JP3174462U - LED lamp mounting structure - Google Patents
LED lamp mounting structure Download PDFInfo
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- JP3174462U JP3174462U JP2012000054U JP2012000054U JP3174462U JP 3174462 U JP3174462 U JP 3174462U JP 2012000054 U JP2012000054 U JP 2012000054U JP 2012000054 U JP2012000054 U JP 2012000054U JP 3174462 U JP3174462 U JP 3174462U
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- 239000000758 substrate Substances 0.000 claims abstract description 28
- 230000017525 heat dissipation Effects 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 8
- 239000007769 metal material Substances 0.000 claims abstract description 8
- 238000001746 injection moulding Methods 0.000 claims abstract description 4
- 238000002347 injection Methods 0.000 claims abstract description 3
- 239000007924 injection Substances 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
【課題】高い密着度及び熱伝導率を得るＬＥＤランプ実装構造体を提供する。
【解決手段】ＬＥＤランプ実装構造体は、ＬＥＤ光源を設置するために用いる実装基板１と、射出成形されたランプホルダ２とを備える。ランプホルダ２上のＬＥＤチップ４は、互いに直列接続され、総耐電圧値が外部電源の電圧値より略大きいか等しい。ランプホルダ２は、射出成形されて実装基板１に連結固定される。実装基板１の下方には、放熱モジュール３が設けられる。ランプホルダ２は、射出成形により実装基板１及び放熱モジュール３に連結固定される。実装基板１は、熱伝導率が高くて放熱が良好な金属材料からなる。ランプホルダ２はプラスチック材料からなる。
【選択図】図１An LED lamp mounting structure that provides high adhesion and thermal conductivity is provided.
An LED lamp mounting structure includes a mounting substrate used for installing an LED light source and an injection molded lamp holder. The LED chips 4 on the lamp holder 2 are connected in series with each other, and the total withstand voltage value is approximately equal to or greater than the voltage value of the external power source. The lamp holder 2 is injection-molded and connected and fixed to the mounting substrate 1. A heat dissipation module 3 is provided below the mounting substrate 1. The lamp holder 2 is connected and fixed to the mounting substrate 1 and the heat dissipation module 3 by injection molding. The mounting substrate 1 is made of a metal material having high thermal conductivity and good heat dissipation. The lamp holder 2 is made of a plastic material.
[Selection] Figure 1
Description
本考案は、ＬＥＤランプに関するものであり、さらに詳しくは、照明に用い、駆動回路及び実装基板をランプホルダとともに成形して結合し、高い密着度及び熱伝導率を得るＬＥＤランプ実装構造体に関するものである。 The present invention relates to an LED lamp, and more particularly to an LED lamp mounting structure that is used for illumination and that has a drive circuit and a mounting board formed and bonded together with a lamp holder to obtain high adhesion and thermal conductivity. It is.
一般に、ＬＥＤランプ源のキャリアである実装基板（ここで実装基板とは、ＬＥＤモジュールを配置したり、ＬＥＤチップを直接マウントしてパッケージし、形成された基板をいう。）は、熱伝導率が高い金属又は多孔質の非金属材料からなり、実装基板とランプホルダとを結合させる方式は、一般に、ネジ孔を利用して螺着する方式及び熱伝導接着剤により接着する方式が知られているが、ネジ孔を利用した場合、部材の数と螺着のステップが増えて密着性に劣り、一方、熱伝導接着剤を利用した場合、それ自体が有する低い熱伝導率により、両者ともに熱伝導率が理想的でないという欠点を有する。また、キャリアプレート及びランプホルダは、異なる性能が得られるようにそれぞれ異なる材料からなる。そのため、２種類の異なる材料を互いに密着させながら一体化させるとともに、高い熱伝導率を得ることができるＬＥＤランプ実装構造体が求められてきた。 In general, a mounting substrate that is a carrier of an LED lamp source (here, the mounting substrate refers to a substrate that is formed by arranging an LED module or directly mounting and packaging an LED chip) has a thermal conductivity. As a method of bonding a mounting substrate and a lamp holder, which is made of a high metal or porous non-metallic material, a method of screwing using a screw hole and a method of bonding using a heat conductive adhesive are generally known. However, when screw holes are used, the number of members and the number of screwing steps increase, resulting in poor adhesion. On the other hand, when heat conductive adhesive is used, both of them conduct heat due to their low thermal conductivity. It has the disadvantage that the rate is not ideal. The carrier plate and the lamp holder are made of different materials so that different performances can be obtained. For this reason, there has been a demand for an LED lamp mounting structure capable of integrating two different materials in close contact with each other and obtaining high thermal conductivity.
