TWI407050B - Embedded light - emitting diodes metal porous media heat sink - Google Patents

Abstract

A metallic porous medium heat sink for embedded light-emitting diodes includes a heat sink body having plural irregular and communicating pores, with a plurality of cooling fins is disposed around its surface, a thermal convection part provided between the plural cooling fins, and an accommodating space arranged on the upper side of the heat sink body. The bottom side of the accommodating space is a thermal conductive surface having a plurality of thermal holes, and the thermal conductive surface is jointed with a light-emitting diode circuit substrate. On the light-emitting diode circuit substrate, thermal conductive pillars are arranged in opposite direction corresponding to the light-emitting diodes. Diameter of the thermal conductive pillars and that of light-emitting diodes is similar. The porous structure of heat sink body can substantially increase the cooling area and the natural convection flow path, and effectively increase the overall cooling capacity. The thermal conductive pillars can transfer heat of light-emitting diodes to the heat sink through the thermal holes, thereby achieving excellent cooling effect.

Description

Embedded light-emitting diode metal porous medium heat sink

The invention provides a light-emitting diode heat sink, in particular to an embedded light-emitting diode metal porous medium heat sink, in the heat sink body (especially inside a plurality of porous dielectric fins) and a heat sink The external body (especially the heat convection between the heat dissipation fins of a plurality of porous media) generates natural convection heat dissipation, and the porous structure greatly increases the heat dissipation area and the natural convection flow path, thereby effectively increasing the overall heat dissipation capability.

It is estimated that by 2020, LEDs will account for 46% of the total market value of the lamps, and in response to the continuous increase in heat generation, the heat dissipation requirements of LEDs will be more urgent. Among them, the heat dissipation of the light-emitting diode can be divided into active and passive, and the passive type does not require additional power components, and has high reliability and energy-saving characteristics.

A conventional light-emitting diode lamp mainly comprises a circuit substrate (2), a plurality of light-emitting diodes (20) soldered on the circuit substrate (2), an optical lamp cover and a cover thereof, and a control circuit component A heat sink that is attached to the circuit board (2) (see Figure 5).

For the convenience of the process, the light-emitting diode is first soldered on the metal or ceramic circuit board, and then the thermal conductive paste is used to bond the circuit substrate and the heat sink, and the effect on heat conduction is not good. Furthermore, the common heat sinks on the market are mostly cylindrical heat sinks and finned heat sinks, of which cylindrical heat sinks The heat dissipation efficiency depends on the surface area, and the surrounding gas can only exchange heat on the surface of the cylindrical heat sink, so the heat dissipation effect is limited, which affects the working efficiency and life of the bulb type LED lamp; The heat dissipation of the film transfers the heat on the light-emitting diode circuit substrate to the heat-dissipating fin by heat conduction, and then uses the temperature difference between the high-temperature heat-dissipating fin and the environment to generate natural convection for heat dissipation, and the heat dissipation efficiency is lower than that of the cylindrical heat dissipation. The seat is slightly better, but there is still more room for improvement in the face of a highly competitive market and cooling efficiency.

In view of the above, the present inventors have been engaged in the above-mentioned prior art, and have been engaged in research and development of related products for many years, and have made efforts to develop breakthroughs in order to obtain better conduction and heat dissipation effects, and after detailed design and careful evaluation, A practical invention.

Conventional common heat sink cooling effect Due to the shape and surface area of the heat sink, the conventional improved heat sink is a fin-type heat sink, which enhances the heat dissipation effect of the heat sink but still has room for improvement. Furthermore, the junction between the LED substrate and the heat sink is often poor in thermal conductivity due to uneven contact.

Providing an embedded light emitting diode gold The utility model relates to a heat-dissipating base of a porous medium, which comprises a heat-dissipating body, wherein the heat-dissipating body has a plurality of irregular and communicating pores, and a plurality of heat-dissipating fins are arranged around the surface of the heat-dissipating body, and each heat-dissipating fin With a hot convection, It can increase the area of heat conduction and air circulation to achieve better heat dissipation. Moreover, another feature of the present invention is that a heat conducting hole is disposed on a heat conducting surface of the heat sink body and the LED substrate, and is coupled to a heat conducting column disposed on the LED substrate, wherein the heat conducting column The number is the same as the position of the light-emitting diode and corresponds to the position, so that the contact area can be effectively increased without destroying the complete structure of the heat sink.

The effect of the invention is to utilize metal porous The porous structure of the medium greatly increases the heat dissipation area and the natural convection flow path, inside the heat sink body (especially inside the heat dissipation fins of a plurality of porous media) and the heat sink body (especially in a plurality of porous media) The heat convection between the fins generates natural convection heat dissipation to produce better heat exchange efficiency, which can effectively increase the overall heat dissipation capacity, and increase the heat conduction area by the heat conduction column on the light emitting diode circuit substrate to effectively heat the heat. It is introduced into the heat sink body and discharged by the pores on the heat sink body to form a good heat convection, thereby taking more heat to achieve a good heat dissipation effect.

The above-mentioned objects, structures and features of the present invention will be described in detail with reference to the preferred embodiments of the present invention. .

