CN102242873A - Led lamp - Google Patents
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- CN102242873A CN102242873A CN2010101685347A CN201010168534A CN102242873A CN 102242873 A CN102242873 A CN 102242873A CN 2010101685347 A CN2010101685347 A CN 2010101685347A CN 201010168534 A CN201010168534 A CN 201010168534A CN 102242873 A CN102242873 A CN 102242873A
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 31
- 229910052755 nonmetal Inorganic materials 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 239000007769 metal material Substances 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 10
- 238000010292 electrical insulation Methods 0.000 abstract description 6
- 239000000919 ceramic Substances 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 9
- 229910010271 silicon carbide Inorganic materials 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000010276 construction Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 4
- 238000004020 luminiscence type Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 229910003465 moissanite Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005281 excited state Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
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Abstract
Description
技术领域 technical field
本发明有关一种LED灯,提供照明使用,特别是指一种除具有极佳的散热、电绝缘效果外,更具有不需更换灯具而可直接替换灯泡使用功效的高效率LED灯。The present invention relates to an LED lamp for lighting, especially a high-efficiency LED lamp that can directly replace a bulb without replacing a lamp, in addition to excellent heat dissipation and electrical insulation effects.
背景技术 Background technique
LED是发光二极管(Light-emitting Diode)的缩写,是半导体材料制成的固态发光元件,材料使用III-V族化学元素(如:磷化镓(GaP)、砷化镓(GaAs)等),发光原理是将电能转换为光,也就是对化合物半导体施加电流,透过电子与电穴的结合,过剩的能量会以光的形式释出,达成发光的效果,属于冷性发光,寿命长达十万小时以上。LED最大的特点在于:无需暖灯时间(Idling Time)、反应速度快、体积小、用电省、耐震、污染低、适合量产,具高可靠度,容易配合应用上的需要制成极小或阵列式的元件。但因为LED是固态照明,即是利用芯片通电,量子激态回复发出能量(光),但在发光的过程中,芯片内的光能量并不能完全传至外界,不能出光的能量,在芯片内部及封装体内便会被吸收,形成热。LED一般的转换效率约只有10%~30%,所以1W的电,只有不到0.2W变成你可以看见的光,其它都是热,若不散热,这些热量累积会对芯片效率及寿命造成损伤。因此要以高效率LED运用于照明设备首先要解决散热的问题。LED is the abbreviation of Light-emitting Diode (Light-emitting Diode), which is a solid-state light-emitting element made of semiconductor materials. The principle of luminescence is to convert electrical energy into light, that is, to apply current to the compound semiconductor. Through the combination of electrons and holes, the excess energy will be released in the form of light to achieve the effect of luminescence. It belongs to cold luminescence and has a long life. More than 100,000 hours. The biggest features of LEDs are: no need for idling time, fast response, small size, low power consumption, shock resistance, low pollution, suitable for mass production, high reliability, and easy to be made into a very small size to meet the needs of applications. or array elements. But because LED is a solid-state lighting, that is, when the chip is powered on, the quantum excited state returns to emit energy (light), but in the process of emitting light, the light energy in the chip cannot be completely transmitted to the outside world, and the energy that cannot be emitted is inside the chip. And the package body will be absorbed, forming heat. The general conversion efficiency of LED is only about 10% to 30%, so less than 0.2W of 1W of electricity can be turned into light that you can see, and the rest is heat. If the heat is not dissipated, the accumulated heat will affect the efficiency and life of the chip. damage. Therefore, to apply high-efficiency LEDs to lighting equipment, the problem of heat dissipation must first be solved.
