JP2001284659A - Led illuminator - Google Patents
Led illuminatorInfo
- Publication number
- JP2001284659A JP2001284659A JP2000097255A JP2000097255A JP2001284659A JP 2001284659 A JP2001284659 A JP 2001284659A JP 2000097255 A JP2000097255 A JP 2000097255A JP 2000097255 A JP2000097255 A JP 2000097255A JP 2001284659 A JP2001284659 A JP 2001284659A
- Authority
- JP
- Japan
- Prior art keywords
- led
- substrate
- hollow portion
- liquid
- electric path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、複数のＬＥＤの
放熱を考慮した基板上に実装したＬＥＤ照明装置に関す
る。[0001] 1. Field of the Invention [0002] The present invention relates to an LED lighting device mounted on a substrate considering heat radiation of a plurality of LEDs.
【０００２】[0002]
【従来の技術】図４は例えば特開平１１−１６３４１０
号公報に示された従来のＬＥＤ照明装置の断面図であ
る。図において２１は基板２２上に実装された複数個の
ＬＥＤチップであり，これらのＬＥＤチップ２１が透光
性を有する材料で形成された容器２３内に密封されてＬ
ＥＤモジュールが構成され、このＬＥＤモジュールを複
数個用いてＬＥＤ照明装置が形成されている。2. Description of the Related Art FIG.
FIG. 1 is a cross-sectional view of a conventional LED lighting device disclosed in Japanese Unexamined Patent Publication (Kokai) No. H10-15095. In the figure, reference numeral 21 denotes a plurality of LED chips mounted on a substrate 22, and these LED chips 21 are sealed in a container 23 formed of a material having a light-transmitting property.
An ED module is configured, and an LED lighting device is formed using a plurality of the LED modules.
【０００３】２３ａはＬＥＤチップ２１と対向する容器
２３の上部に設けられたレンズであり、容器２３と基板
２２とは、接着剤等により固定されている。２４は容器
２３内に充填された水又はアルコールのような有機溶剤
等から成る液体である。A lens 23a is provided on an upper part of the container 23 facing the LED chip 21, and the container 23 and the substrate 22 are fixed with an adhesive or the like. Numeral 24 is a liquid filled in the container 23 and composed of water or an organic solvent such as alcohol.
【０００４】このような構成により、容器２３内でＬＥ
Ｄチップ２１が液体２４と直接接触して放熱するため、
ＬＥＤチップ２１の発熱による温度の上昇を抑えること
ができる。その結果、基板２２へのＬＥＤチップ２１の
実装密度を大きくすることができるとともに、ＬＥＤチ
ップ２１自体の発光効率も高めることができる。With such a configuration, the LE 23 is
Since the D chip 21 is in direct contact with the liquid 24 and dissipates heat,
An increase in temperature due to heat generation of the LED chip 21 can be suppressed. As a result, the mounting density of the LED chips 21 on the substrate 22 can be increased, and the luminous efficiency of the LED chips 21 itself can be increased.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、従来の
ＬＥＤ照明装置では、容器２３内でＬＥＤチップ２１が
液体２４と直接接触しているので、絶縁性の高いＬＥＤ
チップを使用する必要があり、一般のＬＥＤチップまた
はＬＥＤが使用できないという問題があった。However, in the conventional LED lighting device, since the LED chip 21 is in direct contact with the liquid 24 in the container 23, the LED having a high insulation property is used.
There is a problem that a chip must be used and a general LED chip or LED cannot be used.
【０００６】この発明は上記のような問題点を解消する
ためになされたもので、一般のＬＥＤを使用して放熱効
率のよい実装構成とすることにより、ＬＥＤの発熱を抑
え、発光効率、寿命特性のよいＬＥＤ照明装置を提供す
ることを目的とする。SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems. By using a general LED and having a mounting structure with good heat radiation efficiency, heat generation of the LED is suppressed, and luminous efficiency and life are reduced. An object is to provide an LED lighting device having good characteristics.