また、ＬＥＤが直流電源により駆動するので、ＬＥＤに交流電源の商用電源が供給されると、駆動回路により交流電源を直流電源に変換してＬＥＤを駆動する。従来のＬＥＤ駆動回路は、ブリッジ整流器、フィルタ回路、変圧回路、帰還回路などを含むが、駆動回路の構成が複雑であり、回路の体積が大きすぎてコストが高い上、駆動回路の寿命がＬＥＤより短いという欠点を有するため、駆動回路を省略してコストを減らすと共に、ＬＥＤランプの寿命を延ばすこともできるＬＥＤランプ実装構造体が求められてきた。 Further, since the LED is driven by the DC power supply, when the commercial power supply of the AC power supply is supplied to the LED, the drive circuit converts the AC power supply to the DC power supply to drive the LED. The conventional LED driving circuit includes a bridge rectifier, a filter circuit, a transformer circuit, a feedback circuit, etc., but the configuration of the driving circuit is complicated, the circuit volume is too large and the cost is high, and the life of the driving circuit is LED Since it has the shortcoming of being shorter, there has been a demand for an LED lamp mounting structure that can reduce the cost by omitting the drive circuit and also extend the life of the LED lamp.
従って、本考案の課題は、ＬＥＤ光源を設置した実装基板とランプホルダとが密着性よく結合され、従来の駆動回路を省略したＬＥＤランプを提供することにある。 Accordingly, an object of the present invention is to provide an LED lamp in which a mounting substrate on which an LED light source is installed and a lamp holder are coupled with good adhesion, and a conventional driving circuit is omitted.
そこで、本考案者は、前記の本考案の課題を解決するために鋭意検討を重ねた結果、前記実装基板にＬＥＤチップをマウントして封止することにより、さらに、ＬＥＤチップが直列に接続され、それぞれ直列接続されたＬＥＤチップは、その耐電圧値が外部の電源電圧値よりおおよそ大きいか又は等しくなるように構成することにより、前記の本考案の課題を解決できることに着目し、かかる知見に基いて本考案に想到した。 Therefore, as a result of intensive studies to solve the above-described problems of the present invention, the present inventor mounts the LED chip on the mounting substrate and seals it, and the LED chips are further connected in series. Each LED chip connected in series pays attention to the fact that the problems of the present invention can be solved by configuring the LED chips so that the withstand voltage value is approximately larger than or equal to the external power supply voltage value. Based on this, I came up with the present invention.
すなわち、本考案の目的は、ＬＥＤチップをマウントして封止した実装基板を含み、実装基板上のＬＥＤチップが直列接続され、それぞれ直列接続されたＬＥＤチップは、その総耐電圧値が外部の電源電圧値より略大きいか等しく、実装基板の下方には、放熱モジュールが設けられ、ランプホルダが射出成形されて実装基板及び放熱モジュールに連結固定され、駆動回路が省略され、成形後にランプホルダと完全に結合されるため、密着度及び熱伝導率が高いＬＥＤランプ実装構造体を提供することにある。 That is, an object of the present invention includes a mounting substrate in which an LED chip is mounted and sealed, and the LED chips on the mounting substrate are connected in series, and each LED chip connected in series has a total withstand voltage value of the external The heat dissipation module is provided below the mounting board, and the lamp holder is injection-molded and connected and fixed to the mounting board and the heat dissipation module, the drive circuit is omitted, and the lamp holder An object of the present invention is to provide an LED lamp mounting structure having high adhesion and high thermal conductivity because it is completely bonded.
