WO2005103564A1 - Led light source module packaged with metal - Google Patents

Led light source module packaged with metal Download PDF

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Publication number
WO2005103564A1
WO2005103564A1 PCT/CN2004/001442 CN2004001442W WO2005103564A1 WO 2005103564 A1 WO2005103564 A1 WO 2005103564A1 CN 2004001442 W CN2004001442 W CN 2004001442W WO 2005103564 A1 WO2005103564 A1 WO 2005103564A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
light source
led
source module
led light
Prior art date
Application number
PCT/CN2004/001442
Other languages
French (fr)
Chinese (zh)
Inventor
Yaohao Wang
Xing Yan
Original Assignee
Yaohao Wang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaohao Wang filed Critical Yaohao Wang
Priority to JP2007600004U priority Critical patent/JP3131144U/en
Publication of WO2005103564A1 publication Critical patent/WO2005103564A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors

Definitions

  • the present invention relates to a lighting device using an LED (light emitting diode) as a light source, and particularly to an LED light source module installed in an outdoor signboard such as a billboard, a road sign, and the like, so that the sign has a light-emitting effect.
  • LED light emitting diode
  • LED light source module built into outdoor signs such as billboards and road signs.
  • the existing LED light source modules do not consider the heat dissipation and waterproof function in the structure. They simply insert the LED on the PCB board, and then install the PCB board in a poorly waterproof plastic case. None of the shells. Due to poor heat dissipation and moisture, the existing LED light source modules are not ideal in terms of reliability and service life.
  • An object of the present invention is to provide an LED light source module having good heat dissipation and waterproof performance.
  • the invention is implemented as follows:
  • the LED light source module uses a metal circuit board as the carrier of the LED, the LED pins are soldered to the wiring layer of the metal circuit board, the power supply inlet and outlet wires are soldered to the wiring layer, and the wiring layer is attached to the wiring layer.
  • the entire metal circuit board is covered with a waterproof insulating adhesive layer, which seals the LED pins and the soldering points of the power supply inlet and outlet wires together, and a metal shell heat sink is connected to the metal substrate of the metal circuit board.
  • the heat sink is thermally coupled to the metal substrate. Since the entire metal circuit board, the pins of the LEP and the welding points of the power cord are covered and protected by waterproof insulation glue, the LED light source module has good waterproof performance.
  • the heat emitted by the LED can be transferred to the heat sink through the metal circuit board, and then emitted by the heat sink.
  • the LED light source module also has good heat dissipation performance.
  • the advantage of the invention is that the good heat dissipation performance ensures that the LED can work continuously and reliably with high brightness.
  • the good waterproof performance can make the entire light source module work reliably outdoors for a long time, which obviously improves the reliability of the LED light source module.
  • the service life can reach 100,000 hours.
  • FIG. 1 is a schematic structural diagram of Embodiment 1 of the present invention.
  • FIG. 2 is a schematic structural diagram of the second embodiment.
  • each reference numeral is: 1 --- LED-LED light emitting head
  • the LED light source module of this embodiment includes a plug-in LED 1, a metal circuit board 2, and a metal shell heat dissipation plate 3.
  • the metal wiring board 2 itself has a wiring layer 2a and a metal substrate 2b, and the wiring layer 2a and the metal substrate 2b are electrically insulated from each other.
  • the plug-in type LED 1 uses the metal circuit board 2 as a carrier, and its pins are soldered on the wiring layer 2 a of the metal circuit board 2.
