M349157 -八、新型說明： _【新型所屬之技術領域】 本創作為提供-種LED燈泡’尤指—種可讓照明範圍更廣，且 -可達到快速散熱效果之LED燈泡之改良。 ” 【先前技術】 ，、，由於發光二極體（LED)是-種_的半導體元件，利用 电子毛洞_互配合職量以光的形式釋發， 、Μ看板、通訊產品等之發光科，至目前已經M349157 - VIII, new description: _ [New technical field] This creation provides - an LED bulb ‘, especially a kind of LED bulb that can make the illumination range wider and - can achieve rapid cooling effect. [Prior Art],, because the light-emitting diode (LED) is a semiconductor component of the kind, the use of the electronic hair hole _ mutual cooperation capacity in the form of light release, Μ kanban, communication products, etc. , so far
，用，領域中，特別是目前的照明設備上，利用發光二極體作‘ #先7〇件，雖然初期的發光二極體效率不 備X 但在後續的技術及材料改良下，發光二極===== 明顯的進步’逐漸有取代傳統發光树的趨^ κ㈣以冗度已有 晴=:下’發光二極體所需的電流亦 多的数能影塑到▲光：桎體的的熱能亦逐漸增加，而為了不使過 元:二；;命’因此對於已發光二極體作為發光 =件m射的賴轉成了目前照鴨置所必要的手段之 • -般扇或水冷散熱氣.· ·等，由於 φ裝置所設計，因此益^把目、ΙΓ且_散熱手段並不是為照明 .裝置協助轉ΐ二極於原本的照明 置的設計了 題，因此習知技術配合原有照明裝 空氣與散熱片=^傳至到複數散熱片上，再經由 圖所示，係為習用之L ED燈明裝置的影響，如第了 包括：-燈泡座i 〇、一燈罩、、熱一冓’該燈具之散熱結構1係 £：0燈模組12係由散埶 ^，—1£：1：)燈模組12，其中該1^ ㈣ 1 M349157 1’ ΓΓί光二極體1 2 3係焊接於該電路板1 2 2上，再將今 同角度的發光源制較佳之】光更二f此’除了可藉由不 .率並使該LED模組12之壽命增加。更了增加該散熱柱之散熱效 '缺失=iiED燈具之散熱結構於使科，為確實存在下列問題與 、由於發光元件係焊接於電路板1 〇 .該散熱組件1 2 1進行加工砗，目v γ Λ· 2上如此，加工人貝對 溝槽1 2 1 1 則須在每—安裝面上另外沖設有該 .丹粕u丄丄，使仔工序增加，亦提高製作成本。 必須花費較多的日J 口效;此’纽裝人員於組裝時， <爭此订業之相騎商所亟欲研究改善之方向所在者。 【新型内容】 方評:及ίϊ作之=念有麟上述缺失，乃搜集相關資料，經由多 者始設計出此種可達到快速散熱效果之L E D燈泡之改型 .一^創作之主要目的在於：有關於—種LED燈泡係包括.一 導電部及-罩體，其中該基座於一端裝設有—導於ς 形成有—散熱部，於該散熱部上係可黏貼有 ^座及-個或-個以上之晶粒，而該散熱部係為一多面錐形體，苴 7夕面錐形體上黏貼一片柔性導熱電路基板，該柔性導 iIn the field of use, especially in the current lighting equipment, the use of light-emitting diodes as '# first 7-pieces, although the initial luminous diode efficiency is not prepared for X, but in the subsequent technology and material improvement, the light-emitting diode ===== Significant progress 'There is a tendency to replace the traditional illuminating tree ̄ κ (4) with redundancy. The number of currents required for the lower 'light-emitting diodes' can be shaped into ▲ light: 桎The heat energy is gradually increasing, and in order not to over-element: two; life's therefore, the light-emitting diodes have become the necessary means for the current setting of the ducks. Or water-cooled heat-dissipating gas. · ·, etc., because of the design of the φ device, it is not the purpose of illumination, and the device is designed to assist in the design of the original lighting device. The technology cooperates with the original lighting air and heat sink =^ to the plurality of heat sinks, and then through the figure, it is the influence of the conventional L ED lighting device, as the first includes: - bulb holder i 〇, a lampshade, Heat 冓 'The heat dissipation structure of the luminaire 1 is £: 0 light module 12 is composed of ^, -1£:1:) Light module 12, where the 1^ (4) 1 M349157 1' ΓΓί light diode 1 2 3 series is soldered on the circuit board 1 2 2, and then the same angle of illumination source Preferably, the light is further reduced by the rate and the lifetime of the LED module 12 is increased. Moreover, the heat dissipation effect of the heat dissipating column is increased. 