JP2004296245A - Led lamp - Google Patents

Led lamp Download PDF

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Publication number
JP2004296245A
JP2004296245A JP2003086485A JP2003086485A JP2004296245A JP 2004296245 A JP2004296245 A JP 2004296245A JP 2003086485 A JP2003086485 A JP 2003086485A JP 2003086485 A JP2003086485 A JP 2003086485A JP 2004296245 A JP2004296245 A JP 2004296245A
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JP
Japan
Prior art keywords
heat
support member
led
led element
led lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003086485A
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Japanese (ja)
Inventor
Masao Yamaguchi
Ryoji Yokoya
昌男 山口
良二 横谷
Original Assignee
Matsushita Electric Works Ltd
松下電工株式会社
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Publication date
Application filed by Matsushita Electric Works Ltd, 松下電工株式会社 filed Critical Matsushita Electric Works Ltd
Priority to JP2003086485A priority Critical patent/JP2004296245A/en
Publication of JP2004296245A publication Critical patent/JP2004296245A/en
Application status is Pending legal-status Critical

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/02Globes; Bowls; Cover glasses characterised by the shape
    • F21K9/135
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/777Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/51Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00Refractors for light sources
    • F21V5/007Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/30Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED lamp that can suppress temperature increase of an LED element. <P>SOLUTION: The LED lamp 100 is constructed of an LED element 1, a support member 2 for supporting a mounting board 7 to mount the LED element 1, and a bulb 8 for housing the mounting board 7. The support member 2 is formed in nearly cylindrical shape by a material of, for example, aluminum, and its base part 2a is connected to a base 3. The base 3 is one used for general electric bulb and a screw groove is formed using a material of iron or the like. A plurality of heat radiating holes 2c for discharging the air entered from the top end part 2b of the support member 2 is provided in the vicinity of the power supply part 4 of the support member 2. The bulb 8 housing the mounting board 7 is made of resin material and formed in nearly spherical shape, and has a pair of holes 8a facing each other at the bulb wall, and the support member 2 penetrates through the pair of holes 8a. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【0001】 [0001]
【発明の属する技術分野】 BACKGROUND OF THE INVENTION
本発明は、LEDランプに関するものである。 The present invention relates to LED lamps.
【0002】 [0002]
【従来の技術】 BACKGROUND OF THE INVENTION
この種の従来例として、特開2001−243809号公報に示されるものがある。 As a conventional example of this kind, there is one disclosed in JP 2001-243809. このものは、一端に口金が設けられ、他端の開口部に向けてラッパ状に拡がるラッパ状金属放熱部と、このラッパ状金属放熱部の開口部に取り付けられた透光性カバーと、前記ラッパ状金属放熱部と前記透光性カバーにより形成された略球体の内部に設けられた金属基板と、この金属基板の前記透光性カバーに対向する外面に実装されたLED素子とを備えたものである。 This compound, mouthpiece provided at one end, a trumpet-shaped metal radiating portion extending in a trumpet shape towards the opening of the other end, and the translucent cover attached to the opening of the trumpet-shaped metal heat sink portion, wherein a metal substrate provided inside the substantially spherical body formed by the translucent cover and horn-shaped metal heat radiating portion, and a LED element mounted on an outer surface which faces the light-transmitting cover of the metal substrate it is intended. この構成により、LED素子に発生した熱は、略球体内での対流などにより放熱されるほか、金属基板から高熱伝導部材を介してラッパ状金属放熱部に流れ、ラッパ状金属放熱部から外部の空気に放熱される。 With this configuration, heat generated in the LED elements, in addition to being dissipated by such convection in substantially the sphere flow like a trumpet metal heat radiating portion of the metal substrate via the high thermal conductivity member, external from the trumpet-like metal heat radiating portion It is radiated to the air.
【0003】 [0003]
【特許文献1】 [Patent Document 1]
特開2001−243809号公報【0004】 Japanese Unexamined Patent Publication No. 2001-243809 Publication [0004]
【発明が解決しようとする課題】 [Problems that the Invention is to Solve
前記従来例によれば、簡単な冷却構造により、LED素子の発熱を抑制して発光効率を高くすることができる。 According to the prior art, by a simple cooling structure, it is possible to increase the luminous efficiency by suppressing heat generation of the LED elements.