  • the wiring layer 2a is also soldered with the power supply inlet and outlet lines 4, 5.
  • Multiple LED light source modules can be connected in series through the power supply inlet and outlet lines 4, 5, and the power supply lines of the two LED light source modules can be connected with a commercially available waterproof connector.
  • the number and layout of the LEDs 1 and the specific wiring diagram of the wiring layer 2a can be flexibly set according to actual needs.
  • a waterproof insulating adhesive layer 6 covering the entire metal wiring board is also attached to the wiring layer 2a. Prevent Water-insulating adhesive layer 6—and sealed the .1 pins of the LED1 and the soldering points of the power inlet and outlet wires 4 and 5.
  • the waterproof insulating layer 6 should be epoxy resin.
  • the heat sink 3 connected to the metal substrate 2b of the metal circuit board 2 may be made of a metal having a small thermal resistance such as aluminum.
  • the specific shape of the heat dissipation plate 3 can be set flexibly, including various shapes such as circles, rectangles, etc., and the surface of the heat dissipation plate is not limited to a planar shape. Structures such as fins and ribs can be integrally formed on the surface (not shown in the figure) (Out) to further enhance thermal performance.
  • the periphery of the heat dissipation plate 3 is folded toward the direction of the metal circuit board 2 to form an open box body accommodating the metal circuit board, and the waterproof insulating rubber layer 6 seals the open end of the entire box body.
  • the heat dissipation plate 3 also serves as a protective casing, which makes the entire light source module more robust and has the best waterproof performance.
  • a thermally conductive adhesive 7 such as thermally conductive silicone is also bonded between the heat dissipation plate 3 and the metal substrate 2b of the metal circuit board. Since the light emitting angle of the plug-in LED is small, this embodiment specifically protrudes the light emitting head 1a of the LED from the side of the box. In this way, a side-emitting LED light source module can be manufactured.
  • This type of side-emitting LED module can be installed on the inner side of the label when in use, so that the light emitting head of the LED faces away from the light-emitting surface of the label, so that the light emitted by the LED does not directly emit from the light-emitting surface of the label, but passes through the label Multiple diffuse reflections of the inner surface are then emitted from the light emitting surface, so that the illumination on the light emitting surface of the sign can be more uniform.
  • installing the LED light source module on the inner side of the signboard is more conducive to the heat dissipation and waterproof of the LED light source module in some cases.
  • the LED 8 of this embodiment is a patch LED, and other structures are the same as those of the embodiment.
  • This structure can be made into a front-emitting LED light source module, and the module has a minimum thickness.
  • the module can be installed on the inner bottom surface of the label, so that the light emitted by the LED directly passes through the label
  • the light emitting surface of the brand fully utilizes the advantages of the large LED light emitting angle to reduce light loss.
  • installing the LED light source module on the inner bottom surface of the label is more conducive to the heat dissipation and waterproof of the module.
  • screws can also be used to connect the metal circuit board and the heat sink together, and the metal substrate of the metal circuit board can be in close contact with the heat sink to form a thermally conductive connection. In this way, pay attention that the screws do not touch the wiring layer of the metal circuit board to prevent short circuit.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)

