TWI596312B - Vapor chamber device with integrated heat sink and method for manufacturing the same - Google Patents

Description

Temperature equalizing plate device with integrated radiator and method for manufacturing uniform temperature plate device

The present invention relates to a temperature equalizing plate device, and more particularly to a temperature equalizing plate device having an integrated heat sink and a method of manufacturing the temperature equalizing plate device.

Nowadays, the development of products in the technology industry tends to be more sophisticated. For example, in addition to the miniaturization of the volume design, the amount of heat generated is also greatly increased, so the heat generated during operation is also considerable. At present, various electronic heating elements are provided with corresponding heat sinks or heat sinks to maintain their normal operation at the permitted temperature. In addition, heat transfer through the heat pipe or the uniform temperature plate is also an application of the existing heat dissipation technology. The principle of the temperature plate and the heat pipe are the same, and the heat transfer effect is provided through the cyclic change of the gas and liquid phases.

Because the vapor chamber has high heat transfer capability, high thermal conductivity, light weight, simple structure and versatility, it is widely used in the heat conduction of electronic heating elements, and the heat is generated by the electronic heating elements. Quickly guide off to effectively solve the thermal accumulation phenomenon of electronic heating elements at this stage.

However, the body of the existing uniform temperature plate needs to be combined with at least two plates. If it is necessary to provide a heat sink, it is also necessary to combine the heat sink and the temperature equalizing plate by means of welding, etc., the number of components is large, the process is complicated, and the manufacturing is complicated. higher cost.

In summary, the inventors have felt that the above defects can be improved, and they have devoted themselves to research and With the application of the theory, the present invention has finally been proposed to rationally and effectively improve the above defects.

The technical problem to be solved by the present invention is to provide a temperature equalizing plate device and a method for manufacturing a temperature equalizing plate device having an integrated heat sink, wherein the number of components is reduced, the process is simplified, and the manufacturing cost can be reduced.

In order to solve the above technical problem, the present invention provides a temperature equalizing plate device having an integrated heat sink, comprising: a temperature equalizing plate integrally formed by an aluminum extrusion type, the temperature equalizing plate having a first plate body And a second plate body, the first plate body and the second plate body are located on opposite sides of the temperature equalization plate, the first plate body and the second plate body are spaced apart, and the first plate body and the first plate body are An integrally formed connection of the two sides of the second plate body, the temperature equalization plate has a first side edge and a second side edge, the first side edge and the second side edge are located on the opposite temperature plate and the opposite two a plurality of partitions are disposed between the first plate body and the second plate body, and opposite sides of the plurality of partition plates are integrally formed integrally with the inner wall of the first plate body and the second plate body a plurality of chambers formed between the first plate body and the second plate body, the chambers being separated by the partition plates, the chambers being extended by the first side of the temperature equalizing plate To the second side, the first side and the second side are sealed, and the working chamber is filled with working fluid and degassed to form a vacuum; and the radiator The average temperature of the radiator plate is integrally molded aluminum extrusion.

In order to solve the above technical problem, the present invention also provides a method for manufacturing a temperature equalizing plate device, comprising the steps of: integrally forming a temperature equalizing plate and a heat sink by an aluminum extrusion method, wherein the temperature equalizing plate has a first plate body and a second plate body, the first plate body and the second plate body are located on opposite sides of the temperature equalization plate, the first plate body and the second plate body are spaced apart, and the first plate body and the first plate body An integrally formed connection on both sides of the second plate body, the temperature equalization plate has a first side edge and a second side edge, the first side edge and the second side edge are located on opposite sides of the temperature equalization plate a plurality of partitions are disposed between the first plate body and the second plate body, and opposite sides of the plurality of partition plates are respectively integrally connected to the first plate And a plurality of chambers formed by the partition between the first plate body and the second plate body, the chambers being separated by the partition plates, the chambers being The first side of the temperature equalizing plate extends to the second side, the heat sink is integrally formed to the temperature equalizing plate; the first side of the temperature equalizing plate is sealed by welding, and then the The second side of the warming plate is sealed by welding; and the working fluid is injected into the chambers and the degassing process is performed.

