KR101263763B1 - Led lighting unit - Google Patents

Abstract

PURPOSE: An LED lighting device is provided to effectively emit the heat generated from an LED element by using a synthetic resin having thermal conductance and electrical insulation for forming the body of the LED lighting device. CONSTITUTION: A heat radiation housing(20) emits the heat of an LED element(10) to the outside. A conducting wire formation part(30) is formed in the upper surface of the heat radiation housing. A conducting terminal part(40) is arranged in the lower part of the heat radiation housing and is connected to a power socket. The terminal unit supplies different polarity power sources to the LED element and the conducting wire formation part. The terminal unit includes a first terminal member(51) made of a synthetic resin having electric conductance, and a second terminal member(52).

Description

LED lighting unit {LED Lighting unit}

The present invention relates to an LED lighting device, and more particularly, by using a thermally conductive resin having electrical insulation properties and a thermally conductive resin having electrical conductivity properties, heat dissipation performance of heat generated in an LED device can be improved. The present invention relates to an LED lighting device that has been improved in the manufacturing process.

In general, a light emitting diode (LED) is a device that bonds a p-type semiconductor and an n-type semiconductor, and emits light while coupling electrons and holes at the junctions. These LEDs can be used for home appliances, remote control, electric signboards, and various automation devices because they can irradiate high efficiency light with low voltage, and they are applied to various lighting devices because they are environment friendly, have excellent durability and long life. Due to the above-described characteristics of the LED, an illumination device such as an incandescent lamp or a fluorescent lamp which is conventionally used is being replaced by a lighting device using an LED.

The LED device used as a light source of the LED lighting device is made of a surface mount device (SMD) method for mounting directly on a printed circuit board (PCB), and the LED device is formed on a plurality of PCBs. The dogs are aligned and combined. The PCB is mounted to a lamp body of a predetermined shape is mounted on the body of the lighting device.

However, in the case of the LED device, the light mainly proceeds in the direction in which the generated light is irradiated, and most of the heat generated during the light generation process is transferred to the PCB side opposite to the direction of light irradiation. Is composed. Therefore, thermal stress is generated on the PCB formed of relatively heat-sensitive material, which may reduce the performance and life of the LED device, causing malfunction and failure of the lighting device, and lowering the light emission efficiency and energy efficiency of the LED device. Is generated. Therefore, in the lighting device using the LED element, the heat dissipation device can be seen as a very important component. Accordingly, the lighting device using the LED is manufactured so that a plurality of heat dissipation fins are integrally formed on the body on which the PCB is installed, so that the heat emitted from the LED element can be quickly discharged.

However, as described above, the body in which the plurality of heat dissipation fins are formed is mainly manufactured by die-casting aluminum. Aluminum die casting processes include: 1) aluminum casting, 2) gate and overflow cutting, 3) tap, drilling, milling, and CNC processes 4) sanding, 5) plating / powder coating And the like. The mold used in the aluminum die casting process is more expensive than the mold used in the resin injection process, and the die life is only about 1/5 to 1/10 of that of the plastic injection mold. little. In addition, since the heat dissipation fins of the body manufactured by the die casting method are not formed as thin as the heat dissipation fins formed through resin injection, the heat dissipation fins formed through the die cast are heat dissipated in the same space, and thus heat is rapidly dissipated. There is a limit to release. In addition, since the entire heat dissipation housing body serves as an electrically conducting conductor, if a power supply mounted inside the heat dissipation housing and insulation measures against the PCB are not sufficiently considered, it may provide a cause of failure of the device or an electric shock to the user.

In addition, since the lighting device using the aluminum heat dissipation structure is considerably heavier than existing lighting devices such as bulbs and fluorescent lights, it is difficult to replace only the body in which the LED element is mounted on the type of lighting case used in the existing lighting device. Dropping may cause safety problems.

On the other hand, due to the importance of heat dissipation in the LED lighting device, in order to more advantageously respond to the heat radiation, the ultra-high brightness LED lighting device uses a metal substrate (Metal PCB) instead of the FR4 PCB used in the general circuit. Metal substrates are not only expensive compared to conventional PCBs, but also have electrical conductivity of about 2 W / mK between a pattern layer forming a circuit and a metal layer (copper or aluminum plate) for heat diffusion and heat conduction. It needs to be bonded with an adhesive layer. However, in the apparatus requiring the thermal conductivity of 2W / mK or more of the electrically insulating adhesive layer, there is a problem that the adhesive layer acts as a thermal resistance. In addition, since the metal substrate itself is not in contact with air to release heat, the metal substrate only plays a role of diffusing and conducting heat of the LED element to a heat dissipation structure such as a heat dissipation fin that emits heat to air. The metal substrate itself acts as a thermal resistance, unless the substrate has an infinite level of thermal conductivity.