Abstract

A LED light source module packaged with metal case comprises a plurality of LEDs mounted on a metallic circuit board. The metallic circuit board is comprised of a metal substrate and a wiring layer disposed on the upper surface of the metal substrate. The pins of the LEDs are directly bonded to the wiring layer of the metallic circuit board, and a power supply is connected to the wiring layer by two power wires. The metallic circuit board and the connection points of the pins and the power wires are encapsulated by a water-proof insulating adhesive layer. A heat-radiation plate is surface-mounted on the metal substrate such that heat can be conducted to the plate by the metallic circuit board, and then dissipated outside by the plate, therefore the module can have excellent heat-dissipation effects. On the other hand, the whole metallic circuit board and the connection points of the pins and the power wires are all protected by the water-proof insulating adhesive layer, thus the module can also have good water-proof capabilities.

Description

技术领域 Technical field
本发明涉及以 LED (发光二极管）为光源的照明装置， 特别是安装在 广告牌、 路标牌等户外标牌内， 使标牌具有发光效果的 LED光源模块。 背景技术  The present invention relates to a lighting device using an LED (light emitting diode) as a light source, and particularly to an LED light source module installed in an outdoor signboard such as a billboard, a road sign, and the like, so that the sign has a light-emitting effect. Background technique
目前市面上出现一种内置于广告牌、 路标牌等户外标牌内的 LED光 源模块。 已有的这种 LED光源模块在结构上都没有考虑散热和防水功能， 只是简单地将 LED插在 PCB板上，再将 PCB板装在一个防水性很差的塑 料外壳内， 有的甚至连外壳都没有。 由于散热不良、 容易受潮， 因此已有 的 LED光源模块在可靠性和使用寿命方面都不甚理想。  At present, there is an LED light source module built into outdoor signs such as billboards and road signs. The existing LED light source modules do not consider the heat dissipation and waterproof function in the structure. They simply insert the LED on the PCB board, and then install the PCB board in a poorly waterproof plastic case. None of the shells. Due to poor heat dissipation and moisture, the existing LED light source modules are not ideal in terms of reliability and service life.
发明内容 Summary of the invention
本发明的目的是提供一种具有良好的散热和防水性能的 LED光源模 块。  An object of the present invention is to provide an LED light source module having good heat dissipation and waterproof performance.
本发明是这样实现的： LED光源模块以金属线路板作为 LED的承载 体， LED的引脚焊接在金属线路板的布线层上，布线层上焊接有电源进出 线， 在布线层上附着有将整块金属线路板覆盖的防水绝缘胶层， 防水绝缘 胶层一并将 LED的引脚以及电源进出线的焊接点封于其内， 在金属线路 板的金属基板上联接有金属外壳的散热板， 散热板与金属基板导热联接。 由于整块金属线路板以及 LEP的引脚和电源线的焊接点都被防水绝缘胶 覆盖， 受其保护， 因此本 LED光源模块具有良好的防水性能。 另一方面， LED发出的热量可通过金属线路板传递至散热板， 再由散热板散发出去， The invention is implemented as follows: The LED light source module uses a metal circuit board as the carrier of the LED, the LED pins are soldered to the wiring layer of the metal circuit board, the power supply inlet and outlet wires are soldered to the wiring layer, and the wiring layer is attached to the wiring layer. The entire metal circuit board is covered with a waterproof insulating adhesive layer, which seals the LED pins and the soldering points of the power supply inlet and outlet wires together, and a metal shell heat sink is connected to the metal substrate of the metal circuit board. The heat sink is thermally coupled to the metal substrate. Since the entire metal circuit board, the pins of the LEP and the welding points of the power cord are covered and protected by waterproof insulation glue, the LED light source module has good waterproof performance. On the other hand, the heat emitted by the LED can be transferred to the heat sink through the metal circuit board, and then emitted by the heat sink.
—1— 确 认 本 因此本 LED光源模块还具有良好的散热性能。 —1— Confirmation Therefore, the LED light source module also has good heat dissipation performance.
