TWM502818U - Heat sink with hidden isothermal plate - Google Patents

Heat sink with hidden isothermal plate Download PDF

Info

Publication number
TWM502818U
TWM502818U TW104200952U TW104200952U TWM502818U TW M502818 U TWM502818 U TW M502818U TW 104200952 U TW104200952 U TW 104200952U TW 104200952 U TW104200952 U TW 104200952U TW M502818 U TWM502818 U TW M502818U
Authority
TW
Taiwan
Prior art keywords
heat
heat sink
extruded
type
uniform temperature
Prior art date
Application number
TW104200952U
Other languages
Chinese (zh)
Inventor
Sin-Wei He
Chih-Ren Huang
Original Assignee
Forcecon Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Forcecon Technology Co Ltd filed Critical Forcecon Technology Co Ltd
Priority to TW104200952U priority Critical patent/TWM502818U/en
Publication of TWM502818U publication Critical patent/TWM502818U/en

Links

Description

具隱藏式均溫板之散熱器Radiator with hidden uniform temperature plate

本創作係涉及一種散熱器;特別是指一種具有隱藏式均溫板之散熱器創新結構型態揭示者。The present invention relates to a heat sink; in particular, to a revealer of an innovative structural type of a heat sink having a hidden uniform temperature plate.

按,習知散熱器結構設計上,通常廣泛採用導熱性較佳的金屬塊體(如鋁塊)作為主要散熱介質,散熱器通常設有一受熱面以供發熱源組設貼觸。According to the conventional heat sink structure design, a metal block (such as an aluminum block) having better thermal conductivity is generally widely used as a main heat dissipating medium, and the heat sink is usually provided with a heat receiving surface for the heat source to be placed in contact with each other.

為使該發熱源之熱溫導出時能夠獲得快速平均擴散的效果,遂有業界於散熱器的受熱面上再組裝一均溫板,以利用該均溫板的均熱功能來達到前述效果;惟查,此種習知結構於實際應用經驗中發現仍舊存在一些問題與缺弊,舉例而言,當前述習知散熱座的受熱面組設有均溫板時,其均溫板係呈現凸出狀,從而導致散熱座之受熱面整體呈凹凸不平整型態,如此一來,當應用作為LED燈具的散熱結構時,對於LED的組裝設置而言顯然頗為不便,概因所述LED的設置型態相當多元,除了LED的電路基板的型態變化之外,還有設置數量的變化性存在,相對而言,也導致均溫板的設置頗為不便的問題。In order to obtain the effect of rapid average diffusion when the heat temperature of the heat source is derived, the industry has reassembled a temperature equalizing plate on the heating surface of the heat sink to utilize the soaking function of the temperature equalizing plate to achieve the aforementioned effect; However, it is found that this kind of conventional structure still has some problems and shortcomings in practical application experience. For example, when the heating surface of the conventional heat sink is provided with a temperature equalizing plate, the uniform temperature plate is convex. The appearance of the heat sink is such that the heat-receiving surface of the heat sink has an uneven shape. Therefore, when applied as a heat dissipation structure of the LED lamp, it is obviously inconvenient for the assembly of the LED, which is due to the LED. The setting type is quite diverse, and in addition to the type change of the circuit board of the LED, there is a variability in the number of settings, and relatively speaking, the setting of the temperature equalizing plate is rather inconvenient.

是以,針對上述習知散熱器結構所存在之問題點,如何研發出一種能夠更具理想實用性之創新構造,實有待相關業界再加以思索突破之目標及方向者。Therefore, in view of the problems existing in the above-mentioned conventional radiator structure, how to develop an innovative structure that can be more ideal and practical, and the relevant industry should further consider the goal and direction of breakthrough.

有鑑於此,創作人本於多年從事相關產品之製 造開發與設計經驗,針對上述之目標,詳加設計與審慎評估後,終得一確具實用性之本創作。In view of this, the creator has been engaged in the manufacturing development and design experience of related products for many years. After detailed design and careful evaluation, the author has finally achieved a practical and practical creation.

