KR200450948Y1 - High-Efficiency LED Lamp - Google Patents

High-Efficiency LED Lamp Download PDF

Info

Publication number
KR200450948Y1
KR200450948Y1 KR2020080005724U KR20080005724U KR200450948Y1 KR 200450948 Y1 KR200450948 Y1 KR 200450948Y1 KR 2020080005724 U KR2020080005724 U KR 2020080005724U KR 20080005724 U KR20080005724 U KR 20080005724U KR 200450948 Y1 KR200450948 Y1 KR 200450948Y1
Authority
KR
South Korea
Prior art keywords
heat dissipation
lamp
mounting board
led
heat
Prior art date
Application number
KR2020080005724U
Other languages
Korean (ko)
Other versions
KR20090011239U (en
Inventor
친웬롱
Original Assignee
친웬롱
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 친웬롱 filed Critical 친웬롱
Priority to KR2020080005724U priority Critical patent/KR200450948Y1/en
Publication of KR20090011239U publication Critical patent/KR20090011239U/en
Application granted granted Critical
Publication of KR200450948Y1 publication Critical patent/KR200450948Y1/en

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F21V5/048—Refractors for light sources of lens shape the lens being a simple lens adapted to cooperate with a point-like source for emitting mainly in one direction and having an axis coincident with the main light transmission direction, e.g. convergent or divergent lenses, plano-concave or plano-convex lenses

Abstract

본 고안은 고효율 LED 램프(Lamp)에 관한 것으로 본 고안은 주로 LED 모듈(module)과 실장기판, 회로장치 및 방열등좌로 구성되고 LED 모듈(module)은 실장기판상에 설치되고 실장기판은 열전달성이 좋은 금속으로 구성되고 방열 등좌는 방열성이 좋은 다공극(多孔隙) 구조이다. 비금속으로 구성되고 직접 등좌외형에 성형되고 내요부가 있고 내요부의 개구단이 실장기판에 의해서 봉지(封止)되고 그 내부에 회로장치가 설치되고 회로장치에 의해 LED 모듈(module) 과 외부전원이 연결되고 LED가 점등할때에 생성된 열이 재빨리 실장기판에 의해서 전달되고 또 실장기판과 방열등좌 와의 열전달과 열대류 작용에 의해 실장기판 상의 열이 쾌속적으로 방열등좌에 전달되어 방열되고 본 고안의 방열 등좌는 직접 일반의 백열전구 외형에 형성되고 방열효과가 있기 때문에 직접 종래의 백열전구로 적용되고 우수한 방열효과가 얻어질 뿐만 아니라 등구를 교환하지 않고 직접 백열등구를 교환하여 사용할수가 있는 것이다.The present invention relates to a high efficiency LED lamp, which is mainly composed of an LED module, a mounting board, a circuit device, and a heat radiating lamp seat. The LED module is installed on the mounting board, and the mounting board is thermoelectric. It is composed of a good metal and the heat dissipation back is a porous structure with good heat dissipation. Consists of a non-metallic, molded directly on the outside of the seat, with an inner part, the open end of the inner part is sealed by a mounting board, a circuit device is installed inside it, and an LED module and an external power supply are connected by the circuit device. When the LED is turned on, the heat generated is quickly transmitted by the mounting board, and the heat on the mounting board is rapidly transferred to the heat dissipation lamp by heat transfer between the mounting board and the heat dissipation lamp and the action of tropical flow. The heat dissipation seat of the present invention is directly formed on the general incandescent light bulb and has a heat dissipation effect. Therefore, the heat dissipation lamp is directly applied to a conventional incandescent light bulb, and excellent heat dissipation effect can be obtained.

LED, 램프(Lamp), 방열등 LED, Lamp, Heat Dissipation Light

Description

고효율 엘이디 램프 {High-Efficiency LED Lamp}High-Efficiency LED Lamp

본 고안은 고효율 LED 램프(Lamp)기술에 관한 것으로 특히 조명을 제공할 뿐만 아니라 뛰어난 방열 효과를 가지고 등구(燈具)를 갱환(更換)할 필요가 없이 직접 백열전구를 교환하는것에 관한다.The present invention relates to a high-efficiency LED lamp technology, and not only to provide lighting, but also to replace the incandescent bulb directly without having to change the light bulb with excellent heat dissipation effect.

