M338435 γ i 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種發光二極體之散熱裝置之設計，特 別是關於一種表面黏著型發光二極體之散熱結構。 【先前技術】 按，日常生活中最常見之燈光光源包括有傳統鎢絲燈 泡、石英燈泡、日光燈泡及水銀燈等等，而發光二極體（led) 由於具有耗電量低、壽命長、高功率、體積小、環保、以及 冷發光等等特性，故除經常應用於各種資訊電子設備或顯示 裝置外，現已逐漸取代傳統鎢絲燈泡等而成為許多電器元 件、豕電用品之光源體。 但現今以發光二極體作為照明用之燈具，因轉換效率 之問題’使用時發光二極體皆會產生高熱，持續之高熱易對 燈具中之電子元件造成損害，故有許多之散熱方式被研發出 來。常用之散熱方式如將散熱材料貼覆於發熱之電子元件上 或是利用風扇加強空氣之對流以使熱散逸。例如在中華民國 新型專利第M321141號專利案中，揭露出一種大功率LED 燈散熱結構’主要於電路控制裝置結合有複數個大功率的 LED燈，其中；燈罩具有中空容槽，於燈罩周緣設有由複 數個進風孔，該中空容槽内可結合有電路控制裝置及風扇， ，於中1容槽後方之空間可供設置有風扇，燈罩後方為設有 後盍板，此後蓋㈣有複數個出風口 ；藉由風扇之作動，可 5 M33 8435 1 i 入對電路控制 板之出風口帶 ^燈罩周緣之進風孔將冷空氣經由進風孔帶 裝置及LED燈降溫，㈣使熱空氣由後^ 出’以達到循環散熱的目的。 现 【新型内容】 本創作所欲解決之技術問題·· 便， 光二 裝〇 =而，先前之各種散熱裝置大多結構複雜且组裝不 因此徒然、浪費許多製造成本、製程和工時。 緣此’本創作之主要目的即是提供—種表面黏著型發 虽體之散熱結構，以簡單之結構設計節省成本並方便組 本創作解決問題之技術手段·· - 本_為解決習知技術L稀用之技術手段係提 仏一種表面黏著型發光二極體之散熱結構χ 設置於-電路板之表面黏著型發光二極體所產生m 路板係包括有-基材層、—設置在基材層之第—電路銅落層 及第二電路㈣層，其中表面黏著型發光二極體之金屬接^ =痒錫焊接在第-電路_層，電路板開設有至少一導熱 銅^貫穿孔’並在導熱鋼套貫穿孔中具有銅荡套，1 有$導熱板之散熱件經由一膠合層結合於第二電路銅箔 層’膠合層係作為電路板之第二電路銅層和散熱件間之導 熱和絕緣材料層，表面黏著型發光二極體所產生之熱能經由 表面黏著型發光二極體之金屬接腳、焊錫、第—電路銅箱M338435 γ i VIII. New description: [New technical field] This creation is about the design of a heat sink for a light-emitting diode, especially for a heat-dissipating structure of a surface-adhesive light-emitting diode. [Prior Art] Press, the most common light source in daily life includes traditional tungsten light bulb, quartz bulb, daylight bulb and mercury lamp, etc., while the light-emitting diode (LED) has low power consumption, long life and high Power, small size, environmental protection, and cold lighting characteristics, in addition to often used in a variety of information electronic equipment or display devices, has gradually replaced the traditional tungsten filament bulbs and become the light source body of many electrical components, electrical appliances. However, today's light-emitting diodes are used as lighting fixtures. Due to the problem of conversion efficiency, the light-emitting diodes will generate high heat during use. The continuous high heat is easy to damage the electronic components in the lamps, so there are many ways to dissipate heat. Developed. Commonly used heat dissipation methods include attaching a heat dissipating material to a hot electronic component or using a fan to enhance air convection to dissipate heat. For example, in the case of the Republic of China new patent No. M321141, a high-power LED lamp heat dissipation structure is disclosed, which is mainly composed of a plurality of high-power LED lamps, wherein the lampshade has a hollow cavity and is disposed at the periphery of the lampshade. There is a plurality of air inlet holes, and the circuit control device and the fan can be combined in the hollow cavity, and a fan is arranged in the space behind the middle 1 slot, and a rear cover plate is arranged behind the lamp cover, and the rear cover (4) has a plurality of air outlets; by the action of the fan, 5 M33 8435 1 i can enter the air outlet of the circuit control board with the air inlet hole of the periphery of the lamp cover to cool the cold air