JP3142963U - High efficiency LED lamp - Google Patents
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- JP3142963U JP3142963U JP2008002535U JP2008002535U JP3142963U JP 3142963 U JP3142963 U JP 3142963U JP 2008002535 U JP2008002535 U JP 2008002535U JP 2008002535 U JP2008002535 U JP 2008002535U JP 3142963 U JP3142963 U JP 3142963U
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Abstract
【課題】直接に従来のバブルとして適用でき、優れた放熱効果が得られるだけでなく、灯具を交換せず、直接にバブルを交換して使用することができる高効率ＬＥＤランプを提供する。
【解決手段】主として、ＬＥＤモジュールと実装基板、回路装置及び放熱灯座から構成され、該ＬＥＤモジュールは、実装基板に設けられ、実装基板は、熱伝達性の良い金属から構成され、放熱灯座は、放熱性の良い多孔隙構造である非金属から構成され、直接に、灯座外形に成型され、内凹み部があり、内凹み部の開口端が、実装基板によって封止され、内部に回路装置が設置され、回路装置により、ＬＥＤモジュールと外部電源が連結され、ＬＥＤが点灯する時、生成した熱が、素早く実装基板によって伝達される。直接に従来のバブルとして適用でき、優れた放熱効果が得られるだけでなく、灯具を交換せず、直接にバブルを交換して使用することができる。
【選択図】図２Provided is a high-efficiency LED lamp that can be directly applied as a conventional bubble and not only has an excellent heat dissipation effect, but also can be used by directly replacing the bubble without replacing the lamp.
The LED module is mainly composed of an LED module, a mounting board, a circuit device, and a heat dissipation lamp seat. The LED module is provided on the mounting board, and the mounting board is made of a metal having good heat transfer properties. Is made of non-metal, which has a porous structure with good heat dissipation, and is directly molded into the outer shape of the lamp seat, has an inner recess, and the open end of the inner recess is sealed by the mounting substrate, When the circuit device is installed, the LED module is connected to the external power source, and the LED is turned on, the generated heat is quickly transmitted by the mounting substrate. It can be directly applied as a conventional bubble, and not only can an excellent heat dissipation effect be obtained, but also can be used by directly replacing the bubble without replacing the lamp.
[Selection] Figure 2
Description
本考案は、高効率ＬＥＤランプ技術に関し、特に、照明を提供するだけでなく、優れた放熱効果を有し、灯具を更換することが必要しなく、直接にバブルを交換できるものに関する。 The present invention relates to a high-efficiency LED lamp technology, and more particularly, to not only providing illumination, but also having an excellent heat dissipation effect, and it is not necessary to replace the lamp, and the bubble can be replaced directly.
ＬＥＤは、発光ダイオード（Ｌｉｇｈｔ−ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ）の略語で、半導体材料からなる固形発光素子であり、ＩＩＩ−Ｖ族化学元素（例えば、燐化ガリウムＧａＰや砒化ガリウムＧａＡｓ等）が利用され、発光原理は、電気エネルギーを光に変換するもので、即ち、化合物半導体に電流を印加し、電子とホールとを結合させて、エネルギーを光として釈放し、発光の効果が得られ、冷光で、寿命が十万時間以上になる。ＬＥＤは、最大の特長は、アイドリングタイム（ｉｄｌｉｎｇ ｔｉｍｅ）が要らなく、応答スピードが速く、体積が小さく、省電力、耐震、低汚染、量産に適合し、高信頼度などの利点が得られ、また、必要に応じて、容易に、極めて小さい、アレイ式の素子に作製できる。しかしながら、ＬＥＤが固形照明であるため、チップに通電することや量子励起によりエネルギー（光）を回復できるが、発光する過程において、チップ内の光エネルギーが、完全に、外部へ伝達できず、光エネルギーが、チップの内部やパッケージ内において、吸収されて、熱が形成される。ＬＥＤは、一般として、変換効率が約１０％〜３０％であるため、１Ｗの電力で、０．２Ｗのみ可視光に変換され、残りは、熱になり、そのため、放熱せず、それらの熱量が累積すると、チップの効率や寿命が悪化になる。そのため、高効率ＬＥＤを照明設備として利用するには放熱の問題を解決しなければならない。ＬＥＤ放熱特許を例とし、主として、口金上に、底板が固定され、該底板の上面に少なくとも一つの熱パイプが支持されて固定され、熱パイプに複数の放熱片と天板が嵌設されて固定され、天板の上面に、熱パイプに対応する数である高効率ＬＥＤが設けられ、該高効率ＬＥＤの底面が、熱パイプの上端に粘着されて支持される。発光ダイオードパッケージの放熱モジュール特許を例として、該放熱モジュールは、ＬＥＤ回路板と、複数の放熱片を有する放熱ブロックと、直接に該ＬＥＤ回路板を該放熱ブロック上に固定するための放熱ゴム材と、を備え、また、該ＬＥＤ回路板と該放熱ブロックとの間において、金属基板がない。また、高放熱発光ダイオード特許を例とし、少なくとも、多孔隙材料層と、該多孔隙材料層の表面に設けられる熱伝達層と、該熱伝達層に設けられるチップと、を備え、また、該熱伝達層により、該チップから発した熱を、該多孔隙材料層に伝達し、また、該多孔隙材料層を介して、対流により、該熱を外部へ放熱する。 