TWI458135B - Combination of LED Lamp Base and Lamp Base - Google Patents

Description

LED lamp assembly substrate and lamp holder bonding method

The invention belongs to the technical field of LED lamps and provides illumination use, and has the functions of fully combining the structure substrate and the lamp holder after molding, and having high adhesion and good heat conduction.

According to the LED, it is an abbreviation of Light-emitting Diode. It is a solid-state light-emitting component made of semiconductor materials. The material uses III-V chemical elements (such as gallium phosphide (GaP), gallium arsenide (GaAs). ), etc.), the principle of luminescence is to convert electrical energy into light, that is, to apply current to the compound semiconductor, through the combination of electrons and holes, excess energy will be released in the form of light, achieving the effect of luminescence, belonging to cold luminescence, The life span is over 100,000 hours. The biggest features of LED are: no idling time, fast response, small size, low power consumption, low vibration, low pollution, suitable for mass production, high reliability, easy to match with the needs of the application to make very small or Array of components. However, because the LED is solid-state lighting, that is, the wafer is energized, and the quantum exciplex returns to emit energy (light), but in the process of illuminating, the light energy in the wafer cannot be completely transmitted to the outside, and the energy of the light cannot be emitted inside the wafer and The inside of the package will be absorbed to form heat. LED conversion efficiency is only about 10% to 30%, so 1W of electricity, less than 0.2W becomes light that you can see, the other is hot, if not heat, these heat accumulation will damage the efficiency and life of the chip. . Therefore, the application of high-efficiency LEDs to lighting equipment must first solve the problem of heat dissipation. Taking the LED heat dissipation patent as an example, the new M314505 "High Power LED Bulb Heat Dissipation Structure" patent (refer to the patent announcement on June 21, 2007) mainly fixes a base substrate on a base, and the top surface of the base substrate is supported. At least one heat pipe is fixed, the heat pipe sleeve is fixed with a plurality of heat sinks and a top substrate, and the top surface of the top substrate is provided with a high-power LED corresponding to the number of heat pipes, and the bottom surface of the high-power LED is bonded and supported by the heat pipe. The top of the. A new type of heat-dissipating module of the light-emitting diode package (refer to the patent publication of June 21, 2007), the heat-dissipating module comprises: an LED circuit board; a heat-dissipating block, comprising a plurality of heat sinks; And a heat dissipating adhesive material for directly fixing the LED circuit board to the heat dissipating block; wherein there is no metal substrate between the LED circuit board and the heat dissipating block. Patent No. I260798, "High Heat Dissipating Light Emitting Diode" (refer to the patent publication of August 21, 2006), comprising at least: a porous material layer; a heat conducting layer disposed on the surface of the porous material layer; The wafer is disposed on the heat conducting layer, and the heat emitted by the wafer is conducted by the heat conducting layer to the porous material layer, and the heat is convected to the outside by the porous material layer. It can be seen from the above previous cases that the conventional LED heat dissipation uses metal heat sinks, or combined with heat pipes, cooling chips, soaking plates, cooling fans, etc., generally has poor heat dissipation effect, heat dissipation speed is not fast enough, and the heat dissipation module The structure is complicated, the cost is high, and the like, and because the required heat dissipation structure is a non-standardized design, it is necessary to design a dedicated lamp to be used.

