JP3131144U - LED light source module sealed in metal housing - Google Patents
LED light source module sealed in metal housing Download PDFInfo
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- JP3131144U JP3131144U JP2007600004U JP2007600004U JP3131144U JP 3131144 U JP3131144 U JP 3131144U JP 2007600004 U JP2007600004 U JP 2007600004U JP 2007600004 U JP2007600004 U JP 2007600004U JP 3131144 U JP3131144 U JP 3131144U
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- circuit board
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 57
- 239000002184 metal Substances 0.000 title claims abstract description 57
- 239000010410 layer Substances 0.000 claims abstract description 16
- 239000012790 adhesive layer Substances 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 238000003466 welding Methods 0.000 claims abstract description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 2
- 238000009966 trimming Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Abstract
【課題】本考案は良好な放熱性能、防水性能を具える金属ハウジング封止のＬＥＤ光源モジュールを提供する。
【解決手段】本考案に係る金属ハウジング封止のＬＥＤ光源モジュールは、光源モジュールを形成するＬＥＤを含み、金属回路板をＬＥＤの担体とするが、前記ＬＥＤの端子は前記金属回路板の配線層の上に溶接されており、該配線層には電源入出線がさらに接続し且つ前記金属回路板を覆う防水絶縁接着層が付着しており、該防水絶縁接着層は前記ＬＥＤの端子及び前記電源入出線の溶接点を共に内部に封じさせ、前記金属回路板の金属基板上には放熱板が熱伝導的に連結されている。
【選択図】図１The present invention provides an LED light source module sealed with a metal housing having good heat dissipation performance and waterproof performance.
A metal housing-sealed LED light source module according to the present invention includes an LED forming a light source module, and a metal circuit board is used as a carrier of the LED, and the terminal of the LED is a wiring layer of the metal circuit board. A waterproof insulating adhesive layer is further attached to the wiring layer and covers the metal circuit board, and the waterproof insulating adhesive layer is connected to the terminal of the LED and the power source. Both the incoming and outgoing welding points are sealed inside, and a heat radiating plate is thermally conductively connected on the metal substrate of the metal circuit board.
[Selection] Figure 1
Description
本考案はＬＥＤ（発光ダイオード）を光源とする照明装置に係り、特に、ビルボード、道路標識等の戸外用の掲示板に装着されて、その掲示板が発光効果を有すようにするＬＥＤ光源モジュールに関するものである。 The present invention relates to an illumination device using an LED (light emitting diode) as a light source, and more particularly to an LED light source module that is mounted on an outdoor bulletin board such as a billboard or a road sign so that the bulletin board has a light emitting effect. Is.
最近では、ビルボード、道路標識等内置されるＬＥＤ光源モジュールが知られている。それらのＬＥＤ光源モジュールは構造上に放熱及び防水等の機能を考慮しなく、ただ簡単的にＬＥＤをＰＣＢ板に差込んでから、また該ＰＣＢ板を防水性があまりよくないプラスチック製のハウジングに装入するだけであり、更には、ハウジングさえも無い場合もある。これにより、現在のＬＥＤ光源モジュールは、放熱が不良で耐湿性も悪いため、信頼性及び耐用寿命等の方面において、あまり理想的でない。 Recently, LED light source modules installed in billboards, road signs, and the like are known. These LED light source modules do not consider functions such as heat dissipation and waterproofing on the structure, but simply insert the LED into the PCB board, and then make the PCB board into a plastic housing that is not very waterproof. It may only be charged, and there may even be no housing. As a result, the current LED light source module has poor heat dissipation and poor moisture resistance, so it is not ideal in terms of reliability and useful life.
本考案は、良好な放熱性能及び防水性能を有するＬＥＤ光源モジュールを提供することを目的とする。 An object of this invention is to provide the LED light source module which has favorable heat dissipation performance and waterproof performance.
