CN102252299B - Radiating system for light-emitting diode (LED) lamp and LED lamp - Google Patents
Radiating system for light-emitting diode (LED) lamp and LED lamp Download PDFInfo
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- CN102252299B CN102252299B CN201110175360.1A CN201110175360A CN102252299B CN 102252299 B CN102252299 B CN 102252299B CN 201110175360 A CN201110175360 A CN 201110175360A CN 102252299 B CN102252299 B CN 102252299B
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Abstract
The invention provides a radiating system for a light-emitting diode (LED) lamp and the LED lamp. The LED lamp comprises an LED light source which consists of an LED chip and a substrate; the radiating system comprises a radiator and a heat conduction plate; one side, on which the substrate is arranged, of the LED light source is arranged on the radiator; and the heat conduction plate is attached to the surface of the other side of the LED light source and is connected with the radiator. When the radiating system is used, heat generated during the operation of the LED lamp is dissipated by the substrate and the radiator and is also dissipated by the heat conduction plate and the radiator, so that the heat of the LED lamp can be dissipated effectively to improve the radiating efficiency.
Description
Technical field
The present invention relates to lighting technical field, relate in particular a kind of cooling system and LED light fixture of LED light fixture.
Background technology
Along with LED(Light Emitting Diode, light-emitting diode) development of technology, LED obtains applying more and more widely at lighting field, therefore its heat dissipation problem has also obtained paying close attention to more and more widely, and particularly, in high-power LED lamp, great power LED has large specified operating current, its power output major part is converted into heat by conduction, if do not take cooling measure, the heat of accumulation will cause the excess Temperature of LED chip, thereby will affect luminous efficiency and the life-span of LED light fixture.
In the scheme of the heat dissipation problem of existing solution LED light fixture, possible mode is the electric current by controlling LED light fixture, when temperature raises, reduces electric current, thereby minimizing power consumption, but this mode can reduce the luminosity of LED light fixture, can not meet lighting demand, another kind of possible mode is to increase radiator fan in LED light fixture, but when fan breaks down, will affect the heat radiation of LED light fixture, when particularly LED light fixture works in extraneous adverse circumstances, fan more easily damages.
Therefore, existing these two kinds of radiating modes, all can not effectively solve the heat dissipation problem of LED light fixture.
Summary of the invention
In view of this, the invention provides a kind of cooling system and LED light fixture of light fixture, for solving the problem that LED light fixture can not efficiently radiates heat.
For achieving the above object, the invention provides following technical scheme:
A cooling system for LED light fixture, described LED light fixture comprises the LED light source being comprised of LED chip and substrate, and described cooling system comprises radiator and heat-conducting plate, and the size of described heat-conducting plate is greater than the size of described LED light source,
The side that described LED light source is provided with substrate is arranged on described radiator;
Described heat-conducting plate is fitted in the surface of described LED light source opposite side, and is connected with described radiator.
Preferably, described heat-conducting plate embeds the surface of described LED light source opposite side, is fixed by screws on described radiator.
Preferably, between described heat-conducting plate and described LED light source, be filled with silicon gel.
Preferably, between described heat-conducting plate and described radiator, between described substrate and described radiator, full-filling has Heat Conduction Material respectively.
Preferably, described heat-conducting plate is special glass.
Preferably, described heat-conducting plate is quartz or crystal.
Preferably, described radiator is wing type radiator.
Preferably, described LED light source is fixed by screws on described radiator.
A kind of LED light fixture, comprises substrate, is encapsulated in LED chip and above-mentioned cooling system, described substrate and LED chip formation LED light source on described substrate.
Preferably, described LED chip is high-power LED chip.