LED는 발광다이오드(Light Emitting Diode)의 약어로서 반도체 재료로 된 고형발광 소자이며 Ⅲ-Ⅴ 족화학원소(族化學元素)(예를들면 인화(燐火)갈륨 Gap나 비화(砒化)갈륨 GaAs등) 가 이용되고 발광원리는 전기 에너지(energy)를 광(光)으로 변환하는 것으로 즉 화합물 반도체에 전류를 인가하고 전자와 홀(hall)소자를 결합시켜서 에너지(energy)를 광(光)으로 석방(釋放)하고 발광의 효과가 얻어지고 냉광(冷光)은 수명이 십만시간 이상이 된다. LED의 최대의 특징은 아이들링 타임 (idling time) 이 필요하지 않고 응답스피드(speed)가 빠르고 체적(體積)이 작고 성전력(省電力), 내진(耐震), 저오염, 양산(量産)에 적합하고 고신뢰도 등의 이점이 얻어지고 또 필요에 따라서 용이하고 극히 작아 어레이(array)식의 소자에 제작된다.LED is an abbreviation of Light Emitting Diode and is a solid light emitting device made of semiconductor material. It is a group III-V chemical element (for example, gallium phosphide GaP or gallium GaAs). Is used to convert electrical energy into light, that is, by applying a current to a compound semiconductor and combining electrons with a hall element to release energy into light. Amplification and the effect of luminescence is obtained, and the cold light life is over 100,000 hours. The biggest feature of LED is that no idling time is required, the response speed is fast, the volume is small, and it is suitable for sexual power, seismic resistance, low pollution, and mass production. In addition, advantages such as high reliability and the like are obtained, and are easily and extremely small as required, and are manufactured in an array element.

그렇지만 LED가 고형조명이기 때문에 칩(chip)에 통전하는 것이나, 양자여기 (量子勵起)에 의해 에너지(energy)(光)를 회복하지만 발광하는 과정에 있어서 칩(chip) 내의 광(光)에너지(energy)가 완전히 외부로 전달되지만 광(光)(energy)가 칩(chip)내부나 패키지(package)내에 있어서 흡수(吸收)되어서 열(熱)이 형성되어진다.However, since LEDs are solid-state lights, they are energized by a chip, or energy is recovered by quantum excitation, but the light energy in the chip is in the process of emitting light. Energy is completely transmitted to the outside, but light is absorbed in the chip or in the package, and heat is formed.

LED는 일반적으로 변환효율이 약 10 % ~ 30 % 이기 때문에 1 W 의 전력으로 0.2 W 만 가시광(可視光)으로 변환되고 나머지는 열(熱)이 되며 그때문에 방열되지않고 그의 열량이 누적하면 칩(chip)의 효율이나 수명이 악화된다.Since the conversion efficiency of LEDs is generally about 10% to 30%, only 0.2W is converted into visible light with 1W of power, and the rest becomes heat. The efficiency and lifetime of the chip are deteriorated.

그때문에 고효율 LED를 조명설비로 하여 이용하려면 방열의 문제를 해결하지 않으면 아니된다.Therefore, in order to use high efficiency LED as a lighting facility, the problem of heat dissipation must be solved.

LED 방열 특허를 예로하면 주로 구금상(口金上)에 저판이 고정되고 저판의 상면에 적어도 하나의 열 파이프(pipe)가 지지되어 고정되고 열 파이프에 복수의 방열편(放熱片)과 천판(天板)이 감설되어 고정되고 천판의 상면에 열 파이프에 대응하는 수이다 고효율 LED가 설치되고 고효율 LED의 저면이 열파이프의 상단에 점착되어 지지되어진다.In the LED heat dissipation patent, for example, a bottom plate is mainly fixed to a detention phase, and at least one heat pipe is supported and fixed on an upper surface of the bottom plate, and a plurality of heat dissipation pieces and a top plate are mounted on the heat pipe.板) It is fixed and fixed, and it is the number corresponding to the heat pipe on the top surface of the top plate.

