CN101545620A - Led lamp - Google Patents
Led lamp Download PDFInfo
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- CN101545620A CN101545620A CN200810087772A CN200810087772A CN101545620A CN 101545620 A CN101545620 A CN 101545620A CN 200810087772 A CN200810087772 A CN 200810087772A CN 200810087772 A CN200810087772 A CN 200810087772A CN 101545620 A CN101545620 A CN 101545620A
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- baseplate
- lamp socket
- heat
- heat radiation
- led
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses an LED lamp, which mainly comprises an LED module, a framework substrate, a circuit device and a heat-dissipation lamp holder, wherein the LED module is arranged on the framework substrate; the framework substrate consists of metal with good thermal conductivity; the circuit device is arranged in the heat-dissipation lamp holder and connects the LED module with an external power source; the heat-dissipation lamp holder consists of nonmetal which is good in heat dissipation property and has a multi-pore structure, and is directly shaped into a lamp-holder shape; the heat-dissipation lamp holder has an inward-concave part; and the opening end of the inward-concave part is sealed via the framework substrate. As the heat-dissipation lamp holder directly forms the shape of a common bulb and has heat-dissipation function, the heat-dissipation lamp holder can directly replace the prior bulb, thereby having the effect of directly replacing the bulb without replacing the lamp besides having excellent heat-dissipation effect.
Description
Technical field
The present invention relates to a kind of LED lamp.
Background technology
At present, LED is the abbreviation of light emitting diode (Light-emitting Diode), it is the solid luminescent assembly of making by semi-conducting material, wherein semi-conducting material is III-V family chemical element (as: gallium phosphide (GaP), a GaAs (GaAs) etc.), its principle of luminosity is to convert electrical energy into light, just compound semiconductor is applied electric current, by combining of electronics and electric hole, superfluous energy can disengage with the form of light, reaches luminous effect.It is luminous that it belongs to cold property, and the life-span reached more than 100,000 hours.The characteristics of LED maximum are: need not warm up the lamp time (idling time), reaction speed is fast, volume is little, power-saving, shatter-proof, pollute low, be fit to volume production, the reliability height, the needs on the fit applications are made the assembly of minimum or array type easily.But,, promptly utilize the chip energising because LED is a solid-state illumination, the quantum excite state is replied and is sent energy (light), but in luminous process, the light energy in the chip can not reach the external world fully, can not be converted into the energy of light, in chip internal and packaging body, just can be absorbed, form heat.The conversion efficiency that LED is general has only 10%~30% approximately, so the electricity of 1W only becomes the light that can see less than 0.2W, other all is a heat, if do not dispel the heat, these accumulation of heat can cause damage to chip efficient and life-span.So will apply to the problem that lighting apparatus at first will solve heat radiation with high efficiency LED.With LED heat radiation patent is example, the novel M314505 of TaiWan, China number " high-capacity LED bulb radiator structure " patent (with reference on 06 21st, 2007 patent announcement data), mainly be on lamp holder, to be fixed with substrate, the end face of this substrate is fixed with at least one heat pipe, sheathed two or more fin and the top substrate of being fixed with of heat pipe, the end face of top substrate is provided with the high-capacity LED of corresponding heat pipe quantity, and the bottom surface bonding of this high-capacity LED is supported in the top of heat pipe.Novel M314433 number " radiating module of LED package " patent of TaiWan, China (with reference on 06 21st, 2007 patent announcement data), this radiating module comprises: the led circuit plate; Radiating block comprises two or more fin; And the thermal paste material, so as to directly fixing this led circuit plate on this radiating block; Wherein between this led circuit plate and this radiating block, do not have metal substrate.TaiWan, China is invented I260798 number " high-radiating light-emitting diode " patent (with reference on 08 21st, 2006 patent announcement data), comprises at least: the mushy material layer; Heat conduction layer is located at this mushy material laminar surface; And chip, be located at this heat conduction layer, by this heat conduction layer the heat that this chip sent is conducted to this mushy material layer, and by this mushy material layer with this heat to flowing to the outside.
Mostly adopt metal fin by above-described in the known as can be known LED heat radiation of first to file, or in conjunction with modes such as heat pipe, cooling chip, soaking plate, radiator fans, have generally that radiating effect is not good, radiating rate inadequately rapidly, shortcomings such as complicated, the cost height of radiating module structure, and because the radiator structure of required collocation designs for unnormalized, so light fixture that must design specialized can use.This is existing known technology and has maximum shortcoming, and this shortcoming is into an industry difficult problem extremely to be overcome.
Summary of the invention
In view of this, main purpose of the present invention is to provide a kind of provides illumination to use, and except that having splendid radiating effect, has more the LED lamp that must not change light fixture and can directly replace bulb use effect.