Known via above-mentioned technical scheme, compared with prior art, the invention provides a kind of cooling system and LED light fixture of LED light fixture, a side that LED light source is provided with to substrate is arranged on radiator, heat-conducting plate is fitted in the opposite side surface of described LED light source, and be connected with radiator, therefore, the heat producing during the work of LED light fixture, by himself substrate and radiator, shed on the one hand, on the other hand, by heat-conducting plate and radiator, heat is shed, thereby the heat that LED light fixture is produced sheds by radiator, realized the efficiently radiates heat of LED light fixture, improved radiating efficiency simultaneously, therefore guaranteed that LED light fixture normally moves, extended useful life.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiments of the invention, for those of ordinary skills, do not paying under the prerequisite of creative work, other accompanying drawing can also be provided according to the accompanying drawing providing.
Fig. 1 is the cutaway view of the cooling system of a kind of LED light fixture of the present invention;
Fig. 2 is the structure chart of the cooling system of a kind of LED light fixture of the present invention;
Fig. 3 is the structure chart after the assembling of cooling system of a kind of LED light fixture of the present invention;
Fig. 4 is the heat-conducting plate structure figure of a kind of LED light fixture of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.Based on the embodiment in the present invention, those of ordinary skills, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
The embodiment of the invention discloses a kind of LED luminaire heat dissipating system and LED light fixture, a side that LED light source is provided with to substrate is arranged on radiator, heat-conducting plate is fitted in the surface of described LED light source opposite side, and be connected with radiator, therefore, during the work of LED light fixture, the heat that substrate place produces is passed to radiator by substrate, the heat that LED light source opposite side surface produces simultaneously is also passed to radiator by heat-conducting plate, thereby the heat that LED light fixture is produced sheds by radiator, realized the efficiently radiates heat of LED light fixture, improved radiating efficiency simultaneously, therefore guaranteed that LED light fixture normally moves.
Referring to Fig. 1, show the cutaway view of an embodiment of cooling system of a kind of LED light fixture of the present invention.Fig. 2 is the structure chart of an embodiment of the cooling system of described LED light fixture.
Described LED light fixture can comprise LED light source 100, and described LED light source 100 can comprise LED chip 101, substrate 102, and LED chip 101 is encapsulated on described substrate 102.
In actual applications, the important component part LED light source of LED light fixture can be comprised of LED chip and substrate conventionally, and it must also comprise the silver slurry that some packaging technologies are used and the gold thread connecting for chip etc. certainly, and this is no longer going to repeat them.
The back side of LED chip is encapsulated on substrate, the luminous generation heat of LED chip, and the heat at the LED light source back side can transmit by substrate.
The cooling system of described LED light fixture can comprise radiator 200 and heat-conducting plate 300.
Described LED light source 100 is arranged on described radiator 200, that is:
Radiator is the device for conduction, release heat, by LED light source is arranged on radiator, during LED light source work, the luminous generation heat of LED chip, part heat can be passed to radiator by the substrate being connected with LED chip, radiator can be gone out this part thermal release, can effectively reduce the heat that the LED light source back side produces.In the present embodiment, LED light source is provided with to a side of substrate, the side contacting with radiator is made as the LED light source back side, and opposite side is made as LED light source front.
Heat-conducting plate 300 is fitted in the surface of the opposite side of described LED light source 100, and is connected with described radiator 200.
The surface of described opposite side refers to the front of LED light source 100, and the size of heat-conducting plate 300 need be greater than the size of described LED light source 100, can cover described LED light source 100 completely, and contacts with radiator 200.
In actual applications, during LED light source work, the front of LED light source also can produce a large amount of heats, because the heat at the LED light source back side can be passed to radiator by substrate, radiator can discharge the heat at the LED light source back side, therefore the positive temperature of LED light source is conventionally high a lot of than the temperature at the back side of LED light source, can damage equally the life-span of LED chip, therefore the present invention is by increasing by a heat-conducting plate, be arranged on the front of LED light source, with LED light source close contact, and be connected with radiator, thereby the heat in LED light source front also can be passed to radiator by heat-conducting plate, by radiator by thermal release, thereby can reduce the temperature in light source front.