The invention has the beneficial effects that the temperature equalizing plate and the heat sink of the invention are integrally formed by the aluminum extrusion type, the number of components is greatly reduced, and the assembly is not required to be laborious and time-consuming, so that the process can be simplified and the manufacturing cost can be reduced.

The temperature equalizing plate of the present invention is formed with a plurality of chambers, and the chambers are separated by a plurality of partition plates to form independent spaces. The chambers can be simultaneously injected into the working fluid by porous injection, and simultaneously performed by porous pumping. Degassing further simplifies the process and reduces manufacturing costs.

The temperature equalizing plate and the heat sink of the invention are all made of aluminum material, so that the surface of the temperature equalizing plate and the heat sink can be subjected to an anodizing process to form a desired color on the surface of the temperature equalizing plate and the heat sink.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

1‧‧‧Wall plate

11‧‧‧ first board

12‧‧‧Second plate

13‧‧‧ first side

14‧‧‧Second side

15‧‧‧Baffle

16‧‧‧ chamber

17‧‧‧Opening

2‧‧‧heatsink

21‧‧‧ Heat sink fins

3‧‧‧Surface treatment layer

4‧‧‧Filling device

5‧‧‧Exhaust device

1 is a perspective view of a temperature equalizing plate device having an integrated heat sink according to the present invention.

2 is a flow chart showing a method of manufacturing a temperature equalizing plate device of the present invention.

3 is a schematic view (1) of a method of manufacturing a temperature equalizing plate device of the present invention.

4 is a schematic view (2) of a method of manufacturing a temperature equalizing plate device of the present invention.

Fig. 5 is a schematic view (3) showing a method of manufacturing a temperature equalizing plate device of the present invention.

Fig. 6 is a schematic view (4) showing a method of manufacturing a temperature equalizing plate device of the present invention.

Figure 7 is a cross-sectional view of a temperature equalizing plate apparatus having an integrated heat sink of the present invention.

[First Embodiment]

Referring to FIG. 1 and FIG. 7 , the present invention provides a temperature equalizing plate device having an integrated heat sink, comprising a temperature equalizing plate 1 and a heat sink 2 , wherein the temperature equalizing plate 1 and the heat sink 2 are made of aluminum. The temperature equalizing plate 1 and the heat sink 2 are formed into an integrated structure by an aluminum extrusion type.

The temperature equalizing plate 1 is a plate-shaped body, and the temperature equalizing plate 1 is integrally formed by an aluminum extrusion type. The shape of the temperature equalizing plate 1 is not limited. In the embodiment, the temperature equalizing plate 1 has a square plate-like body, both of which are The warm plate 1 can be extruded by aluminum and cold drawn. The temperature equalizing plate 1 has a first plate body 11 and a second plate body 12. The first plate body 11 and the second plate body 12 are located on opposite sides of the temperature equalizing plate 1. In this embodiment, the first plate The body 11 and the second plate body 12 are all square, and the first plate body 11 and the second plate body 12 are spaced apart, and the two sides (left side and right side) of the first plate body 11 and the second plate body 12 are integrally formed. connection. The temperature equalizing plate 1 has a first side 13 and a second side 14 , and the first side 13 and the second side 14 are located on opposite sides of the temperature equalizing plate 1 .

A plurality of partitions 15 are disposed between the first plate body 11 and the second plate body 12. The partition plates 15 are spaced apart from each other, and the opposite sides (top side and bottom side) of the partition plates 15 are integrally formed integrally Connected to the inner walls of the first plate body 11 and the second plate body 12, the partition plates 15 extend from the first side edge 13 of the temperature equalization plate 1 to the second side edge 14.