In order to achieve the above object, technical scheme of the present invention is achieved in that a kind of LED lamp mainly includes:
Led module, described led module is located on the baseplate;
Baseplate, described baseplate constitutes for the thermal conductivity good metal;
Circuit arrangement, described circuit arrangement are located in the heat radiation lamp socket, connect described led module and external power source;
The heat radiation lamp socket, described heat radiation lamp socket is the nonmetal formation of the good tool multi-pore structure of thermal diffusivity, and straight forming becomes the lamp socket profile, and described heat radiation lamp socket has inner fovea part, and the openend of inner fovea part seals by baseplate.
Wherein, described heat radiation lamp socket outer rim is provided with metallic sheath, insulation sleeve and the power contacting plate of bulb special use, and described metallic sheath and power contacting plate electrically connect with circuit arrangement respectively, and described baseplate is provided with lampshade.
Wherein, described circuit arrangement is provided with the splicing ear of projection lamp socket special use, and described splicing ear is convexly equipped with out heat radiation lamp socket bottom outer rim, and described baseplate is provided with reflector.
Wherein, described baseplate has depressed part, and described led module is located at described depressed part.
Wherein, described baseplate is provided with can the forming convection action of a plurality of quantity and the perforation that improves radiating effect.
Wherein, described heat radiation lamp socket is provided with in order to increase the lines of cooling surface area.
Beneficial effect after the employing technique scheme is: LED lamp of the present invention can directly form general bulb profile, and have radiating effect concurrently, can directly replace known bulb uses, except that having splendid radiating effect, have more and must not change the effect that light fixture can directly be replaced bulb, i.e. the present invention can directly use on old light fixture.
Description of drawings
Fig. 1 is the stereogram of bulb-type LED lamp of the present invention;
Fig. 2 is the three-dimensional exploded view of bulb-type LED lamp of the present invention;
Fig. 3 is the three-dimensional generalized section of the combination of bulb-type LED lamp of the present invention;
Fig. 4 is the stereogram of projecting lamp formula LED lamp of the present invention;
Fig. 5 is the three-dimensional exploded view of projecting lamp formula LED lamp of the present invention;
Fig. 6 is the three-dimensional generalized section of the combination of projecting lamp formula LED lamp of the present invention.
Description of reference numerals
1 led module
2 baseplates
21 perforation of 20 depressed parts
3 circuit arrangements
4 heat radiation lamp sockets
40 inner fovea parts, 41 lines
50 metallic sheaths, 51 insulation sleeves
52 power contacting plates
6 splicing ears
7 lampshades
8 reflectors
The specific embodiment
For reaching the technological means of the aforementioned purpose of the present invention, enumerate embodiment, and conjunction with figs. explanation, to structure of the present invention, feature and the effect reached, obtain more preferably to understand.
At first, as Fig. 1, Fig. 2 and shown in Figure 3, the LED lamp among the present invention mainly includes as seen from the figure:
Heat radiation lamp socket 4, be the good tool multi-pore structure of thermal diffusivity (multi-pore structure promptly has the high-specific surface area structure), and by nonmetally constituting (heat radiation lamp socket 4 is made (as ejection formation) by the high non-metallic powder of thermal conductivity, thermal conductivity high non-metallic powder such as aluminium oxide (Al
2O
3), zirconia (Zr
2O), aluminium nitride (AlN), silicon nitride (SiN), boron nitride (BN), tungsten carbide (WC), carborundum (SiC), graphite (C), crystalline silicon carbide, re-crystallized silicon carbide (ReSiC) etc., and be good) with aluminium nitride and carborundum, and straight forming becomes the lamp socket profile, it has inner fovea part 40, and the openend of inner fovea part 40 is by baseplate 2 sealings;
When the LED lamp was lighted, the heat of its generation can promptly be conducted by baseplate 2, and borrowed heat conduction and the thermal convection current effect of baseplate 2 with 4 of heat radiation lamp sockets, led module 1 produced on the baseplate 2 heat was promptly conducted to dispel the heat lamp socket 4 and dispelled the heat.
Heat radiation lamp socket 4 directly forms general bulb profile among the present invention, and have heat dissipation concurrently, can directly replace known bulb and use, except that having splendid radiating effect, also have and must not change light fixture can directly replace the effect of bulb (being that the present invention can directly use) on old light fixture.These heat radiation lamp socket 4 outer rims are provided with metallic sheath 50, insulation sleeve 51 and the power contacting plate 52 of bulb special use, wherein the metallic sheath 50 of this bulb special use, insulation sleeve 51 and power contacting plate 52 are international specification, as E-27, E14 etc., this metallic sheath 50 and power contacting plate 52 electrically connect with circuit arrangement 3 respectively, baseplate 2 is provided with lampshade 7, and constitute the LED lamp, so the present invention directly can be screwed together in and use on the light fixture of known bulb, and needn't replace original old light fixture.