The developer of the present invention has proposed a high-efficiency LED lamp for the lack of the aforementioned prior art (China Patent No. I338109, announced on March 1, 2011; U.S. Patent No. 7,677,767, issued on March 16, 2010), which is mainly The LED module, the component substrate, the circuit device and the heat sink base are arranged on the structure substrate. The structure substrate is made of metal with good thermal conductivity, and the heat dissipation lamp holder has good heat dissipation. The utility model has a multi-porous structure and a non-metal structure, and is directly formed into a lamp holder shape, and has an inner concave portion. The open end of the inner concave portion is closed by a mounting substrate, and a circuit device is arranged therein, and the circuit device connects the LED module and the external power source. When the LED is lit, the heat generated by the LED can be quickly conducted by the substrate, and the heat conduction and thermal convection between the substrate and the heat sink can be quickly conducted to the heat sink. The heat dissipation lamp holder directly forms a general bulb shape and has the heat dissipation performance, and can directly replace the conventional light bulb. In addition to having an excellent heat dissipation effect, the invention can directly directly replace the lamp. Effect of changing light bulbs. However, generally used as a substrate for the LED light source carrier [the mounting substrate is used to provide an LED module or the LED die is directly disposed on the package substrate and then packaged], most of which are made of a metal having good thermal conductivity or The utility model is composed of a porous non-metal material, and the combination manner of the structure substrate and the lamp holder is generally screwed into each other by using a screw hole, or is fixed by using a thermal conductive adhesive, and the former adds a component and a screwing process, and The adhesion is poor, and the latter has the disadvantage of poor heat conduction efficiency due to the lack of thermal conductivity of the thermal conductive rubber itself. Because the carrier board and the lamp holder are different in function, they are usually made of different materials. How to make two different materials can be tightly integrated into one without losing its thermal conductivity, which is an urgent problem to be overcome in the industry.

In view of the lack of conventional technology, the research and development of the present invention has accumulated many years of practical expertise in the design and manufacture of precision ceramics technology industrial products. After continuous research and improvement, the invention has been successfully developed and made public.

The main purpose of the present invention is to provide a method for bonding an LED lamp assembly substrate and a lamp holder. The method comprises the steps of: firstly processing the LED component substrate, placing it in the cavity of the injection molding machine, and then adopting injection molding. The lamp holder is formed by coating the LED package substrate, and has the functions of complete bonding after molding, high adhesion and good heat conduction.

The LED assembly substrate of the present invention is composed of a metal or a porous non-metal material with good heat conduction and heat dissipation, and is provided on the structure substrate by first setting an LED mode to form an LED light source or setting an LED die and packaging the LED light source. The lamp holder is made of plastic injection molding combined with the substrate.

The LED package substrate of the present invention is composed of a porous non-metallic material with good heat conductivity, and the lamp holder is formed by injection molding a porous non-metallic material with good heat dissipation and then being sintered.

In order to achieve the above-described technical means of the present invention, an embodiment is exemplified, and a member of the present invention can obtain a better understanding of the features and effects achieved by the present invention.

The structure substrate used in the present invention is used for disposing an LED module or directly arranging the LED die on the package substrate, and the package substrate is mostly made of a metal material having good thermal conductivity or a porous non-porous. Made of metal material. The lamp holder of the present invention has the general shape of a lamp holder. For the outer edge of the lamp holder, a metal sleeve, an insulating sleeve and a power contact piece for the bulb can be separately provided. [The metal sleeve, the insulating sleeve and the power contact piece for the bulb are internationally accepted. Specifications, such as E-27, E-14, etc., for use on conventional light bulbs. Or, there is a connection terminal dedicated to the projection lamp holder. [The connection terminal for the projection lamp holder is an international standard, such as MR16, etc.], and is directly inserted into the conventional projection lamp without replacing the original projection lamp. By.

The method for combining the LED lamp assembly substrate and the lamp holder of the invention is characterized in that after the LED package substrate is processed first (for example, the structure substrate is flattened, perforated, etc.), it is placed in the cavity of the injection molding machine, and then The lamp holder is coated with the LED component substrate by injection molding, and the package substrate and the lamp holder are coated and bonded by injection molding, and are completely combined after molding, and are not separated and separated, and the adhesion is high. This has the effect of good heat conduction.

The LED package substrate of the present invention is a metal with good heat conduction and heat dissipation [a metal with good heat conduction and heat dissipation such as gold, silver, copper, iron, aluminum, cobalt, nickel, zinc, titanium, manganese, etc.) or a porous non-metal material. [For example, consisting of non-metallic powders with high thermal conductivity, non-metallic powders with high thermal conductivity such as: alumina Al ₂ O ₃ , zirconia Zr ₂ O, aluminum nitride AlN, tantalum nitride SiN, nitriding Boron BN, tungsten carbide WC, tantalum carbide SiC, graphite C, crystalline tantalum carbide, recrystallized tantalum carbide RSiC, etc., and aluminum nitride and tantalum carbide are preferred, which are first provided with LED modules on the substrate. The LED module is a packaged finished product. It is an LED light source or an LED die and is packaged into an LED light source. The lamp holder is molded by a plastic material to form a bonded substrate.