발광다이오드 패키지의 방열 모듈(module) 특허를 예로하여 방열 모듈 (module)은 LED 회로판과 복수의 방열편을 가진 방열 블록(Block)과 직접으로 LED 회로판을 방열 블록상에 고정하기 위한 방열 고무재를 갖추고 또 LED 회로판과 방열 블록과의 사이에 있어서 금속기판이 없고, 또 고방열 발광 다이오드 특허를 예로 하면 적어도 다공극재료층(多孔隙材料層)과 다공극재료층의 표면에 설치되어지는 열전달층과 열전달층에 설치되어지는 칩(chip)을 갖추고 또 열전달층에 의해 칩(chip)에서 발(發)한 열을 다공극재료층에 전달하고 또 다공극재료층을 끼이게하여 대류(對流)에 의해 열을 외부로 방열한다.Taking the patent of the heat dissipation module of the LED package as an example, the heat dissipation module includes a heat dissipation block having an LED circuit board and a plurality of heat dissipation pieces and a heat dissipation rubber material for directly fixing the LED circuit board on the heat dissipation block. In addition, there is no metal substrate between the LED circuit board and the heat dissipation block, and the heat-dissipating layer is provided on at least the surface of the porous material layer and the porous material layer by taking a patent for a high heat-emitting LED. It has a chip installed in the overheat transfer layer and transfers the heat generated from the chip by the heat transfer layer to the porous material layer and pinches the porous material layer to convection. Heat dissipates to the outside.

이상의 예에서 종래의 LED의 방열은 금속방열편을 이용하거나 혹은 열 파이프나 냉각 칩(chip), 균열판, 혹은 방열팬(fan)을 결합하여 사용하지만 방열효과가 좋지 않고 방열 속도가 늦고 또, 방열 모듈(module)의 구조가 복잡해 코스트(cost)가 높은 등의 문제점이 있으며 또 방열구조가 규격화 설계는 없기 때문에 전용설계의 등구(燈具)가 필요하다. 그 때문에 기존의 종래의 기술은 해결하지 않으면 아니 되는 결점이 있다.In the above example, the heat dissipation of the conventional LED is used using a metal heat dissipation piece or a heat pipe, a cooling chip, a crack plate, or a heat dissipation fan, but the heat dissipation effect is not good and the heat dissipation rate is slow. Since the structure of the heat dissipation module is complicated, the cost is high, and since the heat dissipation structure does not have a standardized design, a lamp of a dedicated design is required. Therefore, there is a drawback that the existing conventional technology must be solved.

본 고안의 주된 목적은 주로 LED 모듈(module)과 실장기판, 회로장치 및 방열등좌로 구성되고 LED모듈 (module)이 실장기판상에 설치되고 실장기판이 열전달성이 좋은 금속으로 구성되고 방열 등좌가 방열성이 좋은 다공극(多孔隙) 구조로 비금속으로 구성되고 또 내요부가 있고 내요부의 개구단이 실장기판에 의해서 봉지(封止)되고 그 내부에 회로장치가 설치되고 회로장치에 의해 LED 모듈(module) 과 외부전원이 접속되고 LED를 점등하면 생성된 열이 재빨리 실장기판에 의해서 전달되고 또 실장기판과 방열등좌 와의 열전달과 열대류 작용에 의해 실장기판 상의 열이 재빨리 방열등좌에 전달되어 방열되어지는 고효율 LED 램프(Lamp) 를 제공한다The main purpose of the present invention is mainly composed of LED module, mounting board, circuit device and heat dissipation lamp, LED module is installed on the mounting board, and mounting board is composed of heat transfer metal and heat dissipation lamp Multi-porous structure with good heat dissipation, consisting of nonmetal, inner part, inner end of which is sealed by mounting board, circuit device is installed inside, and LED module ( When the module and external power are connected and the LED is turned on, the generated heat is quickly transmitted by the mounting board, and the heat on the mounting board is quickly transferred to the heat dissipation lamp by the heat transfer between the mounting board and the heat dissipation lamp seat and the action of tropical flow. Provides high efficiency LED lamps that are radiated

본 고안의 다른 목적은 방열등좌 외면에 버블(bubble) 전용의 금속배럴 (Barrel) 이나 절연배럴(Barrel) 및 전원접촉 시트(Seat)가 설치되고 금속배럴 (Barrel)과 전원접촉 시트(Seat)가 회로장치에 전기적으로 접속되고 종래의 백열전구에 적용되어지는 고효율 LED 램프(Lamp)를 제공한다.Another object of the present invention is to install a metal barrel (barrel) or insulating barrel (barrel) and a power contact sheet (Seat) dedicated to the bubble on the outer surface of the heat radiating lamp, and a metal barrel and a power contact sheet (Seat) A high efficiency LED lamp is electrically connected to a circuit device and applied to a conventional incandescent lamp.