As Fig. 4, Fig. 5 and shown in Figure 6, circuit arrangement 3 is provided with the splicing ear 6 of projection lamp socket special use (splicing ear 6 of this projection lamp socket special use is international specification among the present invention, as MR16 etc.), this splicing ear 6 is convexly equipped with out heat radiation lamp socket 4 bottom outer rims, baseplate 2 is provided with reflector 8, and constitute projection-type LED lamp, so the present invention directly can be plugged together and on known projection light fixture, use, and needn't replace original old projection light fixture.
Moreover as Fig. 1, Fig. 2, Fig. 4 and shown in Figure 5, the aforementioned baseplate 2 of the present invention has depressed part 20, and led module 1 is located at this depressed part 20, and when using as bulb, this depressed part 20 is used to set firmly lampshade 7 (as shown in Figures 2 and 3).When using as projecting lamp, this depressed part 20 is used to set firmly reflector 8 (as Fig. 5 and shown in Figure 6).
Again, baseplate 2 is provided with a plurality of perforation 21 among the present invention, to form convection action, improves heat dissipation.Heat radiation lamp socket 4 is provided with the lines 41 that increases cooling surface area.So reach purpose of design of the present invention.
The above only is a preferable possible embodiments of the present invention, is not in order to limit scope of the present invention.
Claims (6)
1, a kind of LED lamp is characterized in that, described LED lamp mainly includes:
Led module, described led module is located on the baseplate;
Baseplate, described baseplate constitutes for the thermal conductivity good metal;
Circuit arrangement, described circuit arrangement are located in the heat radiation lamp socket, connect described led module and external power source;
The heat radiation lamp socket, described heat radiation lamp socket is the nonmetal formation of the good tool multi-pore structure of thermal diffusivity, and straight forming becomes the lamp socket profile, and described heat radiation lamp socket has inner fovea part, and the openend of inner fovea part seals by baseplate.
2, LED lamp according to claim 1, it is characterized in that, described heat radiation lamp socket outer rim is provided with metallic sheath, insulation sleeve and the power contacting plate of bulb special use, and described metallic sheath and described power contacting plate electrically connect with described circuit arrangement respectively, and described baseplate is provided with lampshade.
3, LED lamp according to claim 1 is characterized in that, described circuit arrangement is provided with the splicing ear of projection lamp socket special use, and described splicing ear is convexly equipped with out heat radiation lamp socket bottom outer rim, and described baseplate is provided with reflector.
4, according to claim 2 or 3 described LED lamps, it is characterized in that described baseplate has depressed part, described led module is located at described depressed part.
5, according to claim 2 or 3 described LED lamps, it is characterized in that described baseplate is provided with a plurality of perforation that can form convection action and improve radiating effect.
According to claim 2 or 3 described LED lamps, it is characterized in that 6, described heat radiation lamp socket is provided with in order to increase the lines of cooling surface area.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810087772A CN101545620A (en) | 2008-03-26 | 2008-03-26 | Led lamp |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810087772A CN101545620A (en) | 2008-03-26 | 2008-03-26 | Led lamp |
Publications (1)
Publication Number | Publication Date |
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CN101545620A true CN101545620A (en) | 2009-09-30 |
Family
ID=41192910
Family Applications (1)
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CN200810087772A Pending CN101545620A (en) | 2008-03-26 | 2008-03-26 | Led lamp |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102242873A (en) * | 2010-05-11 | 2011-11-16 | 秦文隆 | LED (light emitting diode) lamp |
CN102893080A (en) * | 2010-05-31 | 2013-01-23 | 夏普株式会社 | Lighting device |
CN103057033A (en) * | 2011-10-21 | 2013-04-24 | 秦文隆 | Combining method of packaging base plate of LED (Light Emitting Diode) lamp and lamp holder |
CN106548994A (en) * | 2016-10-28 | 2017-03-29 | 乐山凯亚达光电科技有限公司 | A kind of quasiconductor heat sink material |
-
2008
- 2008-03-26 CN CN200810087772A patent/CN101545620A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102242873A (en) * | 2010-05-11 | 2011-11-16 | 秦文隆 | LED (light emitting diode) lamp |
CN102893080A (en) * | 2010-05-31 | 2013-01-23 | 夏普株式会社 | Lighting device |
CN103057033A (en) * | 2011-10-21 | 2013-04-24 | 秦文隆 | Combining method of packaging base plate of LED (Light Emitting Diode) lamp and lamp holder |
CN106548994A (en) * | 2016-10-28 | 2017-03-29 | 乐山凯亚达光电科技有限公司 | A kind of quasiconductor heat sink material |
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Open date: 20090930 |