M341808 八、新型說明： 【新型所屬之技術領域】 本創作屬高效率LED燈技術領域，提供照明使用，除具有極佳的 散熱效果外，更具有不須更換燈具而可直接替換燈泡使用之功效。 【先前技術】 按’ LED是發光二極體(Light- emitting Diode)的縮寫，是半 導體材料製成的固態發光元件，材料使用ΙΠ-V族化學元素（如： 磷化鎵(GaP)、砷化鎵（GaAs)等），發光原理是將電能轉換為光， 也就是對化合物半導體施加電流，透過電子與電洞的結合，過剩 的能量會以光的形式釋出，達成發光的效果，屬於冷性發光，壽 命長達十萬小時以上。LED最大的特點在於：無須暖燈時間（idl ing time)、反應速度快、體積小、用電省、耐震、污染低、適合量產， 具南可罪度，谷易配合應用上的需要製成極小或陣列式的元件。 惟因為LED是固態照明，即是利用晶片通電，量子激態回復發出 能量（光），但在發光的過程，晶片内的光能量並不能完全傳至外 界，不能出光的能量，在晶片内部及封裝體内便會被吸收，形成 熱。LED —般的轉換效率約只有1〇%〜3〇%，所以iw的電，只有不到 0.2W變成你可以看見的光，其它都是熱，若不散熱，這些熱量累 積會對晶片效率及壽命造成損傷。故要以高效率LED運用於照明 設備首先要解決散熱的問題。以LED散熱專利為例，新型M314505 號「高功率LED燈泡散熱結構」專利（2〇〇7年〇6月21日專利公 告資料參照），主要係於一燈頭上固定有一底基板，該底基板的頂 M341808 面支樓固疋有至少-支熱導管，熱導管套設固定有複數散熱片及 -頂基板，頂基板的·設有對應熱導管數量的高功率·，該 同功率LED的底面係黏結支樓於熱導管的頂端。新型第腿 號「發光二極體封裝之散麵組」專利(2〇〇7年㈣曰專利公 告資料參照），該散熱模組包含：—⑽電路板；一散熱塊， .包括複數個散熱片；以及—散熱膠材，藉以直接固定該LED電路 .錄熱塊上；其巾在該LED電職與該散織之間，不具有 •—金屬基板。發明第1謂98號「高散熱發光二極體」專利⑽6 年08月21曰專利公告資料參照），至少包括：一多孔隙材料層； -熱傳導層，設於該多⑽材料層表面；以及—晶片，設於該熱 傳導層’由該熱傳導層將該晶片所發出之熱量傳導至該多孔隙材 料層，並由該多孔隙材料層將該熱量對流至外部。 由以上諸前案可知習用LE1D散熱大都採用金屬散熱片，或結合 熱導管、致冷晶片、均熱板、散熱風扇等方式為之，普遍具有散 • 熱效果不佳、散熱速度不夠迅速、散熱模組結構複雜、成本高等 缺失，且由於所需搭配之散熱結構為非規格化設計，故必需設計 專用的燈具方能使用。此即為現行習用技術存有最大之缺失，此 缺失乃成業界亟待克服之難題。 【新型内容】 本創作研創人鑒於習用技術之缺失，積其多年實際從事精密陶 瓷科技工業產品之設計製造專業知識，經不斷研究、改良後，終有 本創作之研創成功，公諸於世。 M341808 緣是，本創作之主要目的在提供一種「高效率LED燈」，其主要M341808 VIII. New Description: [New Technology Field] This creation is a high-efficiency LED lamp technology field. It provides lighting use. In addition to excellent heat dissipation, it can directly replace the bulb without replacing the lamp. . [Prior Art] According to 'LED is the abbreviation of Light-emitting Diode, which is a solid-state light-emitting element made of semiconductor material. The material uses ΙΠ-V group chemical elements (such as: gallium phosphide (GaP), arsenic Gallium (GaAs), etc., the principle of luminescence is to convert electrical energy into light, that is, to apply current to the compound semiconductor, through the combination of electrons and holes, excess energy will be released in the form of light, achieving the effect of luminescence, belonging to Cold lighting, life expectancy of more than 100,000 hours. The biggest feature of LED is that it does not need illuminating time (idl ing time), fast response speed, small size, low electricity consumption, low earthquake resistance, low pollution, suitable for mass production, and has a guilty degree. A very small or array of components. However, because the LED is solid-state lighting, that is, the wafer is energized, and the quantum exciplex returns to emit energy (light), but in the process of illuminating, the light energy in the wafer cannot be completely transmitted to the outside, and the energy of the light cannot be emitted inside the wafer and The inside of the package will be absorbed to form heat. The general conversion efficiency of LED is only about 1〇%~3〇%, so the power of iw is less than 0.2W and it is light that you can see. The other is heat. If it does not dissipate heat, this heat accumulation will affect the efficiency of the chip. Life causes damage. Therefore, the application of high-efficiency LEDs to lighting equipment must first solve the problem of heat dissipation. Taking the LED heat dissipation patent as an example, the new M314505 "High Power LED Bulb Heat Dissipation Structure" patent (refer to the patent publication of