본 고안의 더욱 다른 목적은 회로장치에 투사등좌 전용의 연결단자가 있고 연결단자가 방열등좌의 저부 외연으로 돌출하여 형성되고 종래의 투사 등구에 적용되어지는 고효율 LED 램프(Lamp)를 제공한다.A further object of the present invention is to provide a high efficiency LED lamp (Lamp) that is formed in the circuit device is a connection terminal dedicated to the projection lamp and the connection terminal is formed by protruding to the bottom edge of the heat dissipation lamp and applied to conventional projection lamps .

본 고안의 더욱 다른 목적은 실장기판에 요부가 있고 LED 모듈(module)이 요 부에 설치되어진 고효율 LED 램프(Lamp)를 제공한다.A further object of the present invention is to provide a high efficiency LED lamp having a recess in a mounting board and an LED module installed in the recess.

본 고안의 더욱 다른 목적은 실장기판에 미리 설정된 수의 관통공이 설치되고 이것에 의해 대류작용이 발생하고 방열효과가 향상되어 지는 고효율 LED 램프 (Lamp)를 제공한다.A further object of the present invention is to provide a high-efficiency LED lamp (Lamp) in which a predetermined number of through holes are installed in the mounting substrate, whereby convection occurs and heat dissipation is improved.

본 고안의 더욱 다른 목적은 방열등좌에 방열의 표면적을 증대하기 위한 도병(圖柄)이 설치되고 또 실장기판을 금속으로 하기 위해 고구조밀도(高構造密度) 와 고비열(高比熱)의 특성이 얻어지는 고효율 LED 램프(Lamp)를 제공한다.A further object of the present invention is to provide a high thermal density and high specific heat for the installation of a metal plate on the heat sink to increase the surface area of heat dissipation. It provides a high efficiency LED lamp (Lamp) that the characteristics are obtained.

이와같은 본 고안은 LED를 점등하면 생성된 열이 실장기판에 의해 전달되고 또 실장기판과 방열등좌 와의 열전달과 열대류 작용에 의해 실장기판 상의 열이 쾌속적으로 발열등좌에 전달되어 방열되고 본 고안의 방열 등좌는 직접 일반의 백열전구 외형에 형성되고 방열효과가 있기 때문에 직접 종래의 백열전구로 적용되고 우수한 방열효과가 얻어질 뿐만 아니라 등구를 교환하지 않고 직접 백열등구를 교환하여 사용할 수가 있는 것이다.The present invention is such that when the LED is turned on, the generated heat is transferred by the mounting board, and the heat on the mounting board is rapidly transferred to the heat generating lamp by the heat transfer between the mounting board and the heat dissipation lamp and the action of tropical flow. The heat dissipation seat of the present invention is directly formed on the shape of a general incandescent light bulb and has a heat dissipation effect. Therefore, the heat dissipation seat can be directly used as a conventional incandescent light bulb and an excellent heat dissipation effect can be obtained. .

본 고안은 실장기판(2)에 취부된 LED 모듈(module)(1)과 열전달성이 좋은 금속으로 구성되어지는 회로장치(3)로 방열등좌(4)내에 설치되고 LED 모듈(module) (1)과 외부전원과를 접속하는 실장기판(2)과 방열성이 좋은 다공극 구조로 비금속으로 구성되고 또 일체 성형이며 내요부(40)가 있는 방열등좌(4)를 갖추고 또 내요부(40)의 개구단이 실장기판(2)에 따라 봉지(封止)되어지는 고효율 LED 램프(Lamp) 이다.The present invention is an LED module (1) mounted on the mounting board (2) and a circuit device (3) consisting of a good heat transfer metal is installed in the heat dissipation lamp (4) and the LED module ( 1) and a mounting board (2) for connecting the external power source and a heat dissipation-porous structure having a heat dissipation structure having a heat dissipation seat (4) having a non-metal, integrally molded, and having an inner recess (40). ) Is a high efficiency LED lamp whose encapsulation end is sealed along the mounting substrate 2.

