CN2703295Y - 一种标牌用led光源模块 - Google Patents

一种标牌用led光源模块 Download PDF

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Publication number
CN2703295Y
CN2703295Y CNU2004200449953U CN200420044995U CN2703295Y CN 2703295 Y CN2703295 Y CN 2703295Y CN U2004200449953 U CNU2004200449953 U CN U2004200449953U CN 200420044995 U CN200420044995 U CN 200420044995U CN 2703295 Y CN2703295 Y CN 2703295Y
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CN
China
Prior art keywords
led
light source
source module
led light
circuit board
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Expired - Lifetime
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CNU2004200449953U
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English (en)
Inventor
闫兴
郭冰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foshan NationStar Optoelectronics Co Ltd
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Foshan NationStar Optoelectronics Co Ltd
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Priority to CNU2004200449953U priority Critical patent/CN2703295Y/zh
Priority to PCT/CN2004/001442 priority patent/WO2005103564A1/zh
Priority to JP2007600004U priority patent/JP3131144U/ja
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors

Abstract

一种标牌用LED光源模块，其主要特点是在金属线路板的布线层上焊接有LED和电源进出线，并附着有将整块金属线路板覆盖的防水绝缘胶层，防水绝缘胶层一并将LED的引脚以及电源进出线的焊接点封于其内，在金属线路板的金属基板上联接有散热板，散热板与金属基板导热联接。由于整块金属线路板以及LED的引脚和电源线的焊接点都被防水绝缘胶覆盖，受其保护，因此本LED光源模块具有良好的防水性能。另一方面，LED发出的热量可通过金属线路板传递至散热板，再由散热板散发出去，因此本LED光源模块还具有良好的散热性能。

Description

一种标牌用LED光源模块
技术领域
本实用新型涉及以LED(发光二级管)为光源的照明装置，特别是安装在广告牌、路标牌等户外标牌内，使标牌具有发光效果的LED光源模块。
背景技术
目前市面上出现一种内置于广告牌、路标牌等户外标牌内的LED光源模块。已有的这种LED光源模块在结构上都没有考虑散热和防水功能，只是简单地将LED插在PCB板上，再将PCB板装在一个防水性很差的塑料外壳内，有的甚至连外壳都没有。由于散热不良、容易受潮，因此已有的LED光源模块在可靠性和使用寿命方面都不甚理想。
发明内容
本实用新型的目的是提供一种具有良好的散热和防水性能的LED光源模块。
本实用新型是这样实现的：LED光源模块以金属线路板作为LED的承载体，LED的引脚焊接在金属线路板的布线层上，布线层上焊接有电源进出线，在布线层上附着有将整块金属线路板覆盖的防水绝缘胶层，防水绝缘胶层一并将LED的引脚以及电源进出线的焊接点封于其内，在金属线路板的金属基板上联接有散热板，散热板与金属基板导热联接。由于整块金属线路板以及LED的引脚和电源线的焊接点都被防水绝缘胶覆盖，受其保护，因此本LED光源模块具有良好的防水性能。另一方面，LED发出的热量可通过金属线路板传递至散热板，再由散热板散发出去，因此本LED光源模块还具有良好的散热性能。
本实用新型的优点是良好的散热性能保证了LED能可靠、高亮度地连续工作，加之良好的防水性能，更能使整个光源模块可靠地在户外长时间工作，明显地提高了LED光源模块的可靠性，使用寿命可达到10万小时。
附图说明
图1是本实用新型实施例1的结构示意图；
图2是实施例2的结构示意图。
具体实施方式
实施例1
参见图1，本实施例的LED光源模块包括插件式LED1、金属线路板2和散热板3。金属线路板2本身具有布线层2a和金属基板2b，布线层2a和金属基板2b彼此电绝缘。插件式LED1以金属线路板2作为承载体，其引脚焊接在金属线路板2的布线层2a上。布线层2a还焊接有电源进出线4、5。通过电源进出线4、5可将多个LED光源模块串联在一起，两个LED光源模块的电源线之间可用市售的防水接线器连接。LED1的数量、布局方式，以及布线层2a的具体线路图可根据实际需要灵活设定。在布线层2a上还附着有将整块金属线路板覆盖的防水绝缘胶层6。防水绝缘胶层6一并将LED1的引脚以及电源进出线4、5的焊接点封于其内。作为最佳实施方式，防水绝缘胶层6应采用环氧树脂。联接在金属线路板2的金属基板2b上的散热板3可用热阻小的金属如铝材等制成。散热板3的具体形状可灵活设定，包括圆形、矩形等各种形状，而且散热板的表面也不限于平面形状，可以在表面上整体成型翅片、筋条等结构(图中未示出)，以进一步增强散热性能。在本实施例中，散热板3的周边朝着金属线路板2的方向翻折，形成一个容纳金属线路板的敞口盒体，防水绝缘胶层6将整个盒体的敞口端密封。这种结构以散热板3兼作为保护壳体，使得整个光源模块更加坚固，并且具有最佳的防水性能。为了进一步增强散热效果，本实施例还在散热板3与金属线路板的金属基板2b之间粘结有导热胶7，例如导热硅胶等。由于插件式LED的发光角度较小，因此本实施例特将LED的发光头1a从盒体的侧面伸出。如此可制成侧面发光的LED光源模块。这种侧面发光的LED光源模块，在使用时可安装在标牌的内侧面，使LED的发光头背向标牌的出光面，使得LED发出的光不直接从标牌的出光面射出，而是先经过标牌内表面的多次漫反射后再从出光面射出，如此可使标牌的出光面上的光照度更加均匀。另一方面，将LED光源模块安装在标牌的内侧面，在有些情况下更有利于LED光源模块的散热和防水。
实施例2
参见图2，本实施例的LED8为贴片式LED，其它结构与实施例1相同。这种结构可制成正面发光的LED光源模块，并使模块具有最小的厚度。在使用时，可将模块安装在标牌的内底面，使LED发出的光直接透过标牌的出光面，充分发挥贴片式LED发光角度大的优点，减少光损失。而且在有些情况下，将LED光源模块安装在标牌的内底面更有利于模块的散热和防水。
作为另一种实施例，还可用螺丝将金属线路板与散热板联接在一起，并使金属线路板的金属基板与散热板紧密接触，形成导热联接。采用这种方式应注意螺丝不要与金属线路板的布线层相碰，以防发生短路。
以上实施例是供理解本实用新型之用，并非是对本实用新型的限制，有关领域的普通技术人员，在权利要求所述技术方案的基础上，还可以作出多种变化或变型，例如可以在散热板上开设供安装整个模块用的螺丝孔，又如，用弹簧将散热板与金属线路板夹紧在一起，等等，所有这些等同的变化或变型，都应在本实用新型的保护范围之内。

