M378618 四、指定代表圖·· (一) 本案指定代表圖為：第（一）圖。 (二) 本代表圖之元件符號簡單說明： 均溫板1 第一表面11 第二表面12 容置空間13 支撐柱14 毛細結構15 散熱液16 散熱組件2 導熱板21 散熱鰭片組22 五、新型說明： 【新型所屬之技術領域】 本創作係有關一種均溫板散熱裝置，尤指一種提供發 熱體散熱之均溫板散熱裝置。 【先前技術】 按，在電子產品朝向更輕薄、快速化、多功能與節能 環保的需求下，CPU及GPU的發熱量愈來愈高，高功率的 LED照明也有材料發光效率不足、散熱技術無法突破的瓶 頸而影響LED壽命，然而常見的散熱方式，其主要包括一 基板、一絕緣層、一導電層以及複數LED ;該絕緣層形成 於該基板之一表面；該導電層形成於該絕緣層上，並與該 基板電性隔離，該導電層具有一第一電極以及一第二電 極；該等LED分別設於該絕緣層上，該LED具有電連接該 M378618 第一電極的一第一接腳以及電連接該第二電極的一第二 接腳；藉此’以構成此led導熱結構。 使用此LED導熱結構時，該等LED經由該第一及第 二電極通電後’該等LED即產生出光能及熱能，其光能則 照射出’而熱能則經由該絕緣層傳導至該基板上，再以該 基板導離該等LED所產生之熱能。 然而’習知的LED導熱結構，在實際使用上仍存在 有以下的缺失，因該基板熱傳導速率慢且導熱效果有限， 且該熱能十分容易集中於LED與基板接觸之部位，而無法 有效將熱能平均分佈於基板表面，俾影響該LED之散熱效 月t*，並會降低該led使用的壽命。 有鑑於此，本創作人係為改善並解決上述之缺失， 乃特潛心研究並配合學理之運用，終於提出一種設計合理 且有效改善上述缺失之本創作。 【新型内容】 有鐘於此’本創作即在提供一種均溫板散熱裝置，尤 指一種提供發熱體散熱之均溫板散熱裝置，為其主要目的 者。 為達上揭目的，本創作之均溫板散熱裝置係至少包括 有：一均溫板、一散熱組件以及至少一固定組件，該均溫 板设有相對之第一、第二表面，該第一表面係用以設置發 熱體，該散熱組件係設有一導熱板，該導熱板上並設有複 數散熱鰭片组，而該散熱組件係藉由該導熱板設置於該均 3 M378618 溫板之第二表面，該均溫板與散熱組件間係藉由固定組件 相立組裝固定’而均溫板上所設置之發熱體（可以為發光 二極體、CPU、GPU等電子元件）工作所發出之熱源’可藉 由該均溫板之作用將熱源佈滿整個均溫板板體，並利用散 熱組件將熱源加以散去，以確保發熱體之工作壽命。 [實施方式】 本創作之特點，可參閱本案圖式及實施例之詳細說明 而獲得清楚地瞭解。 如第一圖及第二圖所示，本創作之均溫板散熱裝置， 係至少包括有：一均溫板卜該均溫板丨設有相對之第一表 面11及第二表面12,該第一表面11係用以設置發熱體（可 以為發光二極體、CPU、GPU等電子元件），該均溫板之第 一、第二表面11、12之間設有一封閉式容置空間13，請同 時參閱第三圖所示，且該容置空間13内係設有複數抵持於 第一、第二表面11、12間之支撐柱14,該容置空間13之内 壁面設有毛細結構15，該毛細結構15可以為金屬網，且該 容置空間13内填充有散熱液16 ; 一散熱組件2，該散熱組 件2係設有一導熱板21，該導熱板21上並設有複數散熱鰭 片組22 ’而該散熱組件2係藉由該導熱板21設置於該均溫 板之第二表面12’其中，該散熱鰭片組22係設有複數平行 排列之散熱鰭片221’各散熱鰭片221間係形成有第一散熱 通道222’各散熱鰭片組22間並形成有第二散熱通道223， 藉由該第一第二散熱通道222、223可增加散熱效果；至少 M378618 一固定組件3，設於均溫板1與散熱組件2之間，如圖所示 之實施例中該固定組件3可為螺絲；當然，該固定組件亦 可以為導熱膠，用以固定均溫板與散熱組件。 本創作之均溫板散熱裝置可應用於發光二極體中，該 均溫板之第一表面11上可設置至少一發光二極體4，如第 四圖所示，該發光二極體4一側設有金屬基板41 (可為銀材 質），而該第一表面11上並設有複數與該金屬基板41形狀 尺寸大小相對之凹槽111，該發光二極體4係藉由該金屬基 鲁板41設置於該第一表面之凹槽111中，而達到定位之效果。 當發光二極體4發光工作時，如第五圖所示，該均溫 板之第一表面11係貼合於發光二極體4之底面，此時發 光二極體4所發出之熱能會由均溫板1所吸收，且均溫板 1吸收熱能後，會對容置空間13内的散熱液16進行加 熱，而由於容置空間13内呈接近真空狀態，因此散熱液 16的沸點會降低，並因毛細結構15增加了散熱液16的 接觸面積，所以散熱液16會快速的沸騰並產生蒸氣，而 籲_此蒸氣快速上升並接觸到毛細結構15，並將蒸氣之熱能 .由毛細結構15傳導至第二表面12，再由第二表面12傳 導至散熱鰭片組22，而由複數散熱鰭片221與空氣做熱 交換以將熱能散去，且當蒸氣之熱能由毛細結構15吸收 後，會轉化為散熱液16並落回容置空間13之第一表面 11，再繼續受均溫板1加熱，藉此即可快速且不斷的將均 溫板1所吸收之熱能快速帶離均溫板1，使均溫板1可吸 收更多發光二極體4所發出之熱能。 5 M378618 值得一提的是，本創作之均溫板係以面接觸方式與發 熱體接觸，可將發熱體之工作熱源佈滿整個均溫板板體， 而該均溫板並以面接觸方式與散熱組件接觸，可利用散熱 組件將熱源加以散去，以確保發熱體之工作壽命。 綜上所述，本創作提供一較佳可行之均溫板散熱裝 置，爰依法提呈新型專利之申請；本創作之技術内容及技 術特點巳揭示如上，然而熟悉本項技術之人士仍可能基於 本創作之揭示而作各種不背離本案創作精神之替換及修 飾。因此，本創作之保護範圍應不限於實施例所揭示者， 而應包括各種不背離本創作之替換及修飾，並為以下之申 請專利範圍所涵蓋。 【圖式簡單說明】 第一圖係為本創作中均溫板散熱裝置之結構示意圖。 第二圖係為本創作中均溫板散熱裝置之結構立體圖。 第三圖係為本創作中均溫板之結構分解圖。 第四圖係為本創作中均溫板散熱裝置之結構分解.圖。 第五圖係為本創作中均溫板散熱裝置之使用狀態參考圖。 M378618 【主要元件符號說明】 均溫板1 第一表面11 第二表面12 容置空間13 支撐柱14 毛細結構15 散熱液16 •散熱組件2 導熱板21 散熱鰭片組22 散熱鰭片221 第一散熱通道222 第二散熱通道223 固定組件3 發光二極體4 _.金屬基板41M378618 IV. Designation of Representative Representatives (1) The representative representative of the case is: (1). (2) The symbol of the symbol of the representative figure is briefly described: the temperature equalizing plate 1 the first surface 11 the second surface 12 the accommodating space 13 the supporting column 14 the capillary structure 15 the heat dissipating liquid 16 the heat dissipating component 2 the heat conducting plate 21 the heat dissipating fin group 22 New description: [New technical field] This creation is related to a uniform temperature plate heat sink, especially a heat spreader that provides heat dissipation for the heating body. [Prior Art] According to the