CN202302888U - LED light structure - Google Patents

Abstract

The utility model relates to a LED lamp structure mainly including the structure base plate and the fashioned lamp stand of jet-out of laying the LED crystalline grain, its characterized in that: the LED crystal grains on the packaging substrate are arranged in series, and the total voltage value of the LED crystal grains arranged in series is equal to or larger than the external power voltage value. It has the advantages of no need of driving circuit, complete combination with lamp holder after molding, high sealing degree and good heat conduction.

Description

LED light structure

technical field

The utility model relates to an LED lamp, in particular to an LED lamp assembly structure that saves driving circuits and is fully combined with the lamp holder after forming the assembly substrate, and has high adhesion and good heat conduction.

Background technique

At present, LED is the abbreviation of Light-emitting Diode (Light-emitting Diode), which is a solid-state light-emitting element made of semiconductor materials. ), the principle of luminescence is to convert electrical energy into light, that is, to apply current to the compound semiconductor, and through the combination of electrons and holes, the excess energy will be released in the form of light to achieve the effect of luminescence, which belongs to cold luminescence and has a long life More than 100,000 hours. The biggest features of LEDs are: no need for idling time, fast response, small size, low power consumption, shock resistance, low pollution, suitable for mass production, high reliability, and easy to make into a very small size to meet the needs of applications. or array elements. But because LED is a solid-state lighting, that is, when the chip is powered on, the quantum excitatory state returns to emit energy (light), but in the process of emitting light, the light energy in the chip cannot be completely transmitted to the outside world, and the energy that cannot be emitted is in the inside of the chip and It will be absorbed in the package, forming heat. The general conversion efficiency of LED is only about 10%~30%, so less than 0.2W of 1W of electricity can be turned into visible light, and the rest is heat. If the heat is not dissipated, the accumulated heat will damage the efficiency and life of the chip. . Therefore, in order to apply high-efficiency LEDs to lighting equipment, the problem of heat dissipation must first be solved. Taking the LED cooling patent as an example, the new patent No. M314505 "High Power LED Light Bulb Heat Dissipation Structure" in Taiwan, China (refer to the patent announcement data on June 21, 2007), mainly fixes a bottom substrate on a lamp holder, and the top of the bottom substrate At least one heat pipe is fixed on the surface support, and more than two heat sinks and a top substrate are fixed on the heat pipe sleeve. The top surface of the top substrate is provided with high-power LEDs corresponding to the number of heat pipes, and the bottom surface of the high-power LED is bonded supported on top of the heat pipe. Taiwan's new patent No. M314433 "Heat Dissipation Module for Light-Emitting Diode Package" (refer to the patent announcement data on June 21, 2007), the heat dissipation module includes: an LED circuit board; a heat dissipation block, including more than two heat sinks; and A heat dissipation adhesive material is used to directly fix the LED circuit board on the heat dissipation block; there is no metal substrate between the LED circuit board and the heat dissipation block. China Taiwan Invention No. I260798 "High Heat Dissipation Light Emitting Diode" patent (refer to the patent announcement data on August 21, 2006), at least includes: a porous material layer; a heat conduction layer, located on the surface of the porous material layer; and a The chip is arranged on the heat conduction layer, the heat emitted by the chip is conducted to the porous material layer through the heat conduction layer, and the heat is convected to the outside through the porous material layer. From the above prior applications, it can be known that most known LED heat dissipation adopts metal heat sinks, or combined with heat pipes, cooling chips, vapor chambers, heat dissipation fans, etc., which generally have poor heat dissipation effects, insufficient heat dissipation speed, and complex heat dissipation module structures. , high cost and other disadvantages, and because the heat dissipation structure required is a non-standard design, it is necessary to design a special lamp before it can be used.