Claims (7)

1、一种标牌用LED光源模块，其特征是：以金属线路板作为LED的承载体，LED的引脚焊接在金属线路板的布线层上，布线层上焊接有电源进出线，在布线层上附着有将整块金属线路板覆盖的防水绝缘胶层，防水绝缘胶层一并将LED的引脚以及电源进出线的焊接点封于其内，在金属线路板的金属基板上联接有散热板，散热板与金属基板导热联接。
2、如权利要求1所述的LED光源模块，其特征是所述的防水绝缘胶层为环氧树脂层。
3、如权利要求1所述的LED光源模块，其特征是在散热板的表面整体成型有翅片或者筋条。
4、如权利要求1所述的LED光源模块，其特征是：散热板的周边朝着金属线路板的方向翻折，形成一个容纳金属线路板的敞口盒体，所述的防水绝缘胶层将整个盒体的敞口端密封。
5、如权利要求4所述的LED光源模块，其特征是：在散热板与金属线路板的金属基板之间粘结有导热胶。
6、如权利要求4所述的LED光源模块，其特征是：所述的LED为插件式LED，其发光头从盒体的侧面伸出。
7、如权利要求4所述的LED光源模块，其特征是：所述的LED为贴片式LED。
CNU2004200449953U 2004-04-19 2004-04-19 一种标牌用led光源模块 Expired - Lifetime CN2703295Y (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CNU2004200449953U CN2703295Y (zh) 2004-04-19 2004-04-19 一种标牌用led光源模块
PCT/CN2004/001442 WO2005103564A1 (fr) 2004-04-19 2004-12-13 Module source de lumiere del encapsule dans un boitier metallique
JP2007600004U JP3131144U (ja) 2004-04-19 2004-12-13 金属ハウジング封止のｌｅｄ光源モジュール

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CN103672479A (zh) * 2012-09-21 2014-03-26 简毓臣 照明器具
TWI502152B (zh) * 2012-09-11 2015-10-01
CN110072332A (zh) * 2019-05-22 2019-07-30 四川海英电子科技有限公司 一种金属芯印制板及其制作工艺
CN110139472A (zh) * 2019-05-22 2019-08-16 四川海英电子科技有限公司 一种局部埋置金属芯印制板及其制造工艺

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CN103672479B (zh) * 2012-09-21 2016-05-25 简毓臣 照明器具
CN110072332A (zh) * 2019-05-22 2019-07-30 四川海英电子科技有限公司 一种金属芯印制板及其制作工艺
CN110139472A (zh) * 2019-05-22 2019-08-16 四川海英电子科技有限公司 一种局部埋置金属芯印制板及其制造工艺

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Patentee after: Foshan Guoxing Photoelectric Co., Ltd.

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Patentee before: Foshan Nationstar Optoelectronics Co., Ltd.

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