【０００７】[0007]
【課題を解決するための手段】この発明に係るＬＥＤ照
明装置は、一方の外面に形成された絶縁層上に電路を有
し、内部に形成された中空部内に熱伝導性の液体が充填
された金属性基板と、前記電路に接合された複数のＬＥ
Ｄと、を備える。An LED lighting device according to the present invention has an electric path on an insulating layer formed on one outer surface, and a hollow portion formed inside is filled with a heat conductive liquid. Metal substrate and a plurality of LEs bonded to the electric circuit.
D.
【０００８】また、一方の外面に電路を有し、内部に形
成された中空部内に熱伝導性と絶縁性を有する液体が充
填された絶縁性基板と、前記電路にリード部の先端が前
記絶縁性基板の中空部内に突出するようにして接合され
た複数のリードフレーム型のＬＥＤと、を備える。[0008] Further, an insulating substrate having an electric path on one outer surface and a liquid having thermal conductivity and insulating properties filled in a hollow portion formed therein; A plurality of lead frame-type LEDs joined so as to protrude into the hollow portion of the conductive substrate.
【０００９】また、外面に電路を有する絶縁性部材と金
属性部材の間に形成された中空部内に、熱伝導性と絶縁
性を有する液体が充填された基板と、前記電路にリード
部の先端が前記基板の中空部内に突出するようにして接
合された複数のリードフレーム型のＬＥＤと、を備え
る。A substrate in which a liquid having thermal conductivity and insulating properties is filled in a hollow portion formed between an insulating member having an electric path on the outer surface and a metal member, and a tip of a lead portion is provided on the electric path. And a plurality of lead frame type LEDs joined so as to protrude into the hollow portion of the substrate.
【００１０】[0010]
【発明の実施の形態】実施の形態１．図１は実施の形態
１を示すＬＥＤ照明装置の断面図である。８は基板であ
り、内部に形成された中空部１ａ内に熱伝導性のよい液
体２が充填された金属性容器１、容器１の一方の外面に
形成された絶縁層３、絶縁層上に形成された電路４から
構成される。５は電路４に接合されたチップ型のＬＥ
Ｄ、６は基板８がネジ１９により取付けられる筐体であ
る。金属性容器１の中空部１ａへの液体２の充填は、例
えば、金属性容器１を開口部を有する箱体と蓋から構成
して、箱体に液体２を充填後、開口部に蓋をして接着等
で密閉することにより行う。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 FIG. 1 is a cross-sectional view of the LED lighting device according to the first embodiment. Reference numeral 8 denotes a substrate, a metal container 1 in which a liquid 2 having good thermal conductivity is filled in a hollow portion 1a formed therein, an insulating layer 3 formed on one outer surface of the container 1, and an insulating layer 3 on the insulating layer. It is composed of the formed electric circuit 4. 5 is a chip type LE joined to the electric circuit 4
D and 6 are housings to which the board 8 is attached by screws 19. The filling of the liquid 2 into the hollow portion 1a of the metallic container 1 is performed, for example, by forming the metallic container 1 from a box having an opening and a lid, and after filling the container 2 with the liquid 2, the lid is placed in the opening. And sealing by adhesion or the like.
【００１１】この構成により、ＬＥＤ１が点灯してＬＥ
Ｄ１に生じた熱は、ＬＥＤのリード部に伝わり、リード
部から電路４、絶縁層３、金属性容器１と伝わり、さら
に液体２に熱が伝わり、容器１の全体に伝わる。そし
て、この熱は空気中に放熱される。金属性容器１が取り
付けられる筐体６が金属材のときは、さらに金属性容器
１全体から効率よく筐体６に熱が伝わり、筐体６からも
放熱される。With this configuration, LED1 is turned on and LE
The heat generated in D <b> 1 is transmitted to the lead portion of the LED, transmitted from the lead portion to the electric path 4, the insulating layer 3, the metallic container 1, further transmitted to the liquid 2, and transmitted to the entire container 1. This heat is radiated into the air. When the housing 6 to which the metal container 1 is attached is made of a metal material, heat is further efficiently transmitted from the entire metal container 1 to the housing 6 and is also radiated from the housing 6.
