1338109 九、發明說明： 【發明所屬之技術領域】 本發明屬高效率LED燈技術領域，提供照明使用，除具有極佳 的散熱效果外，更具有不須更換燈具而可直接替換燈泡使用之功 效01338109 IX. Description of the invention: [Technical field of invention] The invention belongs to the technical field of high-efficiency LED lamps, and provides illumination use, in addition to having excellent heat dissipation effect, the utility model can directly replace the use of the bulb without replacing the lamps. 0
V 【先前技術】 按，LED 是發光二極體（Light- emitting Diode)的縮 ，鲁寫’是半導體材料製成的固態發光元件，材料使用ΠΙ-V 族化學元素（如：璘化鎵（Gap)、砷化鎵（GaAs)等），發光 原理是將電能轉換為光，也就是對化合物半導體施加電 流，透過電子與電洞的結合，過剩的能量會以光的形式釋 出’達成發光的效果，屬於冷性發光，壽命長達十萬小時 以上。LED最大的特點在於：無須暖燈時間、 反應速度快、體積小、用電省、耐震、污染低、適合量產， 具高可靠度，容易配合應用上的需要製成極小或陣列式的 •元件。惟因為LED是固態照明，即是利用晶片通電，量子 激態回復發出能量（光），但在發光的過程，晶片内的光能 4並不能完全傳至外界，不能出光的能量，在晶片内部及 封裝體内便會被吸收，形成熱。LED 一般的轉換效率約只 有10%~30%，所以1W的電，只有不到〇.2w變成你可以看 見的光，其它都是熱，若不散熱，這些熱量累積會對晶片 效率及壽命造成損傷。故要以高效率⑽運用於昭明設備 首先要解決散熱的問題。以⑽散熱專利為例’新型 4505，回功率LED燈泡散熱結構」專利（2_年〇6 底義板日告資料參照），主要係於一燈頭上固定有〆 “定=頂面支撐固定有至少-支熱導管，熱 有二管=::二頂基板，頂基板的頂面設 =校於熱導官的頂端。新型第賴榻號「發光二 資二Γ散熱模組」專利(20〇7年°6月21曰專利公告 :抖2) ’該散熱模組包含：―⑽電路板；一散熱 包括複數個散熱片；以及—散熱膠材，藉以直接固定 ^換Μ路板於該散熱塊上；其中在該LED電路板與該散 、之^不具有一金屬基板。發明第1260798號「高散 :發光,極體」專利（_年〇8月21曰專利公告資料參 …、）至>、1括.夕孔隙材料層；一熱傳導層，設於該多 孔隙材料絲面；以及—晶片，設於該熱傳導層，由該熱 傳導層將該晶片所發出之熱量傳導至該多孔隙材料層，迆 由該多孔隙材料層將該熱量對流至外部。 由以上諸前案可知習用LED散熱大都採用金屬散熱片，或结合 熱導管、致冷晶#、均驗、餘風鱗方式软，普遍具有散 熱效果不佳、散熱速度不夠迅速、散熱模組結構複雜、成本高等 缺失，且由於所需搭配之散熱結構為非規格化設計，故必需設計 專用的燈具方能使用。此即為現行習用技術存有最大之缺失，此 缺失乃成業界亟待克服之難題。 【發明内容】 1338109 本發明研發人鑒於習用技術之缺失，積其多年實際從事精密陶 免科技工業產品之設計製造專業知識，經不斷研究、改良後，終 有本發明之研創成功，公諸於世。 緣是，本發明之主要目的在提供一種「高效率led燈」，其主 '要係由LE：D模組、構裝基板、電路裝置及散熱燈座所構成，該LED 模組係設於構裝基板上’構裝基板為導熱性良好之金屬構成，散 熱燈座為散熱性良好之具多孔隙結構非金屬構成，並直接成型成 •燈座外形，其具有内凹部’内凹部之開口端藉構裝基板封閉，其 内设有電路裝置，電路裝置則連結LED模組與外部電源，當led 點壳時，其產生的熱可迅速的被構裝基板所傳導，並藉構裝基板 與散熱燈朗之祕導及熱職侧，使職基板上之熱迅速的 傳導至散熱燈座而散熱，本發明散熱燈座直接形成一般燈泡外 形’並兼具散熱效能’可直接取代習用燈泡使用，除具有極佳的 散熱效果外，更具有不須更換燈具可直接替換燈泡之功效。 本發明之另-主要目的在提供一種「高效率LED燈」，其中， •該散熱燈座外緣設有燈泡專用的金屬套、絕緣套及電源接觸片， 該金屬套及電源接觸片並與電路裝置電性連結，以於習用燈泡燈 具上使用者。 本發明之另-主要目的在提供一種「高效率⑽燈」，其中， 該電路裝置設有投射燈座專用之連結端子，該連結端子並凸設出 散熱燈座底部外緣，以於習用投射燈具上使用者。 本發明之另-主要目的在提供一種「高效率⑽燈」，其中， 該構裝基板具有凹陷部，LED模組係設於該凹陷部者。、 7 1338109 本發明之另一主要目的在提供 該構裝基板設有預定數量之穿孔， 能者。 種「高效率led燈」，其中， 以形成對流仙，提高散熱效V [Prior Art] Press, LED is a shrinkage of Light-emitting Diode, which is a solid-state light-emitting element made of a semiconductor material, and the material uses a ΠΙ-V group of chemical elements (such as gallium antimonide ( Gap), gallium arsenide (GaAs), etc., the principle of luminescence is to convert electrical energy into light, that is, to apply current to the compound semiconductor, through the combination of electrons and holes, excess energy will be released in the form of light. The effect is cold light, and the life span is more than 100,000 hours. The biggest features of LED are: no need for warming time, fast response, small size, low power consumption, low vibration, low pollution, suitable for mass production, high reliability, easy to match the needs of the application to make a minimum or array type. element. However, because the LED is solid-state lighting, that is, using the wafer to energize, the quantum excimer recovers energy (light), but in the process of illuminating, the light energy 4 in the wafer cannot be completely transmitted to the outside, and the energy of the light cannot be emitted inside the wafer. And the inside of the package will be absorbed to form heat. The general conversion efficiency of LED is only about 10%~30%, so 1W of