现有技术中还有一种高效率LED灯,其主要是由LED模块、构装基板、电路装置及散热灯座所构成,该LED模块设于构装基板上,构装基板为导热性良好的金属构成,散热灯座为散热性良好的具多孔隙结构非金属构成,并直接成型成灯座外形,其具有内凹部,内凹部的开口端借构装基板封闭,其内设有电路装置,电路装置则连结LED模块与外部电源,当LED点亮时,其产生的热可迅速的被构装基板所传导,并借构装基板与散热灯座之间的热传导及热对流作用,使构装基板上的热迅速的传导至散热灯座而散热。以摒除公知LED散热大都采用金属散热片,或结合热导管、致冷芯片、均热板、散热风扇等方式,但这种LED灯普遍具有散热效果不佳、散热速度不够迅速、散热模块结构复杂、成本高、不具电绝缘性、安规通过不易,以及由于所需搭配的散热结构为非规格化设计,故必须设计专用的灯具方能使用等缺陷。但是仍有进一步降低材料成本的空间。此即为现行公知技术存有的最大缺点,这个缺点成为业界亟待克服的难题。There is also a high-efficiency LED lamp in the prior art, which is mainly composed of an LED module, a construction substrate, a circuit device and a heat dissipation lamp holder. The LED module is arranged on the construction substrate, and the construction substrate is a good thermal conductivity Made of metal, the heat dissipation lamp holder is made of non-metal with a porous structure with good heat dissipation, and is directly formed into the shape of the lamp holder. It has an inner concave part, and the opening end of the inner concave part is closed by a structural substrate, and a circuit device is arranged inside. The circuit device is connected to the LED module and the external power supply. When the LED is lit, the heat generated by it can be quickly conducted by the construction substrate, and the heat conduction and heat convection between the construction substrate and the heat dissipation lamp holder make the structure The heat on the mounting substrate is quickly conducted to the heat sink lamp holder for heat dissipation. In order to get rid of the known LED heat dissipation, most of them use metal heat sinks, or combine heat pipes, cooling chips, vapor chambers, heat dissipation fans, etc., but this kind of LED lights generally have poor heat dissipation effect, insufficient heat dissipation speed, and complex heat dissipation module structure. , high cost, no electrical insulation, difficult to pass safety regulations, and because the required heat dissipation structure is non-standard design, it is necessary to design a special lamp before it can be used. But there is still room to further reduce material costs. This is the biggest shortcoming of existing known technology, and this shortcoming has become a difficult problem to be overcome urgently in the industry.
发明内容 Contents of the invention
有鉴于此,本发明的主要目的在于提供一种散热效果佳、散热速度快、安全性能高且使用灵活的LED灯。In view of this, the main purpose of the present invention is to provide an LED lamp with good heat dissipation effect, fast heat dissipation speed, high safety performance and flexible use.
为达到上述目的,本发明提供一种LED灯,其主要包括LED模块、散热片及灯座,该LED模块具有导热部及电连结部,散热片为散热性良好的非金属构成,灯座为非金属材料直接成型成灯座外形,其具有内承部来容设前述散热片,该LED模块的导热部与散热片结合,电连结部则连结外部电源,当LED点亮时,其产生的热可迅速的被散热片所传导散热,本发明中的灯座可为一般非金属材料制成,如:塑料、陶瓷或散热陶瓷直接形成一般灯座外形,并具电绝缘甚或散热效能。In order to achieve the above object, the present invention provides an LED lamp, which mainly includes an LED module, a heat sink and a lamp holder. The LED module has a heat conducting part and an electrical connection part. The non-metallic material is directly formed into the shape of the lamp holder, which has an inner bearing part to accommodate the aforementioned heat sink. The heat conduction part of the LED module is combined with the heat sink, and the electrical connection part is connected to the external power supply. When the LED is lit, the heat produced by it The heat can be quickly dissipated by the heat sink. The lamp holder in the present invention can be made of general non-metallic materials, such as: plastic, ceramics or heat-dissipating ceramics directly form the general lamp holder shape, and have electrical insulation or even heat dissipation performance.
本发明LED灯另包括有导热片,该导热片设于LED模块导热部与散热片之间,当点亮LED灯时,其产生的热可迅速的被导热片所传导至散热片而散热。The LED lamp of the present invention further includes a heat conduction sheet, which is arranged between the heat conduction part of the LED module and the heat sink. When the LED lamp is turned on, the heat generated by it can be quickly conducted to the heat sink by the heat conduction sheet to dissipate heat.