本发明的优点是良好的散热性能保证了 LED能可靠、 高亮度的连续 工作， 加之良好的防水性能， 更能使整个光源模块可靠地在户外长时间工 作， 明显地提高了 LED光源模块的可靠性， 使用寿命可达到 10万小时。 附图说明  The advantage of the invention is that the good heat dissipation performance ensures that the LED can work continuously and reliably with high brightness. In addition, the good waterproof performance can make the entire light source module work reliably outdoors for a long time, which obviously improves the reliability of the LED light source module. The service life can reach 100,000 hours. BRIEF DESCRIPTION OF THE DRAWINGS
图 1是本发明实施例 1的结构示意图；  FIG. 1 is a schematic structural diagram of Embodiment 1 of the present invention;
图 2是实施例 2的结构示意图。  FIG. 2 is a schematic structural diagram of the second embodiment.
图中， 各附图标记为： 1---LED -LED的发光头  In the figure, each reference numeral is: 1 --- LED-LED light emitting head
2—金属线路板 2a -布线层  2—metal circuit board 2a-wiring layer
2b---金属基板 3—散热板  2b --- metal substrate 3-heat sink
4—电源进入线 5—电源接出线  4—Power inlet line 5—Power outlet line
6—防水绝缘胶层 7 -导热胶  6—Waterproof insulation adhesive layer 7—Heat conductive adhesive
具体实施方式 Detailed ways
实施例 1  Example 1
参见图 1， 本实施例的 LED光源模块包括插件式 LED1、金属线路板 2和金属外壳散热板 3。 金属线路板 2本身具有布线层 2a和金属基板 2b， 布线层 2a和金属基板 2b彼此电绝缘。插件式 LED1以金属线路板 2作为 承载体， 其引脚焊接在金属线路板 2的布线层 2a上。 布线层 2a还焊接有 电源进出线 4、 5。通过电源进出线 4、 5可将多个 LED光源模块串联在一 起， 两个 LED光源模块的电源线之间可用市售的防水接线器连接。 LED1 的数量、 布局方式， 以及布线层 2a的具体线路图可根据实际需要灵活设 定。在布线层 2a上还附着有将整块金属线路板覆盖的防水绝缘胶层 6。防 水绝缘胶层 6—并将 LED1的.引脚以及电源进出线 4、 5的焊接点封于其 内。 作为最佳实施方式， 防水绝缘层 6应采用环氧树脂。 联接在金属线路 板 2的金属基板 2b上的散热板 3可用热阻小的金属如铝材等制成。 散热 板 3的具体形状可灵活设定， 包括圆形、矩形等各种形状， 而且散热板的 表面也不限于平面形状， 可以在表面上整体成型翅片、 筋条等结构（图中 未示出）， 以进一步增强散热性能。 在本实施例中， 散热板 3的周边朝着 金属线路板 2的方向翻折， 形成一个容纳金属线路板的敞口盒体， 防水绝 缘胶层 6将整个盒体的敞口端密封。这种结构以散热板 3兼作为保护壳体， 使得整个光源模块更加牢固， 并且具有最佳的防水性能。为了进一步增强 散热效果， 本实施例还在散热板 3与金属线路板的金属基板 2b之间粘接 有导热胶 7， 例如导热硅胶等。 由于插件 LED的发光角度较小， 因此本实 施例特将 LED的发光头 la从盒体的侧面伸出。 如此可制成侧面发光的 LED光源模块。 这种侧面发光的 LED模块， 在使用时可安装在标牌的内 侧面， 使 LED的发光头背向标牌的出光面， 使得 LED发出的光不直接从 标牌的出光面射出，而是先经过标牌内表面的多次漫反射后再从出光面射 出， 如此可使标牌的出光面上的光照度更加均匀。 另一方面， 将 LED光 源模块安装在标牌的内侧面， 在有些情况下更有利于 LED光源模块的散 热和防水。 Referring to FIG. 1, the LED light source module of this embodiment includes a plug-in LED 1, a metal circuit board 2, and a metal shell heat dissipation plate 3. The metal wiring board 2 itself has a wiring layer 2a and a metal substrate 2b, and the wiring layer 2a and the metal substrate 2b are electrically insulated from each other. The plug-in type LED 1 uses the metal circuit board 2 as a carrier, and its pins are soldered on the wiring layer 2 a of the metal circuit board 2. The wiring layer 2a is also soldered with the power supply inlet and outlet lines 4, 5. Multiple LED light source modules can be connected in series through the power supply inlet and outlet lines 4, 5, and the power supply lines of the two LED light source modules can be connected with a commercially available waterproof connector. The number and layout of the LEDs 1 and the specific wiring diagram of the wiring layer 2a can be flexibly set according to actual needs. A waterproof insulating adhesive layer 6 covering the entire metal wiring board is also attached to the wiring layer 2a. Prevent Water-insulating adhesive layer 6—and sealed the .1 pins of the LED1 and the soldering points of the power inlet and outlet wires 4 and 5. As a best embodiment, the waterproof insulating layer 6 should be epoxy resin. The heat sink 3 connected to the metal substrate 2b of the metal circuit board 2 may be made of a metal having a small thermal resistance such as aluminum. The specific shape of the heat dissipation plate 3 can be set flexibly, including various shapes such as circles, rectangles, etc., and the surface of the heat dissipation plate is not limited to a planar shape. Structures such as fins and ribs can be integrally formed on the surface (not shown in the figure) (Out) to further enhance thermal