도 " 1 " 내지 도 " 3 " 을 참조하면서 본 고안은 종래의 규격화 상품으로 실장기판(2)에 취부되어지는 LED 모듈(module)과 예를 들면 금(金)이나 은(銀) 동(銅), 철(鐵), 알루미늄(Aluminium), 코발트(cobalt), 니켈(Nickel), 아연(亞鉛) , 티탄(Titan), 망간(mangan) 등이다. 열전달성이 좋은 금속으로 구성되어지는 실장기판(2) 과 방열등좌(4) 내에 설치되고 LED 모듈(module)(1) 과 외부전원을 연결하는 회로장치(3) 와 방열성이 좋은 고비 표면적 구조(高比 表面的 構造)의 다공극구조(多孔隙 構造) 이며 예로는 산화 알루미늄 Al₂O₃나 산화 지르코늄 Zr₂O, 질화 알루미늄 AlN, 질화 실리콘 SiN, 질화 붕소 BN, 탄화 텅스텐 WC, 탄화 실리콘 SiC, 석묵 C, 결정탄화 실리콘, 재결정 탄화 실리콘 ReSie 등이다.With reference to Figs. 1 to 3, the present invention is a conventional standardized product, and an LED module mounted on the mounting board 2 and, for example, gold or silver copper. ), Iron, aluminum, cobalt, nickel, zinc, titanium, manganese, and the like. The circuit board (3) installed in the mounting board (2) and the heat dissipation lamp seat (4) made of metal having good heat transfer, and connecting the LED module (1) and the external power source, and the high specific surface area structure with good heat dissipation. It is a porous structure of high porosity, such as aluminum oxide Al₂O₃ or zirconium oxide Zr₂O, aluminum nitride AlN, silicon nitride SiN, boron nitride BN, tungsten carbide WC, silicon carbide SiC, quartz C, Crystalline silicon, recrystallized silicon carbide, ReSie, and the like.

고열전달율의 비금속분말로 구성되고 그중 질화 알루미늄과 탄화 실리콘이 바람직하다. 또, 일체성형이며 내요부(40) 가 있고 내요부(40)의 개구단이 실장기판(2) 에 봉지되어지는 방열등좌(4)를 갖추고 또 LED를 점등하면 생성된 열이 재빠르게 실장기판(2)에 따라서 전달되고 또 실장기판(2)과 방열등좌(4) 와의 열전달과 열대류 작용에 의해 실장기판(2) 상의 LED에 의해 생성된 열이 재빠르게 방열등좌(4)에 전달되어 방열되어진다.It is composed of a non-metal powder of high heat transfer rate, of which aluminum nitride and silicon carbide are preferred. In addition, when the LED is turned on with the heat dissipation lamp 4 which is integrally formed and has the inner recessed part 40 and the open end of the inner recessed part 40 is sealed to the mounting board 2, the heat generated is quickly mounted. The heat generated by the LED on the mounting substrate 2 is quickly transmitted by the heat transfer between the mounting substrate 2 and the heat dissipation lamp 4 and the tropical flow action of the mounting board 2 and the heat dissipation lamp 4. It is transmitted to and radiated.

본 고안에 관계되는 방열등좌(4)는 직접 일반의 백열전구 외형에 형성되고 방열효과가 얻어지고 또 직접으로 종래의 백열전구 대신으로 사용되고 그것에 의해 뛰어난 방열효과가 얻어질 뿐만 아니라 등구(燈具)를 교환하지 않고 직접으로 백열전구를 교활할 수가 있는 것이다. (즉 본 고안은 직접으로 종래의 등구에 적용된다.)The heat dissipation seat 4 according to the present invention is directly formed on a general incandescent light bulb shape, and a heat dissipation effect is obtained, and is directly used in place of a conventional incandescent light bulb. You can cunning incandescent bulbs directly without replacing them. (In other words, the present invention is directly applied to a conventional lamp.)