本創作之主要目的,係在提供一種具隱藏式均溫板之散熱器,其所欲解決之技術問題,係針對如何研發出一種更具理想實用性之新式散熱器結構為目標加以思索創新突破。The main purpose of this creation is to provide a heat sink with a hidden uniform temperature plate. The technical problem to be solved is to think about how to develop a new radiator structure with more ideal and practicality. .

本創作解決問題之技術特點,在於所述散熱器係包括:一擠型散熱座,包括一散熱部以及可供至少一發熱源組設貼觸之一熱源組設面,其中該散熱部係一體式擠出形成有間隔設置的散熱鰭片,各散熱鰭片之間相對界定形成貫穿擠型散熱座二端向之擠型溝槽;至少一內凹式均溫腔,凹設於擠型散熱座之熱源組設面供發熱源組設部位,該內凹式均溫腔內部容設有支撐體、毛細組織以及工作液,頂端則藉由一蓋板加以蓋合封閉而形成一真空密閉腔室;焊接結合部,設於蓋板周邊與內凹式均溫腔之間呈環狀型態,該焊接結合部係藉以令蓋板之蓋合達到封閉與密合狀態,俾能藉由該內凹式均溫腔、支撐體、毛細組織、工作液、蓋板及焊接結合部構成一隱藏式均溫板構造;且其中,該蓋板頂面與擠型散熱座之熱源組設面之間係呈現高度相同、平順銜接之平整面型態。The technical feature of the present invention is that the heat sink comprises: an extruded heat sink, comprising a heat dissipating portion and a heat source group surface for at least one heat source group to be contacted, wherein the heat sink portion is integrated Extrusion forming a heat dissipating fin disposed at intervals, each of the heat dissipating fins is oppositely defined to form an extruded groove extending through the end of the extruded heat sink; at least one recessed uniform temperature chamber is recessed in the extruded heat sink The heat source group of the seat is provided with a heat source assembly portion, and the concave concave temperature chamber is provided with a support body, a capillary structure and a working fluid, and the top end is closed and closed by a cover plate to form a vacuum sealed chamber. The welding joint portion is disposed in an annular shape between the periphery of the cover plate and the concave-type uniform temperature chamber, and the welded joint portion is used for closing and sealing the cover plate, thereby The concave uniform temperature chamber, the support body, the capillary structure, the working fluid, the cover plate and the welded joint portion constitute a hidden type uniform temperature plate structure; and wherein the top surface of the cover plate and the heat source group of the extruded heat sink seat are provided The flatness is the same, smooth and flat States.

本創作之效果與優點,主要是藉由其擠型散熱座之熱源組設面整合所述內凹式均溫腔之技術特徵,以當散熱器應用作為LED燈具的散熱結構時,因為其擠型散熱座的熱源組設面連同蓋板頂面係呈一平整面型態,所以能夠大幅增進LED組裝設置的便利性,以及均溫板結構設置的便利性而特具實用進步效益。The effect and advantages of the present invention are mainly to integrate the technical features of the concave-type uniform temperature chamber by the heat source assembly surface of the extruded heat sink, so that when the heat sink is applied as the heat dissipation structure of the LED lamp, because of its extrusion The heat source assembly surface of the type heat sink and the top surface of the cover plate have a flat surface type, so that the convenience of assembling the LED assembly and the convenience of the uniform temperature plate structure setting are greatly improved, and the utility model has the practical and progressive benefits.