【００１２】以上のように、一般のＬＥＤを使用して放
熱を効率よく行うことができ、ＬＥＤの発熱を抑え、発
光効率、寿命特性をよくすることができる。As described above, it is possible to efficiently radiate heat using a general LED, suppress the heat generation of the LED, and improve the luminous efficiency and the life characteristics.
【００１３】なお、本実施の形態ではチップ型ＬＥＤの
例を示したが、リードフレーム型のＬＥＤでもよく、こ
の場合はリード部を電路に沿って接合する。In this embodiment, an example of a chip type LED has been described. However, a lead frame type LED may be used. In this case, the leads are joined along an electric path.
【００１４】実施の形態２．図２は実施の形態２を示す
ＬＥＤ照明装置の断面図である。図において実施の形態
１の図１と同じ、または同等な部分には同じ符号を付
し、説明を省略する。１５は基板であり、内部に形成さ
れた中空部内１０ａに熱伝導性と絶縁性を有する液体１
３が充填された絶縁性の容器１０、この容器１０の一方
の外面に形成された電路４から構成される。１１は電路
４にリード部１２が接合されリードフレーム型のＬＥＤ
であり、リード部１２の先端１２ａが基板１５の容器１
０の中空部１０ａ内に突出している。Embodiment 2 FIG. FIG. 2 is a sectional view of the LED lighting device according to the second embodiment. In the figure, the same or equivalent parts as those in FIG. 1 of the first embodiment are denoted by the same reference numerals, and description thereof will be omitted. Reference numeral 15 denotes a substrate, and a liquid 1 having heat conductivity and insulation is provided in a hollow portion 10a formed therein.
3 comprises an insulating container 10 filled with an electric circuit 4 formed on one outer surface of the container 10. 11 is a lead frame type LED in which the lead portion 12 is joined to the electric circuit 4
And the tip 12a of the lead portion 12 is
0 protrudes into the hollow portion 10a.
【００１５】この構成により、ＬＥＤ１１が点灯してＬ
ＥＤ１１に生じた熱は、ＬＥＤ１１のリード部１２に伝
わり、リード部１２の先端部１２ａから液体１３に直接
熱が伝わり、容器１の全体に伝わる。そして、この熱は
空気中に放熱される。容器１０が取り付けられる筐体６
が金属材のときは、さらに容器１０全体から効率よく筐
体６に熱が伝わり、筐体６からも放熱される。With this configuration, the LED 11 is turned on and
The heat generated in the ED 11 is transmitted to the lead 12 of the LED 11, the heat is directly transmitted from the tip 12 a of the lead 12 to the liquid 13, and is transmitted to the entire container 1. This heat is radiated into the air. Housing 6 to which container 10 is attached
When is made of a metal material, heat is further efficiently transmitted from the entire container 10 to the housing 6 and is also radiated from the housing 6.
【００１６】以上のように、一般のＬＥＤを使用して放
熱を効率よく行うことができ、ＬＥＤの発熱を抑え、発
光効率、寿命特性をよくすることができる。As described above, heat can be efficiently dissipated by using a general LED, heat generation of the LED can be suppressed, and luminous efficiency and life characteristics can be improved.