At present, there is also a high-efficiency LED lamp (China Taiwan Patent No. I338109, announced on March 1, 2011; US Patent No. 7677767, announced on March 16, 2010), which is mainly composed of LED modules, structural substrates, and circuits. The LED module is set on the construction substrate, the construction substrate is made of metal with good thermal conductivity, and the heat dissipation lamp holder is made of non-metal with good heat dissipation and porous structure, and it is directly formed into a lamp The shape of the seat has an inner concave part, and the opening end of the inner concave part is closed by the structural substrate. There is a circuit device inside, and the circuit device is connected to the LED module and the external power supply. When the LED is lit, the heat generated by it can be quickly absorbed Conducted by the construction substrate, and through the heat conduction and heat convection between the construction substrate and the heat dissipation lamp holder, the heat on the construction substrate is quickly conducted to the heat dissipation lamp holder to dissipate heat. The heat dissipation lamp holder of the invention directly forms the shape of a general light bulb , and has heat dissipation performance, and can directly replace known light bulbs. In addition to excellent heat dissipation effects, it also has the effect of directly replacing light bulbs without changing lamps. However, generally as the construction substrate of the LED light source carrier (the construction substrate is used to set up the LED module or directly arrange the LED grains on the construction substrate and then package it), most of them are made of metal or polycarbonate with good thermal conductivity. Pores are made of non-metallic materials. The combination of the structural substrate and the lamp holder is usually screwed together by opening screw holes, or using heat-conducting adhesives to fix them by bonding. However, the former increases the number of components and screwing processes. Moreover, the adhesion is poor, and the latter has the disadvantage of poor heat conduction efficiency due to the shortcomings of the heat conduction adhesive itself, such as poor heat conduction effect. Since the carrier board and the lamp holder are usually made of different materials due to their different functions, how to combine the two different materials into one body without losing their thermal conductivity has become an urgent problem to be overcome in the industry.

Furthermore, since the LED is driven by a DC power source, when the LED is applied to a commercial power supply with an AC power source, a driving circuit is required to convert the AC power source into a DC power source to drive the LED. The known LED drive circuit mainly includes a bridge rectifier, a filter circuit, a transformer circuit and a feedback circuit, etc. However, due to the complex structure of the drive circuit, the circuit is large in size and high in cost, and the life of the drive circuit is much lower than that of the LED. Shortcomings, how to simplify the driving circuit, in order to reduce the cost and increase the overall life of the LED lamp, has become an urgent issue to be solved in the industry.

Utility model content

In view of this, the main purpose of the present utility model is to provide an LED lamp assembly structure with simple structure, long service life and good heat dissipation effect.

In order to achieve the above purpose, the utility model provides an LED lamp assembly structure, which mainly includes a construction substrate for laying out LED crystal grains and an injection-molded lamp holder, and is characterized in that: the LED crystal grains on the construction substrate It is arranged in series, and the total withstand voltage value of the LED grains arranged in series is equal to or greater than the voltage value of the external power supply.

The LED lamp assembly structure further includes a lamp holder, and the lamp holder is combined and fixed to the assembly substrate by injection molding.

In the present utility model, a heat dissipation module is arranged under the aforementioned construction substrate, and the lamp holder is combined and fixed by injection molding to fix the construction substrate and the heat dissipation module.

Preferably, the aforementioned assembly substrate of the present invention is made of metal material with heat conduction and heat dissipation properties, and the lamp holder is made of plastic material.

Preferably, the construction substrate is made of porous non-metallic material with thermal conductivity and heat dissipation, and the lamp holder is made of plastic material.

The LED lamp assembly structure of the utility model has the effects of omitting the driving circuit and being completely combined with the lamp holder after molding, with high closeness and good heat conduction.

Description of drawings

Fig. 1 is a cross-sectional view of an assembly structure embodiment of the LED lamp of the present invention.

Explanation of reference signs

1 Build substrate

2 lamp holders

3 cooling modules

4 LED grains.

Detailed ways

In order to achieve the above-mentioned technical means of the utility model, an embodiment is listed, and the description is as follows with accompanying drawings, so as to obtain a better understanding of the structure, characteristics and achieved effects of the utility model.