請參閱第1、2、3圖所示,係本創作具隱藏式均溫板之散熱器之較佳實施例,惟此等實施例僅供說明之用,在專利申請上並不受此結構之限制;所述散熱器A係包括下述構成:一擠型散熱座10 (可為鋁擠型塊體),包括一散熱部11以及可供至少一發熱源05組設貼觸之一熱源組設面12,其中該散熱部11係一體式擠出形成有間隔設置的散熱鰭片13,各散熱鰭片13之間相對界定形成貫穿擠型散熱座10二端向之擠型溝槽14;至少一內凹式均溫腔21,凹設於擠型散熱座10之熱源組設面12供發熱源05組設部位,該內凹式均溫腔21內部容設有支撐體22、毛細組織23以及工作液24,頂端則藉由一蓋板25加以蓋合封閉而形成一真空密閉腔室;焊接結合部30,設於蓋板25周邊與內凹式均溫腔21之間呈環狀型態,該焊接結合部30係藉以令蓋板25之蓋合達到封閉與密合狀態,俾能藉由該內凹式均溫腔21、支撐體22、毛細組織23、工作液24、蓋板25及焊接結合部30構成一隱藏式均溫板20構造;且其中,該蓋板25頂面與擠型散熱座10之熱源組設面12之間係呈現高度相同平順銜接之平整面型態(如第3圖所示)。Please refer to Figures 1, 2 and 3 for a preferred embodiment of the heat sink with a hidden uniform temperature plate. However, these embodiments are for illustrative purposes only and are not subject to this structure in patent applications. The heat sink A includes the following components: an extruded heat sink 10 (which may be an aluminum extruded block), including a heat dissipating portion 11 and a heat source for contacting at least one heat source 05 The heat dissipating portion 11 is formed integrally with the heat dissipating fins 13 , and the heat dissipating fins 13 are oppositely defined to form a squeezing groove 14 extending through the end of the extruded heat sink 10 . At least one recessed uniform temperature chamber 21, recessed in the heat source assembly surface 12 of the extruded heat sink 10 for the heat source 05 assembly portion, the concave concave temperature chamber 21 is internally provided with a support body 22, capillary The structure 23 and the working fluid 24 are closed by a cover plate 25 to form a vacuum sealed chamber; the welded joint portion 30 is disposed between the periphery of the cover plate 25 and the concave concave temperature chamber 21 In the form of the welding joint 30, the cover of the cover plate 25 is brought into a closed and tight state, and the recessed type can be The cavity 21, the support body 22, the capillary structure 23, the working fluid 24, the cover plate 25 and the welded joint 30 form a concealed temperature equalizing plate 20 structure; and wherein the top surface of the cover plate 25 and the heat source of the extruded heat sink 10 Between the set faces 12, the flat faces of the same height are smoothly connected (as shown in Fig. 3).

如第3、4圖所示,其中該散熱器A更可包括至少二插組式散熱薄板40 (可為銅質板片),所述插組式散熱薄板40呈間隔排列且延伸擴大之型態插組定位於擠型散熱座10的散熱部11,所述插組式散熱薄板40之厚度為介於0.2mm至0.9mm之間的薄板型態,各插組式散熱薄板40設有間隔配置的嵌插片41用以對應嵌插配合於散熱鰭片13之間形成的擠型溝槽14,並構成各插組式散熱薄板40係為朝擠型散熱座10二側向延伸設置之型態,且各插組式散熱薄板40之間係形成側向通風流道50;且插組式散熱薄板40的至少局部嵌插片41與相對應的擠型溝槽14槽底之間更留設有通風間隙60,所述通風間隙60與擠型散熱座10之擠型溝槽14相通而形成端向通風流道。As shown in FIG. 3 and FIG. 4 , the heat sink A further includes at least two interposer heat dissipation sheets 40 (which may be copper sheets), and the interposer type heat dissipation sheets 40 are arranged at intervals and extended. The interposer is positioned in the heat dissipating portion 11 of the extruded heat sink 10. The thickness of the interposer heat dissipating plate 40 is a thin plate type between 0.2 mm and 0.9 mm, and each of the interposer heat dissipating plates 40 is provided with a space. The inserting inserts 41 are configured to be inserted into the extruded grooves 14 formed between the heat dissipating fins 13 , and the interposing heat dissipating thin plates 40 are arranged to extend laterally toward the extruded heat sink 10 . a type, and a lateral ventilation channel 50 is formed between each of the interposer heat dissipation sheets 40; and at least a partial insertion piece 41 of the interposer type heat dissipation sheet 40 and a corresponding groove of the extrusion groove 14 are further A venting gap 60 is provided which communicates with the extruded channel 14 of the extruded heat sink 10 to form an end venting channel.

