KR101265163B1 - Led illuminating device using lighting fixture case - Google Patents

Abstract

PURPOSE: An LED lighting device using a lamp container is provided to arrange an LED module to be adjacent to a surface of a light emitting unit, thereby preventing the loss of light quantity. CONSTITUTION: A lamp container has a lower surface and an internal wall. An LED module(20) includes a plurality of LEDs. A hinge profile(30) is fixed inside the lamp container. A heat dissipating structure(40) is combined to a hinge groove of the hinge profile. The heat dissipating structure releases heat of the LED module to the internal wall of the lamp container.

Description

LED lighting device using lighting enclosures {LED ILLUMINATING DEVICE USING LIGHTING FIXTURE CASE}

The present invention relates to a lighting device using a light emitting diode (LED), and more particularly, to reduce the loss of light and to reduce the lighting loss while using the lighting enclosure used in the conventional lighting device such as an incandescent bulb or a halogen bulb. The present invention relates to an LED lighting device that can effectively emit heat generated to implement high efficiency lighting.

Recently, LED elements including semiconductor elements have attracted attention as light sources of various lighting devices. Such LED devices have advantages of high efficiency and long life compared to conventional lighting lamps, such as incandescent bulbs or halogen bulbs, and thus have recently been utilized in various fields as lighting for general lighting devices as well as display light sources.

However, since LEDs have a few different characteristics from conventional light sources, they do not generally use lighting devices such as conventional lighting enclosures, and manufacture and use separate lighting enclosures.

The characteristics of the LED different from the conventional light source are as follows. First, since a conventional light source generates light in all directions, a reflector is installed behind the light source to make a specific light distribution. However, because LEDs produce directional light with a full width of half maximum (FWH) of approximately 120 degrees forward, perpendicular to the surface, cup-shaped reflectors are used to collect more light, and light distribution such as street lights. In order to realize this, the lens is often used on the LED. Second, the LED emits about 70% of the power consumption as heat, but the LED has a disadvantage in that the efficiency is rapidly lowered as the operating temperature rises, so the heat generated must be released through heat conduction to the external heat dissipation structure. At this time, if the heat dissipation is not made properly, not only the efficiency of the LED may be lowered, but also the high temperature destruction of the LED device may occur.

Therefore, the lighting device of the conventional light source is generally designed as a case-type lighting enclosure, in which the light source is located inside, whereas the LED lighting device is positioned so that the LED is located as close to the surface of the light emitting part of the lighting device as the rear surface of the LED lighting device. It is common to design the shape of the heat radiation fins so that sufficient heat radiation is achieved through convection circulation with the surrounding air. The characteristics of these LEDs are a constraint in terms of the design of the lighting device, which makes it difficult to design a variety.

Korean Patent No. 10-1073438 discloses an LED lighting device having a mounting structure applicable to a fixing member for mounting an existing incandescent or fluorescent lighting device. However, in the LED lighting device, the LED is located far from the surface of the light emitting part of the lighting device, resulting in a loss of light, and a heat sink having a shape of a heat sink fin is located at the rear of the LED to provide sufficient heat radiation to the outside of the lighting device. There is still a problem that is not achieved.

As a result, the appearance of the LED lighting device that is currently being developed and used, that is, the lighting enclosure is different from the lighting enclosure used in the conventional lighting device. This difference in appearance is unique while showing the inherent characteristics of the LED, but may also be unfamiliar compared to conventional lighting devices. In particular, the conventional lighting device is designed to match the surrounding landscape, while the recent LED lighting device is not harmonized with the surroundings.

The present invention has been made to solve the above problems, the object of the present invention is that the LED is applied from the surface of the light emitting portion of the lighting device when the LED light source is applied to the case-type lighting enclosure used in the lighting device of the conventional light source The present invention relates to an LED lighting device capable of solving a problem in which a loss of illumination occurs and a heat radiation structure having a shape of a heat radiation fin is attached to a rear surface of the LED to reduce heat radiation efficiency.