The construction substrate referred to in the utility model is a substrate formed by directly arranging LED crystal grains on the construction substrate and then packaging it. Most of the construction substrates are made of metal materials with good thermal conductivity or porous non-metallic materials. The lamp holder referred to in the utility model has a general shape of the lamp holder, such as the outer edge of the lamp holder can be additionally provided with a special metal sleeve, an insulating sleeve and a power contact sheet (the special metal sleeve, insulation sleeve and power contact sheet of the light bulb are internationally accepted). Specifications, such as E-27, E-14, etc.), to use on known light bulb lamps. Or additionally provide a dedicated connection terminal for the projection lamp holder (the connection terminal for the projection lamp holder is an international general standard, such as MR16, etc.), so that it can be directly plugged into the known projection lamp for use without replacing the original old projection lamp .

Please refer to Fig. 1, the LED light assembly structure of the present utility model mainly includes a construction substrate 1 for laying out LED crystal grains 4 and encapsulating them. The utility model is characterized in that: the LED crystal grains 4 on the construction substrate 1 It is set in series, and the total withstand voltage value of each LED grain 4 set in series is equal to or slightly greater than the voltage value of the external power supply, such as the general commercial power (that is, the external power supply) is 110V or 220V, the LED crystal grains 4 set in series in the utility model The total withstand voltage value of the grain 4 is relatively 110V, 220V or slightly greater than 110V, 220V, so that the setting of the driving circuit can be simplified, thereby reducing the manufacturing cost and improving the overall life of the LED lamp.

The foregoing construction substrate 1 of the utility model is metal with good heat conduction and heat dissipation (metals with good heat conduction and heat dissipation such as gold, silver, copper, iron, aluminum, cobalt, nickel, zinc, titanium, manganese, etc.) or porous non-metallic materials (For example, it is composed of non-metallic powder with high thermal conductivity, such as: aluminum oxide Al ₂ O ₃ , zirconium oxide Zr ₂ O, aluminum nitride AlN, silicon nitride SiN, nitride Boron BN, tungsten carbide WC, silicon carbide SiC, graphite C, crystalline silicon carbide, recrystallized silicon carbide RSiC, etc., preferably aluminum nitride and silicon carbide), and a heat dissipation module 3 is provided under the substrate 1, To improve the heat dissipation capability of the LED lamp. The utility model also includes a lamp holder 2, the lamp holder 2 is combined and fixed with the structural substrate 1 and the heat dissipation module 3 by injection molding of plastic materials, because the structural substrate 1 and the lamp holder 2 are combined by injection molding , It is completely combined after molding, will not fall off and separate, and has a high degree of adhesion, so it has the effect of good heat conduction.

Reaching the utility model design purpose like this can be called a practical utility model.

However, the above is only one of the preferred feasible embodiments of the present utility model, and is not intended to limit the scope of the present utility model. Anyone who is familiar with this technology can use the specification and rights of the utility model to write, etc. Effective structural changes should be included in the patent scope of the present utility model.

Claims (5)

1. LED lamp assembling structure; Mainly include as the baseplate of laying LED crystal grain and the lamp socket of ejection formation; It is characterized in that: the LED crystal grain series connection on this baseplate is provided with, and its total proof voltage value of LED crystal grain that each series connection is provided with is for being equal to or greater than the outer power voltage value.

2. LED lamp assembling structure as claimed in claim 1 is characterized in that, this LED lamp assembling structure includes lamp socket in addition, and this lamp socket is to combine fixing said baseplate with ejection formation.

3. LED lamp assembling structure as claimed in claim 2 is characterized in that, said baseplate below is provided with radiating module, and said lamp socket is to combine fixing said baseplate and radiating module with ejection formation.

4. like claim 2 or 3 described LED lamp assembling structures, it is characterized in that said baseplate is that the metal material of tool heat conduction and thermal diffusivity constitutes, said lamp socket is that plastic material constitutes.

5. like claim 2 or 3 described LED lamp assembling structures, it is characterized in that said baseplate is that the porous crack nonmetallic materials of tool heat conduction and thermal diffusivity constitute, said lamp socket is that plastic material constitutes.

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