In particular, in order to bond such a metal substrate on which the LED element is mounted to a heat dissipation structure such as a heat dissipation fin, it is necessary to use another heat conductive adhesive, heat conductive double-sided tape, thermal grease, etc. other than the above-mentioned. This happens in addition. For example, the contact surface of the metal substrate and the heat dissipation structure seems to be completely horizontal to the naked eye, but in fact, the contact surfaces are only partially contacted with each other (typically less than 1%), and the rest are filled with air, so that the heat resistance inhibits heat dissipation of the LED element. Acts as. Therefore, the present invention is supplemented with a thermally conductive adhesive, a thermally conductive double-sided tape, a thermally conductive grease, and the like, but this also has a problem of inhibiting optimum heat dissipation because it has its own thermal resistance.

The present invention has been made in view of the above problems, it is possible to effectively discharge the heat generated from the LED device, provides a light and low cost LED lighting device and a method of manufacturing the same, the environment generated during the manufacturing process The goal is to minimize contamination of

LED lighting apparatus according to the present invention, the light source module having at least one or more LED elements; A heat dissipation housing which is injection-molded with synthetic resin having both thermal conductivity and electrical insulation, and dissipates heat of the light source module to the outside; An electrically conductive wiring forming portion configured in a wiring shape on an upper surface of the heat dissipation housing; A conductive terminal portion disposed under the heat dissipation housing and connected to a power outlet; And a terminal unit formed of an electrically conductive material to supply power having different polarities to the light source module and the conductive wiring forming unit.

The terminal unit is inserted into the heat dissipation housing, one end of which is disposed in a position proximate to the conductive wiring forming portion, and the other end of which is exposed to the conductive terminal portion to supply power of a first polarity of a power outlet to the LED element. 1 terminal member; And a second terminal member inserted into and coupled to the conductive terminal part, one end of which is connected to the conductive wiring forming part, and the other end of which is exposed to the conductive terminal part.

The first and second terminal members may be formed of a synthetic resin having electrical conductivity.

Alternatively, the first and second terminal members may be formed by insert injection molding of metal.

The conductive wiring forming unit may be configured by double-injecting a wire shape with a synthetic resin having electrical conductivity or by printing a wire shape with an electrically conductive ink, and provided as a separate component from the heat dissipation housing, and an upper surface of the heat dissipation housing. It is also possible to be coupled to.

One end of the LED device is connected to the terminal unit, and the other end thereof is connected to the conductive wiring forming part by any one of soldering, ultrasonic fusion and thermal fusion, and an electrically conductive adhesive.

In addition, the conductive terminal unit may be provided as a connector connected to any one of an incandescent bulb, a fluorescent lamp, an MR-type bulb and a PAR bulb standard or an external power supply electric cable.

The heat dissipation housing may be formed of a synthetic resin material having a thermal conductivity of 1 W / mK or more and an electrical resistivity of 1 MΩ · m or more, and the conductive wiring forming part may be formed of a synthetic resin material having an electrical resistivity of 100 Ω · cm or less.

Alternatively, the heat dissipation housing may be formed of a synthetic resin material having a thermal conductivity of 0.2 W / mK or more and an electrical resistivity of 1 MΩ · m or more, and the conductive wiring forming part may be formed of a synthetic resin material having an electrical resistivity of 100 Ω · cm or less.

The LED light source may further include a cover member covering an upper surface of the heat dissipation housing.

In addition, it is preferable that the conductive terminal portion and the terminal unit are integrally formed of an electrically conductive synthetic resin so that a part of the heat dissipating housing having electrical insulation is separated from each other by the electrical polarities of the conductive terminal portion and the terminal unit.

LED lighting apparatus according to another embodiment of the present invention, the light source module at least one or more LED elements are arranged at regular intervals; A heat dissipation housing which is injection-molded with synthetic resin having both thermal conductivity and electrical insulation, and dissipates heat of the light source module to the outside; A conductive wiring forming portion printed on the upper surface of the heat dissipation housing in a wiring shape; A conductive terminal portion disposed at a side surface of the heat dissipation housing and connected to a power outlet; And a terminal unit formed of an electrically conductive material and supplying power having different polarities to the light source module and the conductive wiring forming unit, wherein the heat dissipation housing has a thermal conductivity of 0.2 W / mK or more and an electrical resistivity of 1 MΩ · m or more. It is formed of a synthetic resin material, characterized in that the conductive wiring forming portion is formed of a conductive ink having an electrical resistivity of 100 Ω · cm or less.