前述灯座外缘设有灯泡专用的金属套、绝缘套及电源接触片,该金属套及电源接触片并与LED模块的电连结部电性连结,以在公知的灯泡灯具上使用;前述金属套也可于灯座外缘相对位置处以镀膜或涂层等方式形成导电金属层。The outer edge of the lamp holder is provided with a special metal sleeve, an insulating sleeve and a power contact piece for the light bulb. The metal sleeve and the power contact piece are electrically connected with the electrical connection part of the LED module to be used on the known light bulb lamp; The sleeve can also form a conductive metal layer at the opposite position on the outer edge of the lamp holder by means of coating or coating.
前述LED模块的电连结部连结有投射灯座专用的连结端子,该连结端子并凸设出灯座底部外缘,以在公知的投射灯具上使用。The electrical connection portion of the aforementioned LED module is connected with a dedicated connection terminal for the projection lamp holder, and the connection terminal protrudes from the outer edge of the bottom of the lamp holder for use on known projection lamps.
前述灯座设有增加散热表面积的纹路及散热孔。The aforementioned lamp holder is provided with lines and heat dissipation holes to increase the heat dissipation surface area.
本发明前述LED模块及散热片相对位置处设有穿孔,散热片下方设有具穿孔的固定片,LED灯另包括有固定件,其穿过LED模块、散热片及固定片的穿孔而将之固设;固定片另具有固定孔,以借固定棒自灯座底面由下方穿设而将LED模块及散热片固定于灯座。In the present invention, perforations are provided at the relative positions of the aforementioned LED module and heat sink, and a fixed piece with perforations is provided under the heat sink. Fixing; the fixing sheet also has a fixing hole, so that the LED module and the heat sink are fixed on the lamp holder by passing the fixing rod through the bottom surface of the lamp holder from below.
本发明LED灯另包括有灯罩,该灯罩为塑料一体成型,底部并具有卡部,前述灯座相对位置处设有卡部,以相互卡制固定。The LED lamp of the present invention further includes a lampshade, the lampshade is integrally formed of plastic, and has a clamping portion at the bottom, and the clamping portion is provided at the relative position of the aforementioned lamp holder to be clamped and fixed with each other.
借由本发明的LED灯,可实现快速散热的效果,且不用更换专用的灯具便能在公知的灯具上使用,使用安全方便且灵活。With the LED lamp of the present invention, the effect of rapid heat dissipation can be realized, and it can be used on known lamps without replacing special lamps, and the use is safe, convenient and flexible.
附图说明 Description of drawings
图1为本发明LED灯第一实施例立体分解图;Fig. 1 is a three-dimensional exploded view of the first embodiment of the LED lamp of the present invention;
图2为本发明LED灯第二实施例立体分解图;Fig. 2 is a three-dimensional exploded view of the second embodiment of the LED lamp of the present invention;
图3为本发明LED灯具导热片的第一实施例立体分解图;Fig. 3 is a three-dimensional exploded view of the first embodiment of the heat conducting sheet of the LED lamp of the present invention;
图4为本发明LED灯具导热片的第二实施例立体分解图;Fig. 4 is a three-dimensional exploded view of the second embodiment of the heat conducting sheet of the LED lamp of the present invention;
图5为本发明LED灯第一实施例组立剖面图;Fig. 5 is a cross-sectional view of the first embodiment of the LED lamp of the present invention;
图6为本发明LED灯第二实施例组立剖面图;Fig. 6 is a cross-sectional view of the second embodiment of the LED lamp of the present invention;
图7为本发明LED灯第三实施例组立剖面图。Fig. 7 is an assembled cross-sectional view of the third embodiment of the LED lamp of the present invention.
附图标记说明Explanation of reference signs
1 LED模块1 LED module
10 导热部 11 电连结部10
12 穿孔12 perforations
2 散热片2 heat sinks
20 导热孔 21 穿孔20
22 卡部22 card department
3 灯座3 lamp holders
30 内承部 31 纹路30
32 散热孔32 cooling holes
4 导热片4 Thermal pads
40 穿孔 41 金属导热层40
42 卡部42 card department
5 固定片5 fixed piece
50 穿孔 51 固定孔50
6 灯罩6 lamp shades
60 卡部60 cards
7 反射罩7 reflector
A 固定件 B 固定棒A Fixing piece B Fixing rod
C 金属套 D 绝缘套C Metal sleeve D Insulation sleeve
E 电源接触片 F 导电金属层E Power contacts F Conductive metal layer
G 连结端子G connection terminal
具体实施方式 Detailed ways
为了能对本发明的结构、特征及所达成的功效,获得更佳的了解及为达成本发明前述目的的技术手段,现列举一实施例,并配合附图说明如后。In order to obtain a better understanding of the structure, features, and achieved effects of the present invention, as well as the technical means to achieve the aforementioned objectives of the present invention, an embodiment is now listed, and the accompanying drawings are described as follows.