次に、本考案の実施形態に基づいて、ＬＥＤ光源モジュールを説明する。本考案の実施形態に係るＬＥＤ光源モジュールは、金属回路板をＬＥＤの担体とし、ＬＥＤの端子は前記金属回路板の配線層の上に溶接されており、該配線層には電源入出線がさらに接続し且つ前記金属回路板を覆う防水絶縁接着層が付着しており、該防水絶縁接着層は前記ＬＥＤの端子及び前記電源入出線の溶接点を共に内部に封じさせ、前記金属回路板の金属基板上には放熱板が熱伝導的に連結されている。ここで、前記金属回路板全体及び前記ＬＥＤの端子と前記電源入出線の溶接点が全部前記防水絶縁接着層に覆われたため、該防水絶縁接着層からの保護を受けることができて、前記ＬＥＤ光源モジュールは良好な放熱性能を具備するようになる。一方、ＬＥＤからの熱は前記金属回路板を介して前記放熱板まで伝導され、また該放熱板から発散されることができて、前記ＬＥＤ光源モジュールは良好な放熱性能を具備するようになる。 Next, an LED light source module will be described based on an embodiment of the present invention. In an LED light source module according to an embodiment of the present invention, a metal circuit board is used as an LED carrier, and a terminal of the LED is welded onto a wiring layer of the metal circuit board, and a power input / output line is further connected to the wiring layer. A waterproof insulating adhesive layer is attached to cover and cover the metal circuit board, and the waterproof insulating adhesive layer seals both the terminal of the LED and the welding point of the power input / output line inside, and the metal of the metal circuit board A heat sink is connected to the substrate in a heat conductive manner. Here, since the entire metal circuit board and the welding points of the terminals of the LED and the power input / output lines are covered with the waterproof insulating adhesive layer, protection from the waterproof insulating adhesive layer can be received, and the LED The light source module has good heat dissipation performance. On the other hand, heat from the LED is conducted to the heat radiating plate through the metal circuit plate and can be dissipated from the heat radiating plate, so that the LED light source module has good heat radiating performance.
このため、本考案の実施形態に係る良好な放熱性能を有するＬＥＤ光源モジュールは、ＬＥＤの安全で、高強度の連続な作動を確保し、また良好な防水性能を加えて、該光源モジュール全体を戸外でより安全的に長時間の作業を行うようにし、更に、ＬＥＤ光源モジュールの信頼性及び耐用寿命を向上させるが、その耐用寿命は１０万時間に達することができる。 For this reason, the LED light source module having a good heat dissipation performance according to the embodiment of the present invention secures a safe and high-strength continuous operation of the LED, and adds a good waterproof performance. It is possible to work safely for a long time outdoors, and further improve the reliability and service life of the LED light source module, but the service life can reach 100,000 hours.
第一実施形態
図１に示すように、本実施形態に係るＬＥＤ光源モジュールは差込式ＬＥＤ１と、金属回路板２と、金属ハウジング放熱板３とを備える。前記金属回路板２は配線層２ａと、金属基板２ｂとを備え、該配線層２ａと金属基板２ｂは互いに電気絶縁になっている。前記差込式ＬＥＤ１は前記金属回路板２を担体とし、該ＬＥＤ１の端子は前記金属回路板２の配線層２ａ上に接続されている。該線層２ａには電源入出線４、５が更に接続されている。複数のＬＥＤ光源モジュールは前記電源入出線４、５を介して直列し、二つのＬＥＤ光源モジュールの間は市場で売っている防水接線設備により接続することができる。ここで、前記ＬＥＤ１の数量、配置方式及び配線層２ａの具体的な回路図は実際の需要に従って自由に設定することができる。また、前記配線層２ａには前記回路板２の全体を覆う防水絶縁接着層６が付着されている。該防水絶縁接着層６は、前記ＬＥＤ１の端子及び電源入出線４、５の溶接点を内部に一緒に封じている。本実施形態において、前記防水絶縁接着層６はエポキシ樹脂であることが好ましい。また、前記金属回路板２の金属基板２ｂ上の放熱板３は、例えばアルミニウム等の熱抵抗が低い金属から形成される。前記放熱板３の形状も自由に設定することができて、四角形等の各種の形状を取っても良く、更には、該放熱板３の表面は平面形状に限らず、該表面にフィン、筋状物等の構造（図示せず）を形成しても良くて、これにより放熱性能をより一層高める。本実施形態において、前記放熱板３の周辺は、前記金属回路板２の方向を向かって倒転して、該金属回路板を収容する開口ボックスを形成するが、該ボックス全体の開口端部は前記防水絶縁接着層により封止されている。この様な構造において、放熱板３は保護ハウジングにもなって、前記ＬＥＤ光源モジュールをもっと堅固させ、更により良好な防水性能を有するようにする。また、本実施形態において、放熱効果をより一層向上させるため、前記放熱板３と金属回路板の金属基板２ｂの間に、例えば伝熱的なシリコン接着剤などの熱伝導接着剤７を粘着することができる。また、本実施形態において、ＬＥＤの発光角度が小さいため、前記発光ヘッド１ａは前記ボックスの側面から張出する。これにより、側面から発光できるＬＥＤの光源モジュールを形成することができる。このようなＬＥＤの光源モジュールは、使用時、前記道路標識の内側面に据付けられて、前記ＬＥＤの発光ヘッドと前記道路標識の出光面を相反するようにさせ、前記ＬＥＤからの光が、前記掲示板の出光面から直接射出されなく、前記掲示板の内表面による複数の拡散反射（diffuse reflection）を通して、また前記出光面から射出されるようにして、前記掲示板の出光面上の光照度をより均一させる。一方で、前記ＬＥＤの光源モジュールを前記掲示板の内側面に据付けることは、ある時において、前記ＬＥＤの光源モジュールの放熱及び防水性能に役立っている。