其中,各該散熱鰭片13與擠型溝槽14相對於熱源組設面12之延伸向係可設成垂直角度關係或放射狀型態。The extension fins of the heat dissipation fins 13 and the extruded trenches 14 with respect to the heat source assembly surface 12 may be disposed in a vertical angle relationship or a radial configuration.

其中,所述焊接結合部30可為攪拌焊接型態。Wherein, the welded joint portion 30 can be a stir welding type.

如第3圖所示,其中該擠型散熱座10整體散熱 鰭片13的末端凸伸型態,係可設置成兩側短而中間較長的山型態樣,且所述中間較長的散熱鰭片13係與熱源組設面12所組設的發熱源05 (參第1圖所示)中心位置相對應。As shown in FIG. 3, the end protruding shape of the entire heat dissipating fin 13 of the extruded heat sink 10 can be set to a mountain shape with short sides and a long middle, and the middle is long. The heat radiating fins 13 are associated with the center position of the heat source 05 (shown in FIG. 1) provided in the heat source grouping surface 12.

功效說明: 本創作所揭「具隱藏式均溫板之散熱器」主要藉由所述擠型散熱座、內凹式均溫腔、焊接結合部等創新獨特結構型態與技術特徵,使本創作對照〔先前技術〕所提習知結構而言,主要係可藉由其擠型散熱座之熱源組設面整合所述內凹式均溫腔之技術特徵,由於該內凹式均溫腔之蓋板頂面與擠型散熱座之熱源組設面之間係呈高度相同、平順銜接之平整面型態,俾當散熱器應用作為LED燈具的散熱結構時,因為其擠型散熱座的熱源組設面連同蓋板頂面係呈一平整面型態,所以能夠大幅增進LED組裝設置的便利性,以及均溫板結構設置的便利性而特具實用進步效益。Efficacy Description: The "heat sink with hidden uniform temperature plate" disclosed in this work mainly uses the innovative unique structure and technical features of the extruded heat sink, concave concave temperature chamber and welded joint. In view of the conventional structure proposed in the prior art, the technical feature of the concave-type uniform temperature chamber can be integrated by the heat source assembly surface of the extruded heat sink, because the concave-shaped uniform temperature chamber The top surface of the cover plate and the heat source assembly surface of the extruded heat sink have a flat surface shape of the same height and smooth connection. When the heat sink is used as the heat dissipation structure of the LED lamp, because of the extruded heat sink The heat source group setting surface and the top surface of the cover plate are in a flat surface type, so that the convenience of assembling the LED assembly and the convenience of the uniform temperature plate structure setting are greatly improved, and the utility model has the practical and progressive benefits.

上述實施例所揭示者係藉以具體說明本創作,且文中雖透過特定的術語進行說明,當不能以此限定本創作之專利範圍;熟悉此項技術領域之人士當可在瞭解本創作之精神與原則後對其進行變更與修改而達到等效之目的,而此等變更與修改,皆應涵蓋於如后所述之申請專利範圍所界定範疇中。The disclosures of the above embodiments are specifically intended to illustrate the present invention, and although the descriptions are made by specific terms, the scope of patents of the present invention cannot be limited thereto; those skilled in the art can understand the spirit of the creation. The principles are changed and modified to achieve an equivalent purpose, and such changes and modifications are to be included in the scope defined by the scope of the patent application as described later.

