WO2005103564A1 - Module source de lumiere del encapsule dans un boitier metallique - Google Patents

Module source de lumiere del encapsule dans un boitier metallique Download PDF

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Publication number
WO2005103564A1
WO2005103564A1 PCT/CN2004/001442 CN2004001442W WO2005103564A1 WO 2005103564 A1 WO2005103564 A1 WO 2005103564A1 CN 2004001442 W CN2004001442 W CN 2004001442W WO 2005103564 A1 WO2005103564 A1 WO 2005103564A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
light source
led
source module
led light
Prior art date
Application number
PCT/CN2004/001442
Other languages
English (en)
Chinese (zh)
Inventor
Yaohao Wang
Xing Yan
Original Assignee
Yaohao Wang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaohao Wang filed Critical Yaohao Wang
Priority to JP2007600004U priority Critical patent/JP3131144U/ja
Publication of WO2005103564A1 publication Critical patent/WO2005103564A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors

Definitions

  • the present invention relates to a lighting device using an LED (light emitting diode) as a light source, and particularly to an LED light source module installed in an outdoor signboard such as a billboard, a road sign, and the like, so that the sign has a light-emitting effect.
  • LED light emitting diode
  • LED light source module built into outdoor signs such as billboards and road signs.
  • the existing LED light source modules do not consider the heat dissipation and waterproof function in the structure. They simply insert the LED on the PCB board, and then install the PCB board in a poorly waterproof plastic case. None of the shells. Due to poor heat dissipation and moisture, the existing LED light source modules are not ideal in terms of reliability and service life.
  • An object of the present invention is to provide an LED light source module having good heat dissipation and waterproof performance.
  • the invention is implemented as follows:
  • the LED light source module uses a metal circuit board as the carrier of the LED, the LED pins are soldered to the wiring layer of the metal circuit board, the power supply inlet and outlet wires are soldered to the wiring layer, and the wiring layer is attached to the wiring layer.
  • the entire metal circuit board is covered with a waterproof insulating adhesive layer, which seals the LED pins and the soldering points of the power supply inlet and outlet wires together, and a metal shell heat sink is connected to the metal substrate of the metal circuit board.
  • the heat sink is thermally coupled to the metal substrate. Since the entire metal circuit board, the pins of the LEP and the welding points of the power cord are covered and protected by waterproof insulation glue, the LED light source module has good waterproof performance.
  • the heat emitted by the LED can be transferred to the heat sink through the metal circuit board, and then emitted by the heat sink.
  • the LED light source module also has good heat dissipation performance.
  • the advantage of the invention is that the good heat dissipation performance ensures that the LED can work continuously and reliably with high brightness.
  • the good waterproof performance can make the entire light source module work reliably outdoors for a long time, which obviously improves the reliability of the LED light source module.
  • the service life can reach 100,000 hours.
  • FIG. 1 is a schematic structural diagram of Embodiment 1 of the present invention.
  • FIG. 2 is a schematic structural diagram of the second embodiment.
  • each reference numeral is: 1 --- LED-LED light emitting head
  • the LED light source module of this embodiment includes a plug-in LED 1, a metal circuit board 2, and a metal shell heat dissipation plate 3.
  • the metal wiring board 2 itself has a wiring layer 2a and a metal substrate 2b, and the wiring layer 2a and the metal substrate 2b are electrically insulated from each other.
  • the plug-in type LED 1 uses the metal circuit board 2 as a carrier, and its pins are soldered on the wiring layer 2 a of the metal circuit board 2.
  • the wiring layer 2a is also soldered with the power supply inlet and outlet lines 4, 5.
  • Multiple LED light source modules can be connected in series through the power supply inlet and outlet lines 4, 5, and the power supply lines of the two LED light source modules can be connected with a commercially available waterproof connector.
  • the number and layout of the LEDs 1 and the specific wiring diagram of the wiring layer 2a can be flexibly set according to actual needs.
  • a waterproof insulating adhesive layer 6 covering the entire metal wiring board is also attached to the wiring layer 2a. Prevent Water-insulating adhesive layer 6—and sealed the .1 pins of the LED1 and the soldering points of the power inlet and outlet wires 4 and 5.
  • the waterproof insulating layer 6 should be epoxy resin.
  • the heat sink 3 connected to the metal substrate 2b of the metal circuit board 2 may be made of a metal having a small thermal resistance such as aluminum.
  • the specific shape of the heat dissipation plate 3 can be set flexibly, including various shapes such as circles, rectangles, etc., and the surface of the heat dissipation plate is not limited to a planar shape. Structures such as fins and ribs can be integrally formed on the surface (not shown in the figure) (Out) to further enhance thermal performance.
  • the periphery of the heat dissipation plate 3 is folded toward the direction of the metal circuit board 2 to form an open box body accommodating the metal circuit board, and the waterproof insulating rubber layer 6 seals the open end of the entire box body.
  • the heat dissipation plate 3 also serves as a protective casing, which makes the entire light source module more robust and has the best waterproof performance.
  • a thermally conductive adhesive 7 such as thermally conductive silicone is also bonded between the heat dissipation plate 3 and the metal substrate 2b of the metal circuit board. Since the light emitting angle of the plug-in LED is small, this embodiment specifically protrudes the light emitting head 1a of the LED from the side of the box. In this way, a side-emitting LED light source module can be manufactured.
  • This type of side-emitting LED module can be installed on the inner side of the label when in use, so that the light emitting head of the LED faces away from the light-emitting surface of the label, so that the light emitted by the LED does not directly emit from the light-emitting surface of the label, but passes through the label Multiple diffuse reflections of the inner surface are then emitted from the light emitting surface, so that the illumination on the light emitting surface of the sign can be more uniform.
  • installing the LED light source module on the inner side of the signboard is more conducive to the heat dissipation and waterproof of the LED light source module in some cases.
  • the LED 8 of this embodiment is a patch LED, and other structures are the same as those of the embodiment.
  • This structure can be made into a front-emitting LED light source module, and the module has a minimum thickness.
  • the module can be installed on the inner bottom surface of the label, so that the light emitted by the LED directly passes through the label
  • the light emitting surface of the brand fully utilizes the advantages of the large LED light emitting angle to reduce light loss.
  • installing the LED light source module on the inner bottom surface of the label is more conducive to the heat dissipation and waterproof of the module.
  • screws can also be used to connect the metal circuit board and the heat sink together, and the metal substrate of the metal circuit board can be in close contact with the heat sink to form a thermally conductive connection. In this way, pay attention that the screws do not touch the wiring layer of the metal circuit board to prevent short circuit.