First Embodiment As shown in FIG. 1, the LED light source module according to this embodiment includes a plug-in LED 1, a metal circuit board 2, and a metal housing heat sink 3. The metal circuit board 2 includes a wiring layer 2a and a metal substrate 2b, and the wiring layer 2a and the metal substrate 2b are electrically insulated from each other. The plug-in type LED 1 uses the metal circuit board 2 as a carrier, and the terminal of the LED 1 is connected to the wiring layer 2 a of the metal circuit board 2. Power input / output lines 4 and 5 are further connected to the line layer 2a. A plurality of LED light source modules can be connected in series via the power input / output lines 4 and 5, and the two LED light source modules can be connected by waterproof tangential equipment sold in the market. Here, the quantity of LED1, the arrangement method, and the specific circuit diagram of the wiring layer 2a can be freely set according to actual demand. A waterproof insulating
第二実施形態
図２に示すように、本実施形態に係るＬＥＤ８は貼付式ＬＥＤである以外、その他の構造は前記実施形態と同じである。この様な構造によると、正面から発光すＬＥＤ光源モジュールを形成することができ、更に、該モジュールが最小の厚さを有するようにする。使用時、前記ＬＥＤ光源モジュールを掲示板の内底面に据付けることができて、ＬＥＤからの光が前記掲示板の出光面から直接透過するようにさせて、発光角度が大きい貼付式ＬＥＤの利点を十分に発揮させ、従って、光の損失を減少する。
Second Embodiment As shown in FIG. 2, the LED 8 according to this embodiment is the same as that of the above embodiment except that the LED 8 is a pasted LED. According to such a structure, an LED light source module that emits light from the front can be formed, and the module has a minimum thickness. In use, the LED light source module can be installed on the inner bottom surface of the bulletin board so that the light from the LED can be directly transmitted from the light emitting surface of the bulletin board. And thus reduce light loss.
更に、もう一つの実施形態として、ネジを用いて前記金属回路板と前記放熱板を連結させることができて、該金属回路板と該放熱板を緊密に接触するようにして、熱伝導的な接続を実現する。この様な方式において、短絡状況の発生を防止するため、前記ネジを前記金属回路板の配線層と接触しないように注意する必要がある。 Furthermore, as another embodiment, the metal circuit board and the heat radiating plate can be connected using screws, and the metal circuit board and the heat radiating plate are in close contact with each other, so that heat conduction is achieved. Realize the connection. In such a system, care must be taken not to contact the screw with the wiring layer of the metal circuit board in order to prevent the occurrence of a short-circuit condition.
以上の説明は本考案をもっと易く理解するために述べた実施形態であるが、本考案は前記説明に限らない。例えば、モジュール全体を据付けるために放熱板にネジ穴を形成することとか、又は、スプリングを用いて放熱板と金属回路板を挟み止めることとか、モジュールの形状を円形、四角形、帯状形等にすることとか、この様に、本考案の技術方案に基づいて、業界の普通の技術者により行ったいろんな変化又は変形は、すべて本考案の保護内容に属する。 The above description is an embodiment described for easier understanding of the present invention, but the present invention is not limited to the above description. For example, screw holes are formed in the heat sink to install the entire module, or the heat sink and the metal circuit board are clamped using a spring, or the shape of the module is circular, square, strip-shaped, etc. In this way, all the changes or modifications made by the ordinary engineers in the industry based on the technical scheme of the present invention belong to the protection contents of the present invention.