performance. In this embodiment, the periphery of the heat dissipation plate 3 is folded toward the direction of the metal circuit board 2 to form an open box body accommodating the metal circuit board, and the waterproof insulating rubber layer 6 seals the open end of the entire box body. In this structure, the heat dissipation plate 3 also serves as a protective casing, which makes the entire light source module more robust and has the best waterproof performance. In order to further enhance the heat dissipation effect, in this embodiment, a thermally conductive adhesive 7 such as thermally conductive silicone is also bonded between the heat dissipation plate 3 and the metal substrate 2b of the metal circuit board. Since the light emitting angle of the plug-in LED is small, this embodiment specifically protrudes the light emitting head 1a of the LED from the side of the box. In this way, a side-emitting LED light source module can be manufactured. This type of side-emitting LED module can be installed on the inner side of the label when in use, so that the light emitting head of the LED faces away from the light-emitting surface of the label, so that the light emitted by the LED does not directly emit from the light-emitting surface of the label, but passes through the label Multiple diffuse reflections of the inner surface are then emitted from the light emitting surface, so that the illumination on the light emitting surface of the sign can be more uniform. On the other hand, installing the LED light source module on the inner side of the signboard is more conducive to the heat dissipation and waterproof of the LED light source module in some cases.
实施例 2  Example 2
参见图 2，本实施例的 LED8为贴片式 LED，其他结构与实施例相同。 这种结构可制成正面发光的 LED光源模块， 并使模块具有最小的厚度。 在使用时， 可将模块安装在标牌的内底面， 使 LED发出的光直接透过标 牌的出光面， 充分发挥贴片式 LED发光角度大的优点， 减少光损失。 而 且在有些情况下， 将 LED光源模块安装在标牌的内底面更有利于模块的 散热和防水。 Referring to FIG. 2, the LED 8 of this embodiment is a patch LED, and other structures are the same as those of the embodiment. This structure can be made into a front-emitting LED light source module, and the module has a minimum thickness. In use, the module can be installed on the inner bottom surface of the label, so that the light emitted by the LED directly passes through the label The light emitting surface of the brand fully utilizes the advantages of the large LED light emitting angle to reduce light loss. And in some cases, installing the LED light source module on the inner bottom surface of the label is more conducive to the heat dissipation and waterproof of the module.
作为另一种实施例， 还可用螺丝将金属线路板和散热板联接在一起， 并使金属线路板的金属基板与散热紧密接触， 形成导热联接。采用这种方 式应注意螺丝不要与金属线路板的布线层相碰， 以防发生短路。  As another embodiment, screws can also be used to connect the metal circuit board and the heat sink together, and the metal substrate of the metal circuit board can be in close contact with the heat sink to form a thermally conductive connection. In this way, pay attention that the screws do not touch the wiring layer of the metal circuit board to prevent short circuit.
以上实施例是供理解本发明之用， 并非是对本发明的限制，有关领域 的普通技术人员， 在权利要求所述技术方案的基础上， 还可以作出多种变 化或变型， 例如可以在散热板上开设供安装整个模块用的螺丝孔， 又如， 用弹簧将散热板与金属线路板夹紧在一起， 模型形状可做成圆形、 方形、 长条形等等，所有这些等同的变化或变型，都应在本发明的保护范围之内。  The above embodiments are provided for understanding the present invention, and are not intended to limit the present invention. Those skilled in the relevant art may also make various changes or modifications on the basis of the technical solution described in the claims. There are screw holes for mounting the entire module on it. Another example is to use a spring to clamp the heat sink and the metal circuit board together. The shape of the model can be made round, square, long, etc. All these equivalent changes or Variations should be within the protection scope of the present invention.

