform a press-sealing process on each of the segmented openings to form an opening respectively; and
d)將一工作流體填入該空腔中並施以一除氣封管口加工。d) Fill the cavity with a working fluid and apply a degassing seal nozzle processing.
為了達成上述之目的,本發明還提供另一種一體式均溫板製作方法,其步驟包括:In order to achieve the above objective, the present invention also provides another integrated temperature equalizing plate manufacturing method, the steps of which include:
a1)以一抽伸方式形成有一殼座素材,並在該殼座素材內部形成有一空腔A;a1) A housing material is formed in a drawing manner, and a cavity A is formed inside the housing material;
b1)對該殼座素材做一分段切割加工,並在該空腔A的首、末端分別形成有一開口;b1) Perform a segmental cutting process on the housing material, and form an opening at the first and end of the cavity A;
c1)在該殼座素材的一表面以一鏟削方式成型有複數散熱鰭片20;c1) A plurality of radiating
d1)對分段後的各該開口做一壓合封口加工,而分別形成有一封口部30;以及d1) Perform a pressing and sealing process on each of the segmented openings to form an
e1)將一工作流體40填入該空腔A中並施以一除氣封管口加工。e1) Fill the cavity A with a working
本發明還具有以下功效,藉由封合焊接長度的縮短,可有效地控制均溫板在使用過程中的洩漏問題。透過毛細結構與殼座的一體製成,可解決習知之毛細結構易於剝離或脫落等不良情況。透過各散熱鰭片與殼座的一體製成,可提昇殼座和各散熱鰭片之間的導、散熱效能。The invention also has the following effects. By shortening the length of the sealing and welding, the leakage problem of the uniform temperature plate during use can be effectively controlled. The capillary structure and the housing base are made in one piece, which can solve the problem of easy peeling or falling off of the conventional capillary structure. Through the integration of the heat dissipation fins and the housing base, the conduction and heat dissipation efficiency between the housing base and the heat dissipation fins can be improved.
有關本發明之詳細說明及技術內容,配合圖式說明如下,然而所附圖式僅提供參考與說明用,並非用來對本發明加以限制者。The detailed description and technical content of the present invention are described as follows in conjunction with the drawings. However, the drawings are only provided for reference and explanation, and are not intended to limit the present invention.
請參閱圖6所示,本發明提供一種一體式均溫板製作方法,其方法步驟包括:Please refer to FIG. 6, the present invention provides a method for manufacturing an integrated temperature equalizing plate, and the method steps include:
a)以一抽伸方式形成有一殼座素材及連接在該殼座素材的複數散熱鰭片素材,並在該殼座素材內部形成有一空腔A;a) A shell base material and a plurality of heat dissipation fin materials connected to the shell base material are formed in a drawing manner, and a cavity A is formed inside the shell base material;
b)對該殼座素材和各該散熱鰭片素材做一分段切割加工,並在該空腔A的首、末端分別形成有一開口;b) Perform a segmental cutting process on the shell base material and each heat dissipation fin material, and form an opening at the first and end of the cavity A;
c)對分段後的各該開口做一壓合封口加工,而分別形成有一封口部30;以及c) Perform a pressing and sealing process on each of the segmented openings to form an
d)將一工作流體40填入該空腔A中並施以一除氣封管口加工。d) Fill the cavity A with a working
請參閱圖1至圖4所示,本發明還提供一種一體式均溫板1,其主要包括一殼座10、複數散熱鰭片20、二封口部30及一工作流體40。Referring to FIGS. 1 to 4, the present invention also provides an integrated
殼座10可為鋁、銅或其合金等導熱性良好的材料,並以一抽製延伸方式所形成,此殼座10主要包括一底板11及一頂板12,底板11為一長條形平板,頂板12則平行於底板11且配置在底板11的上方,在底板11和頂板12的兩側分別連接有一邊板13,並在底板11、頂板12和各邊板13之間圍設有一容腔A。The
各散熱鰭片20是分別自頂板12背向底板11的表面延伸形成,本實施例的各散熱鰭片20是與殼座10以前述的抽製延伸方式所形成;各散熱鰭片20除了可如上述方式形成外,亦可以在完成前述的抽製延伸後,再利用刀具以鏟削方式來成型。The
進一步地說明,在完成殼座素材和各散熱鰭片素材的抽製延伸加工後,以刀具對殼座素材和各散熱鰭片素材做分段的切割,如此可在各分段後之殼座10的首、末端二端分別形成有一開口,可將開口上方的各散熱鰭片20端部做去除加工,藉此而利於後續的壓合加工。To further explain, after completing the extraction and extension processing of the shell base material and each heat dissipation fin material, the shell base material and each heat dissipation fin material are cut in sections with a tool, so that the shell base after each section An opening is respectively formed at the first and end ends of 10, and the ends of the heat dissipation fins 20 above the opening can be removed, thereby facilitating the subsequent pressing process.