【００１７】実施の形態３．図３は実施の形態３を示す
ＬＥＤ照明装置の断面図である。図において実施の形態
２の図２と同じかまたは同等な部分には同じ符号を付
し、説明を省略する。１８は基板であり、開口部を有す
る金属性の容器１６、この容器１６の開口部を覆う絶縁
性板１７、容器１６と絶縁性板１７で形成された中空部
１６ａ、中空部１６ａに充填された熱伝導性と絶縁性を
有する液体１３、絶縁性板１７の外面に形成された電路
４から構成される。１１は電路４にリード部１２が接合
されリードフレーム型のＬＥＤであり、リード部１２の
先端１２ａが基板１８の中空部１６ａ内に突出してい
る。Embodiment 3 FIG. 3 is a sectional view of the LED lighting device according to the third embodiment. In the figure, the same or equivalent parts as those in FIG. 2 of the second embodiment are denoted by the same reference numerals, and description thereof will be omitted. Reference numeral 18 denotes a substrate, which is a metal container 16 having an opening, an insulating plate 17 covering the opening of the container 16, a hollow portion 16a formed by the container 16 and the insulating plate 17, and filled in the hollow portion 16a. A liquid 13 having thermal conductivity and insulation properties, and an electric path 4 formed on the outer surface of the insulating plate 17. Reference numeral 11 denotes a lead frame type LED in which a lead portion 12 is joined to the electric circuit 4, and a tip 12 a of the lead portion 12 projects into a hollow portion 16 a of the substrate 18.
【００１８】この構成により、ＬＥＤ１１が点灯してＬ
ＥＤ１１に生じた熱は、ＬＥＤ１１のリード部１２に伝
わり、リード部１２の先端部１２ａから直接液体１３に
熱が伝わり、中空部１６ａの全体に伝わる。そして、こ
の熱は空気中に放熱される。さらに、筐体６を金属材と
すると、基板１８が取り付けられ部分が金属性の容器１
６であるため効率よく筐体６に熱が伝わり、筐体６から
放熱される。With this configuration, the LED 11 is turned on and
The heat generated in the ED 11 is transmitted to the lead portion 12 of the LED 11, the heat is directly transmitted to the liquid 13 from the tip portion 12a of the lead portion 12, and is transmitted to the entire hollow portion 16a. This heat is radiated into the air. Furthermore, if the housing 6 is made of a metal material, the substrate 1
6, the heat is efficiently transmitted to the housing 6 and is radiated from the housing 6.
【００１９】以上のように、一般のＬＥＤを使用して放
熱の効率をよりよくすることができ、ＬＥＤの発熱を抑
え、発光効率、寿命特性をよくすることができる。As described above, the efficiency of heat radiation can be improved by using a general LED, the heat generation of the LED can be suppressed, and the luminous efficiency and the life characteristics can be improved.
【００２０】[0020]
【発明の効果】以上のように、この発明によれば、一方
の外面に形成された絶縁層上に電路を有し、内部に形成
された中空部内に熱伝導性の液体が充填された金属性基
板と、前記電路に接合された複数のＬＥＤと、を備えた
ので、一般のＬＥＤを使用して放熱の効率をよく行うこ
とができ、ＬＥＤの発熱を抑え、発光効率、寿命特性を
よくすることができる。As described above, according to the present invention, there is provided a metal having an electric path on an insulating layer formed on one outer surface and having a hollow formed therein filled with a thermally conductive liquid. Since it is provided with a functional substrate and a plurality of LEDs bonded to the electric circuit, it is possible to use a general LED to efficiently perform heat radiation, suppress heat generation of the LED, and improve the luminous efficiency and life characteristics. can do.
【００２１】また、一方の外面に電路を有し、内部に形
成された中空部内に熱伝導性と絶縁性を有する液体が充
填された絶縁性基板と、前記電路にリード部の先端が前
記絶縁性基板の中空部内に突出するようにして接合され
た複数のリードフレーム型のＬＥＤと、を備えたので、
一般のＬＥＤを使用して放熱の効率をよく行うことがで
き、ＬＥＤの発熱を抑え、発光効率、寿命特性をよくす
ることができる。Also, an insulating substrate having an electric path on one outer surface and having a hollow formed therein filled with a liquid having thermal conductivity and insulating properties; A plurality of lead frame type LEDs joined so as to protrude into the hollow portion of the conductive substrate,
A general LED can be used to improve heat radiation efficiency, suppress heat generation of the LED, and improve luminous efficiency and life characteristics.