LED is an abbreviation for light-emitting diode, and is a solid-state light-emitting element made of a semiconductor material. III-V chemical elements (for example, gallium phosphide GaP, gallium arsenide GaAs, etc.) are used to emit light. Is to convert electrical energy into light, that is, by applying an electric current to the compound semiconductor, combining electrons and holes, releasing the energy as light, obtaining the effect of light emission, cold light, life Over 100,000 hours. The biggest feature of LED is that it does not require idling time, quick response, small volume, power saving, earthquake resistance, low pollution, suitable for mass production, high reliability, etc. Further, if necessary, it can be easily produced into an extremely small array type element. However, since the LED is solid-state lighting, the energy (light) can be recovered by energizing the chip or by quantum excitation. However, in the process of emitting light, the light energy in the chip cannot be completely transmitted to the outside. The energy is absorbed inside the chip and in the package, and heat is formed. Since LEDs generally have a conversion efficiency of about 10% to 30%, only 0.2 W is converted into visible light with 1 W of power, and the rest is converted into heat, so that heat is not dissipated and the amount of heat generated. If accumulated, the efficiency and life of the chip will deteriorate. Therefore, in order to use the high efficiency LED as lighting equipment, the problem of heat dissipation must be solved. An LED heat radiation patent is taken as an example, and a bottom plate is mainly fixed on a base, and at least one heat pipe is supported and fixed on an upper surface of the bottom plate, and a plurality of heat radiation pieces and a top plate are fitted on the heat pipe. A high-efficiency LED having a number corresponding to the heat pipe is provided on the top surface of the top plate, and the bottom surface of the high-efficiency LED is adhered to and supported by the upper end of the heat pipe. Taking a heat dissipation module patent of a light emitting diode package as an example, the heat dissipation module includes an LED circuit board, a heat dissipation block having a plurality of heat dissipation pieces, and a heat dissipation rubber material for directly fixing the LED circuit board on the heat dissipation block. And there is no metal substrate between the LED circuit board and the heat dissipation block. Further, taking a high heat dissipation light emitting diode patent as an example, it comprises at least a porous material layer, a heat transfer layer provided on the surface of the porous material layer, and a chip provided on the heat transfer layer, and The heat transfer layer transfers heat generated from the chip to the porous material layer, and radiates the heat to the outside through the porous material layer by convection.
以上の例から、従来のＬＥＤの放熱は、金属放熱片を利用するか、或いは熱パイプや冷却チップ、均熱板或いは放熱ファンを結合して行うが、放熱効果が良くなく、放熱スピードが遅く、また、放熱モジュールの構造が複雑で、コストが高い等の問題点があり、また、放熱構造が規格化設計ではないため、専用設計の灯具が必要とする。そのため、既存の従来の技術は、解決しなければならない欠点がある。 From the above example, the heat radiation of the conventional LED is performed by using a metal heat radiation piece, or by connecting a heat pipe, a cooling chip, a heat equalizing plate or a heat radiation fan, but the heat radiation effect is not good and the heat radiation speed is slow. In addition, there are problems such as a complicated structure of the heat dissipation module and high cost, and since the heat dissipation structure is not a standardized design, a specially designed lamp is required. Therefore, the existing conventional technology has a drawback that must be solved.