demand for lighter, thinner, more versatile, energy-saving and environmentally friendly products, CPU and GPU heat generation is getting higher and higher. High-power LED lighting also has insufficient material luminous efficiency and heat dissipation technology. A breakthrough bottleneck affects the life of the LED. However, a common heat dissipation method mainly includes a substrate, an insulating layer, a conductive layer, and a plurality of LEDs; the insulating layer is formed on a surface of the substrate; the conductive layer is formed on the insulating layer And electrically isolated from the substrate, the conductive layer has a first electrode and a second electrode; the LEDs are respectively disposed on the insulating layer, and the LED has a first connection electrically connecting the first electrode of the M378618 a foot and a second pin electrically connected to the second electrode; thereby constituting the LED heat conducting structure. When the LED thermal conduction structure is used, after the LEDs are energized via the first and second electrodes, the LEDs generate light energy and thermal energy, and the light energy is emitted, and the thermal energy is transmitted to the substrate via the insulating layer. And the substrate is guided away from the thermal energy generated by the LEDs. However, the conventional LED heat conduction structure still has the following defects in practical use, because the substrate has a slow heat conduction rate and a limited heat conduction effect, and the heat energy is easily concentrated on the portion where the LED contacts the substrate, and the heat energy cannot be effectively performed. It is evenly distributed on the surface of the substrate, which affects the heat dissipation effect t* of the LED and reduces the lifetime of the LED. In view of this, the creator has improved and solved the above-mentioned shortcomings, and has devoted himself to researching and cooperating with the application of theory, and finally proposed a creation that is reasonable in design and effective in improving the above-mentioned defects. [New content] There is a clock here. This creation is to provide a temperature-dissipating heat sink, especially a heat-dissipating heat sink with a heat-generating body, which is the main purpose. In order to achieve the above, the present uniform temperature plate heat dissipating device comprises at least: a temperature equalizing plate, a heat dissipating component and at least one fixing component, wherein the temperature equalizing plate is provided with a first and second surface, the first A heat dissipating component is disposed on the heat dissipating component, and the heat dissipating component is provided with a plurality of heat dissipating fin sets, and the heat dissipating component is disposed on the average 3 M378618 warming plate by the heat conducting plate The second surface, the temperature equalizing plate and the heat dissipating component are assembled and fixed by the fixing component, and the heating element (which can be an electronic component such as a light emitting diode, a CPU, a GPU, etc.) provided on the temperature equalizing plate is issued. The heat source 'brings the heat source to cover the entire temperature plate body by the action of the temperature equalizing plate, and dissipates the heat source by using the heat