through the air inlet belt device and the LED lamp, (4) heat The air is taken out by the rear to achieve the purpose of circulating heat dissipation. Now [new content] The technical problems that this creation wants to solve. · Yes, the light-emitting devices are different. However, most of the previous heat-dissipating devices are complicated in structure and assembly is not in vain, which wastes a lot of manufacturing costs, processes and man-hours. Therefore, the main purpose of this creation is to provide a surface-adhesive type of heat dissipation structure, a simple structure design to save costs and facilitate the creation of a solution to solve problems. The technical method of L is used to improve the heat dissipation structure of a surface-adhesive light-emitting diode. The surface of the circuit board is provided with a surface-mounted light-emitting diode, and the m-plate layer includes a substrate layer. a first circuit copper layer and a second circuit (four) layer of the substrate layer, wherein the metal of the surface-adhesive light-emitting diode is soldered to the first circuit layer, and the circuit board is provided with at least one heat conductive copper The hole 'has a copper sleeve in the through hole of the heat conduction steel sleeve, and the heat dissipation member of the heat conduction plate is bonded to the second circuit copper foil layer through a glue layer as a second circuit copper layer and heat dissipation of the circuit board. The heat conduction and insulation material layer between the parts, the heat energy generated by the surface-adhesive light-emitting diode passes through the metal pin of the surface-adhesive light-emitting diode, the solder, the first circuit copper case
M338435， I 層、導熱銅箔套貫穿孔之銅箔套、第二電路銅箔層、膠人厣 傳導至散熱件之導熱板，由散熱件散逸。 本創作對照先前技術之功效： 經由本創作所採用之技術手段，只需藉由一膠合層、 一散熱件、在電路板所佈設之第一電路銅箔層和第二電路銅 箔層、以及在電路板所開設之至少一導熱銅箔套貫穿孔即可 達到發光二極體散熱之目的，不但便於組裝而省時，且可節 省製造成本、製程和工時。 本創作所採用的具體實施例，將藉由以下之實施例及 附呈圖式作進一步之說明。 【實施方式】 參閱第1圖和第2圖所示，其係顯示本創作表面黏著 型發光二極體之散熱結構之第一實施例本創作表面黏著型 發光二極體之散熱結構1係用以傳導並散逸設置於一電路 板2之複數顆表面黏著型發光二極體3所產生之熱能。 電路板2係可為軟質電路板或硬質電路板，其係包括 有:基材層、一設置在基材層21之第一電路銅箱層22 及第一電路銅箔層23 ’其中表面黏著型發光二極體3之金 屬接腳31係以焊錫4焊接在第_電路編層η，且在第一 電路銅M22之表面塗財一層防焊絕緣漆24，在第二電 ，銅V白層23之表面塗佈有—層防焊絕緣漆25。第一電路銅 箱層22在各個表面黏著型發光二極體3之金屬接腳31之間 7 M3 3 843 5 絕緣空間22卜第二電路銅箔層23在各個表 二極體3之金屬接腳31之對應位置之間係分 空間231，以避免產生短路。M338435, I layer, copper foil sleeve of through-hole of thermal conductive copper foil sleeve, copper foil layer of second circuit, heat-conducting plate of rubber mandrel to heat sink, dissipated by heat sink. The present invention compares the effects of the prior art: through the technical means employed in the present creation, only by a glue layer, a heat sink, a first circuit copper foil layer and a second circuit copper foil layer disposed on the circuit board, and At least one thermal conductive copper foil sleeve through hole formed in the circuit board can achieve the purpose of dissipating heat from the LED, which is convenient for assembly and saves time, and can save manufacturing cost, process and man-hour. The specific