LED lighting device according to the present invention for achieving the above object is a lamp housing having a bottom and an inner wall embedded therein, consisting of a plurality of LEDs, LED modules are spaced apart from a predetermined interval from the bottom of the lamp housing, One or more hinge grooves are formed on the outer circumferential surface thereof, and the hinge profile fixedly installed in the interior of the lamp enclosure and the hinge coupling of the hinge profile of the hinge profile to be in close contact with the inner wall of the lamp enclosure are generated from the LED module. It includes a heat dissipation structure for dissipating heat to the inner wall of the lamp enclosure,

Preferably, the heat dissipation structure includes a first heat dissipation in close contact with the rear surface of the LED module, a second heat dissipation in close contact with the inner wall of the lamp housing, and a connection portion connecting the first heat dissipation plate and the second heat dissipation plate,

The first heat sink is attached to the back of the LED module by any one of a thermally conductive adhesive, thermally conductive pads or graphite,

A side hinge portion is formed on the first heat sink, and one of the hinge grooves formed in the hinge profile is a side hinge groove in which the side hinge portion slides.

The center of the side hinge portion and the center of the hinge profile are located horizontally,

The connecting portion is formed with an upper hinge portion, any one of the hinge grooves formed in the hinge profile is a lower hinge groove that the upper hinge portion is slide coupled,

The center of the upper hinge portion is located below the center of the hinge profile,

The center of the upper hinge portion is located below the upper end of the second heat sink,

The LED module and the heat dissipation structure are composed of at least one or more pairs, and each of the second heat dissipation plates of the one or more pairs of heat dissipation structures is in close contact with an inner wall of the lamp housing facing each other, and the one or more pairs of heat dissipation. Each of the first heat sinks of the structure is coupled in the same plane by the coupling member,

The heat dissipation structure is made of aluminum,

Further comprising a thermally conductive elastic member between the second heat sink and the inner wall of the lamp enclosure,

The thermally conductive elastic member is characterized in that the thermally conductive polymer, graphite, copper or aluminum is one of the pads processed in the form of a foam or a bundle of yarns.

According to the LED lighting apparatus according to the present invention by placing the LED module adjacent to the light emitting surface at a predetermined interval spaced from the bottom of the existing light enclosure containing the interior of the interior of the lamp module to shorten the path from the LED module to the light emitting surface There is a remarkable effect of reducing the amount of light lost inside.

In addition, according to the LED lighting device according to the present invention, the LED lighting device by a heat dissipation structure that efficiently distributes heat generated from the LED module to the surface of the lamp enclosure by hinge-binding with the hinge profile so as to be in close contact with the inner wall of the lamp enclosure. There is a remarkable effect that can improve the power efficiency.

In addition, according to the LED lighting device according to the present invention by fixing the hinge profile combined with the heat dissipation structure to which the LED module is attached to the existing interior lighting lamp enclosure to configure the LED lighting device, the design of the existing lighting lamp enclosure Can be used as it is or modified only partly, significantly reducing development period and cost, and maintaining the design of various existing lighting enclosures as it is, and remarkable effect of eliminating user's rejection of unfamiliar external lighting devices. There is.

1 is a perspective view showing the overall appearance of the LED lighting apparatus according to the present invention.
2 is a perspective view showing a state in which each component of the LED lighting apparatus according to the present invention is coupled.
3 is a perspective view showing the internal structure of the LED lighting apparatus according to the present invention.
4 is an experimental example showing the temperature distribution of the LED lighting apparatus according to the present invention.
Figure 5 is a side view showing a state in which the heat dissipation structure according to the present invention is coupled to the hinge profile.
6 is a side view showing a state in which the heat dissipation structure is coupled to the hinge profile according to another embodiment of the present invention.

LED lighting device according to the present invention is a technical feature that can implement a high-efficiency lighting by reducing the light loss and effectively dissipating heat generated from the LED while still using the lighting enclosure used in the conventional lighting devices such as incandescent bulbs or halogen bulbs To present.

In the following, preferred embodiments, advantages and features of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing the overall appearance of the LED lighting apparatus according to the present invention, Figure 2 is a perspective view showing the combined state of each component of the LED lighting apparatus according to the present invention, Figure 3 is an LED lighting according to the present invention A perspective view showing the internal structure of the device.

1 to 3, the LED lighting device according to the present invention comprises a lamp enclosure 10 having a bottom and an inner wall embedded therein, and a plurality of LEDs, which are fixed from an embedded bottom of the lamp enclosure 10. The LED module 20 spaced apart from each other, one or more hinge grooves are formed on the outer circumferential surface and fixed in the interior of the lamp enclosure 10 and the hinge profile 30 and the lamp enclosure 10. The heat dissipation structure 40 is hinged to the hinge groove of the hinge profile 30 so as to be in close contact with the inner wall to emit heat generated from the LED module 20 to the inner wall of the lamp enclosure 10.