かくして、本考案によれば、ＬＥＤ光源を設置するために用いる実装基板と、射出成形されたランプホルダと、該ランプホルダ上に設けたＬＥＤチップとを備えたＬＥＤランプ実装構造体であって、
前記ランプホルダ上のＬＥＤチップは、互いに直列接続され、総耐電圧値が外部電源の電圧値より略大きいか又は等しいことを特徴とするＬＥＤランプ実装構造体
が提供される。
Thus, according to the present invention, an LED lamp mounting structure comprising a mounting substrate used for installing an LED light source, an injection molded lamp holder, and an LED chip provided on the lamp holder,
The LED chips on the lamp holder are connected in series with each other, and the LED lamp mounting structure is provided in which the total withstand voltage value is substantially larger than or equal to the voltage value of the external power source.
前記ランプホルダは、射出成形されて前記実装基板に連結固定されることが好ましい。 The lamp holder is preferably injection-molded and connected and fixed to the mounting substrate.
前記実装基板の下方には、放熱モジュールが設けられ、前記ランプホルダは、射出成形により前記実装基板及び前記放熱モジュールに連結固定されることが好ましい。 It is preferable that a heat dissipation module is provided below the mounting substrate, and the lamp holder is connected and fixed to the mounting substrate and the heat dissipation module by injection molding.
前記実装基板は、熱伝導率が高く、放熱が良好な金属材料からなり、前記ランプホルダはプラスチック材料からなることが好ましい。 The mounting substrate is preferably made of a metal material having high thermal conductivity and good heat dissipation, and the lamp holder is preferably made of a plastic material.
前記実装基板は、熱伝導率が高く、放熱が良好な多孔質の非金属材料からなり、前記ランプホルダは、プラスチック材料からなることが好ましい。 The mounting board is preferably made of a porous non-metallic material having high thermal conductivity and good heat dissipation, and the lamp holder is preferably made of a plastic material.
本考案は、前記の構成からなるものであり、ＬＥＤ光源を設置した実装基板とランプホルダとが高度の密着性により結合されたものであり、直列に接続されたＬＥＤチップを有することから、従来の駆動回路を省略することができ、構造の簡素化及びコストの低減化を達成したＬＥＤランプ実装構造体を提供することができる。 The present invention is composed of the above-described configuration, in which a mounting substrate on which an LED light source is installed and a lamp holder are combined with a high degree of adhesion, and has LED chips connected in series. Thus, it is possible to provide an LED lamp mounting structure that can achieve a simplified structure and a reduced cost.
以下、本考案の実施形態について図面に基づいて説明する。なお、これによって本考案が限定されるものではない。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the present invention is not limited thereby.
本考案のＬＥＤランプ実装構造体の実装基板は、実装基板上にＬＥＤチップを直接マウントした後に封止して製作した基板である。本考案の実装基板は、熱伝導率が高い金属材料又は多孔質の非金属材料からなる。本考案のランプホルダは、一般のランプホルダの形状を有するものであり、特に限定されるものではない。例えば、ランプホルダの外縁には、電球専用の口金部、絶縁スリーブ及び電源接触片（電球専用の口金部、絶縁スリーブ及び電源接触片は、Ｅ−２７、Ｅ−１４などの国際標準規格である。）が付加的に配置され、従来の電球ランプを使用することができる。或いは、プロジェクタ型ランプベース専用の接続端子（プロジェクタ型ランプベース専用の接続端子は、ＭＲ１６などの国際標準規格である。）は、従来のプロジェクタ型ランプに直接挿入して使用することができるため、従来のプロジェクタ型ランプを代替する必要がない。 The mounting board of the LED lamp mounting structure of the present invention is a board manufactured by directly mounting an LED chip on the mounting board and then sealing it. The mounting board of the present invention is made of a metal material having a high thermal conductivity or a porous non-metal material. The lamp holder of the present invention has the shape of a general lamp holder and is not particularly limited. For example, on the outer edge of the lamp holder, a cap part dedicated to a light bulb, an insulating sleeve and a power contact piece (the cap part dedicated to a light bulb, an insulating sleeve and a power contact piece are international standards such as E-27 and E-14 .) Can be additionally arranged and a conventional bulb lamp can be used. Alternatively, the connection terminal dedicated for the projector type lamp base (the connection terminal dedicated for the projector type lamp base is an international standard such as MR16) can be used by directly inserting into the conventional projector type lamp. There is no need to replace the conventional projector-type lamp.