embodiments used in the present application will be further illustrated by the following examples and accompanying drawings. [Embodiment] Referring to FIG. 1 and FIG. 2, the first embodiment of the heat dissipating structure of the surface-applied light-emitting diode of the present invention is shown. The heat energy generated by the plurality of surface-adhesive light-emitting diodes 3 disposed on a circuit board 2 is conducted and dissipated. The circuit board 2 can be a flexible circuit board or a rigid circuit board, and includes a base material layer, a first circuit copper box layer 22 disposed on the base material layer 21, and a first circuit copper foil layer 23' The metal pin 31 of the type LED 2 is soldered to the first circuit layer η with solder 4, and a layer of solder resist varnish 24 is applied on the surface of the first circuit copper M22, in the second electric, copper V white The surface of layer 23 is coated with a layer of solder resist varnish 25. The first circuit copper box layer 22 is between the metal pins 31 of the respective surface-adhesive light-emitting diodes 3 7 M3 3 843 5 The insulating space 22 the second circuit copper foil layer 23 is connected to the metal of each of the surface diodes 3 A space 231 is defined between the corresponding positions of the feet 31 to avoid short circuits.
係分別留有一 面黏著型發光 別留有一絕緣 二型發光三極體之散熱結構1係在電路板2開 獲數個導熱鋼絲貫穿孔26，並在導熱㈣套貫穿孔 26中々具有銅羯套261，導熱銅箱套貫穿孔26之銅箱套係連 接於第-電路銅箱層22和第二電路銅猪層U，_具有二導 熱板121之散熱件12經由一膠合層u結合於第二電路㈣ 層=因防焊絕緣漆25極薄），且膠合層u係、作為電路板2 之第二電路銅fg層23和散熱件12間之導熱和絕緣材料層， 其結合之方式可為熱料、膠黏合、超音波炼合或以機械曰迫 緊法結合(如使用螺絲、鉚釘或夾具等），勝合層U係可為 石夕膏、謂或㈣片，其除了具有膠合緊貼和絕緣之功能 外:亦有良好之導熱效果。散熱件之導熱板⑵之一表 面係凸出形成有複數個散熱·鰭板122，以增加散熱效率，散 .熱件12係可由導熱性佳之金屬所製成。 月 當表面黏著型發光二極體3通電發光時，表面黏著型 發光二極體3所產生之熱能經由表面黏著型發光二極體、 :金屬接腳31、烊錫4、第一電路鋼箔層22、導熱鋼箔套 貝穿孔26之銅箱套261、第二電路鋼箱層23、膠合層u 傳導至導熱板12卜再傳導至散熱鰭板122，由散熱^ Η ，逸。因此，第二電路銅箱層23係具有一預定面積、，該預 定面積係越大越好，且在電路板2所開設之導熱銅f|套貫穿 孔26之數目係越多越好，以利熱能之傳導。 8 M338435 、 I. 參閱第3圖所不，其係顯示本創作表面黏著型發光二 ，體之散熱結構之第二實_之剖視示意圖。本創作表面黏 者型發光二極體之散熱結構la之結構設計與前述之第一實 ::例大致相同’故相同之構件乃標示以相同之元件編號，以 貝對應。其差異在於第二實施例中之電路板2a係僅包括有 基材層21、電路銅箱層22’和防焊絕緣漆％，且一散熱件 12a係經由-膠合層Ua結合於電路板％之電路銅荡層 22’（因防焊絕緣漆24極薄），且散熱件m係開設有兩個開 孔123開孔123之位置係恰對應於表面黏著型發光二極體 3’以使散熱件12a之導熱板121a可經由膠合| na膠合緊 貼於電路板2a之電路㈣層22，，膠合層⑴係作為電路板 h之電路銅_ 22，和散熱件12a間之導熱和絕緣材料層。 表面黏著型發光二極體3所產生之熱能經由表面黏著型發 光二極體3之金屬接腳3卜焊錫4、電路㈣層22，、膠合 潛Ua傳導至導熱板121a，再傳導至散熱縛板⑽，由散 .熱件12a散逸。 並且，散熱件12a之散熱轉板l22a之高度係不超過表 面黏著型發光二極體3之頂面（發光面），以免遮蔽表面黏著 型發光二極體3所發出之光線。且電路銅羯層22，係具有一 預定面積1預定面積係越大越好，.關熱能之傳導。 參閱第4 ®所不，其係顯*本1彳作表面黏著型發光二 ，體之散熱結構之第三實_之剖視示意H創作表面黏 著31勒光-極體之散熱結構j b之結構設計與前述之第一實 施例大致相同，故相同之構件乃標示以相同之元件編號，以 M33 843 5 為對應。其差異在於除了五 踗拓？夕筮千 、了放熱件12經由膠合層11結合於電 路板2之弟二電路銅箔屛 电 Μ Ί1 Α 9 3外’更有散熱件12a經由膠合 層11a結合於電路板2 T 田胗口 效果。 之弟一電路鋼箱層22,以增加散熱 參閱第5圖所示，1孫 /、係顯不本創作表面黏著型發光二 菩雜* j 例之剖視示意®。