Abstract

L'invention concerne un module source de lumière DEL encapsulé dans un boîtier métallique. Ce module comprend une pluralité de DEL montées sur une carte de circuits imprimés métallique. Cette dernière est constituée d'un substrat métallique et d'une couche de câblage disposée sur la surface supérieure du substrat métallique. Les broches des DEL sont liées directement à la couche de câblage de la carte de circuits imprimés métallique, et une alimentation est raccordée à la couche de câblage par deux fils d'alimentation. La carte de circuits imprimés métallique et les points de raccordement des broches et des fils d'alimentation sont encapsulés dans une couche adhésive isolante étanche. Une plaque à rayonnement thermique est montée sur la surface du substrat métallique, de sorte que la chaleur puisse être conduite vers la plaque par la carte de circuits imprimés métallique, puis dissipée vers l'extérieur par la plaque, ce qui confère au module d'excellentes propriétés de dissipation thermique. D'autre part, l'intégralité de la carte de circuits imprimés métallique ainsi que les points de raccordement des broches et des fils d'alimentation sont protégés par la couche adhésive isolante étanche, ce qui confère au module de bonnes propriétés d'étanchéité.
PCT/CN2004/001442 2004-04-19 2004-12-13 Module source de lumiere del encapsule dans un boitier metallique WO2005103564A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007600004U JP3131144U (ja) 2004-04-19 2004-12-13 金属ハウジング封止のｌｅｄ光源モジュール

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNU2004200449953U CN2703295Y (zh) 2004-04-19 2004-04-19 一种标牌用led光源模块
CN200420044995.3 2004-04-19

Publications (1)

Publication Number Publication Date
WO2005103564A1 true WO2005103564A1 (fr) 2005-11-03

Family

ID=34775443

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2004/001442 WO2005103564A1 (fr) 2004-04-19 2004-12-13 Module source de lumiere del encapsule dans un boitier metallique

Country Status (3)

Country Link
JP (1) JP3131144U (fr)
CN (1) CN2703295Y (fr)
WO (1) WO2005103564A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106299097A (zh) * 2016-10-11 2017-01-04 黄福强 一种正贴正发光led、灯条及高透率显示屏
US9916782B2 (en) 2013-12-31 2018-03-13 Ultravision Technologies, Llc Modular display panel
US10061553B2 (en) 2013-12-31 2018-08-28 Ultravision Technologies, Llc Power and data communication arrangement between panels
EP3405012A1 (fr) * 2017-05-15 2018-11-21 GE Lighting Solutions, LLC Procédé pour fournir une connexion filaire à une carte de circuit imprimé
US10248372B2 (en) 2013-12-31 2019-04-02 Ultravision Technologies, Llc Modular display panels
US10706770B2 (en) 2014-07-16 2020-07-07 Ultravision Technologies, Llc Display system having module display panel with circuitry for bidirectional communication