【００２２】また、外面に電路を有する絶縁性部材と金
属性部材の間に形成された中空部内に、熱伝導性と絶縁
性を有する液体が充填された基板と、前記電路にリード
部の先端が前記基板の中空部内に突出するようにして接
合された複数のリードフレーム型のＬＥＤと、を備えた
ので、一般のＬＥＤを使用して放熱の効率をよりよくす
ることができ、ＬＥＤの発熱を抑え、発光効率、寿命特
性をよくすることができる。A substrate filled with a liquid having thermal conductivity and insulating properties in a hollow portion formed between an insulating member having an electric path on the outer surface and a metal member, and a tip of a lead portion provided on the electric path. And a plurality of lead frame type LEDs that are joined so as to protrude into the hollow portion of the substrate, so that the efficiency of heat radiation can be improved using a general LED, and the heat generation of the LED can be improved. And the luminous efficiency and life characteristics can be improved.
【図１】 この発明の実施の形態１を示すＬＥＤ照明装
置の断面図である。FIG. 1 is a sectional view of an LED lighting device according to a first embodiment of the present invention.
【図２】 この発明の実施の形態２を示すＬＥＤ照明装
置の断面図である。FIG. 2 is a sectional view of an LED lighting device according to a second embodiment of the present invention.
【図３】 この発明の実施の形態２を示すＬＥＤ照明装
置の断面図である。FIG. 3 is a sectional view of an LED lighting device according to a second embodiment of the present invention.
【図４】 従来のＬＥＤ照明装置の断面図である。FIG. 4 is a cross-sectional view of a conventional LED lighting device.
１ 金属性容器、１０ 絶縁性容器、１６ 金属性容
器、１ａ、１０ａ，１６ａ 中空部、３ 絶縁層、４
電路、５、１１ ＬＥＤ、６筐体、８、１２ リード
部、１２ａ リード先端部、８ 金属性基板、１５ 絶
縁性基板、１８ 基板、１７ 絶縁性板。Reference Signs List 1 metal container, 10 insulating container, 16 metal container, 1a, 10a, 16a hollow portion, 3 insulating layer, 4
Electrical path, 5, 11 LED, 6 housing, 8, 12 lead part, 12a Lead tip, 8 metal substrate, 15 insulating substrate, 18 substrate, 17 insulating plate.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 牧原 千晴 神奈川県鎌倉市大船二丁目14番40号 三菱 電機照明株式会社内 (72)発明者 山田 健一 神奈川県鎌倉市大船二丁目14番40号 三菱 電機照明株式会社内 Ｆターム(参考） 3K014 AA01 LA01 LB04 5F041 AA33 CA91 DA25 DC07 FF11 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Chiharu Makihara 2--14-40 Ofuna, Kamakura City, Kanagawa Prefecture Inside Mitsubishi Electric Lighting Co., Ltd. (72) Inventor Ken-ichi Yamada 2- 14-40 Ofuna, Kamakura City, Kanagawa Mitsubishi F term (reference) in Denki Lighting Co., Ltd. 3K014 AA01 LA01 LB04 5F041 AA33 CA91 DA25 DC07 FF11
Claims (3)
を有し、内部に形成された中空部内に熱伝導性の液体が
充填された金属性基板と、 前記電路に接合された複数のＬＥＤと、 を備えたことを特徴とするＬＥＤ照明装置。1. A metal substrate having an electric path on an insulating layer formed on one outer surface and having a hollow portion formed therein filled with a thermally conductive liquid, and a plurality of metal substrates joined to the electric path. An LED lighting device comprising: an LED;
れた中空部内に熱伝導性と絶縁性を有する液体が充填さ
れた絶縁性基板と、 前記電路にリード部の先端が前記絶縁性基板の中空部内
に突出するようにして接合された複数のリードフレーム
型のＬＥＤと、 を備えたことを特徴とするＬＥＤ照明装置。2. An insulating substrate having an electric path on one outer surface and a liquid having thermal conductivity and insulating properties filled in a hollow formed therein, and a tip of a lead portion in the electric path is provided with the insulating member. And a plurality of lead frame type LEDs joined so as to protrude into a hollow portion of the conductive substrate.