本創作表面黏The heat dissipation structure 1 which has an adhesive type light-emitting type and an insulated two-type light-emitting three-pole body is respectively provided on the circuit board 2 to obtain a plurality of heat conductive steel wire through holes 26, and has a copper ferrule sleeve in the heat conduction (four) sleeve through hole 26 261, the copper box sleeve of the heat conducting copper box sleeve through hole 26 is connected to the first circuit copper box layer 22 and the second circuit copper pig layer U, the heat sink 12 having the two heat conducting plates 121 is coupled to the first layer via a glue layer u The second circuit (four) layer = because the solder resist varnish 25 is extremely thin), and the glue layer u is used as the heat conduction and insulating material layer between the second circuit copper fg layer 23 of the circuit board 2 and the heat sink 12, and the combination thereof can be For hot material, adhesive bonding, ultrasonic blending or mechanical pressing (such as the use of screws, rivets or clamps, etc.), the Winning layer U system can be Shi Xi cream, said or (four) piece, in addition to gluing In addition to the function of closeness and insulation: there is also good thermal conductivity. One of the heat conducting plates (2) of the heat dissipating member is formed with a plurality of heat dissipating fins 122 to increase the heat dissipating efficiency, and the heat dissipating member 12 is made of a metal having good thermal conductivity. When the surface-adhesive light-emitting diode 3 is energized to emit light, the heat generated by the surface-adhesive light-emitting diode 3 passes through the surface-adhesive light-emitting diode, the metal pin 31, the tin-tin 4, and the first circuit steel foil. The layer 22, the copper box sleeve 261 of the heat conductive steel foil sleeve perforation 26, the second circuit steel box layer 23, and the glue layer u are conducted to the heat conduction plate 12 and then conducted to the heat dissipation fin plate 122, and are dissipated by heat dissipation. Therefore, the second circuit copper box layer 23 has a predetermined area, and the larger the predetermined area is, the better, and the number of the heat conductive copper f| sleeve through holes 26 formed in the circuit board 2 is as good as possible. The conduction of heat. 8 M338435, I. Refer to Figure 3, which is a cross-sectional view showing the second surface of the heat-dissipating structure of the surface. The structural design of the heat dissipating structure la of the surface-applied light-emitting diode of the present invention is substantially the same as that of the first embodiment described above. Therefore, the same components are denoted by the same component numbers, and the corresponding ones are corresponding. The difference is that the circuit board 2a in the second embodiment includes only the substrate layer 21, the circuit copper case layer 22' and the solder resist lacquer %, and a heat sink 12a is bonded to the circuit board via the glue layer Ua. The circuit copper layer 22' (because the solder resist varnish 24 is extremely thin), and the heat sink m is provided with two openings 123 and the opening 123 corresponds to the surface-adhesive light-emitting diode 3'. The heat conducting plate 121a of the heat dissipating member 12a can be adhered to the circuit (4) layer 22 of the circuit board 2a via