dissipation component to ensure the working life of the heat generating body. [Embodiment] The features of this creation can be clearly understood by referring to the detailed description of the drawings and the examples. As shown in the first figure and the second figure, the uniform temperature plate heat dissipating device of the present invention comprises at least: a temperature equalizing plate, wherein the temperature equalizing plate is provided with a first surface 11 and a second surface 12 opposite to each other, The first surface 11 is configured to provide a heating element (which may be an electronic component such as a light emitting diode, a CPU, a GPU, etc.), and a closed accommodating space 13 is disposed between the first and second surfaces 11 and 12 of the temperature equalizing plate. Please refer to the third figure at the same time, and the accommodating space 13 is provided with a plurality of support columns 14 that are resisted between the first and second surfaces 11 and 12, and the inner wall of the accommodating space 13 is provided with capillary The structure 15 may be a metal mesh, and the accommodating space 13 is filled with a heat dissipating liquid 16; a heat dissipating component 2 is provided with a heat conducting plate 21, and the heat conducting plate 21 is provided with a plurality of heat conducting plates 21 The heat dissipation fin assembly 22 is disposed on the second surface 12 ′ of the temperature equalization plate, and the heat dissipation fin assembly 22 is provided with a plurality of heat dissipation fins 221 ′ that are arranged in parallel. Each of the heat dissipation fins 221 is formed with a first heat dissipation channel 222 ′ between each of the heat dissipation fin groups 22 and formed with a second The heat dissipation channel 223 can increase the heat dissipation effect by the first and second heat dissipation channels 222 and 223; at least the M378618 a fixing component 3 is disposed between the temperature equalization plate 1 and the heat dissipation component 2, as shown in the embodiment shown in the figure. The fixing component 3 can be a screw; of course, the fixing component can also be a thermal adhesive for fixing the temperature equalizing plate and the heat dissipating component. The uniform temperature plate heat dissipating device of the present invention can be applied to the light emitting diode, and at least one light emitting diode 4 can be disposed on the first surface 11 of the temperature equalizing plate, as shown in the fourth figure, the light emitting diode 4 A metal substrate 41 (which may be made of silver) is disposed on one side, and the first surface 11 is provided with a plurality of grooves 111 opposite to the shape and size of the metal substrate 41. The light emitting diode 4 is made of the metal The base plate 41 is disposed in the groove 111 of the first surface to achieve the positioning effect. When the illuminating diode 4 is illuminated, as shown in the fifth figure, the first surface 11 of the tempering plate is attached to the bottom surface of the illuminating diode 4, and the thermal energy emitted by the illuminating diode 4 is After being absorbed by the temperature equalizing plate 1, and the temperature equalizing plate 1 absorbs heat energy, the heat radiating liquid 16 in the accommodating space 13 is heated, and since the