部材の間に形成された中空部内に、熱伝導性と絶縁性を
有する液体が充填された基板と、 前記電路にリード部の先端が前記基板の中空部内に突出
するようにして接合された複数のリードフレーム型のＬ
ＥＤと、 を備えたことを特徴とするＬＥＤ照明装置。3. A substrate in which a liquid having thermal conductivity and insulation is filled in a hollow portion formed between an insulating member having an electric path on its outer surface and a metal member; Are connected to each other so as to project into the hollow portion of the substrate.
An LED lighting device comprising: an ED.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000097255A JP2001284659A (en) | 2000-03-31 | 2000-03-31 | Led illuminator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000097255A JP2001284659A (en) | 2000-03-31 | 2000-03-31 | Led illuminator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001284659A true JP2001284659A (en) | 2001-10-12 |
Family
ID=18611895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000097255A Pending JP2001284659A (en) | 2000-03-31 | 2000-03-31 | Led illuminator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001284659A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US7466023B2 (en) | 2002-03-06 | 2008-12-16 | Hamamatsu Photonics K.K. | Semiconductor light emitting device and plant cultivating system |
| US9241375B2 (en) | 2003-04-01 | 2016-01-19 | Sharp Kabushiki Kaisha | Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus |
| US7579629B2 (en) | 2003-04-01 | 2009-08-25 | Sharp Kabushiki Kaisha | Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus |
| US11424210B2 (en) | 2003-04-01 | 2022-08-23 | Xiamen San'an Optoelectronics Co., Ltd. | Light-emitting package |
| US10741533B2 (en) | 2003-04-01 | 2020-08-11 | Xiamen San'an Optoelectronics Co., Ltd. | Light-emitting package |
| US10490535B2 (en) | 2003-04-01 | 2019-11-26 | Xiamen San'an Optoelectronics Co., Ltd. | Light-emitting apparatus |
| US9768153B2 (en) | 2003-04-01 | 2017-09-19 | Sharp Kabushiki Kaisha | Light-emitting apparatus |
| US8030675B2 (en) | 2003-04-01 | 2011-10-04 | Sharp Kabushiki Kaisha | Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus |
| US8421109B2 (en) | 2003-04-01 | 2013-04-16 | Sharp Kabushiki Kaisha | Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus |
| US8629476B2 (en) | 2003-04-01 | 2014-01-14 | Sharp Kabushiki Kaisha | Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus |
| KR101142936B1 (en) * | 2004-12-31 | 2012-05-10 | 서울반도체 주식회사 | Luminescence apparatus |
| WO2006089996A1 (en) * | 2005-02-28 | 2006-08-31 | Kone Corporation | Lighting system for an elevator car |
| US7838898B2 (en) | 2007-02-05 | 2010-11-23 | Samsung Electronics Co., Ltd. | Light emitting diode module and display device having the same |
| WO2009111978A1 (en) * | 2008-03-13 | 2009-09-17 | Wang Willie | Led daylight strip lamp |
| JP2009224486A (en) * | 2008-03-14 | 2009-10-01 | Li-Hong Science & Technology Co Ltd | Led module |
| JP2010103282A (en) * | 2008-10-23 | 2010-05-06 | zong-zhi Hou | Fluid convection heat dissipation device |
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