방열등좌 (4)의 외연을 예를들면 E - 27이나 E - 14 등의 국제 공통규격이다. 백열전구 전용의 금속배럴(50)과 절연배럴(51) 및 전원접촉 시트(Seat)(52)가 설치되고 금속배럴(50)과 절연배럴(51) 및 전원접촉 시트(Seat)(52)가 회로장치 (3)에 전기적으로 접속되고 실장기판(2) 상에 램프(Lamp)갓(7)이 설치되고 이것에 의해 LED 백열전구가 구성되고 그때문에 본 고안은 직접 종래의 백열전구의 등구에 나합되어 사용되고 본래의 오래된 등구를 교환하지 않아도 좋다.The outer edge of the heat radiating lamp 4 is an international common standard such as E-27 or E-14. The metal barrel 50, the insulation barrel 51, and the power contact sheet (Seat) 52 for the incandescent lamp are installed, and the metal barrel 50, the insulation barrel 51 and the power contact sheet (Seat) 52 are installed. The lamp shade 7 is electrically connected to the circuit device 3 and the lamp shade 7 is installed on the mounting board 2, whereby the LED incandescent lamp is constituted. Therefore, the present invention is directly integrated into the lamp of a conventional incandescent lamp. It is not necessary to replace the old old bulbs.

도 " 4 " 내지 도 " 6 " 을 참조하면서 본 고안의 회로장치(3)는 예를들면 MR 16 등의 국제 공통규격이다. 투사등좌(投射燈座) 전용의 연결단자(6) 가 설치되고 연결단자(6)가 방열등좌(4) 의 저부 외연으로 돌출하여 형성되고 실장기판(2) 상에 반사갓(8)이 있고 이것에 의해 LED 투사 램프(Lamp)가 구성되고 이것에 의해 본 고안은 직접 종래의 투사등구 상에 삽설되어 사용되고 본래의 오래된 등구를 교환하지 않아도 좋다.Referring to Figs. 4 to 6, the circuit device 3 of the present invention is an international common standard such as MR 16, for example. A connection terminal 6 dedicated to the projection lamp seat is provided, and the connection terminal 6 is formed to protrude to the bottom outer edge of the heat dissipation lamp seat 4, and the reflector 8 is mounted on the mounting board 2. In this way, an LED projection lamp is formed, whereby the present invention is directly inserted into a conventional projection lamp and used without having to replace the original old lamp.

도 " 1 " 과, 도 " 2 ", 도 " 4 " 및 도 " 5 " 와 같이 본 고안은 전기 실장 기판(2) 에 요부(20)가 있으며, LED 모듈(module)(1) 이 요부(20)에 설치되고 백열전구로 사용할 때에는 요부(20)에 램프(Lamp)갓(7) 이 도 " 2 " 와 도 " 3 " 과 같이 고정되어진다. 투사램프로 사용할 때에는 요부(20) 에 반사갓(8)이 도 " 5 " 와 도 " 6 " 과 같이 고정되어진다.As shown in Fig. 1, Fig. 2, Fig. 4, and Fig. 5, the present invention has a recess 20 in the electric mounting board 2, and the LED module 1 is recessed. 20) and the lamp shade 7 is fixed to the recessed portion 20 as shown in Fig. 2 and Fig. 3 when used as an incandescent lamp. When used as a projection lamp, the reflection shade 8 is fixed to the recessed portion 20 as shown in Figs. 5 and 6.

또, 본 고안은 실장기판(2) 에 미리 설정된 수의 관통공(21)이 설치되고 이것에 의해 대류작용(對流作用)이 얻어져서 방열효과가 향상되어진다. 또, 방열등좌 (4)에 방열표면적을 증대하기 위한 도병(41)이 형성되어진다. 그때문에 본 고안은 보다 진보적이며 또한 실용적인 것이다.In addition, according to the present invention, a predetermined number of through-holes 21 are provided in the mounting substrate 2, whereby convection action is obtained, whereby the heat dissipation effect is improved. In addition, a heat shield 41 for increasing the heat dissipation surface area is formed in the heat dissipation seat 4. For this reason, the present invention is more advanced and practical.