図１を参照する。図１に示すように、本考案の一実施形態によるＬＥＤランプ実装構造体は、ＬＥＤチップ４をマウントして封止した実装基板１を含む。本実施形態のＬＥＤランプ実装構造体の特徴は、実装基板１上のＬＥＤチップ４が直列接続されている点であり、それぞれ直列接続されたＬＥＤチップ４は、その総耐電圧値が外部の電源電圧値より略大きいか又は等しい。ここで電源電圧値とは、例えば、１１０Ｖ又は２２０Ｖの一般の商用電源（即ち、外部電源）を指す。本実施形態の直列接続したＬＥＤチップ４の総耐電圧値は、１１０Ｖ、２２０Ｖより略大きいか等しいため、駆動回路の設置を省略することができるので、製造コストを減らすと共にＬＥＤランプの寿命を延ばすこともできる。 Please refer to FIG. As shown in FIG. 1, an LED lamp mounting structure according to an embodiment of the present invention includes a mounting substrate 1 on which an LED chip 4 is mounted and sealed. The feature of the LED lamp mounting structure of the present embodiment is that the LED chips 4 on the mounting substrate 1 are connected in series, and each of the LED chips 4 connected in series has a total withstand voltage value of an external power supply. It is approximately greater than or equal to the voltage value. Here, the power supply voltage value indicates, for example, a general commercial power supply (ie, external power supply) of 110V or 220V. Since the total withstand voltage value of the LED chips 4 connected in series of the present embodiment is substantially larger than or equal to 110V and 220V, the installation of the drive circuit can be omitted, thereby reducing the manufacturing cost and extending the life of the LED lamp. You can also.
前述の実装基板１は、熱伝導率が高くて放熱が良好な金属（例えば、金、銀、銅、鉄、アルミニウム、コバルト、ニッケル、亜鉛、チタン、マンガンなど、熱伝導及び放熱が良好な金属を含む。）又は多孔質の非金属材料（例えば、酸化アルミニウム、酸化ジルコニウム、窒化アルミニウム、窒化ケイ素、窒化ホウ素、炭化タングステン、炭化ケイ素、黒鉛、結晶炭化ケイ素、再結晶炭化ケイ素など熱伝導率が高い非金属粉末であるが、そのなかでも窒化アルミニウム及び炭化ケイ素が好ましい。）からなり、実装基板１の下方に、ＬＥＤランプの放熱機能を高めるために、放熱モジュール３を配置する。本実施形態はランプホルダ２をさらに含む。このランプホルダ２は、プラスチック射出成形されて実装基板１及び放熱モジュール３と連結固定される。本実施形態の実装基板１とランプホルダ２とは、射出成形方式により覆われて結合されるので、成形後に完全に結合されて互いに外れることがない。そのため、密着度及び熱伝導率が高いＬＥＤランプを提供することができる。 The mounting board 1 described above is a metal having high thermal conductivity and good heat dissipation (for example, gold, silver, copper, iron, aluminum, cobalt, nickel, zinc, titanium, manganese, etc.) Or porous non-metallic materials (for example, aluminum oxide, zirconium oxide, aluminum nitride, silicon nitride, boron nitride, tungsten carbide, silicon carbide, graphite, crystalline silicon carbide, recrystallized silicon carbide, etc.) In order to improve the heat dissipation function of the LED lamp, the heat dissipation module 3 is disposed below the mounting substrate 1. The present embodiment further includes a lamp holder 2. The lamp holder 2 is injection-molded with plastic and connected and fixed to the mounting substrate 1 and the heat dissipation module 3. Since the mounting substrate 1 and the lamp holder 2 of the present embodiment are covered and joined by the injection molding method, they are completely joined after molding and do not come off from each other. Therefore, it is possible to provide an LED lamp having high adhesion and high thermal conductivity.