Referring to the first and second figures, the present invention is an embedded light-emitting diode metal porous dielectric heat sink, comprising a heat sink body (1), which is mostly irregular and Compatible with pores (17) The heat sink body (1) may be composed of a foamed aluminum structure with a plurality of foamed pores or a sintered copper particle having a plurality of sintered pores, and the heat sink body (1) is surrounded by a ring. There are a plurality of heat dissipation fins (30), each of the heat dissipation fins (30) has a heat convection portion (31), and a first accommodation space (11) is disposed at a top surface of the heat dissipation seat body (1). The bottom surface of the first accommodating space (11) has a heat conducting surface (13) coupled to a light emitting diode circuit substrate (5), and a second receiving portion is disposed on the bottom surface of the heat sink body (1). Space (15), the control circuit components (not shown) of the light-emitting diode (50) can be placed.

Wherein, the heat conducting surface (13) has a plurality of heat conducting holes (131), and is matched with the heat conducting column (51) disposed on the light emitting diode circuit substrate (5), and the heat conducting column (51) is further disposed. In the opposite direction and corresponding to the direction of the light-emitting diode (50), the heat-conducting column (51) has an appropriate spacing and the diameter of the column is similar to the diameter of the light-emitting diode (50), and the heat-conducting column (51) The preferred spacing is 1.5 to 2 times the column diameter.

Thereby, the heat radiating area and the air flowability are increased by the plurality of irregular and communicating pores (17) of the heat sink body (1), and the light emitting diode circuit board (5) is added. The heat conducting column (51) can enhance the effect of heat conduction, and is discharged by the pores (17) to form a good heat convection, and take away more heat to achieve a good heat dissipation effect.

For the practical application of the present invention, please refer to the heat sink body of the embedded light-emitting diode metal porous medium heat sink seat as shown in the first to fourth figures (1) It may be a bowl shape or a cylindrical shape, but is not limited by such shapes, and the aforementioned heat dissipation fins (30) may be composed of a foamed aluminum structure having a plurality of foamed pores or a The sintered copper particles of the plurality of sintered pores are formed to increase the penetration characteristics and enhance the heat dissipation efficiency thereof; and the heat convection portion (31) between the heat dissipation fins (30) may be embedded with a plurality of A solid metal heat conducting member (40) for increasing the ability of the light source of the light emitting diode (50) to conduct to the metal foaming fin, so that the heat source of the light emitting diode (50) can be more effectively introduced into the metal foaming material. In the pore structure, it is another embodiment to increase the efficiency of the entire heat dissipation fin (30), or to replace the solid metal heat conductor (40) described above with a foamed aluminum structure of a plurality of foamed pores.

The present invention has been described with reference to the preferred embodiments of the present invention. However, those skilled in the art can change and modify the present invention without departing from the spirit and scope of the invention. Such changes and modifications shall be covered in the scope defined by the following patent application.

. Conventional part:

(2) ‧‧‧ circuit substrate

(20)‧‧‧Lighting diodes

. Part of the invention:

(1)‧‧‧ Heat sink

(11)‧‧‧First accommodation space

(13) ‧‧‧Heat conduction surface

(131)‧‧‧Heat hole

(15) ‧‧‧Second accommodation space

(17) ‧ ‧ pores

(51)‧‧‧ Thermal column

(30)‧‧‧Heat fins

(31) ‧‧‧Hot Convection Department

(40)‧‧‧ Solid metal heat conductive parts

(5) ‧‧‧Lighting diode circuit board

(50) ‧‧‧Lighting diodes

(51)‧‧‧ Thermal column

The first figure is a perspective exploded view of the present invention

The second figure is a three-dimensional sectional view of the present invention

The third figure is a diagram of another embodiment of the present invention

The fourth figure is a diagram of another embodiment of the present invention

The fifth figure is a schematic diagram of the decomposition of the conventional light-emitting diode heat dissipation module.

(1)‧‧‧ Heat sink

(131)‧‧‧Heat hole

(30)‧‧‧Heat fins

(40)‧‧‧ Solid metal heat conductive parts

Claims (6)

An embedded light-emitting diode metal porous medium heat sink comprises: a heat sink body having a plurality of irregular and communicating pores, and a plurality of heat sink fins around the surface of the heat sink body At least one heat convection portion is disposed between each of the heat dissipation fins, wherein the heat convection portion is embedded with at least one solid metal heat conduction member; and a first accommodating space is disposed at a top surface of the heat dissipation seat body, the first a heat conducting surface is coupled to a light emitting diode circuit substrate at a bottom surface of the accommodating space, the heat conducting surface has a plurality of heat conducting holes, and a plurality of heat conducting columns corresponding to the heat conducting column are disposed on the light emitting diode circuit substrate The holes are matched, and the heat conducting column is disposed opposite to and corresponding to a light emitting diode, and the heat conducting columns have an appropriate spacing and the column diameter is similar to the diameter of the light emitting diode. The embedded light-emitting diode metal porous medium heat sink according to claim 1, wherein the heat sink body and the heat sink fin are formed by a foamed aluminum structure with a plurality of foamed pores. . The embedded light-emitting diode metal porous medium heat sink according to claim 1, wherein the heat sink body and the heat sink fin are composed of sintered copper particles with a plurality of sintered pores. The embedded light-emitting diode metal porous medium heat sink according to claim 1, wherein a second accommodating space is further disposed at a bottom surface of the heat sink body, and the second accommodating space can be placed with the light emitting diode Body control Road component. The embedded light-emitting diode metal porous medium heat sink according to claim 1, wherein the heat sink body can be in the shape of a bowl. The embedded light-emitting diode metal porous medium heat sink according to claim 1, wherein the heat sink body has a cylindrical shape.