도 1 은 본 고안의 백열전구의 사시도1 is a perspective view of an incandescent lamp of the present invention

도 2 는 본 고안의 백열전구의 분해 사시도2 is an exploded perspective view of the incandescent lamp of the present invention

도 3 은 본 고안의 백열전구의 조립상태 단면도3 is an assembled state cross-sectional view of the incandescent lamp of the present invention

도 4 는 본 고안의 투사램프(Lamp)의 사시도4 is a perspective view of a projection lamp of the present invention (Lamp)

도 5 는 본 고안의 투사램프(Lamp)의 분해 사시도5 is an exploded perspective view of the projection lamp (Lamp) of the present invention

도 6 은 본 고안의 투사램프(Lamp)의 조립상태 단면도Figure 6 is a cross-sectional view of the assembly state of the projection lamp (Lamp) of the present invention

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

(1) LED 모듈 (module) (2) 실장기판(實裝基板) (20) 요부(凹部)(1) LED module (2) Mounting board (20) Main part

(21) 관통공(貫通孔) (3) 회로장치(回路裝置) (4) 방열등좌(放熱燈座)(21) Through holes (3) Circuit devices (4) Heat dissipation lamps

(40) 내요부(內凹部) (50) 금속배럴(Barrel) (51) 절연배럴(Barrel)(40) Inner part (50) Metal barrel (51) Insulation barrel

(52) 전원접촉 시트(Seat) (6) 연결단자(連結端子) (7) 램프(Lamp)갓(笠)(52) Power contact seat (6) Connection terminal (7) Lamp lamp

(8) 반사(反射)갓(笠)(8) reflection shade

Claims (6)

실장기판(2)에 취부되어지는 LED 모듈(module)(1)과 열전달성이 좋은 금속으로 구성되어지는 실장기판(2)과 방열등좌(4) 내에 설치되고 LED 모듈(module)(1) 과 외부전원을 연결하는 회로장치(3) 와 방열성이 좋고 비금속으로 구성되고 다공극 구조이며 직접 등좌 외형에 성형되고 내요부(40) 가 있고 내요부(40) 의 개구단이 실장기판(2)에 의해 봉지되어지는 방열등좌(4)로 구성되어 짐을 특징으로 하는 고효율 LED 램프(Lamp)LED module (1) to be mounted on the mounting board (2) and the mounting board (2) and heat dissipation lamp (4) consisting of a metal with good heat transfer and installed in the LED module (1) Circuit device (3) for connecting the external power source with heat dissipation and is composed of non-metallic, multi-porous structure, is formed in the shape of the back seat directly, and has an inner recess (40), and the open end of the inner recess (40) is a mounting board (2) High efficiency LED lamp, characterized in that it consists of a heat dissipation lamp seat (4) which is sealed by 제 1 항에 있어서The method of claim 1 방열등좌(4) 외면에 백열전구 전용의 금속버블(50) 이나 절연버블(51) 및 전원접촉 시트(Seat)(52)가 설치되고 금속버블(50)과 절연버블(51) 및 전원접촉 시트(Seat)(52)가 회로장치(3)에 전기적으로 접촉되고 실장기판(2)상에 램프(Lamp)갓(7)이 설치되고 이것에 의해 LED 백열전구가 구성되어 짐을 특징으로 하는 고효율 LED 램프(lamp)On the outer surface of the heat radiating lamp seat (4), a metal bubble (50) or an insulating bubble (51) and a power contact sheet (Seat) 52 for exclusive use of incandescent lamps are installed, and the metal bubble (50) and the insulating bubble (51) and power contact The seat 52 is in electrical contact with the circuit device 3, and a lamp shade 7 is installed on the mounting board 2, whereby an LED incandescent lamp is formed. LED lamp 삭제delete 삭제delete 삭제delete 삭제delete
KR2020080005724U 2008-04-30 2008-04-30 High-Efficiency LED Lamp KR200450948Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2020080005724U KR200450948Y1 (en) 2008-04-30 2008-04-30 High-Efficiency LED Lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2020080005724U KR200450948Y1 (en) 2008-04-30 2008-04-30 High-Efficiency LED Lamp

Publications (2)

Publication Number Publication Date
KR20090011239U KR20090011239U (en) 2009-11-04
KR200450948Y1 true KR200450948Y1 (en) 2010-11-12

Family

ID=41557111

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2020080005724U KR200450948Y1 (en) 2008-04-30 2008-04-30 High-Efficiency LED Lamp

Country Status (1)