electricity is less than 〇.2w becomes light that you can see. Others are hot. If it does not dissipate heat, these heat accumulation will cause wafer efficiency and life. damage. Therefore, it is necessary to use high efficiency (10) for Zhaoming equipment. First, we must solve the problem of heat dissipation. Take (10) heat dissipation patent as an example of 'new 4505, return power LED bulb heat dissipation structure' patent (2_year 〇 6 bottom board daily information reference), mainly fixed on a lamp holder At least - the heat pipe, the heat has two tubes =:: two top substrates, the top surface of the top substrate is set to the top of the thermal guide. The new type of "Lay's "two-dimensional two-heat relay module" patent (20 〇 7 years ° June 21 曰 Patent Announcement: Shake 2) 'The heat dissipation module contains: ― (10) circuit board; a heat sink includes a plurality of heat sinks; and - a heat sink glue, thereby directly fixing the switch board On the heat dissipating block; wherein the LED circuit board and the dispersing body do not have a metal substrate. Invention No. 1260798 "High dispersion: illuminating, polar body" patent (_August 21st, 曰 公告 曰 曰 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 And a wafer disposed on the heat conducting layer, the heat emitted by the wafer is conducted by the heat conducting layer to the porous material layer, and the heat is convected by the porous material layer to the outside. It can be seen from the above previous cases that the conventional LED heat dissipation uses metal heat sinks, or combined with heat pipes, cooling crystals, uniform inspection, and residual wind scales. Generally, the heat dissipation effect is not good, the heat dissipation speed is not fast enough, and the heat dissipation module structure is complicated. The cost is high, and because the required heat dissipation structure is a non-standardized design, it is necessary to design a dedicated lamp to use. This is the biggest lack of existing technology, and this lack is a difficult problem to be overcome in the industry. SUMMARY OF THE INVENTION 1338109 The research and development of the present invention is based on the lack of conventional technology, and has accumulated many years of practical expertise in the design and manufacture of precision ceramics industrial products. After continuous research and improvement, the research and development of the present invention is successful. world. The main purpose of the present invention is to provide a "high-efficiency led lamp", which is composed of an LE:D module, a substrate, a circuit device and a heat sink. The LED module is The 'substrate substrate on the structure substrate is made of a metal with good thermal conductivity, and the heat dissipation lamp holder is made of a non-metallic structure with a good heat dissipation and a multi-porous structure, and is directly formed into a shape of a lamp holder, and has an opening of a concave portion of the inner concave portion The end is closed by the structural substrate, and the circuit device is arranged therein. The circuit device connects the LED module and the external power source. When the LED is in the shell, the heat generated by the LED can be quickly transmitted by the substrate, and the substrate is assembled. With the secret of the heat sink and the hot side, the heat on the substrate is quickly transmitted