gluing, and the bonding layer (1) serves as the heat conducting and insulating material between the circuit copper _ 22 of the circuit board h and the heat dissipating member 12a. Floor. The heat generated by the surface-adhesive light-emitting diode 3 passes through the metal pin 3 of the surface-adhesive light-emitting diode 3, the solder 4, the circuit (4) layer 22, and the bonding potential Ua is conducted to the heat-conducting plate 121a, and then conducted to the heat-dissipating bond. The plate (10) is dissipated by the heat-dissipating member 12a. Moreover, the height of the heat-dissipating plate 12a of the heat-dissipating member 12a does not exceed the top surface (light-emitting surface) of the surface-adhesive light-emitting diode 3, so as not to shield the surface from the light emitted by the light-emitting diode 3. And the circuit copper layer 22 has a predetermined area 1 and the predetermined area is as large as possible, and the heat energy is turned off. Refer to Section 4®, which is the first surface of the body. The third embodiment of the heat dissipation structure of the body is shown in Fig. H. The surface of the lens is 31-light-polar structure. The design is substantially the same as the first embodiment described above, and the same components are denoted by the same component numbers, corresponding to M33 843 5 . The difference is in addition to the five extensions?夕筮千, the heat releasing member 12 is bonded to the circuit board 2 via the glue layer 11 to the second circuit copper foil 屛 Α 1 Α 9 3 outer 'more heat sink 12a is bonded to the circuit board 2 via the glue layer 11a effect. The brother of a circuit steel box layer 22, in order to increase heat dissipation, as shown in Figure 5, 1 Sun /, the system is not created by the surface of the adhesive type of light II. The surface of this creation is sticky
者型發光二極體之散教姓M & 文〜、、、、°構1c申之散熱件12c係呈中空管 狀且由金屬材料所製成，包括右道 匕括有一導熱板Ulc和複數個散 熱鰭板122c。一敕皙夕带故 > … 、之電路板2b係經由膠合層llc膠合緊 貼於散熱件12c之外璜；Φ 』 ” # 卜衣面。電路板2b係包括一基材層21b、 -弟-電路銅箱層22b、一第二電路銅，層现、一防焊絕 ^4 b和-防焊絕緣漆2 5 b，簡姻設有複數個導熱銅 貫穿孔26 ’每—個導熱銅箱套貫穿孔26係分別具有一 =套（圖中未示），第—電路銅箱層咖在各個表面黏著型 《光二極體3之金屬接聊31之間同樣分別留有-絕緣空間 22卜第二電路銅落層2儿在各個表面黏著型發光二極體3 之盈屬接腳31之對應位置之間同樣分別留有一絕緣空間 231 〇 表面黏著型發光二極體3所產生之熱能係經由其金屬 接:31依序傳導至焊錫4、第—電路则層既、導熱銅猪 套貫穿孔26之銅箔套、第二電路銅箔層23b、膠合層Uc 和散熱件12c而散逸至空氣中。 參閱第6圖所示，其係顯示本創作表面黏著型發光二 極體之散熱結構之第五實施例之立體示意圖。如圖所示，本 M338435 創作表面黏著型發光二極體之散熱結構ld係包括在電路 2c所開設之複數個導熱㈣套貫穿孔（圖巾未朴在電路板 2c所佈設之兩層電路_層（圖中未示）、_膠合層（圖中未 示）、以及-散熱件⑶，散熱件12d係為一般照明燈且中 =凹面鏡，係由金屬材料所製成，而電路板〜同樣係為軟 貝電路板，故可配合散熱件12d之形狀經由膠合層而貼人机 置於散熱件12d(凹面鏡)上，於本實施例中，散熱件^(凹又 面鏡)之外表面係凸出形成有複數個散熱鰭板咖，以增加 散熱效果；或者，#散熱件l2d(凹面鏡)本身所達成之^熱 效果已足夠（或當散熱件12d結合其它金料殼所達成之散 熱效果已足夠）時，則散熱件12d(凹面 出形成散熱韓板咖。 不而凸 參閱第7圖所示，其係本創作表面黏著型發光二極體 =散熱結構之第六實施例之剖視示意圖。本創作表面黏著型 么光-極體之散熱結構le之結構設計與前述之第一實施例 .大致相同’故相同之構件乃標示以相同之元件編號，以資對 應。其差異在於第六實施例中之散熱件12e係為—電子裝置 (例如桌燈、車燈、手電筒等）之金屬外殼，亦即將第1圖中 之=路板2經由膠合層u貼合設置於散熱件i2e(電子裝置 ”殼)’以使表面黏著型發光二極體3所產生之熱能 a政…件12e(電子裝置之金屬外殼)散逸至空氣中，且於 本汽知例中’散熱件12e(金屬外殼)之底面係凸出形成有複 數個散熱鳍板122e ’以增加散熱效果。 多閱第8圖所示’其係本創作表面黏著型發光二極體 M338435 * 之散熱結構之第七實_之剖初意圖。本創作表面黏著型 發光二極體之散熱結構lf之結構設計與前述之第六實施例 大致相同’故相同之構件乃標示以相同之元件編號，以資對 應。