The lighting enclosure 10 according to the present invention is a lighting enclosure 10 developed and used for an existing lighting device such as a metal halide or a high pressure sodium lamp, and has a bottom and an inner wall which are internally embedded to locate a light source therein. .

The LED module 20 consists of a plurality of LEDs that emit directional light forwardly perpendicular to the surface. Preferably, the LED module 20 may be provided with a symmetrical light distribution lens having various angles, a reflecting plate, or a batwing type or side light distribution type lens for dispersing light in a horizontal direction depending on the purpose of use.

In general, in the LED lighting device, depending on the place of use and constraints, the light emitting part of the lighting device may use a glass or a plastic window such as polycarbonate (PC) or acrylic having a transparent or translucent diffusion property. When the window is used in the light emitting unit as described above, the illumination loss due to the partial reflection of the window may occur.

Therefore, the LED lighting device according to the present invention is arranged to be spaced as close to the window as possible by placing the LED module 20 spaced apart from the bottom of the embedded lamp housing 10 by a predetermined interval. As described above, when the LED module 20 is positioned as close to the window as possible, it was found that the lighting loss is about 3% less than when the LED module 20 is placed inside the lamp enclosure 10 and the reflector is used.

  The LED module 20 is arranged to be spaced apart from the bottom surface of the lamp housing 10 by the coupling of the hinge profile 30 and the heat dissipation structure 40, the hinge profile 30 and the heat dissipation structure 40 The coupling structure of) is described in detail below.

The hinge profile 30 is formed with one or more hinge grooves extending in one direction and fixedly installed in the interior of the lamp enclosure 10. One or more hinge grooves may be formed on the outer circumferential surface of the hinge profile 30 to freely configure a rotation center axis of the hinge coupling, and may improve freedom in the design of the heat dissipation structure 40.

Preferably, both ends of the hinge profile 30 may be fixed to the support 15 in the lamp enclosure 10 using screws or the like. In general, a lighting lamp enclosure 10 that is developed and used for an existing lighting device is provided with a support 15 for fixing a light source, a reflector or a driving device, etc. so that both ends of the hinge profile 30 are supported on the support 15. Can be fixed by screws or the like.

When the support 15 is not provided in the lamp enclosure 10, the hinge profile 30 is fixedly installed inside the lamp enclosure 10 through a separate support 15 or the hinge profile 30 is installed. ) Can also be directly fixed to the interior of the lamp housing (10).

In addition, the hinge profile 30 is fixedly installed in the interior of the lamp enclosure 10 spaced apart from the bottom of the recessed bottom of the lamp enclosure 10, the LED module 20 by coupling with the heat radiation structure 40 to be described later. ) Is installed adjacent to the light emitting portion.

The heat dissipation structure 40 according to the present invention is hinged to the hinge groove of the hinge profile 30 to be in close contact with the inner wall of the lamp enclosure 10 to heat generated from the LED module 20 to the inner wall of the lamp enclosure 10. Release. The heat dissipation structure 40 includes a first heat dissipation plate 42 in close contact with the rear surface of the LED module 20, a second heat dissipation plate 46 in close contact with the inner wall of the lamp enclosure 10, and the first heat dissipation plate 42. And a connection portion 44 connecting the second heat sink 46.

The first heat dissipation plate 42, the second heat dissipation plate 46, and the connecting portion 44 of the heat dissipation structure 40 are preferably formed by integrally extruding the heat dissipation structure 40. The heat dissipation structure 40 is made of aluminum having high thermal conductivity. It is preferably made of.

The first heat sink 42 of the heat dissipation structure 40 of the present invention is fixedly attached to the back surface of the LED module 20 using a material of a flexible physical property such as screws and thermally conductive adhesive 50 or a heat conductive pad or graphite. In addition, the first heat sink 42 has a side hinge portion 43 is formed, the slide is coupled to the side hinge groove 33 formed on one side of the hinge profile (30).

When the first heat sink 42 is slide-bonded to the hinge profile 30 as described above, the hinge profile 30 is fixed to the support 15 provided in the lamp housing 10 as described above. 2 The play between the heat sink 46 and the inner wall of the lamp enclosure 10 is adjusted.