Referring to Fig. 3, be the structure chart after the assembling of the embodiment of cooling system of LED light fixture provided by the invention, as shown in Figure 3, the size of radiator 200 need be greater than the size of described heat-conducting plate 300, so that heat-conducting plate 300 can contact with radiator 200.LED chip and substrate be (because LED chip and substrate size are less than heat-conducting plate, not shown in Fig. 3) between radiator 200 and heat-conducting plate 300.
In a specific embodiment, the approximate size of LED light source: 56mm(millimeter) * 40mm*4mm;
LED light source substrate approximate size: 56mm*40mm*1.5mm;
Heat-conducting plate approximate size: 80mm*65mm*8mm;
It should be noted that, the present invention is not limited to concrete size value and dimension scale, and described LED light source 100, substrate 102 and heat-conducting plate 300 might not refer to cuboid, above-mentioned size value is the relation in size for better explanation LED light source and heat-conducting plate, a just size value of its largest portion of choosing.
After the energising of LED light fixture, LED light source starts luminous generation heat, and because the substrate of its LED light source is directly connected with radiator, the heat that the LED light source back side produces, can be passed to radiator by substrate, by radiator, is dispelled the heat; The heat in LED light source front can, by being fitted in its positive heat-conducting plate, also be passed to radiator, shed, thereby realize efficiently radiates heat, and LED light source front and back dispels the heat simultaneously by radiator, has improved radiating efficiency.
It should be noted that, the shape of the cooling system described in Fig. 1 and Fig. 2 is specific embodiment of the present invention, and cooling system provided by the present invention, can also be other shape, and the present invention does not do concrete restriction to this.
In embodiments of the present invention, the cooling system of LED light fixture is provided with radiator and heat-conducting plate, radiator is arranged on the described LED light source back side, heat-conducting plate is arranged on the front of LED light source, and contact with radiator, the heat of LED light source front and back can be discharged by radiator, thereby can realize the efficiently radiates heat of light fixture, improved radiating efficiency simultaneously.
As another preferred embodiment, in conjunction with Fig. 1 and Fig. 2, described heat-conducting plate 300 is the surfaces that embed described LED light source 100, and is fixed by screws on described radiator 200.
Heat-conducting plate 300 embedded with LED light source 100 fronts, that is to say, heat-conducting plate 300 fits tightly with LED light source 100.Wherein, realizing a kind of implementation fitting tightly is that heat-conducting plate 300 and the one side that LED light source 100 fronts contact, be provided with the shape corresponding with described LED light source 100, thereby can guarantee close contact, and do not interspace.Specifically can be referring to Fig. 4, show the structure of the one side that heat-conducting plate 300 and LED light source 100 fit, it is provided with the shape corresponding with LED light source 100.
Described in LED lamp installation during cooling system, first the LED light source 100 LED chip 101 and substrate 102 being formed is arranged on radiator 200, and be fixed by screws on described radiator 200, then heat-conducting plate 300 is embedded to the front of described LED light source 100, contact completely with described LED light source 100, make 100 one-tenth of heat-conducting plate 300 and LED light sources as a whole, and be fixed on described radiator 200.
Wherein, between heat-conducting plate 300 and LED light source 100, can also fill silicon gel.
Silicon gel is owing to having elasticity; and there is good electric property and chemical stability; thereby can guarantee that heat-conducting plate 300 contacts completely with LED light source 100, and do not interspace, and silicon gel has dustproof, moistureproof, shockproof and insulation protection effect to described LED light source 100 circuits.
It should be noted that, the silicon gel of filling is in order to guarantee that heat-conducting plate 300 is good with contacting of LED light source 100, and it can also select other material to fill, and does not affect the normal luminous and heat radiation of LED light source.
For better transferring heat, the place that described heat-conducting plate 300 directly contacts with radiator 200, and the place that directly contacts with radiator 200 of described substrate 102 also can full-filling Heat Conduction Material, described Heat Conduction Material is specifically as follows thermal grease conduction.