A plurality of chambers 16 are formed in the interior of the temperature equalizing plate 1. The chambers 16 are located between the first plate body 11 and the second plate body 12. The chambers 16 are separated by the partition plates 15. That is, a partition 15 is disposed between each adjacent two chambers 16 to form separate spaces for the chambers 16 respectively. In this embodiment, the chambers 16 have a substantially elliptical cross section, but are not limited. The chambers 16 extend from the first side 13 of the temperature equalizing plate 1 to the second side 14 , that is, The chambers 16 form an elongated space that allows the chamber 16 to contain the desired working fluid for cyclical changes in the gas and liquid phases. Provide heat transfer.

The partitions 15 can also function as a support structure for supporting the first plate body 11 and the second plate body 12 in addition to partitioning the chambers 16 to avoid A plate body 11 and a second plate body 12 are deformed and collapsed, so that the temperature equalizing plate 1 has better strength.

The temperature equalizing plate 1 is formed by extrusion of aluminum. The first side 13 and the second side 14 of the temperature equalizing plate 1 are open at the time of molding, and must be sealed by welding or the like to make the chambers. 16 can form a confined space. The temperature equalizing plate 1 can be provided with a plurality of openings 17 (as shown in FIG. 4), which can be used to fill a working fluid (such as acetone) and degassing (vacuum), and can also be porous in the chambers 16. At the same time, the working fluid and the porous body are injected while degassing, and after filling the working fluid and the degassing is completed, the openings 17 are sealed.

The heat sink 2 and the temperature equalizing plate 1 are integrally formed by an aluminum extrusion type. In the embodiment, the heat sink 2 is integrally formed integrally with the first plate body 11 of the temperature equalizing plate 1, that is, the heat sink 2 is integrally formed. It is connected to the outer wall of the first plate body 11 of the temperature equalizing plate 1. The heat sink 2 can include a plurality of heat dissipation fins 21 , and the heat dissipation fins 21 can be elongated. The heat dissipation fins 21 can extend to the first side 13 and the second side 14 . However, the shape of the heat sink 2 is not limited and may be changed as needed. For example, the heat dissipation fins 21 may be processed into a columnar shape or other shapes. In addition, the surfaces of the temperature equalizing plate 1 and the heat sink 2 may also be subjected to a plating, baking or anodizing process, and a surface treatment layer 3 is formed on the surfaces of the temperature equalizing plate 1 and the heat sink 2 to increase the appearance.

[Second embodiment]

Referring to FIG. 2, the present invention further provides a method for manufacturing a temperature equalizing plate device, which comprises the following steps: First, a uniform temperature plate 1 and a heat sink 2 (shown in FIG. 1) are integrally formed by aluminum extrusion. That is, the uniform temperature plate 1 and the heat sink 2 are extruded by using an aluminum ingot as a material, and further cold drawing processing can be performed after extrusion molding, so that the temperature equalizing plate 1 and the heat sink 2 can be more accurately shaped. Then, the extruded temperature equalizing plate 1 and the heat sink 2 can pass through The effect processing (reheat treatment) process, after the cutting process, can be cut by the clamp to form the temperature equalizing plate 1 and the heat sink 2 to a desired length. In addition, it can also be subjected to a degreasing cleaning process and a baking process.

The temperature equalizing plate 1 has a first plate body 11 and a second plate body 12, and the first plate body 11 and the second plate body 12 are spaced apart, and the two sides of the first plate body 11 and the second plate body 12 are integrated In the formed connection, the temperature equalization plate 1 has a first side 13 and a second side 14. A plurality of partition plates 15 are disposed between the first plate body 11 and the second plate body 12, and opposite sides of the partition plates 15 are integrally formed integrally with the inner walls of the first plate body 11 and the second plate body 12, respectively. . A plurality of chambers 16 are formed in the interior of the temperature equalizing plate 1. The chambers 16 are located between the first plate body 11 and the second plate body 12. The chambers 16 are separated by the partition plates 15 to form an independent Space. The heat sink 2 is integrally connected to the first plate body 11 of the temperature equalization plate 1 , and the heat sink 2 may include a plurality of heat dissipation fins 21 .