the 2nd, 7th, June 21st) mainly fixes a base substrate on a base, the base substrate The top M341808 surface support has at least a heat pipe, the heat pipe sleeve is fixed with a plurality of heat sinks and a top substrate, and the top substrate is provided with a high power corresponding to the number of heat pipes, and the bottom surface of the same power LED The adhesive branch is attached to the top of the heat pipe. The new leg number "Glowing diode package of the face group" patent (2〇〇7 years (four) 曰 patent announcement data reference), the heat dissipation module includes: - (10) circuit board; a heat sink block, including a plurality of heat sinks And the heat-dissipating glue material, thereby directly fixing the LED circuit. The heat-receiving block; the towel between the LED electric power and the weaving does not have a metal substrate. Invention No. 1 No. 98 "High heat-dissipating light-emitting diode" patent (10) 6 years, August 21, 2011 patent publication reference), comprising at least: a porous material layer; - a heat conducting layer disposed on the surface of the plurality (10) material layer; a wafer disposed on the heat conducting layer to conduct heat from the wafer to the porous material layer, and the heat is convected to the outside by the porous material layer. It can be seen from the above cases that conventional LE1D heat dissipation uses metal heat sinks, or combined with heat pipes, cooling chips, soaking plates, cooling fans, etc., generally has poor heat dissipation, insufficient heat dissipation speed, and heat dissipation. The module structure is complicated, the cost is high, and the heat dissipation structure is required to be a non-standardized design. Therefore, it is necessary to design a dedicated lamp to be used. This is the biggest lack of existing technology, and this lack is a difficult problem to be overcome in the industry. [New content] In view of the lack of conventional technology, this creative researcher has accumulated many years of experience in the design and manufacture of precision ceramics technology industrial products. After continuous research and improvement, the creation of this creation has been successful and made known to the world. M341808 is the main purpose of this creation is to provide a "high efficiency LED light", which is mainly
係由LE1D模組、構裝基板、電路裝置及散熱燈座所構成，該LED 模組係設於構裝基板上，構裝基板鱗紐良好之金屬構成，散 熱燈座為散難良好之具多孔隙結構非金屬構成，並直接成型成 燈座外形’其具有_部，朗部之開口端藉構裝基板封閉，其 内汉有電路裝置’電路裝置則連結⑽模組與外部電源，當勵 點亮時，其產生的熱可迅速的被構裝基板所傳導，並藉構裝基板 與散熱燈關之熱料及紐流制，使齡基板上之熱迅速的 傳導至散熱燈座而散熱，本創作散熱燈座直接形成一般燈泡外 形’並兼具散熱效能，可直接取代制燈泡使用，除具有極佳的 散熱效果外，更具有不須更換燈具可直接替換燈泡之功效。 4本創作之另-主要目的在提供一種「高效率⑽燈」，其中，該 政…、燈座外緣设有燈泡專用的金屬套、絕緣套及電源接觸片，該 金屬套及電源接觸片並與電路裝置電性連結，以於f祕泡燈具 上使用者。 本創作之另-主要目的在提供一種「高效率㈣燈」，其中兮 有投射燈座專用之連結端子，該連結端子並凸設出散X …、且座底部外緣’崎投紐具上使用者。 構作之另—主要目的在提供""種「高效率LED燈」，其中，該 裝基板具有凹_，led模_設於該凹陷部者。 構？要，在提供一種「高效率LED燈」，其中，該 者。U π預疋數量之穿孔，以形成對流作用，提高散熱效能 乍之另主要目的在提供一種「高效率⑽燈」，其中，該 M341808 散熱燈座設有增加散熱表面積之紋路者。 本創作構裝基板係顧金屬具有高結構密度以及高比容熱之特 性’所以具有較南之導熱能力（如：銅金屬之熱傳導率為 °c)。而該散熱燈座係利用不同粒徑的高熱導率非金屬粉粒(如： 碳化石夕SiC熱傳導率為270W/m°C)，非金屬具有較低的比容熱， 是一種相當好的散熱材料。 ^ 【實施方式】 為達成本創作前述目的之技術手段，茲列舉一實施例，並配合 圖式說明如後，貴審查委員可由之對本創作之結構、特徵及所達成 之功效，獲致更佳之瞭解。 首先，明參閱第一、一、二圖所示，由圖可知本創作主要包括 有： LED模組(1) ’為習用規格化商品，係設於構裝基板(？)