Claims

权利要求 Rights request
1、一种金属外壳封装 LED光源模块， 包括组成光源模块的 LED, 其 特征是： 它是以金属线路板作为 LED的承载体， 金属线路板由金属基板 和设在金属基板上的布线层构成， LED 的引脚与金属线路板的布线层连 接， 布线层上还连接有电源进出线， 在布线层上部附着有覆盖金属线路板 的防水绝缘胶层，在金属线路板的金属基板上联接有散热板， 散热板与金 属基板导热联接。  1. A metal case-encapsulated LED light source module, comprising LEDs constituting the light source module, which is characterized in that it uses a metal circuit board as a carrier of the LED, and the metal circuit board is composed of a metal substrate and a wiring layer provided on the metal substrate. The LED pins are connected to the wiring layer of the metal circuit board. Power wiring is also connected to the wiring layer. A waterproof insulating rubber layer covering the metal circuit board is attached to the upper part of the wiring layer. The metal substrate of the metal circuit board is connected to the wiring layer. The heat radiating plate is thermally connected with the metal substrate.
2、 如权利要求 1所述的 LED光源模块， 其特征是： 所述防水绝缘胶 覆盖整块金属线路板上部， LED的引脚以及电源进出线的焊接点全部封于 防水绝缘胶层内。  2. The LED light source module according to claim 1, wherein the waterproof insulating glue covers the entire upper part of the metal circuit board, and the pins of the LED and the welding points of the power inlet and outlet wires are all sealed in the waterproof insulating glue layer.
3、 如权利要求 1或 2所述的 LED光源模块， 其特征是： 所述的防水 绝缘胶层为环氧树脂层。  3. The LED light source module according to claim 1 or 2, characterized in that: the waterproof and insulating rubber layer is an epoxy resin layer.
4、 如权利要求 1或 2所述的 LED光源模块， 其特征是： 在散热板的 表面整体成型有翅片或者筋条。  4. The LED light source module according to claim 1 or 2, wherein a fin or a rib is integrally formed on a surface of the heat dissipation plate.
5、 如权利要求 1或 2所述的 LED光源模块， 其特征是： 在散热板的 周边朝着金属线路板的方向翻折， 形成一个容纳金属线路板的敞口盒体， 所述的防水绝缘胶层将整个盒体的敞口端密封。  5. The LED light source module according to claim 1 or 2, characterized in that: the periphery of the heat dissipation plate is folded toward the metal circuit board to form an open box body accommodating the metal circuit board, and the waterproof The insulating glue layer seals the open end of the entire box body.
6、 如权利要求 5所述的 LED光源模块， 其特征是： 在散热板与佘属 线路板的金属基板之间粘结有导热胶。  6. The LED light source module according to claim 5, wherein a thermally conductive adhesive is bonded between the heat sink and the metal substrate of the metal circuit board.
7、 如上述任一项权利要求所述的 LED光源模块， 其特征是： 所述的 LED为插件式 LED, 其发光头从盒体的侧面伸出。  7. The LED light source module according to any one of the preceding claims, wherein: the LED is a plug-in LED, and a light emitting head thereof protrudes from a side of the box body.
8、 如上述任一项权利要求所述的 LED光源模块， 其特征是： 所述的 LED为贴片式 LED。  8. The LED light source module according to any one of the preceding claims, wherein the LED is a patch LED.
PCT/CN2004/001442 2004-04-19 2004-12-13 Led light source module packaged with metal WO2005103564A1 (en)

Priority Applications (1)

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JP2007600004U JP3131144U (en) 2004-04-19 2004-12-13 LED light source module sealed in metal housing

Applications Claiming Priority (2)

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CN200420044995.3 2004-04-19
CNU2004200449953U CN2703295Y (en) 2004-04-19 2004-04-19 LED light source module for mark plate

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WO2005103564A1 true WO2005103564A1 (en) 2005-11-03

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