to the heat sink to dissipate heat. The heat sink of the present invention directly forms a general bulb shape 'and has the heat dissipation performance' and can directly replace the conventional light bulb. In addition to the excellent heat dissipation effect, it can directly replace the bulb without replacing the lamp. Another main object of the present invention is to provide a "high-efficiency LED lamp", wherein: the outer edge of the heat-dissipating lamp holder is provided with a metal sleeve, an insulating sleeve and a power contact piece for the bulb, the metal sleeve and the power contact piece and The circuit device is electrically connected to the user of the conventional light bulb luminaire. Another main object of the present invention is to provide a "high-efficiency (10) lamp", wherein the circuit device is provided with a connection terminal dedicated to the projection lamp holder, and the connection terminal protrudes from the outer edge of the bottom of the heat dissipation lamp holder for conventional projection. The user on the luminaire. Another object of the present invention is to provide a "high efficiency (10) lamp" in which the package substrate has a recessed portion to which the LED module is attached. 7, 1338109 Another primary object of the present invention is to provide a predetermined number of perforations for the package substrate. a kind of "high-efficiency led light", in which, to form a convection fairy, to improve heat dissipation
本發明之另-主要目的在提供—種「高效率LED燈」，以，該 散熱燈座設有增加散熱表面積之紋路者。 X 本發明構裝基㈣糊金屬具有高結構贿以及高比容熱之特 性’所以具有較高之導熱能力（如：鋼金屬之熱 °C)。而該散舰座係_獨粒㈣高熱導轉金屬粉粒(如： 碳化石夕Sic熱傳導率為270W/VC)，非金屬具有較低的比容熱， 是一種相當好的散熱材料。 【實施方式】 為達成本發明前述目的之技術手段，茲列舉一實施例，並配合 圖式說明如後，責審查委員可由之對本發明之結構、特徵及所達 成之功效，獲致更佳之瞭解。 首先，請參閱第一、二、三圖所示，由圖可知本發明主要包括 _有： LE：D模組（1)，為習用規格化商品，係設於構裝基板(2)上； 構裝基板(2) ’為導熱性良好之金屬構成【導熱良好之金屬如 金、銀、銅、鐵、鋁、鈷、鎳、鋅、鈦、錳等】； 電路裝置（3)，設於散熱燈座(4)内，連結LED模組(1)與外部 電源； 散熱燈座(4) ’為散熱性良好之具多孔隙結構（多孔隙結構即具 有高比表面積結構)非金屬構成【散熱燈座(4)由熱導率高的非金 1338109 屬粉體製成(如射出成型），熱導率高的非金屬粉體諸如：氧化鋁 Al2〇3、氧化锆Zr2〇、氮化鋁A1N、氮化矽SiN、氮化硼BN、碳 化鎢WC、碳化矽SiC、石墨C、結晶碳化矽、再結晶碳化矽ResiC ^等，而以氮化鋁及碳化矽為佳】，並直接成型成燈座外形，其具有 、内凹部（40)，内凹部（40)之開口端藉構裝基板(2)封閉； 當LED點亮時，其產生的熱可迅速的被構裝基板(2)所傳導， 並藉構裝基板(2)與散熱燈座（4)間之熱傳導及熱對流作用，使構 φ 裝基板上(2)LED所產生的之熱迅速的傳導至散熱燈座（4)而散熱 者。 . 本發明散熱燈座(4)係直接形成一般燈泡外形，並兼具散熱效 能，可直接取代習用燈泡使用，除具有極佳的散熱效果外，更具 有不須更換燈具可直接替換燈泡之功效【即本發明可直接於舊的 燈具上使用】。該散熱燈座（4)外緣設有燈泡專用的金屬套（5〇)、 絕緣套(51)及電源接觸片（52)【該燈泡專用的金屬套（5〇)、絕緣 套(51)及電源接觸片（52)為國際通用規格，如e-27、E14等】，該 •金屬套(50)及電源接觸片（52)並與電路裝置(3)電性連結，構裝基 板(2)上設有燈罩（7) ’而構成LED燈泡’如此即可以本發明直接 螺合於習用燈泡之燈具上使用，而不必替換原有的舊燈具。 再請參閱第四、五、六圖所示’本發明該電路裝置（3)設有投 射燈座專用之連結端子（6)【該投射燈座專用之連結端子（6)為國 際通用規格，如MR16等】，該連結端子(6)並凸設出散熱燈座（4) 底部外緣，構裝基板(2)上設有反射罩（8)，而構成LED投射燈， 如此即可以本發明直接插合於習用投射燈具上使用，而不必替換 (S ) 9 1338109 原有的舊投射燈具者。 再者’請參閱第…三、四、五騎示，本發明前述構裝基板 (2)具有凹陷部（2〇) ’LED模組（1)係設於該凹陷部（2〇)，在作為燈 -泡使用時，該凹陷部（20)用為固設一燈罩（7)【請參閱第二、三 '圖】。在作為投射燈使用時，該凹陷部（20)用為固設一反射罩(8) 【清參閱第五、六圖】。 又，本發明構裝基板(2)設有預定數量之穿孔(21；)，以形成對 籲流作用’提高散熱效能。散熱燈座⑷設有增加散熱表面積之紋路 (41)者。如此而達本發明設計目的，堪稱一實用之發明者。 綜上所述，本發明所揭露之一種「高效率LE：D燈」為昔所無， 亦未曾見於國内外公開之刊物上，理已具有「新紐」之專利要 件，又本發明確可摒除習用技術缺失，並達成本發明設計目的， 亦已祕符合個補餅’並可供產#上·，銳法提出申 請’謹請責審查委員惠予審查’並賜與本案專利，實感德便。 惟以上所述者，謹為本發明之一可行實施例而已，舉 # 凡利用本發明說明書或申請專利範圍所做之等效結構變 化’理應包括於本發明之專利範疇内。 【圖式簡單說明】 第一圖係本發明燈泡式實施例立體圖。 第二圖係本發明燈泡式實施例立體分解圖。 第二圖係本發明燈泡式實施例組立剖面圖。 第四圖係本發明投射燈式實施例立體圖。 第五圖係本發明投射燈式實施例立體分解圖。 1338109 第六圖係本發明投射燈式實施例組立剖面圖。 