LED lighting apparatus according to another embodiment of the present invention, the light source module at least one or more LED elements are arranged at regular intervals; A heat dissipation housing which is injection-molded with synthetic resin having both thermal conductivity and electrical insulation, and dissipates heat of the light source module to the outside; A conductive wiring forming unit which is double-injected in a wire shape on the upper surface of the heat dissipation housing; A conductive wiring forming part in which a part of a wiring shape is double-injected on the upper surface of the heat dissipation housing and the wiring of the remaining part is printed with conductive ink; And a terminal unit formed of an electrically conductive material and supplying power having different polarities to the light source module and the conductive wiring forming unit, wherein the heat dissipation housing has a thermal conductivity of 0.2 W / mK or more and an electrical resistivity of 1 MΩ · m or more. It is formed of a synthetic resin material, the conductive wiring forming portion, characterized in that the electrical resistivity is formed of a synthetic resin material of 100Ω · cm or less. In this case, the conductive wiring forming portion, the surface may be plated with a metal material.

According to the present invention as described above, since the injection molding of the synthetic resin having both excellent thermal conductivity and both thermal conductivity and electrical insulation of the flame-retardant material to form the body of the lighting device, the lighting device with an expensive die-cast metal material as in the prior art Even without forming the body, the heat generated by the LED element can be effectively released.

In addition, since the LED element and the conductive wiring forming part can be directly connected to each other without any additional fixing means such as soldering or epoxy adhesive by thermal fusion or ultrasonic fusion, heat transfer loss that can occur when soldering or adhesive is used is eliminated. It is possible to minimize. In addition, since the conductive wiring forming portion formed in the heat dissipating housing and the LED (and other circuit elements) can be directly connected to each other by soldering or thermal welding, ultrasonic welding, or electrically conductive adhesive, there is no need for a separate PCB. Therefore, it is possible not only to minimize the heat transfer loss but also to reduce the weight and the cost of constructing the product.

1 is a perspective view showing an example of an LED lighting apparatus according to the present invention,
Fig. 2 is an exploded perspective view of Fig. 1,
3 is a perspective view of a state in which the cover member of FIG. 1 is removed;
4 is a bottom plan view of FIG. 1.
5 and 6 are perspective views showing an example of an LED lighting apparatus according to another embodiment of the present invention.

Hereinafter, the LED lighting apparatus according to the present invention will be described with the drawings.

1 is a perspective view showing an example of an LED lighting apparatus according to the present invention, Figure 2 is an exploded perspective view of Figure 1, Figure 3 is a perspective view of the cover member of Figure 1 removed, Figure 4 is a bottom plan view of Figure 1; 5 and 6 are perspective views showing an example of an LED lighting apparatus according to another embodiment of the present invention.

1 to 6, the LED lighting apparatus according to the present invention, the LED element 10, the heat dissipation housing 20, the conductive wiring forming portion 30, the conductive terminal portion 40 and the first and first It comprises a terminal unit 50 consisting of two terminal members (51, 52).

The light source module preferably includes at least one LED element 10. At this time, the LED device 10 is formed of a semiconductor p-n junction structure, a semiconductor device that emits light by recombination of electrons and holes is driven by a current in one direction. Therefore, in order to use the light emitting diode for general lighting, an AC-DC converter is required. Recently, LEDs that can be driven using an AC power source without an AC-DC converter have been developed for use in general lighting, but because of their relatively high cost, the LED element 10 operating from a DC power source is still present. It is used a lot. Also in the case of the present invention, since the LED element 10 operating in a direct current environment is used, it has a terminal portion to which the + and-poles are joined.

In addition, LED or power control IC that can be driven using an AC power source has been developed so that it can be used for general lighting, and in the case of the present invention, it can be operated in a DC driving environment that is a direct current or an AC driving environment that is an alternating current. However, it is obvious that both electrodes are required in a direct current environment or an alternating current environment, and the two electrodes must be separated by a circuit.

Only one LED device 10 may be used when a high brightness and high efficiency device is used, but in general, it is preferable to mount and use a plurality of LED devices 10. According to a preferred embodiment of the present invention, the LED element 10 is preferably disposed so that the three LED elements 10 having the same standard spaced apart, but is not limited to this, different colors as necessary It is also possible to mount the LED element 10 having.