其差異在於表面黏著型發光二極體之散熱結構if之散 熱件12f之底面並無凸出形成散減板，此乃由於散熱; 12f(金屬外殼）本身所達成之散熱效果已足夠。 舉凡熟悉此技藝者皆能輕易得知，本創作中之散熱件 係可為各種電子裝置（如桌燈、車燈、手電筒、或顯示器等） 之金屬外殼，而電路板2、2b、2c係為可彎曲之軟質電路板， 故可貼合設置於各種形狀之散熱件上，例如上述之電路板 2b可經由膠合層llc貼合設置於中空管狀之散熱件丨^，當 然亦可貼合設置於其它呈方形、三角形、多邊形、錐形等； 之金屬散熱件上，如此即可使應用於各種電子裝置之金屬外 殼之表面黏著型發光二極體有良好之散熱管道，並延長電子 裝置之使用壽命。此外，當電路板上需設置過多被動元件 時，亦可使用多層電路板，即在電路板係佈設有兩層以上之 電路銅箔層；或可使用堆層電路板，亦即將兩片以上之電路 板結合。 由以上之實施例可知，本創作所提供之表面黏著型發 光二極體之散熱結構確具產業上之利用價值，故本創作業已 付合於專利之要件。惟以上之敘述僅為本創作之較佳實施例 說明，凡精於此項技藝者當可依據上述之說明而作其它種種 之改良，惟這些改變仍屬於本創作之創作精神及以下所界定 之專利範圍中。 12 M338435 【圖式簡單說明】 第1圖係本創作表面黏著型發光二極體之散熱結構之第— 實施例之剖視示意圖； 第2圖係第1圖中a部位之放大示意圖； 苐3圖係本創作表面黏著型發光二極體之散熱結構之第一 實施例之剖視示意圖； 第4圖係本創作表面黏著型發光二極體之散熱結構之第三 實施例之剖視示意圖； 第5圖係本創作表面黏著型發光二極體之散熱結構之第四 實施例之剖視示意圖； 第6圖係本創作表面黏著型發光二極體之散熱結構之第五 實施例之立體示意圖； 第7圖係本創作表面黏著型發光二極體之散熱結構之第六 實施例之剖視示意圖； 第8圖係本創作表面黏著型發光二極體之散熱結構之第七 實施例之剖視示意圖。 【主要元件符號說明】 I、 la、lb、k、Id、表面黏著型發光二極體之散熱結構 le、If II、 11 a、11 b、11 c 膠合層 12、12a、12b、12c、散熱件 12d 、 12e 、 12f 13 M338435 121、121a、121c 122 、 122a 、 122c 、 122d 、 122e 123 2、2a、2b、2c 21 、 21b 22 、 22b 22， 221 23 、 23b 231 24 、 24b 25 、 25b 26 261 3 31 4 導熱板 散熱鰭板 開孔 電路板 基材層 第一電路銅箔層 電路銅箔層 絕緣空間 第二電路銅箔層 絕緣空間 防焊絕緣漆 防焊絕緣漆 導熱銅箔套貫穿孔 銅f#套 表面黏著型發光二極體 金屬接腳 焊錫 14The heat sink 12c is a hollow tubular shape and is made of a metal material, including a heat conduction plate Ulc and a plurality of right-handed light-emitting diodes. Heat sink fins 122c. The circuit board 2b is glued to the outside of the heat sink 12c via the glue layer llc; Φ 』 ” #布衣面. The circuit board 2b includes a substrate layer 21b, Brother-circuit copper box layer 22b, a second circuit copper, layered, a solder-proof solder ^4 b and - solder-proof insulating varnish 2 5 b, a small number of thermal conductive copper through holes 26 'each heat transfer The copper box sleeve through holes 26 respectively have a set (not shown), and the first circuit copper box layer has a separate space between the surface adhesion type "metal diodes 31 of the light diodes 3". 22b, the second circuit copper falling layer 2 also has an insulating space 231 between the corresponding positions of the surplus pin 31 of each surface-adhesive light-emitting diode 3, respectively, which is generated by the surface-adhesive light-emitting diode 3 The thermal energy is sequentially transmitted to the solder 4 via the metal connection 31, the second layer of the first circuit, the copper foil sleeve of the thermal copper pig sleeve through hole 26, the second circuit copper foil layer 23b, the glue layer Uc and the heat sink 12c. Dissipate into the air. Refer to Figure 6, which shows the heat dissipation structure of the surface-bonded LED of the creation. A three-dimensional schematic view of the fifth embodiment. As shown in the figure, the heat dissipation structure ld of the M338435 surface-emissive light-emitting diode includes a plurality of heat-conducting (four) sets of through holes formed in the circuit 2c (the towel is not on the circuit board). 