本考案の主な目的は、主として、ＬＥＤモジュールと実装基板、回路装置及び放熱灯座から構成され、該ＬＥＤモジュールが、実装基板上に設けられ、実装基板が、熱伝達性の良い金属から構成され、放熱灯座が、放熱性の良い多孔隙構造で、非金属から構成され、また、内凹み部を有し、内凹み部の開口端が、実装基板によって封止され、その内部に回路装置が設けられ、回路装置により、ＬＥＤモジュールと外部電源が接続され、ＬＥＤを点灯すると、生成した熱が、素早く実装基板によって伝達され、また、実装基板と放熱灯座との熱伝達と熱対流作用により、実装基板上の熱が、素早く放熱灯座に伝達されて放熱される高効率ＬＥＤランプを提供する。 The main object of the present invention is mainly composed of an LED module, a mounting board, a circuit device and a heat dissipation lamp seat, the LED module is provided on the mounting board, and the mounting board is made of a metal having good heat transfer properties. The heat dissipation lamp seat has a porous structure with good heat dissipation and is made of a non-metal, and has an inner recess, and the opening end of the inner recess is sealed by a mounting substrate, and a circuit is formed in the inner recess. When the LED module is connected to the external power supply by the circuit device and the LED is turned on, the generated heat is quickly transmitted by the mounting board, and heat transfer and heat convection between the mounting board and the heat dissipation lamp seat By the action, a high-efficiency LED lamp is provided in which heat on the mounting board is quickly transmitted to the heat radiating lamp seat and radiated.
本考案の他の目的は、該放熱灯座外縁に、バブル専用の金属バレルや絶縁バレル及び電源接触シートが設けられ、該金属バレルと電源接触シートが、回路装置に電気的に接続され、従来のバブル灯具に適用される高効率ＬＥＤランプを提供する。 Another object of the present invention is to provide a bubble-dedicated metal barrel or insulating barrel and a power contact sheet on the outer edge of the radiator lamp seat, and the metal barrel and the power contact sheet are electrically connected to a circuit device. The present invention provides a high-efficiency LED lamp that is applied to a bubble lamp.
本考案の更の他の目的は、該回路装置に、投射灯座専用の連結端子があり、該連結端子が、放熱灯座の底部外縁から突出して形成され、従来の投射灯具に適用される高効率ＬＥＤランプを提供する。 Still another object of the present invention is that the circuit device has a connection terminal dedicated to the projection lamp seat, the connection terminal is formed to protrude from the outer edge of the bottom of the heat dissipation lamp seat, and is applied to a conventional projection lamp. A high efficiency LED lamp is provided.
本考案の更の他の目的は、該実装基板に、凹み部があり、ＬＥＤモジュールが、該凹み部に設けられる高効率ＬＥＤランプを提供する。 Still another object of the present invention is to provide a high-efficiency LED lamp in which the mounting substrate has a recess, and an LED module is provided in the recess.
本考案の更の他の目的は、該実装基板に、予めに設定された数の貫通穴が設けられ、これにより、対流作用が発生され、放熱効果が向上される高効率ＬＥＤランプを提供する。 Still another object of the present invention is to provide a high-efficiency LED lamp in which a predetermined number of through holes are provided in the mounting substrate, thereby generating a convection action and improving a heat dissipation effect. .
本考案の更の他の目的は、該放熱灯座に、放熱の表面積を増大するための図柄が設けられ、また、実装基板が金属からなるため、高構造密度と高比熱の特性が得られる高効率ＬＥＤランプを提供する。 Still another object of the present invention is to provide a design for increasing the surface area of heat dissipation on the heat radiating lamp seat, and since the mounting substrate is made of metal, characteristics of high structural density and high specific heat can be obtained. A high efficiency LED lamp is provided.
本考案は、主として、実装基板に取り付けられるＬＥＤモジュールと、熱伝達性の良い金属から構成される回路装置で、放熱灯座内に設けられ、ＬＥＤモジュールと外部電源とを接続する実装基板と、放熱性の良い、多孔隙構造で、非金属から構成され、また、一体成型で、内凹み部がある放熱灯座と、を備え、また、内凹み部の開口端が、実装基板によって封止される高効率ＬＥＤランプである。 The present invention is a circuit device mainly composed of an LED module attached to a mounting board and a metal having good heat transfer, and is provided in a heat dissipation lamp seat, and the mounting board for connecting the LED module and an external power source; It has a porous structure with good heat dissipation, is made of non-metal, and has a heat dissipation lamp seat that is integrally molded and has an inner recess, and the opening end of the inner recess is sealed by a mounting substrate. High efficiency LED lamp.