以一壓具(圖未示出)對各開口做壓合封口加工而分別形成有一封口部30,其中在壓合封口加工的過程中可預留一除氣管(圖未示出);繼之,再將工作流體40從除氣管填入前述容腔A中。A press tool (not shown in the figure) is used to press and seal each opening to form an
最後,對前述均溫板半成品施以加熱方式來進行除氣和以焊接方式封閉除氣管的管口的加工,藉以得到本發明之一體式均溫板1。Finally, the semi-finished product of the temperature equalizing plate is heated to perform degassing and the nozzle of the degassing pipe is closed by welding, so as to obtain the one-
進一步地說明,本發明之一體式均溫板1,還包括一毛細結構50,此毛細結構50可為複數槽溝51,各槽溝51可與前述殼座10以前述之抽製延伸方式所形成,各槽溝5是成型在前述底板11、頂板12和各邊板13的內壁面上。同理,毛細結構亦可為一金屬編織網,此金屬編織網是佈設在前述底板11、頂板12和各邊板13的內壁面上。To further illustrate, the one-piece
請參閱圖5所示,本發明之一體式均溫板,除了可如上述實施例外,亦可如本實施例之型態,其中此一體式均溫板1A還包括複數支撐柱60,各支撐柱60可與殼座10以前述的抽製延伸方式所形成,其是連接在前述底板11和頂板12之間且形成在前述容腔A中。另,本實施例的毛細結構50A為一金屬編織網,其是佈設在前述底板11、頂板12和各邊板13的內壁面上及各支撐柱60的表面。Please refer to FIG. 5, an integrated temperature equalizing plate of the present invention, except for the above-mentioned implementation, can also be the same as the form of this embodiment, wherein the integrated
請參閱圖7所示,本發明還提供另一種一體式均溫板製作方法,其方法步驟包括:Please refer to FIG. 7, the present invention also provides another integrated temperature equalizing plate manufacturing method, the method steps include:
a1)以一抽伸方式形成有一殼座素材,並在該殼座素材內部形成有一空腔A;a1) A housing material is formed in a drawing manner, and a cavity A is formed inside the housing material;
b1)對該殼座素材做一分段切割加工,並在該空腔A的首、末端分別形成有一開口;b1) Perform a segmental cutting process on the housing material, and form an opening at the first and end of the cavity A;
c1)在該殼座素材的一表面以一鏟削方式成型有複數散熱鰭片20;c1) A plurality of radiating
d1)對分段後的各該開口做一壓合封口加工,而分別形成有一封口部30;以及d1) Perform a pressing and sealing process on each of the segmented openings to form an
e1)將一工作流體40填入該空腔A中並施以一除氣封管口加工。e1) Fill the cavity A with a working
其中步驟c1)是可以在步驟b1)之前施作。Wherein step c1) can be performed before step b1).
綜上所述,本發明之一體式均溫板及其製作方法,確可達到預期之使用目的,而解決習知之缺失,又因極具新穎性及進步性,完全符合發明專利申請要件,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障發明人之權利。In summary, the one-body temperature equalizing plate and the manufacturing method of the present invention can indeed achieve the intended purpose of use, and solve the deficiencies of conventional knowledge. Because of its novelty and progress, it fully meets the requirements of an invention patent application. The application is filed in accordance with the Patent Law, please check carefully and grant the patent for this case to protect the rights of the inventor.
1、1A:一體式均溫板1.1A: One-piece uniform temperature plate
10:殼座10: Shell seat
11:底板11: bottom plate
12:頂板12: Top plate
13:邊板13: side board
A:容腔A: Chamber
20:散熱鰭片20: cooling fins
30:封口部30: Sealing part
40:工作流體40: working fluid
50、50A:毛細結構50, 50A: Capillary structure
51:槽溝51: Groove
60:支撐柱60: Support column
a~d:步驟a~d: steps
a1~e1:步驟a1~e1: steps
圖1 係本發明之殼座和各散熱鰭片立體外觀圖。Fig. 1 is a three-dimensional external view of the housing and the heat dissipation fins of the present invention.
圖2 係本發明之殼座和各散熱鰭片組合剖視圖。Figure 2 is a cross-sectional view of the combination of the housing and the heat dissipation fins of the present invention.
圖3 係本發明一體式均溫板立體外觀圖。Figure 3 is a perspective view of the integrated temperature equalizing plate of the present invention.
圖4 係本發明一體式均溫板組合剖視圖。Figure 4 is a cross-sectional view of the integrated temperature equalizing plate assembly of the present invention.
圖5 係本發明之另一實施例組合剖視圖。Figure 5 is a combined cross-sectional view of another embodiment of the present invention.
圖6 係本發明一體式均溫板方法流程圖。Figure 6 is a flow chart of the integrated temperature equalizing plate method of the invention.
圖7 係本發明一體式均溫板另一方法流程圖。Fig. 7 is a flowchart of another method of the integrated temperature equalizing plate of the present invention.
1:一體式均溫板 1: One-piece uniform temperature plate
10:殼座 10: Shell seat
13:邊板 13: side board
20:散熱鰭片 20: cooling fins
30:封口部 30: Sealing part
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TWI775590B (en) * | 2021-09-03 | 2022-08-21 | 營邦企業股份有限公司 | Looping flow-field heat sink |
TWI831243B (en) * | 2021-08-26 | 2024-02-01 | 雙鴻科技股份有限公司 | Heat dissipation module |
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CN104114010A (en) * | 2014-04-03 | 2014-10-22 | 东莞汉旭五金塑胶科技有限公司 | Uniform temperature plate with cooling fins |
TWI596312B (en) * | 2016-11-10 | 2017-08-21 | 展緻企業有限公司 | Vapor chamber device with integrated heat sink and method for manufacturing the same |
CN108253827B (en) * | 2016-12-28 | 2020-06-23 | 神讯电脑(昆山)有限公司 | Aluminum extrusion type hot plate and manufacturing method thereof |
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TWI831243B (en) * | 2021-08-26 | 2024-02-01 | 雙鴻科技股份有限公司 | Heat dissipation module |
TWI775590B (en) * | 2021-09-03 | 2022-08-21 | 營邦企業股份有限公司 | Looping flow-field heat sink |
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