accommodating space 13 is in a vacuum state, the boiling point of the heat radiating liquid 16 is Lowering, and because the capillary structure 15 increases the contact area of the heat-dissipating liquid 16, the heat-dissipating liquid 16 will boil rapidly and generate steam, and the vapor rapidly rises and contacts the capillary structure 15, and the thermal energy of the vapor is caused by the capillary. The structure 15 is conducted to the second surface 12 and is then conducted by the second surface 12 to the heat sink fin group 22, and heat is exchanged from the plurality of heat sink fins 221 to dissipate heat energy, and when the heat of the vapor is transferred by the capillary structure 15 After absorption, it will be converted into the heat dissipating liquid 16 and fall back to the first surface 11 of the accommodating space 13, and then continue to be heated by the temperature equalizing plate 1, thereby rapidly and continuously heating the heat energy absorbed by the temperature equalizing plate 1. From the uniform temperature plate 1, the temperature equalizing plate 1 can absorb more light 4 heat energy emitted by the diode. 5 M378618 It is worth mentioning that the uniform temperature plate of this creation is in contact with the heating element by surface contact, and the working heat source of the heating element can be covered with the whole temperature uniform plate body, and the temperature equalizing plate is in surface contact manner. In contact with the heat dissipating component, the heat source can be used to dissipate the heat source to ensure the working life of the heating element. In summary, the present invention provides a better and feasible uniform temperature plate heat sink device, and submits a new patent application according to law; the technical content and technical features of the present invention are disclosed above, but those skilled in the art may still be based on The disclosure of this creation is a variety of alternatives and modifications that do not depart from the spirit of the creation of this case. Therefore, the scope of protection of this creation should not be limited to those disclosed in the examples, but should include various alternatives and modifications that do not depart from the present invention and are covered by the following patent claims. [Simple description of the diagram] The first diagram is a schematic diagram of the structure of the uniform temperature plate heat dissipation device in the creation. The second picture is a perspective view of the structure of the uniform temperature plate heat sink in the creation. The third picture is a structural exploded view of the uniform temperature plate in this creation. The fourth picture is the structural decomposition of the uniform temperature plate heat dissipation device in this creation. The fifth figure is a reference diagram of the use state of the uniform temperature plate heat sink in the creation. M378618 [Main component symbol description] Temperature equalizing plate 1 First surface 11 Second surface 12 accommodating space 13 Support column 14 Capillary structure 15 Heat sink 16 • Heat dissipating component 2 Heat conducting plate 21 Heat sink fin group 22 Heat sink fin 221 First Heat dissipation channel 222 second heat dissipation channel 223 fixing component 3 light emitting diode 4 _. metal substrate 41