2c is arranged in two layers of circuit _ layer (not shown), _ glue layer (not shown), and - heat sink (3), heat sink 12d is a general lighting and medium = concave mirror, is made of metal materials The circuit board is also made of a soft shell circuit board, so that it can be placed on the heat sink 12d (concave mirror) via the glue layer in the shape of the heat sink 12d. In this embodiment, the heat sink ^( The outer surface of the concave mirror is formed with a plurality of heat-dissipating fins to increase the heat dissipation effect; or, the heat sink l2d (concave mirror) itself has sufficient heat effect (or when the heat sink 12d is combined) When the heat dissipation effect achieved by other gold shells is sufficient), the heat sink 12d (the concave surface is formed to form a heat sink Korean plate. The convex surface is not shown in Fig. 7, which is a surface-emissive light-emitting diode of the present invention. A cross-sectional view of a sixth embodiment of the structure The structural design of the surface-adhesive-type heat-dissipating structure of the present invention is substantially the same as that of the first embodiment described above. Therefore, the same components are labeled with the same component number, and the difference lies in the sixth. The heat dissipating member 12e in the embodiment is a metal casing of an electronic device (for example, a table lamp, a lamp, a flashlight, etc.), that is, the road plate 2 in FIG. 1 is attached to the heat dissipating member i2e via the bonding layer u ( The electronic device "shell" is such that the thermal energy generated by the surface-adhesive light-emitting diode 3 is dissipated into the air, and in the present example, the heat sink 12e (metal) The bottom surface of the outer casing is convexly formed with a plurality of heat radiating fins 122e' to increase the heat dissipation effect. More on the eighth figure shown in Fig. 8 is the original intention of the seventh embodiment of the heat-dissipating structure of the surface-applied light-emitting diode M338435*. The structural design of the heat dissipating structure lf of the surface-emissive light-emitting diode of the present invention is substantially the same as that of the sixth embodiment described above. Therefore, the same components are denoted by the same component numbers. The difference is that the heat dissipation structure of the surface-adhesive light-emitting diode does not protrude from the bottom surface of the heat-dissipating member 12f to form a diffusion plate, which is due to heat dissipation; the heat dissipation effect achieved by the 12f (metal casing) itself is sufficient. Anyone familiar with this art can easily know that the heat sink in this creation can be a metal casing of various electronic devices (such as table lamps, lamps, flashlights, or displays), and the circuit boards 2, 2b, 2c are It is a flexible flexible circuit board, so that it can be attached to heat sinks of various shapes. For example, the circuit board 2b can be attached to the hollow tubular heat sink 经由^ via the glue layer llc, and of course, it can also be fitted. In other metal heat sinks which are square, triangular, polygonal, tapered, etc., the