The LED package substrate of the present invention is a porous non-metallic material with good thermal conductivity [such as a non-metallic powder composed of a high thermal conductivity, and a non-metallic powder having a high thermal conductivity such as alumina Al ₂ O ₃ or zirconia. Zr ₂ O, aluminum nitride AlN, tantalum nitride SiN, boron nitride BN, tungsten carbide WC, tantalum carbide SiC, graphite C, crystalline tantalum carbide, recrystallized niobium carbide RSiC, etc., and aluminum nitride and tantalum carbide Preferably, the lamp holder is made of a porous non-metallic material with good heat dissipation [such as a non-metallic powder having a high thermal conductivity, and a non-metallic powder having a high thermal conductivity such as alumina Al ₂ O ₃ , Zirconia Zr ₂ O, aluminum nitride AlN, tantalum nitride SiN, boron nitride BN, tungsten carbide WC, tantalum carbide SiC, graphite C, crystalline tantalum carbide, recrystallized niobium carbide RSiC, etc., and aluminum nitride and carbonization矽 is better] injection molding combined with the substrate, and then through the sintering process, the LED module is set after the sintering process.

Thus, the design object of the present invention is a practical inventor.

In summary, the "LED lamp assembly substrate and lamp holder bonding method" disclosed in the present invention has never been seen before, and has not been seen in publications published at home and abroad, and has already had novel patent requirements, and It is clear that the lack of customary technology can be eliminated, and the design purpose of the present invention is achieved. It has also fully complied with the requirements of the invention patent, and can be used for industrial use, and the application is submitted according to law. I would like to ask your review committee to give a review and give the patent. Debian.

However, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Those skilled in the art will be able to use the present invention and the alternative process of the scope of the patent application or Equivalent structural changes are intended to be included within the scope of the invention.

Claims (6)

A method for combining an LED lamp assembly substrate and a lamp holder, wherein the LED package substrate is processed first, and then placed in a cavity of the injection molding machine, and then the lamp holder is coated with the LED package substrate by injection molding. Made. The LED lamp assembly substrate and the lamp holder bonding method according to the first aspect of the invention, wherein the LED component substrate is composed of a porous non-metal material having good heat conduction and heat dissipation, and the LED is disposed on the structure substrate. The mold forms an LED light source, and the lamp holder is coated with the LED assembly substrate by injection molding of the plastic material. The method for combining an LED lamp assembly substrate and a lamp holder according to the first aspect of the invention, wherein the LED component substrate is composed of a porous non-metallic material having good heat conduction and heat dissipation, and the LED is first disposed on the structure substrate. The die is packaged into an LED light source, and the lamp holder is coated with the LED package substrate by injection molding of the plastic material. The LED lamp assembly substrate and the lamp holder assembly method according to the first aspect of the invention, wherein the LED component substrate is made of a metal having good heat conduction and heat dissipation, and the LED module is disposed on the structure substrate to form an LED. The light source is then coated with the plastic material to cover the LED assembly substrate. The method of combining the LED lamp assembly substrate and the lamp holder according to the first aspect of the invention, wherein the LED component substrate is made of a metal having good heat conduction and heat dissipation, and the LED chip is first disposed on the package substrate and packaged. The LED light source is used to encapsulate the lamp holder with the LED package substrate by injection molding of the plastic material. The method for combining an LED lamp assembly substrate and a lamp holder according to the first aspect of the invention, wherein the LED component substrate is made of a porous non-metallic material with good heat conductivity, and the lamp holder is provided with a porous non-porous heat dissipation. The metal material is injection molded and bonded to the substrate, and then sintered.