【0005】 [0005]
しかしながら、LED素子を高密度実装する場合などにおいては、LED素子の寿命の確保及び発光効率の向上の点から、さらに放熱効果を高めLED素子の温度を抑制することが望ましい。 However, in a case of high-density mounting the LED element, from the viewpoint of improving the securing and luminous efficiency of the lifetime of the LED element, it is desirable to suppress the addition temperature of the LED element improved heat dissipation efficiency.
【0006】 [0006]
本発明は、かかる事由に鑑みてなしたものであり、その目的とするところは、LED素子の温度上昇を抑制することのできるLEDランプを提供することである。 The present invention has no in view of the above circumstances, and its object is to provide an LED lamp capable of suppressing the temperature increase of the LED element.
【0007】 [0007]
【課題を解決するための手段】 In order to solve the problems]
請求項1に係る発明は、LED素子と、LED素子が実装される実装基板を支持する支持部材と、実装基板を収納するバルブと、を備えるLEDランプにおいて、バルブ壁に対向する一対の孔を設け、一対の孔にLED素子の熱を放熱させる放熱機能を有する支持部材を貫通させて設けたことを特徴とする。 The invention according to claim 1, an LED element, a support member for supporting the mounting board on which the LED element is mounted, a valve for accommodating the mounting board, the LED lamps with a pair of holes which faces the valve wall provided, characterized in that provided by penetrating the support member having a heat dissipation function to dissipate the heat of the LED element to the pair of holes.
【0008】 [0008]
請求項2に係る発明は、請求項1記載の発明において、前記LED素子は、支持部材の軸周りに複数実装されるものであることを特徴とする。 The invention according to claim 2 is the invention of claim 1, wherein the LED element is characterized in that it is intended to be more mounted around the axis of the support member.
【0009】 [0009]
請求項3に係る発明は、請求項1又は請求項2記載の発明において、前記支持部材を筒形状にし、支持部材内に空気の流れを発生させることにより、LED素子の熱を放熱させるようにしたことを特徴とする。 The invention according to claim 3 is the invention of claim 1 or claim 2, wherein the said support member in a tubular shape, by generating a flow of air in the support member, so as to radiate the heat of the LED element characterized in that it was.
【0010】 [0010]
請求項4に係る発明は、請求項1又は請求項2記載の発明において、前記支持部材はヒートパイプからなり、ヒートパイプで伝熱させることにより、LED素子の熱を放熱させるようにしたことを特徴とする。 The invention according to claim 4, in the invention of claim 1 or claim 2, wherein said support member is made of the heat pipe, whereby heat is transferred by the heat pipe, that the heat of the LED element so as to heat radiation and features.
【0011】 [0011]
請求項5に係る発明は、請求項3又は請求項4記載の発明において、前記支持部材は、バルブから突出した部分に放熱フィンを有するものであることを特徴とする。 The invention according to claim 5, characterized in that in the invention of claim 3 or claim 4, wherein said support member is characterized in that it is one that has a radiating fin portion protruding from the valve.
【0012】 [0012]
請求項6に係る発明は、請求項1乃至請求項5記載の発明において、周囲に照明用の反射板を備え、前記支持部材と反射板を熱的に接続したことを特徴とする。 The invention according to claim 6 is the invention of claims 1 to 5, further comprising a reflector for lighting the surroundings, the supporting member and the reflecting plate, characterized in that connected thermally.
【0013】 [0013]
請求項7に係る発明は、複数のLED素子と、複数のLED素子が実装される実装基板を支持する支持部材と、実装基板を収納するバルブと、を備えるLEDランプにおいて、ヒートパイプを実装基板に沿わすとともに、ヒートパイプをバルブから突出させることにより、LED素子が発生する熱をヒートパイプを介して伝熱させ、外部に放熱させるようにしたことを特徴とする【0014】 The invention according to claim 7, a plurality of LED elements, and a support member having a plurality of LED elements to support the mounting substrate is mounted, a valve for accommodating the mounting board, the LED lamps with mounting board a heat pipe together be along the, by protruding a heat pipe from the valve, the heat LED element generates via the heat pipe is a heat transfer, characterized in that so as to be radiated to the outside [0014]
【発明の実施の形態】 DETAILED DESCRIPTION OF THE INVENTION
(第1の実施形態) (First Embodiment)
第1の実施形態を図1に基づいて説明する。 The first embodiment will be described with reference to FIG. 図1(a)は、本実施形態のLEDランプ100の斜視図である。 Figure 1 (a) is a perspective view of the LED lamp 100 of this embodiment. 図1(b)は、本実施形態のLEDランプ100の断面図である。 Figure 1 (b) is a cross-sectional view of the LED lamp 100 of this embodiment.