以上説明したように、本考案の好適な実施形態を前述の通り開示したが、これらは決して本考案を限定するものではない。本考案の主旨と領域を逸脱しない範囲内で各種の変更や修正を加えることができる。従って、本考案の実用新案登録請求の範囲は、このような変更や修正を含めて広く解釈されるべきである。 As described above, the preferred embodiments of the present invention have been disclosed as described above, but these do not limit the present invention in any way. Various changes and modifications can be made without departing from the spirit and scope of the present invention. Accordingly, the scope of the utility model registration claim of the present invention should be broadly interpreted including such changes and modifications.
１ 実装基板
２ ランプホルダ
３ 放熱モジュール
４ ＬＥＤチップ
1 Mounting Board 2 Lamp Holder 3 Heat Dissipation Module 4 LED Chip
Claims (5)
前記ランプホルダ上のＬＥＤチップは、互いに直列接続され、総耐電圧値が外部電源の電圧値より略大きいか又は等しいことを特徴とするＬＥＤランプ実装構造体。 An LED lamp mounting structure comprising a mounting substrate used for installing an LED light source, an injection molded lamp holder, and an LED chip provided on the lamp holder,
The LED chips on the lamp holder are connected in series with each other, and the total withstand voltage value is substantially larger than or equal to the voltage value of the external power source.
前記ランプホルダは、射出成形により前記実装基板及び前記放熱モジュールに連結固定されてなることを特徴とする請求項２に記載のＬＥＤランプ実装構造体。 Below the mounting substrate, a heat dissipation module is provided,
The LED lamp mounting structure according to claim 2, wherein the lamp holder is connected and fixed to the mounting substrate and the heat dissipation module by injection molding.
前記ランプホルダは、プラスチック材料からなることを特徴とする請求項２又は３に記載のＬＥＤランプ実装構造体。 The mounting board is made of a metal material having high thermal conductivity and good heat dissipation,
4. The LED lamp mounting structure according to claim 2, wherein the lamp holder is made of a plastic material.
前記ランプホルダは、プラスチック材料からなることを特徴とする請求項２又は３に記載のＬＥＤランプ実装構造体。
The mounting board is made of a porous nonmetallic material having high thermal conductivity and good heat dissipation,
4. The LED lamp mounting structure according to claim 2, wherein the lamp holder is made of a plastic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012000054U JP3174462U (en) | 2012-01-07 | 2012-01-07 | LED lamp mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012000054U JP3174462U (en) | 2012-01-07 | 2012-01-07 | LED lamp mounting structure |
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| JP3174462U true JP3174462U (en) | 2012-03-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012000054U Expired - Fee Related JP3174462U (en) | 2012-01-07 | 2012-01-07 | LED lamp mounting structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013161164A1 (en) * | 2012-04-27 | 2013-10-31 | ソニー株式会社 | Light-bulb-shaped light source device and translucent cover |
| WO2013179770A1 (en) * | 2012-05-31 | 2013-12-05 | 船井電機株式会社 | Illumination device and light-bulb-type illumination device |
-
2012
- 2012-01-07 JP JP2012000054U patent/JP3174462U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013161164A1 (en) * | 2012-04-27 | 2013-10-31 | ソニー株式会社 | Light-bulb-shaped light source device and translucent cover |
| JPWO2013161164A1 (en) * | 2012-04-27 | 2015-12-21 | ソニー株式会社 | Light bulb type light source device and translucent cover |
| US9851092B2 (en) | 2012-04-27 | 2017-12-26 | Sony Corporation | Electric light bulb type light source apparatus and translucent cover |
| WO2013179770A1 (en) * | 2012-05-31 | 2013-12-05 | 船井電機株式会社 | Illumination device and light-bulb-type illumination device |
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