【主要元件符號說明】 (1) LE：D 模組 (2) 構裝基板 (20)凹陷部 （21)穿孔 (3) 電路裝置 (4) 散熱燈座 (40)内凹部 （41)紋路 (50)金屬套 （51)絕緣套 (52)電源接觸片 (6) 連結端子 (7) 燈罩 (8) 反射罩Another main object of the present invention is to provide a "high efficiency LED lamp" which is provided with a pattern for increasing the surface area of the heat dissipation. X The structure of the present invention (4) paste metal has a high structural bribe and high specific heat characteristics, so it has a high thermal conductivity (e.g., steel metal heat °C). The submarine _ singular (four) high thermal conductivity metal powder (such as: carbonized stone Sic thermal conductivity 270W / VC), non-metal has a lower specific heat, is a fairly good heat sink material. [Embodiment] In order to achieve the above-described technical means of the present invention, an embodiment will be exemplified, and the structure of the present invention can be better understood by the reviewing committee. First, please refer to the first, second and third figures. It can be seen from the figure that the present invention mainly includes: LE:D module (1), which is a conventional standardized product, which is disposed on the structure substrate (2); The structure substrate (2) 'is composed of a metal having good thermal conductivity [a metal having good heat conductivity such as gold, silver, copper, iron, aluminum, cobalt, nickel, zinc, titanium, manganese, etc.); a circuit device (3) is provided at In the heat-dissipating lamp holder (4), the LED module (1) and the external power supply are connected; the heat-dissipating lamp holder (4) is a non-metallic structure with a porous structure (a porous structure or a high specific surface area structure) with good heat dissipation. The heat-dissipating lamp holder (4) is made of non-gold 1338109 powder with high thermal conductivity (such as injection molding), and non-metallic powder with high thermal conductivity such as: alumina Al2〇3, zirconia Zr2〇, nitriding Aluminum A1N, tantalum nitride SiN, boron nitride BN, tungsten carbide WC, tantalum carbide SiC, graphite C, crystalline tantalum carbide, recrystallized niobium carbide ResiC ^, etc., and aluminum nitride and tantalum carbide are preferred, and directly Formed into a lamp holder shape having an inner recess (40), the open end of the inner recess (40) being closed by the mounting substrate (2); when the LED is lit, The generated heat can be quickly conducted by the substrate (2), and by the heat conduction and heat convection between the substrate (2) and the heat sink base (4), the φ package substrate (2) LED The generated heat is quickly transmitted to the heat sink base (4) while dissipating heat. The heat-dissipating lamp holder (4) of the invention directly forms a general bulb shape and has the heat-dissipating effect, and can directly replace the conventional light bulb, in addition to having an excellent heat-dissipating effect, the utility model can directly replace the bulb with no need to replace the lamp. [The invention can be used directly on old lamps]. The outer edge of the heat-dissipating lamp holder (4) is provided with a metal sleeve (5〇), an insulating sleeve (51) and a power contact piece (52) for the bulb (the metal sleeve (5〇) and the insulating sleeve (51) for the bulb) And the power contact piece (52) is an international standard, such as e-27, E14, etc., the metal sleeve (50) and the power contact piece (52) are electrically connected to the circuit device (3), and the substrate is assembled ( 2) The lampshade (7) is provided