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009199820A (ja) * 2008-02-20 2009-09-03 Kanehirodenshi Corp Ｌｅｄランプ
JP5516987B2 (ja) * 2010-10-13 2014-06-11 東芝ライテック株式会社 発光装置および照明器具
JP5495961B2 (ja) * 2010-06-09 2014-05-21 富士電機機器制御株式会社 Ｌｅｄユニット
TW201411039A (zh) * 2012-09-11 2014-03-16 Yu-Chen Jian 照明器具
CN103672479B (zh) * 2012-09-21 2016-05-25 简毓臣 照明器具
CN110072332A (zh) * 2019-05-22 2019-07-30 四川海英电子科技有限公司 一种金属芯印制板及其制作工艺
CN110139472A (zh) * 2019-05-22 2019-08-16 四川海英电子科技有限公司 一种局部埋置金属芯印制板及其制造工艺

Citations (8)

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JP2000183236A (ja) * 1998-12-10 2000-06-30 Kyocera Corp 半導体素子収納用パッケージ
WO2000069000A1 (fr) * 1999-05-12 2000-11-16 Osram Opto Semiconductors Gmbh & Co. Ohg Ensemble diodes electroluminescentes
CN1361555A (zh) * 2000-12-29 2002-07-31 李洲企业股份有限公司 晶片式发光二极管及其制造方法
US6428189B1 (en) * 2000-03-31 2002-08-06 Relume Corporation L.E.D. thermal management
CN2585273Y (zh) * 2002-12-12 2003-11-05 葛世潮 发光二极管照明装置
CN2596555Y (zh) * 2002-10-21 2003-12-31 佛山市光电器材公司 基于金属线路板的功率型led
US6713956B2 (en) * 2001-07-24 2004-03-30 Lite-On Technology Corporation Display module including a plate for heat dissipation and shielding
CN2634572Y (zh) * 2003-08-15 2004-08-18 品能科技股份有限公司 具有模块化发光二极管的电路板结构

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000183236A (ja) * 1998-12-10 2000-06-30 Kyocera Corp 半導体素子収納用パッケージ
WO2000069000A1 (fr) * 1999-05-12 2000-11-16 Osram Opto Semiconductors Gmbh & Co. Ohg Ensemble diodes electroluminescentes
US6428189B1 (en) * 2000-03-31 2002-08-06 Relume Corporation L.E.D. thermal management
CN1361555A (zh) * 2000-12-29 2002-07-31 李洲企业股份有限公司 晶片式发光二极管及其制造方法
US6713956B2 (en) * 2001-07-24 2004-03-30 Lite-On Technology Corporation Display module including a plate for heat dissipation and shielding
CN2596555Y (zh) * 2002-10-21 2003-12-31 佛山市光电器材公司 基于金属线路板的功率型led
CN2585273Y (zh) * 2002-12-12 2003-11-05 葛世潮 发光二极管照明装置
CN2634572Y (zh) * 2003-08-15 2004-08-18 品能科技股份有限公司 具有模块化发光二极管的电路板结构

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10380925B2 (en) 2013-12-31 2019-08-13 Ultravision Technologies, Llc Modular display panel
US10373535B2 (en) 2013-12-31 2019-08-06 Ultravision Technologies, Llc Modular display panel
US9978294B1 (en) 2013-12-31 2018-05-22 Ultravision Technologies, Llc Modular display panel
US9984603B1 (en) 2013-12-31 2018-05-29 Ultravision Technologies, Llc Modular display panel
US9990869B1 (en) 2013-12-31 2018-06-05 Ultravision Technologies, Llc Modular display panel
US10061553B2 (en) 2013-12-31 2018-08-28 Ultravision Technologies, Llc Power and data communication arrangement between panels
US9916782B2 (en) 2013-12-31 2018-03-13 Ultravision Technologies, Llc Modular display panel
US10248372B2 (en) 2013-12-31 2019-04-02 Ultravision Technologies, Llc Modular display panels
US10540917B2 (en) 2013-12-31 2020-01-21 Ultravision Technologies, Llc Modular display panel
US10410552B2 (en) 2013-12-31 2019-09-10 Ultravision Technologies, Llc Modular display panel
US10706770B2 (en) 2014-07-16 2020-07-07 Ultravision Technologies, Llc Display system having module display panel with circuitry for bidirectional communication
CN106299097A (zh) * 2016-10-11 2017-01-04 黄福强 一种正贴正发光led、灯条及高透率显示屏
CN106299097B (zh) * 2016-10-11 2024-02-09 黄福强 一种正贴正发光led、灯条及高透率显示屏
EP3405012A1 (fr) * 2017-05-15 2018-11-21 GE Lighting Solutions, LLC Procédé pour fournir une connexion filaire à une carte de circuit imprimé
US10707635B2 (en) 2017-05-15 2020-07-07 Current Lighting Solutions, Llc Method for providing a wire connection to a printed circuit board

Also Published As

Publication number Publication date
CN2703295Y (zh) 2005-06-01
JP3131144U (ja) 2007-04-26

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