'The missing=the heat dissipation structure of the iiED lamp is in the U.S., because the following problems are indeed present, and since the light emitting element is soldered to the circuit board 1 该. The heat dissipating component 1 2 1 is processed, In the case of v γ Λ· 2, the processing of the manhole to the groove 1 2 1 1 is required to additionally punch the dan 粕 丄丄 每 on each of the mounting surfaces, so that the boring process is increased, and the manufacturing cost is also increased. It is necessary to spend a lot of Japanese J-effects; when the 'new-loading staff is assembled, &l; the rider of this competition is eager to study the direction of improvement. [New content] Fangfang: and ϊϊ作=念有麟 The above-mentioned missing, is to collect relevant information, through the majority of the design of this LED bulb that can achieve rapid cooling effect. The main purpose of the creation is The LED light bulb comprises: a conductive portion and a cover body, wherein the base is mounted at one end - a heat sink is formed on the heat sink portion, and a heat sink portion is attached to the heat sink portion. One or more dies, and the heat dissipating portion is a multi-faceted conical body, and a flexible thermal conductive circuit substrate is adhered to the 苴7 面 cone, the flexible guiding
夕面錐形體上LED燈模組之電氣迴路，其該多面錐形體U 板係可黏貼有—個或一個以上之晶粒，再者基座 4-向導熱性金屬材料（如：銅、銘），由於該多面錐形體盆 ’隹面上係貼f有導賴板或接腳架基座、柔性導熱電路基板及晶粒， 6 M349157 如此，該多面錐形體上的晶粒發光時， — 熱性金屬材質所製成的基座，一可達到粑圍更廣，再經由高導 本創作之次要目的在於：由於n文熱之效果。 -時所能涵芸之而并;古UP , 匕U係為一種直射光，因此發光 .可達到照;;=¾^將複數L曙設於不同面時二 基板’其導電薄Slit零二係可黏貼-柔性導熱電路 .散熱部係為-多面錐形體或生導熱電路基板上，因此該 薄板可黏附於任何不同形狀之散熱^ 該柔性導熱電路基板及導電 其工序十分簡易，因而大幅降以造費^該散熱部於製造加工時 【實施方式】 Μ ίίΐί述目的及功效’本創作所採用之技術手段及構造，心 Ε _可清楚看==== 1遠離該導電部2〇之一端开π古^導電^2Q於5玄基座2 .係可黏貼有一個二3，於該散熱部2 3上 •-導電薄板3〇ί接燈模組係由 3 ί上:一多面錐形體2 31，其該多面錐形1 體^ 1上[_模組3之電氣迴路，其該 上之m ?，==性#熱電路基板31係可獅有—個或一個以 、^ ’再者基座21係為—高導熱性金屬材料（如：銅、紹 接腳=基座、、木性導熱電路基板3丄及晶粒3 2。 述之結構、組成設計’錄本創作之賴作動情形說明如 ，μ同％配合芩閱第四圖及第五圖所示，係為本創作較佳實施例之 7 M349157 動作示意圖一及圖二，由圖中姑 容置空間211 (如第三圖所J疋看出’由於基座21係形成有一 有複數貫穿孔2 3 2，當鮮’且於多面錐形體2 3 1頂面形成 -導電部2 0係連接有-電線“ ^組^基f21及導電部2 〇時，因 .2 1内部穿過，再由該複數貫穿孔2 1經由基座 ◦卡設於該基座2 1之底部，秋 f 再將該導電部2 形體2 3 1 (如：三角_、二，亥溥板3 0貼覆於該多面錐 ’再將該柔性導熱電路基‘3形柱體）的每-個平面上 ，貼覆完成後再將2直接黏貼使用 讓該L ED燈泡亥導電薄板3 〇相接，如此，不僅可 效’另外’該導電方式係用導同及佳之散熱功 裝置，甚至是多加工序沖f 〇此热須再而外加設散設 可達到高散熱之效果。π私’勤顧導板3Q的特性亦 ，此配合賴第六圖所示，係為本創作另-㈣t之t娜-立圖 3 3^^：^tm3〇 熱部2 3上====周邊貼覆於該散 ，如此，該L ^聰貼至各该柔性導熱電路基板3 1上 薄板3 〇時，亦益i n夕f明範圍則更加廣泛，且於黏貼該導電 造，，藉此提;作，在製程時可節省許多的製 示意圖圖if=所示’係為本創作再—較佳實施例之動作 及二Ξ體燈泡4，係由-基座4 1、-散刪3 形，再者，糾^f 中絲座4 1與該散熱體4 3係'為-體成 4 3 2之各二ΐ…租4 3係為一多面錐形體4 3 2，於該多面錐形體 (siliccme^^i黏貼有一晶粒5，並藉由混入有螢光粉的石夕利康 係為4U ?7黏著媒介，於該基座41上所加設的罩體4 2 ，同時可讓整顆LED燈泡4具有廣角的照射效果 達到熱體4 3及該_ 4 1的高散熱功能進行散熱，已 咬彳、長L· £D燈泡4的使用壽命。 M349157 ，3ί九圖所不，係為摘作又—較佳實施例之動作示意圖- .，再去，兮血f ，、中該基座4 1 a與該散熱體4 3 a係為一體成形 a頂面係S貼ίΐ 為—圓柱體4 3 2 a，於該圓柱體4 3 2 'silicone) ft、^ 5 3，並藉由混人有螢錢的補康（ 2 an /作為—黏者齡，於絲座4 1 3上所加設的罩體4 2 ^為-球狀㊉膠，藉此可形成—封裝狀態。 择體4 作之專利細W，#_赚本創 及等效結構變化=====為，修飾 實存:下;優，_… 形體2 3 ㈡。因此可在該多面錐 其照明範圍更廣，再經由高導以材以時， ，-可達到快速散熱之效果。 〇所I成的基座21、41 二、由於該散熱部2 3係黏設該導電薄;^ ^ η π 3係為-多面錐形體2 3 2或—圓柱體2 3 3 ^此該散熱部2 黏附於任何不同形狀之散熱部2 3 j導電薄板3 〇可 時1工序十分簡易，因而大幅降低製熱部2 3於製造加工 綜上所述’本創作之LED燈泡之改良於 一功效及目的，故本創作誠為一實用性優異 守，為確實能達到 之申請要件’爰依法提出申請，盼審委^眼、=’為符合新型專利 作人之辛苦創作’倘若肖局審委有任何、，枝本創作，以保障創 作人定當竭力配合，實感德便。 叫不吝來函指示，創 M349157 ' 【圖式簡單說明;j 第二圖 第三圖 弟四圖 第五圖 第六圖 第七圖 第八圖 第九圖 第一圖 之1 佳實施例之立體^圖。 巧本創作.紐實關之讀 :ίί=較佳實施例之動作示意。 係為本創作較佳實關之動作示一。 