It should be noted that, the heat-conducting plate in the embodiment of the present invention is required to be transparent material, does not affect the light effect that of LED light source, can select transparency high, high temperature resistant, conductive coefficient is high, and the special glass of easily processing, and described special glass specifically can be selected the materials such as quartz or crystal.
The conductive coefficient of special glass is conventionally very high, the highest conductive coefficient can reach 1.4W/mK(watt/meter and open), and the conductive coefficient of air is approximately 0.024W/mK, therefore the capacity of heat transmission of special glass will be far away higher than the capacity of heat transmission of air, therefore at the positive heat-conducting plate of installing of LED light source, can effectively the heat in LED light source front be derived, pass to radiator, its radiating effect is better than contacting with air than LED light source is direct, by air, is dispelled the heat.
In order to strengthen the radiating effect of radiator 200, described radiator 200 can be wing type radiator, and fin is zigzag fashion, thereby has increased area of dissipation, improves radiating efficiency.
Wherein, described radiator 200 can be aluminium alloy heat radiator.
In embodiments of the present invention, heat-conducting plate embedded with LED light source and LED light source form an entirety, and be fixed on radiator, the heat that LED light source produces, a part is passed to radiator by substrate, and the heat in LED light source front is passed to radiator by heat-conducting plate, realized the efficiently radiates heat of light fixture, radiator adopts wing type radiator simultaneously, has increased area of dissipation, has improved radiating efficiency.
The present invention also provides a kind of LED light fixture, and described LED light fixture comprises LED chip, substrate and above-mentioned cooling system, and described LED chip is encapsulated on described substrate, forms LED light source.LED light source is arranged on radiator, and heat-conducting plate covers the front of described LED light source.
Described LED light fixture is owing to having above-mentioned cooling system, thereby can realize efficiently radiates heat, guarantees that light fixture normally works, and extended the useful life of light fixture.
It should be noted that, it must also comprise basic link described LED light fixture, comprises driver, lamp outer casing etc., due to same as the prior art, does not repeat them here.
Wherein, described LED chip is specially high-power LED chip, a module of multiple LED chip composition is connected with substrate, because LED chip concentrates in limited space, heat radiation difficulty, cause LED light source excess Temperature, thereby cause the life-span of LED to be reduced, and accelerate the light decay of LED, the efficiency that affects the elements such as LED driver and reliability, and excess Temperature also can cause LED light wave to change, affect illuminating effect, LED light fixture provided by the present invention is due to can efficiently radiates heat, thereby can address the above problem.
Wherein, described baseplate material can be selected the copper alloy of good heat conduction effect.
It should be noted that, if in the manufacture craft of high-power LED light source, when carrying out high-power LED chip and substrate package, in order to guarantee LED light source line security, can use silicon gel on LED light source surface.Therefore the place that LED light source surface contacts with heat-conducting plate, just can be without recharging silicon gel, can guarantee fitting tightly of LED light source surface and heat-conducting plate.
LED light fixture provided by the present invention, due to can efficiently radiates heat, and radiating efficiency be high, therefore long service life, good illumination effect.
In this specification, each embodiment adopts the mode of going forward one by one to describe, and each embodiment stresses is and the difference of other embodiment, between each embodiment identical similar part mutually referring to.