図１乃至図３を参照しながら、本考案は、主として、従来の規格化商品で、実装基板２に取り付けられるＬＥＤモジュール１と、例えば、金や銀、銅、鉄、アルミニウム、コバルト、ニッケル、亜鉛、チタン、マンガン等である熱伝達性の良い金属から構成される実装基板２と、放熱灯座４内に設けられ、ＬＥＤモジュール１と外部電源を連結する回路装置３と、放熱性が良く、高比表面積構造の多孔隙構造であり、例えば、酸化アルミニウムＡｌ２Ｏ３や酸化ジルコニウムＺｒ２Ｏ、窒化アルミニウムＡｌＮ、窒化シリコンＳｉＮ、窒化ホウ素ＢＮ、炭化タングステンＷＣ、炭化シリコンＳｉＣ、石墨Ｃ、結晶炭化シリコン、再結晶炭化シリコンＲｅＳｉＣ等である高熱伝達率の非金属粉末から構成され、その中、窒化アルミニウムと炭化シリコンが、好ましく、また、一体成型であり、内凹み部４０があり、内凹み部４０の開口端が、実装基板２に封止される放熱灯座４と、を備え、また、ＬＥＤを点灯すると、生成した熱が、素早く実装基板２によって伝達され、また、実装基板２と放熱灯座４との熱伝達と熱対流作用により、実装基板上２のＬＥＤにより生成された熱が、素早く放熱灯座４に伝達されて放熱される。 Referring to FIGS. 1 to 3, the present invention is mainly a conventional standardized product, such as an LED module 1 attached to a mounting board 2, and, for example, gold, silver, copper, iron, aluminum, cobalt, nickel, A mounting board 2 made of a metal having good heat transfer properties such as zinc, titanium, manganese, etc., a circuit device 3 provided in the heat dissipating lamp seat 4 and connecting the LED module 1 and an external power source, and a good heat dissipation , A porous structure having a high specific surface area structure, such as aluminum oxide Al 2 O 3 and zirconium oxide Zr 2 O, aluminum nitride AlN, silicon nitride SiN, boron nitride BN, tungsten carbide WC, silicon carbide SiC, graphite C, It is composed of non-metallic powder with high heat transfer coefficient such as crystalline silicon carbide, recrystallized silicon carbide ReSiC, etc. Siliconized is preferable, is integrally molded, has an indented portion 40, an opening end of the indented portion 40 includes a heat dissipating lamp seat 4 sealed on the mounting substrate 2, and an LED. When the lamp is lit, the generated heat is quickly transferred by the mounting board 2, and the heat generated by the LEDs on the mounting board 2 is quickly transferred by the heat transfer and the thermal convection action between the mounting board 2 and the radiator lamp seat 4. It is transmitted to the heat dissipation lamp seat 4 and radiated.
本考案に係る放熱灯座４は、直接に一般のバブル外形に形成され、放熱効果が得られ、また、直接に、従来のバブルの代わりに使用でき、それにより、優れた放熱効果が得られるだけでなく、灯具を交換せず、直接にバブルを交換することができる（即ち、本考案は、直接に、従来の灯具に適用できる）。該放熱灯座４の外縁に、例えば、Ｅ−２７やＥ１４等の国際共通規格であるバブル専用の金属バレル５０と絶縁バレル５１及び電源接触シート５２が設けられ、該金属バレル５０と電源接触シート５２が、更に、回路装置３に電気的に接続され、実装基板２上にランプ笠７が設けられ、これにより、ＬＥＤバブルが構成され、そのため、本考案は、直接に従来のバブルの灯具に螺合されて使用でき、元の古い灯具を交換しなくても良い。 The heat dissipating lamp seat 4 according to the present invention is directly formed in a general bubble shape to obtain a heat radiation effect, and can be directly used in place of the conventional bubble, thereby obtaining an excellent heat radiation effect. In addition, the bubble can be exchanged directly without changing the lamp (ie, the present invention can be applied directly to a conventional lamp). For example, a metal barrel 50 dedicated to bubbles, an insulating barrel 51, and a power contact sheet 52, which are internationally common standards such as E-27 and E14, are provided on the outer edge of the radiator lamp seat 4, and the metal barrel 50 and the power contact sheet are provided. 52 is further electrically connected to the circuit device 3, and a lamp shade 7 is provided on the mounting substrate 2, thereby forming an LED bubble. Therefore, the present invention is directly applied to a conventional bubble lamp. It can be screwed and used, and it is not necessary to replace the old lamp.