The heat dissipation housing 20 may withstand the high heat emitted from the LED element 10 and is injection molded into a synthetic resin having excellent heat resistance and thermal conductivity so as to discharge heat to be transferred from the LED element 10 to the outside. As the material of the heat dissipation housing 20, among the high thermal-conductive polyamide (nylon), poly phenyl sulfide (PPS), liquid crystal polymer (LCP), polycarbonate (PC), noryl (NORYL) resin and Ultem (PEI) Either can be used. In general, PPS / LCP injection material has thermal conductivity of 0.1 ~ 0.2W / mK, and Ultem (PEI) injection material is amorphous high-performance thermoplastic, which has imide bonds and good processability which gives excellent heat resistance and strength. It is resin of the formation of the ether bond which shows. In addition, an additive such as aluminum nitride may be added to the synthetic resin to improve thermal conductivity. Synthetic resin materials having both thermal conductivity and electrical insulation can maintain mechanical strength in a high temperature environment, and since they are flame retardant materials, they are suitable for use in lighting devices that generate a lot of heat.

In the present invention, as the material of the heat dissipation housing 20, it is preferable to use a material based on satisfying the electrical insulation properties such as LCP (Liquid Crystal Polymer) or PC and Nylon, PPS.

An example of LCP is LCP-based flame-retardant and high-flow synthetic resins developed by Unitika, Japan.The thermal conductivity is 30W / mK or more, the electrical resistivity of the electrically conductive resin is 10Ω · cm, and the electrical resistivity of the electrically insulating resin. Has 1014Ω · cm or more of flame retardancy and has the following physical properties.

As described above, when the heat dissipation housing 20 is formed using a synthetic resin having both thermal conductivity and electrical insulation, a heat dissipation plate or a heat dissipation layer made of metal is formed on the upper surface 21 of the heat dissipation housing as in the prior art. There is no need to do so, it is possible to simplify the structure and reduce the manufacturing cost.

As shown in FIGS. 1 and 5, the upper surface 21 on which the LED element 10 of the heat dissipation housing 20 is mounted is formed to have a substantially circular shape, and has a conical shape in which the diameter decreases toward the lower side. Prepared. In this case, the heat dissipation housing 20 is provided with a heat dissipation fin 23 to radiate heat efficiently. The heat dissipation fin 23 is formed to extend in the longitudinal direction toward the lower side with respect to the upper surface 21, is configured to be as wide as possible the contact area with air.

The LED device 10 and the conductive wiring forming unit 30 may be connected in various ways, but the present invention may be electrically energized through an ultrasonic welding unit or a thermal welding unit without a separate conductive connecting member such as soldering. You can also connect.

The conductive wiring forming unit 30 is double injection-molded in a wire shape on the upper surface of the heat dissipation housing 20 by using a synthetic resin having both thermal conductivity and electrical conductivity, where the LED element 10 is mounted. do.

The conductive wiring forming portion 30 is provided to have a substantially ring shape, as shown in FIGS. 2 and 3. The conductive wiring forming unit 30 is a wiring pattern connected to one polarity or one polarity of the LED element 10 or different polarities in the case of AC AC, and is different from the first terminal member 51 to be described later. It is formed to be insulated.

The conductive wiring forming portion 30 may form a groove having a predetermined depth in the upper surface 21 of the heat dissipation housing 20, and may be double injection molded to fit the groove, or the upper surface 21. It is also possible to double injection molding so as to be laminated at a certain height. In this case, the material that is double-injected on the upper surface 21 may be made of a synthetic resin having electrical conductivity, or may be formed of a metal material.

Alternatively, the conductive wiring forming unit 30 may be configured by pattern-printing the wiring shape with ink having electrical conductivity. Although not illustrated, the conductive wiring forming unit 30 may be formed of an electrically conductive synthetic resin or a metal material, and the upper surface 21 may be formed. It can also be attached to the configuration.

In the case of the present invention, since both the material of the heat dissipation housing 20 and the material of the conductive wiring forming portion 30 are made of a synthetic resin having both thermal conductivity and electrical insulation, the thermal conductivity efficiency is not reduced at the contact surface. .