A‧‧‧散熱器
05‧‧‧發熱源
10‧‧‧擠型散熱座
11‧‧‧散熱部
12‧‧‧熱源組設面
13‧‧‧v散熱鰭片
14‧‧‧擠型溝槽
20‧‧‧隱藏式均溫板
21‧‧‧內凹式均溫腔
22‧‧‧支撐體
23‧‧‧毛細組織
24‧‧‧工作液
25‧‧‧蓋板
30‧‧‧焊接結合部
40‧‧‧插組式散熱薄板
41‧‧‧嵌插片
50‧‧‧側向通風流道
60‧‧‧通風間隙
A‧‧‧ Radiator 05‧‧‧Heat source 10‧‧‧Extrusion heat sink 11.‧‧Dissipation part 12‧‧‧Heat source set surface 13‧‧‧V heat sink fin 14‧‧‧Extrusion groove 20‧‧‧Concealed uniform temperature plate 21‧‧‧Concave uniform temperature chamber 22‧‧‧Support body 23‧‧‧Capillary structure 24‧‧‧Working liquid 25‧‧‧ Cover 30‧‧‧ Welding joint 40‧‧‧Incorporated heat-dissipating sheets 41‧‧‧ Inserts 50‧‧‧ Lateral ventilation runners 60‧‧‧ Ventilation gap

第1圖係本創作較佳實施例之結構分解立體圖。 第2圖係本創作較佳實施例之結構組合立體圖。 第3圖係本創作較佳實施例之結構剖視圖。 第4圖係本創作散熱器更包括插組式散熱薄板之實施例分  解立體圖。 第5圖係承第4圖所揭實施例之組合立體圖。 第6圖係本創作之散熱鰭片呈放射狀型態之實施例圖。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is an exploded perspective view of the preferred embodiment of the present invention. Figure 2 is a perspective view of the structural combination of the preferred embodiment of the present invention. Figure 3 is a cross-sectional view showing the structure of the preferred embodiment of the present invention. Fig. 4 is an exploded perspective view of the embodiment in which the heat sink of the present invention further includes an interposer type heat sink. Figure 5 is a combined perspective view of the embodiment of Figure 4. Figure 6 is a diagram showing an embodiment of the heat sink fin of the present invention in a radial pattern.

A‧‧‧散熱器 A‧‧‧heatsink

05‧‧‧發熱源 05‧‧‧heat source

10‧‧‧擠型散熱座 10‧‧‧Extrusion type heat sink

11‧‧‧散熱部 11‧‧‧ Department of heat dissipation

12‧‧‧熱源組設面 12‧‧‧Heat source set up

13‧‧‧散熱鰭片 13‧‧‧Heat fins

14‧‧‧擠型溝槽 14‧‧‧Extrusion groove

20‧‧‧隱藏式均溫板 20‧‧‧Hidden temperature equalization board

21‧‧‧內凹式均溫腔 21‧‧‧ concave concave temperature chamber

22‧‧‧支撐體 22‧‧‧Support

23‧‧‧毛細組織 23‧‧‧Muscle tissue

25‧‧‧蓋板 25‧‧‧ Cover

Claims (5)