上； 構裝基板(2)，為導熱性良好之金屬構成【導熱良好之金屬如 金、銀、銅、鐵、鋁、鈷、鎳、辞、鈦、錳等】； 電路裝置(3) ’設於散熱燈座(4)内，連結LED模組（1)與外部電 源； 散熱燈座(4)，為散熱性良好之具多孔隙結構（多孔隙結構即具 有高比表面積結構)非金屬構成【散熱燈座(4)由熱導率高的非金屬 粉體製成(如射出成型），熱導率高的非金屬粉體諸如：氧化銘 Al2〇3、氧化锆Zr2〇、氮化鋁A1N、氮化矽SiN、氮化硼BN、碳 化鎢WC、碳化矽SiC、石墨C、結晶碳化矽、再結晶碳化矽Resic 等，而以氮化鋁及碳化矽為佳】，並直接成型成燈座外形，其具有 内凹部（40)，内凹部(4〇)之開口端藉構裝基板(2)封閉； M341808 當LED點亮時，其產生的熱可迅速的被構裝基板(2)所傳導，並 藉構裝基板(2)與散熱燈座(4)間之熱傳導及熱對流作用，使構裂基 板上(2)LE：D所產生的之熱迅速的傳導至散熱燈座(4)而散熱者。 本創作散熱燈座(4)係直接形成一般燈泡外形，並兼具散熱效 能，可直接取代習用燈泡使用，除具有極佳的散熱效果外，更具有 不須更換燈具可直接替換燈泡之功效【即本創作可直接於舊的燈具 上使用】。該散熱燈座(4)外緣設有燈泡專用的金屬套(5〇)、絕緣套 _ (51)及電源接觸片（52)【該燈泡專用的金屬套(5〇)、絕緣套（51) • 及電源接觸片（52)為國際通用規格，如e-27、E14等】，該金屬套 (50)及電源接觸片（52)並與電路裝置(3)電性連結，構裝基板(2) 上設有燈罩（7) ’而構成LED燈泡，如此即可以本創作直接螺合於 習用燈泡之燈具上使用，而不必替換原有的舊燈具。 再請參閱第四、五、六圖所示，本創作該電路裝置(3)設有投射 燈座專用之連結端子（6)【該投射燈座專用之連結端子（6)為國際 通用規格，如MR16等】，該連結端子(6)並凸設出散熱燈座（4)底 • 部外緣，構裝基板(2)上設有反射罩(8)，而構成LED投射燈，如 此即可以本創作直接插合於習用投射燈具上使用，而不必替換原 有的舊投射燈具者。 再者，請參閱第一、二、四、五圖所示，本創作前述構裝基板 (2)具有凹陷部（20)，LE：D模組（1)係設於該凹陷部（2〇) ，在作為燈 泡使用時，該凹陷部⑽縣固設—燈罩⑺【請參閱第二、三 圖】。在作為投紐使㈣，該凹陷部(2_細設一反射罩⑻ 【請參閱第五、六圖】。 又本創作構裝基板(2)設有預定數量之穿孔(21)，以形成對流 M341808 作用’提高散熱效能。雜懸⑷設有增加散絲面積之紋路⑷） 者。如此而達本創作設計目的，堪稱一實用之創作者。 、.’不上所述’本創作所揭露之—種「高效率⑽燈」為昔所無，亦 未曾見於酬外公開之刊物上，理已具新穎性之專利要件，又本創 作確可摒除習職術缺失，並達成料目的，亦已充份符合新型 利之「可供產業上利用之新型」專利要件，妥依法提出申請 貴審查委m審查，並辭本案翻，魏德便。 惟以上所财，僅為補狀—較財竹_邮 拘限本創狀細，舉凡縣此項賴人士 I非用以 内申請專利範_作之結構變化’理應包括於本創作 【圖式簡單說明】 第一圖係本創作燈泡式實施例立體圖。 第二圖係本創作燈泡式實施例立體分解圖。 第三圖係本創作燈泡式實施例組立剖面圖。 第四圖係本創作投射燈式實施例立體圖。 第五圖係摘作投紐讀蝴立體分解圖 第六圖係本創作投射燈式實施例組立剖面圖 【主要元件符號說明】 (1) LED模組 (21)穿孔 (2) 構裝基板 (20)凹陷部 (3) 電路裝置 M341808 (41)紋路 (51)絕緣套 (4)散熱燈座 (40)内凹部 (50)金屬套 (52)電源接觸片 (6)連結端子 • (7)燈罩 _ (8)反射罩The LED module is composed of a LE1D module, a component substrate, a circuit device and a heat-dissipating lamp holder. The LED module is mounted on the structure substrate, and the metal substrate of the substrate is well-formed. The heat-dissipating lamp holder is difficult to disperse. The porous structure is made of non-metal and directly formed into a lamp holder shape, which has a _ portion, and the open end of the lang portion is closed by a substrate, and the circuit device in the circuit device connects the (10) module and the external power source. When the excitation is lit, the heat generated by the substrate can be quickly transmitted by the substrate, and the heat of the substrate and the heat sink can be quickly transferred to the heat sink to dissipate heat. The creation of the heat-dissipating lamp holder directly forms the general shape of the bulb and has the heat-dissipating effect, which can directly replace the bulb, and has the excellent heat-dissipating effect, and has the effect of directly replacing the bulb without replacing the lamp. 4 Another of the creations - the main purpose is to provide a "high-efficiency (10) lamp", in which the outer edge of the lamp holder is provided with a metal sleeve for the bulb, an insulating sleeve and a power contact piece, the metal sleeve and the power contact piece And electrically connected with the circuit device, so as to be a user on the bubble lamp. Another main purpose of this creation is to provide a "high-efficiency (four) lamp", in which there is a connection terminal dedicated to the projection lamp holder, and the connection terminal is provided with a dissipative X ... and the outer edge of the seat bottom is used on the chip By. Another main purpose of the construction is to provide a "high-efficiency LED lamp" in which the substrate has a concave _, and a led mode is provided in the