Then, the first side 13 of the temperature equalizing plate 1 is sealed by welding (aluminum welding) (as shown in FIG. 3), so that one end of the chambers 16 is sealed, and then, for the temperature equalizing plate 1 The one side 13 is tested for leak prevention. If the first side 13 of the temperature equalizing plate 1 is not sealed, the welding method can be used to reinforce. After the first side 13 of the temperature equalizing plate 1 is sealed, the sealing can be further performed. The metal powder may be disposed on the inner wall of the first plate body 11 and the second plate body 12 and the wall surface of the partition plate 15, and the metal powder may be fixed to the first plate body 11 by sintering or the like. And the inner wall of the second plate body 12 and the wall surface of the partition plate 15 to improve the heat transfer efficiency and speed of the temperature equalizing plate 1.

Next, the second side 14 of the temperature equalizing plate 1 is sealed by welding (aluminum welding) (as shown in FIG. 4) such that the other end of the chambers 16 is substantially sealed. The temperature equalizing plate 1 can be provided with a plurality of openings 17 respectively communicating with the chambers 16, the openings 17 can be used to fill the working fluid, and the working fluid can utilize the filling device 4 (as shown in the figure) Filled in the chambers 16 as shown in FIG. The working fluid is a working fluid having a low boiling point, and the working fluid may be pure water, methanol, refrigerant, acetone or ammonia, thereby utilizing the phase change of the working fluid to achieve rapid heat transfer and soaking. In the present embodiment, the working fluid is acetone. The openings 17 can also be subjected to a degassing process, and the degassing process can include one degassing and secondary degassing, and one degassing can be a vacuuming process, and the pumping device 5 can be utilized (as shown in FIG. 6). The chambers 16 are subjected to a vacuuming process. The secondary degassing can be a heating process, so that a vacuum state can be reliably formed in the temperature equalizing plate 1. In this embodiment, the chambers 16 can simultaneously inject the working fluid through the openings 17 , and the chambers 16 can simultaneously degas through the openings 17 to form the chambers 16 . Vacuum state. After the filling of the working fluid and the degassing are completed, the openings 17 are sealed by welding or the like to form the chambers 16 into a sealed shape (as shown in FIG. 7).

Finally, the process of maximum heat flux (QMAX) test, water temperature test and explosion-proof test can be further carried out, and the surface of the temperature equalizing plate 1 and the heat sink 2 can be further electroplated, painted or anodized to make the temperature uniform. The surface of the board 1 and the heat sink 2 is formed with a surface treatment layer 3 to enhance the appearance.

The temperature equalizing plate and the heat sink of the invention are integrally formed by an aluminum extrusion type, and the number of components thereof is greatly reduced, and the assembly is not required to be laborious and time-consuming, so that the process can be simplified and the manufacturing cost can be reduced.

Furthermore, the temperature equalizing plate of the present invention has a plurality of chambers formed therein, and the chambers are separated by a plurality of partition plates to form independent spaces. The chambers can be injected into the working fluid at the same time by porous injection, or can be pneumatically pumped. By degassing at the same time, the process can be simplified and the manufacturing cost can be reduced.

In addition, since the temperature equalizing plate and the heat sink of the present invention are all made of aluminum, the surface of the temperature equalizing plate and the heat sink can be subjected to an anodizing process to form a desired color on the surfaces of the temperature equalizing plate and the heat sink.

The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, equivalent changes made by using the description of the present invention and the contents of the drawings are all included in the scope of protection of the present invention. Inside.