首先,请参阅图1所示,由图可知本发明主要包括有:At first, referring to shown in Fig. 1, as can be seen from the figure, the present invention mainly includes:
LED模块1,其为规格化商品,其具有导热部10及电连结部11,该LED模块1的导热部10与散热片2结合(如粘合、螺合等),电连结部11则连结外部电源;
散热片2,其为散热性良好的具多孔隙结构(多孔隙结构即具有高比表面积结构)非金属构成,如可由热导率高的非金属粉体制成,热导率高的非金属粉体诸如:氧化铝Al2O3、氧化锆Zr2O、氮化铝AlN、氮化硅SiN、氮化硼BN、碳化钨WC、碳化硅SiC、石墨C、结晶碳化硅、再结晶碳化硅RSiC等,而以氮化铝及碳化硅为佳;
灯座3,其为非金属材料直接成型成灯座外形,其具有内承部30来容设前述散热片2;
当LED点亮时,其产生的热可迅速的被散热片2所传导散热。When the LED is turned on, the heat generated by it can be rapidly conducted and dissipated by the
本发明前述灯座3可为一般非金属材料制成,如:以塑料射出成型,具有电绝缘特性。其也可由散热性良好的具多孔隙结构(多孔隙结构即具有高比表面积结构)非金属构成(如由热导率高的非金属粉体制成(如射出成型等),热导率高的非金属粉体诸如:氧化铝Al2O3、氧化锆Zr2O、氮化铝AlN、氮化硅SiN、氮化硼BN、碳化钨WC、碳化硅SiC、石墨C、结晶碳化硅、再结晶碳化硅RSiC等,而以氮化铝及碳化硅为佳),并直接成型成灯座外形,如此兼具电绝缘及散热效能。本发明灯座3直接形成一般灯座外形,可直接取代公知灯泡使用,具有不需更换灯具可直接替换灯泡的功效(即本发明可直接于旧的灯具上使用)。The
请参阅图2所示,图中标示为另一种LED模块1,该LED模块1的导热部10设于侧方,在本实施例中,该散热片2对应于该LED模块1的位置处设有导热孔20,以将该LED模块1产生的热由导热部10传导至散热片2而散热。Please refer to FIG. 2, which is marked as another
请参阅图3、图4所示,本发明另包括有导热片4,该导热片4设于LED模块1的导热部10与散热片2之间,导热片4为导热性良好的金属构成(导热良好的金属如金、银、铜、铁、铝、钴、镍、锌、钛、锰等),当点亮LED灯时,其产生的热可迅速的被导热片4所传导,并借导热片4与散热片2之间的热传导作用,使导热片4上的热迅速的传导至散热片2而散热。本发明导热片4可直接成形于散热片2上(请参阅图5所示,如以印刷或涂布等方式直接在散热片2与LED模块1的结合部上,形成金属导热层41),以减少部件、降低成本。Please refer to Fig. 3 and shown in Fig. 4, the present invention further includes a
请参阅图1至图4,本发明前述灯座3外缘设有增加散热表面积的纹路31。Please refer to FIG. 1 to FIG. 4 , the outer edge of the
请参阅图5所示,本发明前述灯座3设有贯通内承部30与灯座3外部的散热孔32,使灯座3内部的热得以散出,并具有对流作用,增强散热效果。Please refer to FIG. 5 , the
请再参阅图1所示,本发明前述LED模块1具有穿孔12,散热片2于LED模块1的穿孔12相对位置处设有穿孔21,散热片2下方设有具穿孔50的固定片5,本发明的LED灯另包括有固定件A(固定件A可为一般公知的螺栓、销件等),其穿过LED模块1的穿孔12、散热片2的穿孔21及固定片5的穿孔50而将LED模块1、散热片2及固定片5固设。本发明前述固定片5另具有固定孔51,以借固定棒B(固定棒B可为一般的螺栓、销件等)自灯座3底面由下方穿设过固定片5的固定孔51,而将LED模块1及散热片2等固定于灯座3。前述固定棒B可为金属材质,以作为LED模块1连结外部电源之用。Please refer to FIG. 1 again, the