depressed portion. Structure? Yes, there is a "high efficiency LED light", which is the one. U π pre-twisted number of perforations to create convection and improve heat dissipation. The other main purpose is to provide a "high efficiency (10) lamp", wherein the M341808 heat sink has a texture that increases the heat dissipation surface area. The fabricated substrate has a high structural density and high specific heat characteristics, so it has a souther thermal conductivity (for example, the thermal conductivity of copper metal is °c). The heat-dissipating lamp holder utilizes high thermal conductivity non-metallic particles of different particle sizes (eg, carbon carbide SiC thermal conductivity is 270 W/m ° C), and non-metal has a lower specific heat, which is quite good. Heat sink material. ^ [Embodiment] In order to achieve the above-mentioned technical means for the purpose of the present invention, an embodiment will be listed, and with reference to the following description, the reviewing committee can obtain a better understanding of the structure, characteristics and achieved effects of the present creation. . First, as shown in the first, first and second figures, it can be seen from the figure that the creation mainly includes: LED module (1) 'is a conventional product, which is set on the substrate (?); (2) For the metal with good thermal conductivity [Metals with good thermal conductivity such as gold, silver, copper, iron, aluminum, cobalt, nickel, rhodium, titanium, manganese, etc.]; circuit device (3) 'located in the heat sink (4) Connect the LED module (1) to the external power supply; The heat-dissipating lamp holder (4) is a non-metallic structure with a good heat dissipation and a multi-porous structure (a porous structure that has a high specific surface area). (4) Non-metallic powders with high thermal conductivity (such as injection molding), non-metallic powders with high thermal conductivity such as: Oxide Al2〇3, Zirconia Zr2〇, Aluminum Nitride A1N, Nitriding矽SiN, boron nitride BN, tungsten carbide WC, tantalum carbide SiC, graphite C, crystalline tantalum carbide, recrystallized niobium carbide Resic, etc., and aluminum nitride and tantalum carbide are preferred, and directly formed into a lamp holder shape, It has a concave portion (40), and the open end of the inner concave portion (4〇) is closed by the mounting substrate (2); M341808 when the LED is lit, it is generated The heat can be quickly conducted by the substrate (2), and by the heat conduction and heat convection between the substrate (2) and the heat sink (4), the (2) LE:D is generated on the cracked substrate. The heat is quickly transmitted to the heat sink base (4) and dissipated. The creation of the heat-dissipating lamp holder (4) directly forms a general bulb shape and has the same heat dissipation performance, and can directly replace the conventional light bulb. In addition to having excellent heat dissipation effect, the utility model can directly replace the bulb without replacing the lamp. That is, the creation can be used directly on the old lamps. The outer edge of the heat-dissipating lamp holder (4) is provided with a metal sleeve (5〇) for the bulb, an insulating sleeve _ (51) and a power contact piece (52) [a metal sleeve (5〇) for the bulb, an insulating sleeve (51) • and