surface-adhesive light-emitting diodes of the metal casings used in various electronic devices have good heat-dissipating pipes and extend the electronic device. Service life. In addition, when too many passive components are required on the circuit board, a multi-layer circuit board may be used, that is, two or more circuit copper foil layers are provided on the circuit board; or a stacked circuit board may be used, that is, two or more layers are used. Board combination. It can be seen from the above embodiments that the heat dissipation structure of the surface-adhesive light-emitting diode provided by the present invention has industrial utilization value, so the original operation has been paid for the patent requirements. However, the above description is only for the preferred embodiment of the present invention, and those skilled in the art may make other improvements according to the above description, but these changes still belong to the creative spirit of the creation and the following definitions. In the scope of patents. 12 M338435 [Simple description of the drawing] Fig. 1 is a schematic cross-sectional view showing the heat dissipating structure of the surface-adhesive light-emitting diode of the present invention; Fig. 2 is an enlarged schematic view showing the a portion in the first drawing; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 4 is a cross-sectional view showing a third embodiment of a heat dissipating structure of a surface-adhesive light-emitting diode of the present invention; FIG. 4 is a cross-sectional view showing a third embodiment of a heat dissipating structure of the surface-applied LED of the present invention; 5 is a schematic cross-sectional view showing a fourth embodiment of the heat dissipating structure of the surface-adhesive light-emitting diode of the present invention; FIG. 6 is a perspective view showing a fifth embodiment of the heat dissipating structure of the surface-adhesive LED of the present invention. Fig. 7 is a cross-sectional view showing a sixth embodiment of the heat dissipating structure of the surface-adhesive light-emitting diode of the present invention; and Fig. 8 is a cross-sectional view showing the seventh embodiment of the heat dissipating structure of the surface-adhesive light-emitting diode of the present invention See the schematic. [Description of main component symbols] I, la, lb, k, Id, heat-dissipating structure of surface-adhesive light-emitting diodes, If II, 11 a, 11 b, 11 c glue layers 12, 12a, 12b, 12c, heat dissipation Pieces 12d, 12e, 12f 13 M338435 121, 121a, 121c 122, 122a, 122c, 122d, 122e 123 2, 2a, 2b, 2c 21, 21b 22, 22b 22, 221 23, 23b 231 24, 24b 25, 25b 26 261 3 31 4 Thermal plate heat sink fin hole circuit board base layer first circuit copper foil layer circuit copper foil layer insulation space second circuit copper foil layer insulation space anti-weld insulation paint soldering insulation paint thermal conductive copper foil sleeve through hole Copper f# sets of surface-adhesive light-emitting diode metal pin solder 14