On the other hand, in order to lower the resistance value of the conductive wiring forming portion 30, the surface may be plated with a metal material. That is, since the conductive wiring forming portion 30 is a material through which electricity flows, and the heat dissipation housing 20 is made of an insulating material, the conductive wiring forming portion 30 may be electroplated while applying electricity to the conductive wiring forming portion 30. . As another method, it is also possible to plate the said electrically conductive wiring formation part 30 using the chemical plating method. As such, when the conductive wiring forming unit 30 is plated with a metal material, the electrical conduction with the LED element 10 mounted in the conductive wiring forming unit 30 may be further improved.

The conductive terminal portion 40 is disposed below the heat dissipation housing 20 and connected to a power outlet, but it is preferable to have a spiral outer circumferential surface that meets the incandescent bulb standard as shown, but is not limited thereto. It may be configured to meet the bulb specifications of various standards, such as LED lamps to replace the.

The terminal unit may be composed of first and second terminal members 51 and 52.

The first terminal member 51 is inserted from the upper side to the lower side in the center of the heat dissipation housing 20, one end is disposed in a position close to the conductive wiring forming portion 30, the other end to the conductive terminal portion 40 Exposed. The exposed end supplies the power of the first polarity of the power outlet to the LED element 10.

The first terminal member 51 may be formed of various materials. Any material may be used as long as it is a material capable of energizing. In addition, it may have a configuration such as screw bolt for ease of coupling, as shown in the hexagonal bolt configuration, the corresponding shape is formed in the groove on the upper surface 21 of the heat dissipation housing 20 by It is also possible to fix.

The second terminal member 52 is inserted and coupled from the lower side to the upper side through a groove provided in one wall of the conductive terminal portion 40, one end of which is electrically connected to the conductive wiring forming portion 30, and the other end thereof is It is exposed to the outside of the conductive terminal portion 40, and receives the power of the second polarity of the power outlet together with the conductive terminal portion 40.

The second terminal member 52 may be made of any material as long as it is a material that can conduct electricity, such as the first terminal member 51, and a shape corresponding to a screw formed on the outer circumferential surface of the conductive terminal part 40 is provided on the exposed surface. It is good to be.

Meanwhile, as shown in FIGS. 1 and 2, the cover member 1 having a bulb shape may be further provided on the LED element 10 to prevent contamination and damage of the LED element 10. .

On the other hand, as shown in Figure 5 and 6, the LED lighting apparatus according to another embodiment of the present invention may be configured in a shape replaced with a fluorescent lamp. In this case, the plurality of LED elements 10 are arranged to have a predetermined number of rows and rows, the heat dissipation housing 20 is formed long in the longitudinal direction on the back, the heat dissipation fin 23 may be configured on the surface.

In addition, although not shown, the present invention may be applied to various forms, such as MR light bulbs and PAR light bulbs, in the same manner.

According to the present invention as described above, without a separate wiring member or a separate PCB for supplying power to the LED element 10, by using soldering or thermal fusion or ultrasonic fusion, electrically conductive adhesive, etc. of the heat dissipation housing 20 It is possible to mount the LED element 10 on the upper side.

In addition, it is convenient because it can be used immediately by replacing the existing incandescent bulb.

The technical object of the present invention is not limited to the above-mentioned technical objects and other technical objects which are not mentioned can be clearly understood by those skilled in the art from the following description will be.

10; LED device 20; Heat dissipation housing
21; Upper surface 23; Heat sink fin
30; An electrically conductive wiring forming portion 40; Conductive Terminal
51; A first terminal member 52; Second terminal member

Claims (17)