係為本創作另-態樣之立體示意圖: 聲 作再一較佳實施例之動作示意圖 ίτ'為本創作再一較佳實施例之動作示意圖 係為本創作又一較佳實施例之動作示音圖 【主要元件符號說明】 散熱結構 燈泡座 燈罩 L E D燈模組 散熱組件 溝槽 電路板 發光二極體 L E D燈泡 導電部 電線 基座 容置空間 罩體 散熱部 多面錐形體 貫穿孔 圓柱體The electrical circuit of the LED lamp module on the equatorial cone, the multi-faceted cone U plate can be adhered to one or more crystal grains, and then the base 4-guided thermal metal material (such as: copper, Ming ), because the multi-faceted cone-shaped basin has a baffle or a tripod base, a flexible thermally conductive circuit substrate and a die, 6 M349157, when the grain on the multi-faceted cone is illuminated, The base made of hot metal material can achieve a wider circumference, and the secondary purpose of creating through the high guide is: due to the effect of n text heat. - The time can be covered; the ancient UP, 匕U is a kind of direct light, so the light can be achieved;; = 3⁄4^ The plural L曙 is set on different sides when the two substrates 'the thin thin Slit It can be adhered-flexible heat-conductive circuit. The heat-dissipating part is a multi-faceted cone or a heat-conducting circuit board, so the thin plate can be adhered to any different shape of heat dissipation. The flexible heat-conductive circuit substrate and the conductive process are very simple, so the drop is greatly reduced. At the time of manufacturing and processing, the heat dissipating part is manufactured and processed. [Embodiment] Μ ΐ ΐ ΐ 述 述 述 述 述 述 述 述 述 述 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 _ _ _ _ _ _ _ _ _ _ _ _ _ _ One end open π ancient ^ conductive ^ 2Q on 5 Xuan base 2 . The system can be attached with a two 3, on the heat sink 2 3 • Conductive thin plate 3 〇 接 light module is made of 3 ί: a multi-faceted Conical body 2 31, the multi-faceted conical 1 body ^ 1 [_ module 3 electrical circuit, the upper m?, == sex #thermal circuit substrate 31 can be a lion has one or one to, ^ 'The pedestal 21 is a high thermal conductivity metal material (such as: copper, shackle = pedestal, woody thermal circuit board 3 丄 and die 3 2. Description of the structure and composition of the design. The description of the operation of the recording is as shown in Fig. 4 and Fig. 5 is the schematic diagram of the operation of the 7 M349157 in the preferred embodiment of the present invention. Figure 2, from the illustration of the space 211 in the figure (as seen in the third figure, "Because the base 21 is formed with a plurality of through holes 2 3 2, when fresh" and on the top surface of the multi-faceted cone 2 3 1 The forming-conducting portion 20 is connected to the electric wire "^ group ^ ff and the conductive portion 2 ,, because the inner portion of the inner portion of the through hole 2 is inserted through the base, and the plurality of through holes 2 1 are inserted into the base through the base At the bottom of 2 1 , autumn f then the conductive part 2 body 2 3 1 (such as: triangle _, two, 溥 溥 plate 30 attached to the multi-faceted cone 'and then the flexible thermal conductive circuit base '3-shaped cylinder) On each of the planes, after the affixing is completed, the 2 GP bulbs are directly bonded to each other, so that the L ED bulbs are connected to each other, so that not only the other energy-saving means is used, but also the heat-dissipating device is used. Even the multi-addition process rush f 〇 this heat must be added separately to achieve high heat dissipation effect. π private 'diligence guide 3Q characteristics also This cooperation is shown in the sixth figure, which is based on the creation of another - (four) t t na - vertical figure 3 3 ^ ^: ^ tm3 〇 hot part 2 3 ==== periphery