The second heat dissipation plate 46 in close contact with the inner wall of the lighting enclosure 10 is preferably formed to be the same as the curved surface of the inner wall. In addition, the thermally conductive elastic member 60 having thermal conductivity and elasticity is attached to a surface closely contacting the inner wall of the second heat sink 46 in order to firmly adhere the second heat sink 46 to the inner wall of the lamp enclosure 10. do. As the thermally conductive elastic member 60, a sheet of silicon polymer, graphite or copper or aluminum processed by mixing a thermally conductive material in the form of foam or thread can be used. By the thermally conductive elastic member 60 as described above, the second heat dissipation plate 46 may be firmly adhered to the inner wall of the lamp enclosure 10, and the thermal conductivity efficiency may be improved.

In order to closely contact the second heat sink 46 to the inner wall of the lamp enclosure 10 by the hinge structure, a torque must be applied to the second heat sink 46. Although not shown, in order to apply a torque to the second heat sink 46 of the heat dissipation structure 40 to closely contact the inner wall of the lamp enclosure 10, the first heat sink 42 may be spaced apart from the bottom of the lamp enclosure 10 by a predetermined distance. It can be fixed with long screws (not shown) so as to be spaced apart, for example horizontally.

Preferably, the LED lighting device according to the present invention comprises at least one or more pairs of the LED module 20 and the heat dissipation structure 40, so that each second heat sink 46 of the one or more pairs of heat dissipation structures 40 is formed. Silver is in close contact with the inner wall of the opposing lighting enclosure 10, each of the first heat sink 42 of the one or more paired heat dissipation structure 40 is configured to be coupled in the same plane by the coupling member 48 can do.

For example, when the LED module 20 and the heat dissipation structure 40 are configured as two pairs, as shown in the figure, the LED module 20 and the heat dissipation structure 40 are opposite to the lamp housing ( 10 is hinged to the hinge profile 30 fixedly installed on the inner wall of each. Torque must be applied to each of the second heat sinks 46 so that the second heat sinks 46 of the pair of heat dissipation structures 40 adhere to the inner wall of the opposing lamp enclosure 10. To this end, by coupling each of the first heat sink 42 on the same plane by a coupling member 48, such as a flattening plate, the second heat sink 46 on the inner wall of the lamp housing 10 facing the other heat sink without a separate structure Torque can be applied to each other.

LED lighting device according to the present invention is a lamp housing the heat generated from the LED module 20 by the heat dissipation structure 40 consisting of the first heat sink 42, the second heat sink 46 and the connection portion 44 as described above. It becomes possible to transmit efficiently to the inner wall of (10).

In more detail, the conventional light source operates at a high temperature and has high heat resistance, so that the distance between the lamp enclosure 10 and the light source is not a problem, and thus the internal shape and the surface of the lamp enclosure 10 are eliminated. It is designed arbitrarily and is not suitable for fixing the LED module 20 to the lamp enclosure 10 as it is.

In order to efficiently dissipate heat generated from the LED module 20 to the outside due to the characteristics of the LED module 20, the thermal contact resistance between the LED module 20 and the lamp enclosure 10 should be minimized. It is necessary to firmly adhere the module 20 to the lamp enclosure 10.

However, when the LED module 20 is fixed in close contact with the recessed bottom surface of the lamp enclosure 10, the LED module 20 is located inside the lamp enclosure 10 far from the surface of the light emitting portion, thereby Light loss will occur.

In addition, in the case of the conventional lighting enclosure 10, the thermal conductivity of the lighting enclosure 10 itself is not a big problem, and mainly uses aluminum alloy or iron having a relatively low thermal conductivity, and its thickness is also formed within 2 mm. There is a problem that the thermal conductivity of the lamp enclosure 10 itself is low. Therefore, when the LED module 20 is fixed in close contact with the recessed bottom surface of the lamp enclosure 10, the surface of the lamp enclosure 10 may not be used as a heat dissipation area.

In order to avoid the above problems, the LED lighting device of the present invention diffuses heat generated from the LED module 20 by the heat dissipation structure 40, and the heat dissipation structure 40 is hinged in the hinge profile 30. The hinge is coupled to be able to firmly adhere to the inner wall of the lamp enclosure (10). In addition, the LED lighting device of the present invention emits heat generated from the LED module 20 to the side, not the central portion of the lamp enclosure (10).

Although not shown, a driving device (not shown) and other electronic components are located in the interior of the lamp enclosure 10. When heat generated from the LED module 20 is discharged through the central portion of the lamp housing 10, the driving device and other electronic components may be thermally damaged and high temperature breakage may occur. It may lead to a decrease in efficiency. Therefore, the LED lighting device of the present invention emits heat generated from the LED module 20 to the side of the lamp enclosure 10 to damage the drive device and other electronic components located inside the lamp enclosure 10. Prevents and improves the efficiency of the components themselves.