１ ＬＥＤ
１ａ ＬＥＤの発光ヘッド
２ 金属回路板
２ａ 配線層
２ｂ 金属基板
３ 放熱板
４ 電源引入線
５ 電源引出線
６ 防水絶縁接着層
７ 熱伝導接着剤
1 LED
DESCRIPTION OF SYMBOLS 1a LED light-emitting head 2 Metal circuit board 2a Wiring layer 2b Metal substrate 3 Heat sink 4 Power supply line 5
Claims (8)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2004200449953U CN2703295Y (en) | 2004-04-19 | 2004-04-19 | LED light source module for mark plate |
| PCT/CN2004/001442 WO2005103564A1 (en) | 2004-04-19 | 2004-12-13 | Led light source module packaged with metal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP3131144U true JP3131144U (en) | 2007-04-26 |
Family
ID=34775443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007600004U Expired - Lifetime JP3131144U (en) | 2004-04-19 | 2004-12-13 | LED light source module sealed in metal housing |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3131144U (en) |
| CN (1) | CN2703295Y (en) |
| WO (1) | WO2005103564A1 (en) |
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| WO2009104304A1 (en) * | 2008-02-20 | 2009-08-27 | 株式会社カネヒロデンシ | Led lamp |
| JP2011258423A (en) * | 2010-06-09 | 2011-12-22 | Fuji Electric Fa Components & Systems Co Ltd | Led unit |
| JP2012084733A (en) * | 2010-10-13 | 2012-04-26 | Toshiba Lighting & Technology Corp | Light-emitting device and lighting apparatus |
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| TW201411039A (en) * | 2012-09-11 | 2014-03-16 | Yu-Chen Jian | Illumination device |
| CN103672479B (en) * | 2012-09-21 | 2016-05-25 | 简毓臣 | Ligthing paraphernalia |
| US9582237B2 (en) | 2013-12-31 | 2017-02-28 | Ultravision Technologies, Llc | Modular display panels with different pitches |
| US9195281B2 (en) | 2013-12-31 | 2015-11-24 | Ultravision Technologies, Llc | System and method for a modular multi-panel display |
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| CN106299097B (en) * | 2016-10-11 | 2024-02-09 | 黄福强 | Positive luminous LED, lamp strip and high-transmittance display screen are just pasted |
| US10707635B2 (en) * | 2017-05-15 | 2020-07-07 | Current Lighting Solutions, Llc | Method for providing a wire connection to a printed circuit board |
| CN110072332A (en) * | 2019-05-22 | 2019-07-30 | 四川海英电子科技有限公司 | A kind of metal core printed board and its manufacture craft |
| CN110139472A (en) * | 2019-05-22 | 2019-08-16 | 四川海英电子科技有限公司 | A kind of part buried metal core printed board and its manufacturing process |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3987649B2 (en) * | 1998-12-10 | 2007-10-10 | 京セラ株式会社 | Package for storing semiconductor elements |
| DE19922176C2 (en) * | 1999-05-12 | 2001-11-15 | Osram Opto Semiconductors Gmbh | Surface-mounted LED multiple arrangement and its use in a lighting device |
| US6428189B1 (en) * | 2000-03-31 | 2002-08-06 | Relume Corporation | L.E.D. thermal management |
| CN1145225C (en) * | 2000-12-29 | 2004-04-07 | 李洲企业股份有限公司 | Chip-type LED and its manufacture |
| US6713956B2 (en) * | 2001-07-24 | 2004-03-30 | Lite-On Technology Corporation | Display module including a plate for heat dissipation and shielding |
| CN2585273Y (en) * | 2002-12-12 | 2003-11-05 | 葛世潮 | LED illumination device |
| CN2596555Y (en) * | 2002-10-21 | 2003-12-31 | 佛山市光电器材公司 | Power type LED based on metal circuit board |
| CN2634572Y (en) * | 2003-08-15 | 2004-08-18 | 品能科技股份有限公司 | Circuit board structure with modulized luminous diode |
-
2004
- 2004-04-19 CN CNU2004200449953U patent/CN2703295Y/en not_active Expired - Lifetime
- 2004-12-13 JP JP2007600004U patent/JP3131144U/en not_active Expired - Lifetime
- 2004-12-13 WO PCT/CN2004/001442 patent/WO2005103564A1/en active Application Filing
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009104304A1 (en) * | 2008-02-20 | 2009-08-27 | 株式会社カネヒロデンシ | Led lamp |
| JP2009199820A (en) * | 2008-02-20 | 2009-09-03 | Kanehirodenshi Corp | Led lamp |
| JP2011258423A (en) * | 2010-06-09 | 2011-12-22 | Fuji Electric Fa Components & Systems Co Ltd | Led unit |
| JP2012084733A (en) * | 2010-10-13 | 2012-04-26 | Toshiba Lighting & Technology Corp | Light-emitting device and lighting apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN2703295Y (en) | 2005-06-01 |
| WO2005103564A1 (en) | 2005-11-03 |
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