with 'the LED bulb' so that the invention can be directly screwed onto the lamp of the conventional light bulb without having to replace the original old lamp. Referring to the fourth, fifth and sixth figures, the circuit device (3) of the present invention is provided with a connection terminal (6) dedicated to the projection lamp holder. [The connection terminal (6) dedicated to the projection lamp holder is an international standard. For example, MR16, etc., the connecting terminal (6) protrudes from the bottom outer edge of the heat sink base (4), and the reflective substrate (8) is disposed on the mounting substrate (2) to form an LED projection lamp. The invention is directly inserted into conventional projection luminaires without having to replace (S) 9 1338109 the original old projection luminaire. Furthermore, please refer to the third, fourth, and fifth riding instructions. The above-mentioned structure substrate (2) of the present invention has a recessed portion (2). The LED module (1) is attached to the recessed portion (2〇). When used as a lamp-bubble, the recessed portion (20) is used to fix a lamp cover (7) [please refer to the second and third views]. When used as a projection lamp, the recessed portion (20) is used to fix a reflector (8) [see Figures 5 and 6]. Further, the structure substrate (2) of the present invention is provided with a predetermined number of perforations (21;) to form a function of urging flow to improve heat dissipation performance. The heat sink base (4) is provided with a pattern (41) that increases the heat dissipation surface area. Thus, the design object of the present invention is a practical inventor. In summary, the "high-efficiency LE:D lamp" disclosed in the present invention has never been seen in the publications disclosed at home and abroad, and has already possessed the patent requirements of "New New Zealand", and the present invention is indeed Eliminating the lack of customary technology, and achieving the design purpose of the present invention, it has also been consistent with a patch of cakes and can be produced on the #, · Sharp applied to apply 'please review the review committee to benefit the review' and give the patent, the real sense Will. However, the above description is intended to be a possible embodiment of the present invention, and equivalent structural changes made by the specification or the scope of the patent application are intended to be included in the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a perspective view of a bulb embodiment of the present invention. The second drawing is an exploded perspective view of a bulb embodiment of the present invention. The second drawing is a cross-sectional view of a bulb embodiment of the present invention. The fourth figure is a perspective view of a projection lamp type embodiment of the present invention. Figure 5 is a perspective exploded view of a projection lamp type embodiment of the present invention. 1338109 The sixth drawing is a sectional view of an embodiment of the projection lamp type of the present invention. [Description of main component symbols] (1) LE: D module (2) Construction substrate (20) recessed portion (21) perforated (3) Circuit device (4) Heat sink (40) inner recess (41) grain ( 50) Metal sleeve (51) Insulation sleeve (52) Power contact piece (6) Connection terminal (7) Lamp cover (8) Reflector