the power contact piece (52) is an international standard, such as e-27, E14, etc., the metal sleeve (50) and the power contact piece (52) are electrically connected to the circuit device (3) to form the substrate. (2) There is a lampshade (7)' to form an LED bulb, so that the original screw can be directly screwed onto the lamp of the conventional light bulb without having to replace the original old lamp. Referring to the fourth, fifth and sixth figures, the circuit device (3) of the present invention is provided with a connection terminal (6) dedicated to the projection lamp holder. [The connection terminal (6) dedicated to the projection lamp holder is an international standard. For example, MR16, etc., the connecting terminal (6) protrudes from the bottom of the heat sink base (4), and the reflector (8) is disposed on the mounting substrate (2) to form an LED projection lamp. This creation can be directly inserted into the conventional projection luminaire without having to replace the original old projection luminaire. Furthermore, as shown in the first, second, fourth and fifth figures, the above-mentioned structure substrate (2) has a recessed portion (20), and the LE:D module (1) is provided in the recessed portion (2〇) ), when used as a light bulb, the recess (10) county is fixed - the lampshade (7) [please refer to the second and third figures]. In the case of a casting (4), the depressed portion (2_ is provided with a reflecting cover (8) [please refer to the fifth and sixth figures]. The artificially constructed substrate (2) is provided with a predetermined number of perforations (21) to form The convection M341808 acts to 'enhance heat dissipation. The suspension (4) is provided with a texture (4) that increases the area of the loose wire. This is the purpose of this creative design, can be called a practical creator. The 'high-efficiency (10) lights are not disclosed in the above-mentioned works. They have never been seen in the publications of the public, and they have been patented with novelty. Excluding the lack of apprenticeship, and achieving the purpose, it has fully complied with the new type of patents that can be used in the industry. It is submitted in accordance with the law to apply for review by the review committee, and the case is turned over, Wei De. However, the above-mentioned financial resources are only for the supplement---------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Description] The first figure is a perspective view of the present bulb embodiment. The second figure is an exploded perspective view of the present bulb embodiment. The third figure is a sectional view of the light bulb embodiment of the present invention. The fourth figure is a perspective view of an embodiment of the present projection lamp. The fifth picture is taken as a projection of the three-dimensional exploded view of the project. The sixth picture is a set of cross-sections of the project of the creative projection lamp. [Main component symbol description] (1) LED module (21) perforated (2) 20) Depression (3) Circuit device M341808 (41) Grain (51) Insulation sleeve (4) Heat sink base (40) Inner recess (50) Metal sleeve (52) Power contact piece (6) Connection terminal • (7) Shade _ (8) reflector
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