1‧‧‧Wall plate

11‧‧‧ first board

12‧‧‧Second plate

13‧‧‧ first side

14‧‧‧Second side

15‧‧‧Baffle

16‧‧‧ chamber

2‧‧‧heatsink

21‧‧‧ Heat sink fins

Claims (10)

A temperature equalizing plate device having an integrated heat sink comprises: a temperature equalizing plate integrally formed by an aluminum extrusion type, the temperature equalizing plate having a first plate body and a second plate body, the first The plate body and the second plate body are located on opposite sides of the temperature equalizing plate, the first plate body and the second plate body are spaced apart, and the first plate body and the second plate body are integrally formed on both sides The first temperature plate has a first side and a second side, and the first side and the second side are located on opposite sides of the temperature equalizing plate, the first board and the first side A plurality of partitions are disposed between the two boards, and opposite sides of the partitions are integrally formed integrally with the inner walls of the first board and the second board, the first board and the second Forming a plurality of chambers between the plates, the chambers being partitioned by the partitions, the chambers extending from the first side of the temperature equalizing plate to the second side, the first side The side and the second side are sealed, and the working chamber is filled with a working fluid and degassed to form a vacuum; and the heat sink, the heat sink and the temperature equalizing plate are extruded in an aluminum manner Molding. The temperature equalizing plate device with an integrated heat sink according to claim 1, wherein the heat sink is integrally formed integrally with the first plate body of the temperature equalizing plate, and the heat sink comprises a plurality of heat dissipating fins. The heat dissipation fins extend to the first side and the second side. A temperature equalizing plate device having an integrated heat sink according to claim 1, wherein the temperature equalizing plate and the surface of the heat sink are formed with a surface treatment layer. The temperature equalizing plate device as claimed in claim 1 , wherein the temperature equalizing plate is provided with a plurality of openings, wherein the openings are respectively connected to the chambers, and the chambers pass through the plurality of openings The opening is injected into the working fluid and degassed to form a vacuum, and the openings are sealed after the working fluid is filled and the degassing is completed. A method for manufacturing a temperature equalizing plate device, comprising the steps of: integrally forming a temperature equalizing plate and a heat sink by an aluminum extrusion method, wherein the temperature equalizing plate has a first plate body and a second plate body, the first plate The second plate body and the second plate body are located on opposite sides of the temperature equalizing plate, the first plate body and the second plate body are spaced apart, and the first plate body and the second plate body are integrally formed on both sides thereof. Connection, the temperature equalization plate has a first a first side and a second side, the first side and the second side are located on opposite sides of the temperature equalizing plate, and the first board and the second board are provided with a plurality of partitions The two opposite sides of the partition plate are integrally connected to the inner wall of the first plate body and the second plate body, and a plurality of chambers are formed between the first plate body and the second plate body. The chambers are separated by the partitions, the chambers extending from the first side of the temperature equalizing plate to the second side, the heat sink integrally connected to the temperature equalizing plate; The first side of the temperature equalizing plate is sealed by welding, and the second side of the temperature equalizing plate is sealed by welding; and the working fluid is injected into the chambers and the degassing process is performed. The method for manufacturing a temperature equalizing plate device according to claim 5, wherein the temperature equalizing plate and the heat sink are extruded by using an aluminum ingot as a material, and further subjected to a cold drawing processing and a time-sensitive processing process after extrusion molding, and then Cutting process, degreasing cleaning process and baking process. The method for manufacturing a temperature equalizing plate device according to claim 5, wherein the first plate body and the inner wall of the second plate body and the wall surface of the partition plates are provided with metal powder. The method of manufacturing a temperature equalizing plate device according to claim 5, wherein the temperature equalizing plate is provided with a plurality of openings, wherein the openings are respectively connected to the chambers, and the chambers are injected through the openings The working fluid is degassed, and after filling the working fluid and degassing, the openings are sealed. The method for manufacturing a temperature equalizing plate device according to claim 8, wherein the degassing process comprises a primary degassing and a secondary degassing, the primary degassing is a vacuuming process, and the secondary degassing is a heating process, The chambers simultaneously inject the working fluid through the openings, and the chambers simultaneously degas through the openings. The method for manufacturing a temperature equalizing plate device according to claim 5, wherein the temperature equalizing plate and the surface of the heat sink are plated, painted or anodized to form a surface treatment layer on the surface of the temperature equalizing plate and the heat sink. .