attached to the scattered, so, the When L ^ Cong is attached to the thin plate 3 上 on each of the flexible thermal conductive circuit substrates 3 1 , the range is more extensive, and the conductive layer is formed by bonding, thereby improving the process. Schematic diagram if= is shown as the creation of the preferred embodiment - the action of the preferred embodiment and the two-body bulb 4, which is made up of - pedestal 4 1 - scattered 3, and then, corrected The seat 4 1 and the heat dissipating body 4 3 are 'body-shaped into 4 3 2 each... The rent 4 3 is a multi-faceted conical body 4 3 2, and the polyhedral cone (siliccme^^i has a crystal attached thereto) The granule 5 and the 4U-7 adhesive medium mixed with the fluorite powder are used to attach the cover 4 2 to the pedestal 41, and the entire LED bulb 4 has wide-angle illumination. The effect reaches the high heat dissipation function of the hot body 4 3 and the _ 4 1 for heat dissipation, and the service life of the long L·£D bulb 4 has been bitten. M349157, 3 九 图 , , , 摘 349 349 349 349 349 349 349 349 349 349 M M M M M M M M M M 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳a top system S paste ΐ ΐ — - cylinder 4 3 2 a, in the cylinder 4 3 2 'silicone) ft, ^ 5 3, and by mixing people with money for the supplement (2 an / as - sticky Age, the cover body 4 2 ^ added on the wire base 4 1 3 is - spherical ten glue, which can be formed into a package state. The body 4 is patented fine W, #_赚本创 and etc. Effect structure change =====, the modification exists: lower; excellent, _... shape 2 3 (2). Therefore, the multi-faceted cone can have a wider illumination range, and then through the high-conductance material, The effect of rapid heat dissipation. The base 21, 41 of the I. I. The heat thin portion 2 3 is attached to the conductive thin; ^^ η π 3 is a multi-faceted cone 2 3 2 or a cylinder 2 3 3 ^The heat dissipating portion 2 is adhered to the heat dissipating portion of any different shape 2 3 j conductive sheet 3 〇, the process is very simple, thereby greatly reducing the heating unit 23 in the manufacturing process Improvement in one effect and purpose Therefore, this creation is a practical and excellent shoud, for the application requirements that can indeed be achieved, 爰 提出 提出 提出 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 盼 、 、 ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Figure 8 is a ninth diagram, the first figure is a three-dimensional image of a preferred embodiment. The novel creation. New Zealand's reading: ίί = the action of the preferred embodiment. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of another embodiment of the present invention: a schematic diagram of the operation of a preferred embodiment of the present invention. Action sound diagram [main component symbol description] Heat dissipation structure bulb seat lampshade LED light module heat dissipation component groove circuit board light emitting diode LED bulb conductive part wire base accommodation space cover heat dissipation part multi-faceted cone through hole circle Cylinder
2 ' 4 ' 4 a 2 0 2 0 1 2 1、4 1、4 1 a 2 112 ' 4 ' 4 a 2 0 2 0 1 2 1 , 4 1 , 4 1 a 2 11
2 3 3、4 3 2 a 10 M349157 •L E D燈模組 導電薄板 柔性導熱電路基板 - 晶粒 矽利康2 3 3, 4 3 2 a 10 M349157 • L E D lamp module Conductive sheet flexible thermal circuit board - die 矽利康