一種具隱藏式均溫板之散熱器,所述散熱器包括: 一擠型散熱座,包括一散熱部以及可供至少一發熱源組設貼觸之一熱源組設面,其中該散熱部係設有間隔設置的散熱鰭片,各散熱鰭片之間相對界定形成貫穿擠型散熱座二端向之擠型溝槽; 至少一內凹式均溫腔,凹設於擠型散熱座之熱源組設面供發熱源組設部位,該內凹式均溫腔內部容設有支撐體、毛細組織以及工作液,頂端則藉由一蓋板加以蓋合封閉而形成一真空密閉腔室; 焊接結合部,設於蓋板周邊與內凹式均溫腔之間呈環狀型態,該焊接結合部係藉以令蓋板之蓋合達到封閉與密合狀態,俾能藉由該內凹式均溫腔、支撐體、毛細組織、工作液、蓋板及焊接結合部構成一隱藏式均溫板構造; 且其中,該蓋板頂面與擠型散熱座之熱源組設面之間係呈現高度相同、平順銜接之平整面型態。A heat sink with a hidden temperature equalizing plate, the heat sink comprising: an extruded heat sink, comprising a heat dissipating portion and a heat source group surface for at least one heat source group to be contacted, wherein the heat sink portion The heat dissipating fins are arranged at intervals, and the heat dissipating fins are oppositely defined to form an extruded groove extending through the two ends of the extruded heat sink; at least one recessed uniform temperature chamber is recessed in the heat source of the extruded heat sink The set surface is provided for the heat source assembly portion, the concave concave temperature chamber is provided with a support body, a capillary structure and a working fluid, and the top end is closed by a cover plate to form a vacuum sealed chamber; The joint portion is disposed in an annular shape between the periphery of the cover plate and the concave-type uniform temperature chamber, and the welded joint portion is used for closing and sealing the cover plate, and the concave portion can be adopted by the concave portion The uniform temperature chamber, the support body, the capillary structure, the working fluid, the cover plate and the welded joint portion constitute a hidden uniform temperature plate structure; and wherein the top surface of the cover plate and the heat source assembly surface of the extruded heat sink seat are presented The flat surface type with the same height and smooth connection. 如申請專利範圍第1項所述之具隱藏式均溫板之散熱器,其中該散熱器係更包括至少二插組式散熱薄板,所述插組式散熱薄板呈間隔排列且延伸擴大之型態插組定位於擠型散熱座的散熱部,所述插組式散熱薄板之厚度為介於0.2mm至0.9mm之間的薄板型態,各插組式散熱薄板設有間隔配置的嵌插片用以對應嵌插配合於散熱鰭片之間形成的擠型溝槽,並構成各插組式散熱薄板係為朝擠型散熱座二側向延伸設置之型態,且各插組式散熱薄板之間係形成側向通風流道;且插組式散熱薄板的至少局部嵌插片與相對應的擠型溝槽槽底之間更留設有通風間隙,所述通風間隙與擠型散熱座之擠型溝槽相通而形成端向通風流道。The heat sink with a hidden temperature equalizing plate according to claim 1, wherein the heat sink further comprises at least two interposer heat dissipating sheets, and the interposer type heat dissipating sheets are arranged at intervals and extended and expanded. The state interposer is positioned in the heat dissipating portion of the extruded heat sink, and the thickness of the plug type heat dissipating thin plate is a thin plate type between 0.2 mm and 0.9 mm, and each of the plug type heat dissipating thin plates is provided with a spacer arrangement. The chip is adapted to be inserted into the extruded groove formed between the heat dissipating fins, and the plug-in heat dissipating thin plates are configured to extend laterally toward the extruded heat sink, and each of the plugs is configured to dissipate heat. A lateral ventilation flow path is formed between the thin plates; and at least a partial insertion piece of the insertion type heat dissipation thin plate and a corresponding extruded groove bottom are further provided with a ventilation gap, and the ventilation gap and the extruded heat dissipation The extruded grooves of the seat communicate to form an end-venting flow passage. 如申請專利範圍第2項所述之具隱藏式均溫板之散熱器,其中各該散熱鰭片與擠型溝槽相對於熱源組設面之面延伸向係設成垂直角度關係或放射狀型態。The heat sink with a hidden uniform temperature plate according to claim 2, wherein each of the heat dissipating fins and the extruded groove are perpendicularly or radially arranged with respect to a surface of the heat source assembly surface. Type. 如申請專利範圍第3項所述之具隱藏式均溫板之散熱器,其中所述焊接結合部係為攪拌焊接型態。The heat sink with a hidden uniform temperature plate according to claim 3, wherein the welded joint is a stir welding type. 如申請專利範圍第4項所述之具隱藏式均溫板之散熱器,其中該擠型散熱座整體散熱鰭片的末端凸伸型態,係設置成兩側短而中間較長的山型態樣,且所述中間較長的散熱鰭片係與熱源組設面所組設的發熱源中心位置相對應。The heat sink with a hidden uniform temperature plate according to the fourth aspect of the patent application, wherein the extruded heat sink fin has an end protruding shape, which is set to a mountain shape with short sides and a long middle portion. In the aspect, the intermediate long fins correspond to the center position of the heat source set by the heat source group.
TW104200952U 2015-01-21 2015-01-21 Heat sink with hidden isothermal plate TWM502818U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW104200952U TWM502818U (en) 2015-01-21 2015-01-21 Heat sink with hidden isothermal plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104200952U TWM502818U (en) 2015-01-21 2015-01-21 Heat sink with hidden isothermal plate