At least one LED device;
A heat dissipation housing which is injection molded from a synthetic resin having both thermal conductivity and electrical insulation, and dissipates heat of the LED element to the outside;
An electrically conductive wiring forming portion configured in a wiring shape on an upper surface of the heat dissipation housing;
A conductive terminal portion disposed under the heat dissipation housing and connected to a power outlet; And
And a terminal unit formed of an electrically conductive material to supply power having different polarities to the LED element and the conductive wiring forming unit.
The terminal unit,
A first terminal member inserted into the heat dissipation housing, one end of which is disposed in a position proximate to the conductive wiring forming portion, and the other end of which is exposed to the conductive terminal portion to supply power of a first polarity of a power outlet to the LED element; And
And a second terminal member inserted into and coupled to the conductive terminal part, the second terminal member being connected to the conductive wiring forming part and the other end exposed to the conductive terminal part.
delete The method of claim 1,
The first and second terminal members are LED lighting device formed of a synthetic resin having electrical conductivity.
The method of claim 1,
The first and the second terminal member is an LED lighting device which is formed by injection molding the metal material.
According to claim 1, The conductive wiring forming portion,
LED lighting device that double-inject the wiring shape with a synthetic resin having electrical conductivity.
According to claim 1, The conductive wiring forming portion,
LED lighting device for printing wiring shapes with electrically conductive ink.
According to claim 1, The conductive wiring forming portion,
The LED lighting device is provided as a separate component from the heat dissipation housing and coupled to an upper surface of the heat dissipation housing.
The method of claim 1, wherein the LED element,
One end is connected to the terminal unit, and the other end is connected to the conductive wiring forming portion by any one of the method of soldering, ultrasonic fusion and thermal fusion, electrically conductive adhesive.
The method of claim 1,
The conductive terminal unit is provided with any one of incandescent bulb, fluorescent lamp, MR type bulb and PAR bulb standard, wire connection connector.
The method of claim 1,
The heat dissipation housing is formed of a synthetic resin material having a thermal conductivity of 1 W / mK or more and an electrical resistivity of 1 MPa · m or more,
The conductive wiring forming unit, the LED lighting apparatus, characterized in that the electrical resistivity is formed of a synthetic resin material of 100Ω · cm or less.
The method of claim 1,
The heat dissipation housing is formed of a synthetic resin material having a thermal conductivity of 0.2 W / mK or more and an electrical resistivity of 1 MPa · m or more,
The conductive wiring forming unit, the LED lighting apparatus, characterized in that the electrical resistivity is formed of a synthetic resin material of 100Ω · cm or less. The method of claim 1,
And a cover member covering an upper surface of the heat dissipation housing in which the LED element is mounted.
The method of claim 1,
An LED lighting device in which a conductive terminal portion and a terminal unit are integrally formed of an electrically conductive synthetic resin, and a part of the heat dissipating housing having electrical insulation is separated from each other with different polarities of the conductive terminal portion and the terminal unit.
A light source module in which at least one LED element is disposed at regular intervals;
A heat dissipation housing which is injection-molded with synthetic resin having both thermal conductivity and electrical insulation, and dissipates heat of the light source module to the outside;
A conductive wiring forming portion printed on the upper surface of the heat dissipation housing in a wiring shape;
A conductive terminal portion disposed in the heat dissipation housing and connected to an external power source such as a power outlet; And
And a terminal unit formed of an electrically conductive material and supplying power having different polarities to the light source module and the conductive wiring forming unit.
The heat dissipation housing is formed of a synthetic resin material having a thermal conductivity of 0.2 W / mK or more and an electrical resistivity of 1 MPa · m or more,
The electrically conductive wiring forming portion is formed of a conductive ink having an electrical resistivity of 100 Ω · cm or less.
A light source module in which at least one LED element is disposed at regular intervals;
A heat dissipation housing which is injection-molded with synthetic resin having both thermal conductivity and electrical insulation, and dissipates heat of the light source module to the outside;
A conductive wiring forming unit which is double-injected in a wire shape on the upper surface of the heat dissipation housing;
A conductive terminal portion disposed in the heat dissipation housing and connected to an external power source such as a power outlet; And
And a terminal unit formed of an electrically conductive material and supplying power having different polarities to the light source module and the conductive wiring forming unit.
The heat dissipation housing is formed of a synthetic resin material having a thermal conductivity of 0.2 W / mK or more and an electrical resistivity of 1 MPa · m or more,
The conductive wiring forming unit, the LED lighting apparatus, characterized in that the electrical resistivity is formed of a synthetic resin material of 100Ω · cm or less.
A light source module in which at least one LED element is disposed at regular intervals;
A heat dissipation housing which is injection-molded with synthetic resin having both thermal conductivity and electrical insulation, and dissipates heat of the light source module to the outside;
A conductive wiring forming part in which a part of a wiring shape is double-injected on the upper surface of the heat dissipation housing and the wiring of the remaining part is printed with conductive ink;
A conductive terminal portion disposed in the heat dissipation housing and connected to an external power source such as a power outlet; And
And a terminal unit formed of an electrically conductive material and supplying power having different polarities to the light source module and the conductive wiring forming unit.
The heat dissipation housing is formed of a synthetic resin material having a thermal conductivity of 0.2 W / mK or more and an electrical resistivity of 1 MPa · m or more,
The conductive wiring forming unit, the LED lighting apparatus, characterized in that the electrical resistivity is formed of a synthetic resin material and the conductive ink of 100Ω · cm or less.
The method of claim 16, wherein the conductive wiring forming portion,
LED lighting device whose surface is plated with metal material.

Images