4 is an experimental example showing the temperature distribution of the LED lighting apparatus according to the present invention. More specifically, Figure 4 (a) shows the temperature distribution of the surface of the lamp enclosure of the LED lighting device according to the present invention, Figure 4 (b) is fixed to the center of the LED module in close contact with the bottom surface of the lamp housing enclosed. The temperature distribution in the case of dissipating heat is shown.

Referring to FIG. 4, when the heat generated from the LED module 20 is radiated to the center portion of the lamp enclosure 10 by the above experiment, the maximum temperature is 5 when it is emitted to the side of the lamp enclosure 10. It was found that even lower. Therefore, according to the LED lighting apparatus according to the present invention can solve the heat dissipation problem that has the greatest impact on the reliability of the LED device even when using the existing lamp enclosure 10 as it is and can improve the lighting efficiency.

5 is a side view showing the heat dissipation structure 40 according to the present invention coupled to the hinge profile 30, Figure 6 is a heat dissipation structure 40 according to another embodiment of the present invention the hinge profile 30 It is a side view showing the state that is coupled to. The arrow here represents the direction of torque with respect to the central axis of rotation of the hinge coupling.

5 and 6, the heat dissipation structure 40 according to the present invention and the heat dissipation structure 40 according to another embodiment of the present invention are coupled to the hinge profile 30 to be in close contact with the inner wall of the lamp enclosure 10. The configuration will be described in detail in comparison.

In the heat dissipation structure 40 according to the present invention illustrated in FIG. 5, a side hinge portion 43 is formed at one side of the first heat sink 42, and the side hinge portion 43 is formed at one side of the hinge profile 30. Side hinge groove 33 is formed to slide. As described above, when the side hinge portion 43 is formed on one side of the first heat sink 42 and coupled to the side hinge groove 33 on one side of the hinge profile 30, the side hinge portion 43 Since the central axis of rotation of the hinge coupling, which is the center, is positioned horizontally with the center of the hinge profile 30, the first heat sink 42 of the heat dissipation structure 40 must be pressed downward, so that the second heat sink 46 is not provided with the lamp housing 10. It adheres firmly to the inner wall of). In the structure as described above, the clearance between the second heat sink 46 and the inner wall of the lamp enclosure 10 is increased when the hinge profile 30 is fixed to the inside of the lamp enclosure 10, and then the first heat sink 42 is opened. The second heat sink 46 is firmly in close contact with the inner wall of the lamp enclosure 10 in the process of pressing to the bottom.

On the other hand, in the heat dissipation structure 40 according to another embodiment of the present invention shown in FIG. 6, the upper hinge portion 45 is formed on the upper portion of the connection portion 44 of the heat dissipation structure 40, the hinge profile 30 The lower hinge groove 35 to which the upper hinge portion 45 is slide-coupled is formed in the lower portion. In the case where the upper hinge portion 45 is formed at the upper portion of the connection portion 44 of the heat dissipation structure 40 and is coupled to the lower hinge groove 35 at the lower portion of the hinge profile 30, the center of the upper hinge portion 45 Since the rotational central axis of the hinge hinge is located below the center of the hinge profile 30, the second heat sink 46 may be configured to provide a lighting enclosure with a vertical force that pushes the first heat sink 42 downward. 10) the strength of close contact with the inner wall is low.

However, when the upper hinge portion 45 is formed at the upper portion of the connection portion 44 of the heat dissipation structure 40 to be coupled to the lower hinge groove 35 at the lower portion of the hinge profile 30, the second heat sink 46 The torsional force applied to the hinge profile 30 when it is in close contact with the inner wall of the lamp enclosure 10 is smaller than in the case of FIG. Accordingly, when the hinge profile 30 is fixed to the support 15 of the lamp enclosure 10, since the torsional stress applied to the support 15 is small, a strong torque can be applied, and thus the strength of the support 15 is low. It can be used effectively.

In addition, when the upper hinge portion 45 is preferably formed on the upper portion of the connection portion 44 of the heat dissipation structure 40, when coupled to the lower hinge groove 35 of the lower portion of the hinge profile 30, the upper hinge portion The rotation center axis of the hinge coupling which is the center of the 45 may be configured to be located below the upper end of the second heat sink 46. In this case, the rotation center axis of the hinge coupling is located below the upper end of the second heat sink 46 so that the second heat sink 46 is fixed before the hinge profile 30 is fixed to the support 15 of the lamp enclosure 10. First contact with the inner wall of the lamp enclosure 10, and then in the process of fixing the hinge profile 30 to the support 15, the second heat sink 46 is automatically firmly in close contact with the inner wall of the lamp enclosure (10). It is a structure.