To the above-mentioned explanation of the disclosed embodiments, make professional and technical personnel in the field can realize or use the present invention.To the multiple modification of these embodiment, will be apparent for those skilled in the art, General Principle as defined herein can, in the situation that not departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (7)
1. a cooling system for LED light fixture, described LED light fixture comprises the LED light source being comprised of LED chip and substrate, it is characterized in that, described cooling system comprises radiator and heat-conducting plate, the size of described heat-conducting plate is greater than the size of described LED light source, and described heat-conducting plate is transparent material
Described radiator is wing type radiator;
The side that described LED light source is provided with substrate is arranged on described radiator;
Described heat-conducting plate is fitted in the surface of described LED light source opposite side, and is connected with described radiator;
Between described heat-conducting plate and described LED light source, be filled with silicon gel;
Between described heat-conducting plate and described radiator, between described substrate and described radiator, full-filling has Heat Conduction Material respectively;
The heat that described LED light source produces, a part is passed to described radiator by described substrate, and another part is passed to described radiator by described heat-conducting plate.
2. cooling system according to claim 1, is characterized in that, described heat-conducting plate embeds the surface of described LED light source opposite side, is fixed by screws on described radiator.
3. cooling system according to claim 1, is characterized in that, described heat-conducting plate is special glass.
4. cooling system according to claim 3, is characterized in that, described heat-conducting plate is quartz or crystal.
5. cooling system according to claim 1, is characterized in that, described LED light source is fixed by screws on described radiator.
6. a LED light fixture, is characterized in that, comprises substrate, is encapsulated in the LED chip on described substrate and the cooling system as described in claim 1～5 any one, and described substrate and LED chip form LED light source.
7. light fixture according to claim 6, is characterized in that, described LED chip is high-power LED chip.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110175360.1A CN102252299B (en) | 2011-06-27 | 2011-06-27 | Radiating system for light-emitting diode (LED) lamp and LED lamp |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110175360.1A CN102252299B (en) | 2011-06-27 | 2011-06-27 | Radiating system for light-emitting diode (LED) lamp and LED lamp |
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| CN102252299A CN102252299A (en) | 2011-11-23 |
| CN102252299B true CN102252299B (en) | 2014-04-16 |
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| CN201110175360.1A Active CN102252299B (en) | 2011-06-27 | 2011-06-27 | Radiating system for light-emitting diode (LED) lamp and LED lamp |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102840485A (en) * | 2012-09-07 | 2012-12-26 | 南宁市立节节能电器有限公司 | LED energy-saving daylight lamp |
| CN103033959A (en) * | 2012-12-06 | 2013-04-10 | 南京莱斯信息技术股份有限公司 | Liquid crystal display |
| CN107178760A (en) * | 2017-07-20 | 2017-09-19 | 东莞市翰胜金属制品有限公司 | A kind of radiator and its installation method for LED spotlight |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201011442Y (en) * | 2007-01-30 | 2008-01-23 | 黄志高 | High power LED orienting lamp with GB reflecting orienting glass bulb |
| CN202092078U (en) * | 2011-06-27 | 2011-12-28 | 成都曙光光纤网络有限责任公司 | Heat-dissipation system of light-emitting diode (LED) lamp and LED lamp |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100632003B1 (en) * | 2005-08-08 | 2006-10-09 | 삼성전기주식회사 | Led package having recess in heat transfer part |
| JP2010153761A (en) * | 2008-11-19 | 2010-07-08 | Rohm Co Ltd | Led lamp |
| CN201539737U (en) * | 2009-10-14 | 2010-08-04 | 深圳市瑞丰光电子有限公司 | LED lamp |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201011442Y (en) * | 2007-01-30 | 2008-01-23 | 黄志高 | High power LED orienting lamp with GB reflecting orienting glass bulb |
| CN202092078U (en) * | 2011-06-27 | 2011-12-28 | 成都曙光光纤网络有限责任公司 | Heat-dissipation system of light-emitting diode (LED) lamp and LED lamp |
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| Title |
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| JP特开2010-153761A 2010.07.08 |
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Denomination of invention: Radiating system for light-emitting diode (LED) lamp and LED lamp Effective date of registration: 20170407 Granted publication date: 20140416 Pledgee: Chengdu small business financing Company Limited by Guarantee Pledgor: Chengdu Shuguang Optical Fiber Network Co.,Ltd. Registration number: 2017510000019 |
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