Country Link
KR (1) KR200450948Y1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101054305B1 (en) * 2010-12-30 2011-08-08 금강전기 (주) Led lighting unit and manufacturing method thereof
WO2012091364A2 (en) * 2010-12-30 2012-07-05 금강전기(주) Led lighting apparatus and method for manufacturing same
WO2013009049A2 (en) * 2011-07-08 2013-01-17 Lg Innotek Co., Ltd. Lighting device
KR101263763B1 (en) * 2011-12-07 2013-05-13 금강전기 (주) Led lighting unit
KR101263766B1 (en) * 2011-07-29 2013-05-13 금강전기 (주) LED Lighting unit
KR101859439B1 (en) 2011-07-08 2018-05-21 엘지이노텍 주식회사 Lighting device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100496522B1 (en) 2005-03-23 2005-06-27 주식회사 누리플랜 Led illumination lamp
US20070159828A1 (en) 2006-01-09 2007-07-12 Ceramate Technical Co., Ltd. Vertical LED lamp with a 360-degree radiation and a high cooling efficiency

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100496522B1 (en) 2005-03-23 2005-06-27 주식회사 누리플랜 Led illumination lamp
US20070159828A1 (en) 2006-01-09 2007-07-12 Ceramate Technical Co., Ltd. Vertical LED lamp with a 360-degree radiation and a high cooling efficiency

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101054305B1 (en) * 2010-12-30 2011-08-08 금강전기 (주) Led lighting unit and manufacturing method thereof
WO2012091364A2 (en) * 2010-12-30 2012-07-05 금강전기(주) Led lighting apparatus and method for manufacturing same
WO2012091364A3 (en) * 2010-12-30 2012-08-23 금강전기(주) Led lighting apparatus and method for manufacturing same
WO2013009049A2 (en) * 2011-07-08 2013-01-17 Lg Innotek Co., Ltd. Lighting device
WO2013009049A3 (en) * 2011-07-08 2013-02-07 Lg Innotek Co., Ltd. Lighting device
US8931921B2 (en) 2011-07-08 2015-01-13 Lg Innotek Co., Ltd. Lighting device
US9353915B2 (en) 2011-07-08 2016-05-31 Lg Innotek Co., Ltd. Lighting device
US9562674B2 (en) 2011-07-08 2017-02-07 Lg Innotek Co., Ltd. Lighting device
KR101859439B1 (en) 2011-07-08 2018-05-21 엘지이노텍 주식회사 Lighting device
KR101263766B1 (en) * 2011-07-29 2013-05-13 금강전기 (주) LED Lighting unit
KR101263763B1 (en) * 2011-12-07 2013-05-13 금강전기 (주) Led lighting unit

Also Published As

Publication number Publication date
KR20090011239U (en) 2009-11-04

Similar Documents

Publication Publication Date Title
JP3142963U (en) High efficiency LED lamp
KR200450948Y1 (en) High-Efficiency LED Lamp
US20090244899A1 (en) LED Lamp Having Higher Efficiency
JP5508113B2 (en) Lamp and lighting device
EP2105659A1 (en) LED lamp having higher efficiency
KR101123497B1 (en) Buried-Type Photonic Device Package Module Using a Thermocouple
US8193688B2 (en) LED lamp having higher efficiency
JP2009037796A (en) Light source and illuminating device
JP2007088078A (en) Light-emitting device
JP2011150926A (en) High-efficiency type led lamp
CN101545620A (en) Led lamp
CN201575346U (en) High efficiency led lamp
JP2009259738A (en) Highly efficient led lamp
JP3160879U (en) High efficiency LED lamp
CN201836667U (en) Led lamp
JP5487505B2 (en) LED lamp
TWI398602B (en) High efficiency LED lights
CN201269415Y (en) LED lamp
TWI338109B (en)
CN102052581A (en) High-efficient LED (light emitting diode) lamp
CN102242873A (en) LED (light emitting diode) lamp
JP3163777U (en) Heat sink and LED lamp
EP2341275A1 (en) LED lamp having higher efficiency
TWI393838B (en) LED lights
JP5372238B2 (en) Manufacturing method of integrated multilayer lighting device

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20131106

Year of fee payment: 4

FPAY Annual fee payment
LAPS Lapse due to unpaid annual fee