In general, the interior of most existing lighting enclosure 10 has a shape that is narrower toward the inside, that is, toward the bottom embedded in the light emitting portion. Therefore, in the above case, while fixing the hinge profile 30 to the support 15 of the lamp enclosure 10, the lower end of the second heat sink 46 receives the torque in the clockwise direction as shown, so that the second heat sink ( The upper end of the 46 is applied to the rotational force in the direction of the inner wall of the lamp enclosure 10, and thus firmly in close contact with the inner wall of the lamp enclosure 10.

Accordingly, each configuration in which the heat dissipation structure 40 illustrated in FIGS. 5 and 6 is coupled to the hinge profile 30 and closely adheres to the inner wall of the lighting enclosure 10 may include a shape and a support inside the lighting enclosure 10. According to the position or strength of 15), there are advantages and disadvantages, and it is preferable to apply selectively.

While the preferred embodiments of the present invention have been described and illustrated above using specific terms, such terms are used only for the purpose of clarifying the invention, and it is to be understood that the embodiment It will be obvious that various changes and modifications can be made without departing from the spirit and scope of the invention. Such modified embodiments should not be understood individually from the spirit and scope of the present invention, but should be regarded as being within the scope of the claims of the present invention.

10: light enclosure 15: support
20: LED module 30: hinge profile
33: side hinge groove 35: lower hinge groove
40: heat dissipation structure 42: first heat sink
43: side hinge 44: connection portion
45: upper hinge portion 46: second heat sink
48: bonding member 50: thermally conductive adhesive
60: thermally conductive elastic member

Claims (12)

A lighting enclosure having a bottom and an inner wall embedded therein;
An LED module composed of a plurality of LEDs, the LED module being spaced apart from the bottom of the lamp housing by a predetermined interval;
One or more hinge grooves extending in one direction on an outer circumferential surface thereof, the hinge profiles being fixedly installed in the interior of the lamp enclosure; And
And a heat dissipation structure hinged to a hinge groove of the hinge profile to closely contact the inner wall of the lamp enclosure to radiate heat generated from the LED module to the inner wall of the lamp enclosure.
The method of claim 1,
The heat dissipation structure,
A first heat sink in close contact with a rear surface of the LED module;
A second heat sink in close contact with an inner wall of the lamp enclosure; And
LED lighting device comprising a connecting portion for connecting the first heat sink and the second heat sink.
3. The method of claim 2,
The first heat sink is attached to the back of the LED module by any one of a thermally conductive adhesive, a thermally conductive pad or graphite.
3. The method of claim 2,
The first heat sink is formed with a side hinge portion,
LED hinge device, characterized in that any one of the hinge grooves formed in the hinge profile is a side hinge groove that the side hinge portion is slide coupled.
The method of claim 4, wherein
And a center of the side hinge portion and a center of the hinge profile are horizontally positioned.
3. The method of claim 2,
The connecting portion is formed with an upper hinge portion,
LED hinge device, characterized in that any one of the hinge groove formed in the hinge profile is a lower hinge groove that the upper hinge portion is slide coupled.
The method according to claim 6,
The center of the upper hinge portion is LED lighting device, characterized in that located below the center of the hinge profile.
The method according to claim 6,
The center of the upper hinge portion is an LED lighting device, characterized in that located below the upper end of the second heat sink.
3. The method of claim 2,
The LED module and the heat dissipation structure is composed of at least one pair,
Each of the second heat sinks of the at least one pair of heat dissipation structures is in close contact with an inner wall of the lamp housing facing each other,
And each first heat sink of the at least one pair of heat dissipation structures is coupled in the same plane by a coupling member.
The method of claim 1,
The heat dissipation structure is an LED lighting device, characterized in that made of aluminum.
3. The method of claim 2,
LED lighting device further comprises a thermally conductive elastic member between the second heat sink and the inner wall of the lamp enclosure.
The method of claim 11,
The thermally conductive elastic member is a LED lighting device, characterized in that the thermally conductive polymer, graphite, copper or aluminum is one of the pads processed in the form of foam or thread bundle.

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