図４乃至図６を参照しながら、本考案の回路装置３に、例えば、ＭＲ１６等の国際共通規格である投射灯座専用の連結端子６が設けられ、該連結端子６が、放熱灯座４の底部外縁から突出して形成され、実装基板２上に、反射笠８があり、これにより、ＬＥＤ投射ランプが構成され、これにより、本考案は、直接に、従来の投射灯具上に挿設されて使用でき、元の古い灯具を交換しなくても良い。 4 to 6, the circuit device 3 of the present invention is provided with a connection terminal 6 dedicated to a projection lamp seat, which is an international common standard such as MR16, for example, and the connection terminal 6 is connected to the heat radiation lamp seat 4. The projection projection 8 is formed on the mounting substrate 2 so as to form an LED projection lamp, whereby the present invention is directly inserted on a conventional projection lamp. It is not necessary to replace the original old lamp.
図１と図２、図４及び図５のように、本考案は、前記実装基板２に、凹み部２０があり、ＬＥＤモジュール１が、該凹み部２０に設けられ、バブルとして使用する時、該凹み部２０に、ランプ笠７が固定される（図２と図３のように）。投射ランプとして使用する時、該凹み部２０に、反射笠８が固定される（図５と図６のように）。 As shown in FIGS. 1, 2, 4, and 5, in the present invention, the mounting substrate 2 has a recess 20, and the LED module 1 is provided in the recess 20 and used as a bubble. The lamp shade 7 is fixed to the recess 20 (as shown in FIGS. 2 and 3). When used as a projection lamp, the reflective shade 8 is fixed to the recess 20 (as shown in FIGS. 5 and 6).
また、本考案は、実装基板２に、予めに設定された数の貫通穴２１が設けられ、これにより、対流作用が得られて、放熱効果が向上される。また、放熱灯座４に、放熱表面積を増大するための図柄４１が形成される。そのため、本考案は、より進歩的かつより実用的で、法に従って実用新案請求を出願する。 Further, according to the present invention, a predetermined number of through holes 21 are provided in the mounting substrate 2, whereby a convection action is obtained and a heat dissipation effect is improved. Moreover, the design 41 for increasing the heat radiating surface area is formed on the heat radiating lamp seat 4. Therefore, the present invention is more progressive and more practical, and file a utility model claim in accordance with the law.
以上は、ただ、本考案のより良い実施例であり、本考案は、それによって制限されることが無く、本考案に係わる実用新案請求の範囲や明細書の内容に基づいて行った等価の変更や修正は、全てが、本考案の実用新案請求の範囲内に含まれる。 The above is only a better embodiment of the present invention, and the present invention is not limited thereby, and equivalent modifications made based on the scope of the claims of the utility model related to the present invention and the contents of the description. All modifications and variations are included in the scope of the utility model claims of the present invention.
１ ＬＥＤモジュール
２ 実装基板
２０ 凹み部
２１ 貫通穴
３ 回路装置
４ 放熱灯座
４０ 内凹み部
４１ 図柄
５０ 金属バレル
５１ 絶縁バレル
５２ 電源接触シート
６ 連結端子
７ ランプ笠
８ 反射笠
DESCRIPTION OF SYMBOLS 1 LED module 2 Mounting board 20 Recessed part 21 Through hole 3 Circuit apparatus 4 Radiation lamp seat 40 Inner recessed part 41 Pattern 50 Metal barrel 51 Insulation barrel 52 Power supply contact sheet 6 Connecting terminal 7 Lamp shade 8 Reflective shade
Claims (6)
実装基板に取り付けられるＬＥＤモジュールと、
熱伝達性の良い金属から構成される実装基板と、
放熱灯座内に設けられ、ＬＥＤモジュールと外部電源を連結する回路装置と、
放熱性が良く、非金属から構成され、多孔隙構造であり、直接に、灯座外形に成型され、内凹み部があり、内凹み部の開口端が、実装基板により封止される放熱灯座と、
ことを特徴とする高効率ＬＥＤランプ。 mainly,
An LED module attached to the mounting substrate;
A mounting board made of metal with good heat transfer,
A circuit device provided in the heat dissipation lamp seat and connecting the LED module and an external power source;
A heat dissipation lamp with good heat dissipation, composed of non-metal, porous structure, directly molded into the outer shape of the lamp seat, with an inner recess, and the open end of the inner recess is sealed by the mounting substrate Zodiac,
A high-efficiency LED lamp characterized by that.
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