请再参阅图3所示,本发明前述导热片4于LED模块1的穿孔12相对位置处设有穿孔40,以借固定件A穿过LED模块1的穿孔12、导热片4的穿孔40、散热片2的穿孔21及固定片5的穿孔50而将LED模块1、导热片4、散热片2及固定片5固设。Please refer to FIG. 3 again, the
请再参阅图2所示,本发明前述散热片2设有穿孔21,散热片2下方设有具穿孔50的固定片5,本发明LED灯另包括有固定件A(固定件A可为一般公知的螺栓、销件等),其穿过LED模块1的穿孔12、散热片2的穿孔21及固定片5的穿孔50而将LED模块1、散热片2及固定片5固设。本发明前述固定片5另具有固定孔51,以借固定棒B(固定棒B可为一般的螺栓、销件等)自灯座3底面由下方穿设过固定片5的固定孔51,而将LED模块1及散热片2等固定于灯座3。前述固定棒B可为金属材质,以作为LED模块1连结外部电源之用。Please refer to Fig. 2 again, the
请再参阅图4所示,本发明前述导热片4设有穿孔40,以借固定件A穿过导热片4的穿孔40、散热片2的穿孔21及固定片5的穿孔50而将导热片4、散热片2及固定片5固设。Please refer to FIG. 4 again, the above-mentioned
请再参阅图1至图6所示,本发明另包括有灯罩6,该灯罩为塑料一体成型,底部并具有卡部60,前述散热片2相对灯罩6的卡部60的位置处设有卡部22(如图1、图2、图4的实施例),以使灯罩6与散热片2相互卡制固定。或者,前述导热片4相对灯罩6的卡部60的位置处设有卡部42(如图3的实施例),以使灯罩6与导热片4相互卡制固定。如此可将灯罩6与灯座3等整体固定稳固,可摒除公知采用粘固方式,无法有效固定,而无法通过安规拉力测试的缺点。Please refer to Fig. 1 to Fig. 6 again, the present invention further includes a
再者,请参阅各相关附图,前述灯座3外缘设有灯泡专用的金属套C、绝缘套D及电源接触片E(该灯泡专用的金属套C、绝缘套D及电源接触片E为国际通用规格,如E-27、E-14等),该金属套C及电源接触片E并与LED模块1的电连结部11电性连结,以在公知的灯泡灯具上使用;请参阅图6所示,前述金属套C也可在灯座3外缘相对位置处以镀膜或涂层等方式形成导电金属层F。Furthermore, referring to each relevant accompanying drawing, the outer edge of the
请参阅图7所示,前述LED模块1的电连结部11连结有投射灯座专用的连结端子G(该投射灯座专用的连结端子G为国际通用规格,如MR16等),该连结端子G并凸设出灯座3底部外缘,灯座3上设有反射罩7,而构成LED投射灯,如此即可以本发明的LED灯直接插合于公知的投射灯具上使用,而不必替换原有的旧投射灯具。Please refer to FIG. 7 , the
如此而达到本发明设计的目的。Reach the purpose of the present invention's design like this.
以上所述,仅为本发明的一个较佳可行实施例而已,并非用以局限本发明的保护范围,凡是熟悉这种技术的人士,运用本发明说明书及权利要求书所作的等效结构变化,理应包括于本发明的专利保护范围内。The above is only a preferred feasible embodiment of the present invention, and is not intended to limit the protection scope of the present invention. Anyone who is familiar with this technology can use the equivalent structural changes made by the specification and claims of the present invention. Should be included in the patent protection scope of the present invention.
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