Publications (1)

Publication Number Publication Date
TWM502818U true TWM502818U (en) 2015-06-11

Family

ID=53936955

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104200952U TWM502818U (en) 2015-01-21 2015-01-21 Heat sink with hidden isothermal plate

Country Status (1)

Country Link
TW (1) TWM502818U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106090647A (en) * 2016-07-29 2016-11-09 苏州聚力电机有限公司 Has the radiator of concealed temperature-uniforming plate
CN106090646A (en) * 2016-07-29 2016-11-09 苏州聚力电机有限公司 A kind of radiator having concealed temperature-uniforming plate
CN106141603A (en) * 2016-07-29 2016-11-23 苏州聚力电机有限公司 Has the molding heat radiator method of concealed temperature-uniforming plate
CN106181277A (en) * 2016-07-29 2016-12-07 苏州聚力电机有限公司 A kind of molding heat radiator method having concealed temperature-uniforming plate
TWI596312B (en) * 2016-11-10 2017-08-21 展緻企業有限公司 Vapor chamber device with integrated heat sink and method for manufacturing the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106090647A (en) * 2016-07-29 2016-11-09 苏州聚力电机有限公司 Has the radiator of concealed temperature-uniforming plate
CN106090646A (en) * 2016-07-29 2016-11-09 苏州聚力电机有限公司 A kind of radiator having concealed temperature-uniforming plate
CN106141603A (en) * 2016-07-29 2016-11-23 苏州聚力电机有限公司 Has the molding heat radiator method of concealed temperature-uniforming plate
CN106181277A (en) * 2016-07-29 2016-12-07 苏州聚力电机有限公司 A kind of molding heat radiator method having concealed temperature-uniforming plate
TWI596312B (en) * 2016-11-10 2017-08-21 展緻企業有限公司 Vapor chamber device with integrated heat sink and method for manufacturing the same

Similar Documents

Publication Publication Date Title
TWM502818U (en) Heat sink with hidden isothermal plate
TWI571197B (en) Thin vapor chamber and wick structures thereof
TWI604782B (en) Heat pipe side-by-side heat sink and its production method
US20160187074A1 (en) Supporting structure for vapor chamber
TWI541487B (en) Mean temperature plate support structure
TWI598554B (en) Thin vapor chamber and manufacturing method thereof
CN201156860Y (en) Water cooling head construction for heat radiating
CN204466130U (en) Double-structure integrated radiator with heat dissipation gain effect
TWM501091U (en) Structure of support for temperature-equalisation plate
TWI550388B (en) Heat dissipater with the function of hiding a vapor chamber heat spreader and the method for making the same
JP3196200U (en) Soaking plate support structure
TW202001177A (en) Vapor chamber structure
TWM520852U (en) Temperature-variable liquid container improvement structure
CN205980891U (en) Temperature -uniforming plate and epitheca component thereof
TWM544621U (en) Heat spreader with supporting gain effect
TWI620910B (en) A three dimensional vapor chamber device
TWI551972B (en) Heat dissipater having compound structure for promoting heat dissipating effect and the method for making the same
TWI644074B (en) Three-dimensional heat transmission device
CN104869783A (en) Radiating module combined structure and radiating module manufacture method
TWM544191U (en) Heat pipes side by side heat dissipation device
US20100116475A1 (en) Radiator
JP3174591U (en) Heat dissipation device
TWI407050B (en) Embedded light - emitting diodes metal porous media heat sink
TWM604874U (en) Cooling module with multiple heat pipes arranged in parallel
TWI600871B (en) Heat dissipating assembly