【0015】 [0015]
本実施形態のLEDランプ100は、LED素子1と、LED素子1が実装される実装基板7を支持する支持部材2と、実装基板7を収納するバルブ8とを有して構成されている。 LED lamp 100 of this embodiment, the LED element 1, a supporting member 2 for supporting the mounting board 7 on which the LED element 1 is mounted, is configured to include a valve 8 for accommodating the mounting board 7.
【0016】 [0016]
LED素子1は、チップ型のもので、例えば青色LEDと蛍光体用いた白色LEDである。 LED element 1 is of a chip type, for example, a blue LED and a phosphor white LED using. 支持部材2は、たとえばアルミ等の材料で略円筒形状に形成されてなるもので、その基端部2aが、口金3に接続されている。 The support member 2, for example, those formed by a substantially cylindrical shape with a material such as aluminum, the base end portion 2a is connected to the mouthpiece 3. 口金3は、一般の電球の口金に用いられるもので、鉄等の材料により、ネジ溝が形成されてなるものである。 Mouthpiece 3 is used for a cap of a general light bulb, a material such as iron, in which a thread groove is formed. そして、支持部材2の口金3近傍には、電源部4が設けられている。 Then, to the base 3 near the supporting member 2, the power supply unit 4 is provided. 電源部4は、口金3に印加される商用電源からの交流電圧を、直流電圧に変換してLED素子1に印加するもので、支持部材2の外側に向かって広がる傾斜面を有する電源基板ボックス4a内に、支持部材2の軸に対して直交するように設置される電源基板4bを収納している。 Power supply unit 4, the AC voltage from the commercial power source applied to the base 3, intended to be applied to the LED element 1 into a DC voltage, power supply board box having an inclined surface extending toward the outside of the support member 2 in the 4a, housing the installed the power board 4b so as to be orthogonal to the axis of the support member 2.
【0017】 [0017]
支持部材2の電源部4近傍には、支持部材2の先端部2bから流入した空気が流出する複数の放熱孔2cが設けられている。 The power supply unit 4 near the supporting member 2 has a plurality of heat radiation holes 2c of the air flowing from the support member 2 of the tip portion 2b flows out is provided. そして、放熱孔2cの口金3側近傍には、先端部2bから支持部材2内に流入した空気が、放熱孔2cから、スムーズに流出するように、先端部2bに向かって突出した凸部を有するガイド2dが設けられている。 Then, in the vicinity mouthpiece 3 side of the heat radiation holes 2c, air flowing from the tip 2b to the support member 2, the heat dissipation hole 2c, to flow out smoothly, the projected portion that projects toward the tip portion 2b guide 2d having are provided.
【0018】 [0018]
支持部材2の放熱孔2cと先端部2b間には、熱伝導絶縁シート(図示はしない)及びホルダー6を介してLED素子1が複数実装された実装基板7が配設されている。 Between louver 2c and the tip portion 2b of the support member 2 is thermally conductive insulating sheet (not shown) and the mounting substrate 7 on which the LED element 1 has a plurality of mounting through the holder 6 is disposed. 熱伝導絶縁シートは、例えばシリコン系のゴムに、鉄又はセラミック等の高熱伝導率のフィラーを混ぜたものである。 Thermally conductive insulating sheet, for example a rubber silicon, but mixed with filler having high thermal conductivity of iron or ceramic. なお、熱伝導絶縁シートに変えて、高熱伝導率のグリース又は接着剤を用いてもよい。 Incidentally, in place of the thermally conductive insulating sheet, it may be used grease or adhesive with high thermal conductivity. ホルダー6は、LED素子1が複数実装された実装基板7を保持するもので、高熱伝導率の材料により、支持部材2が貫通する孔を有して、略六角柱形状に形成されるものである。 Holder 6, in which the LED element 1 holds the mounting substrate 7 in which a plurality implemented, a material of high thermal conductivity, has a hole in which the support member 2 penetrates, those formed in a substantially hexagonal shape is there. そして、ホルダー6の支持部材2の軸に平行に位置する6つの各長方形面には、略長方形の実装基板7が配設されている。 Then, in each of the six rectangular surfaces of which lies parallel to the axis of the support member 2 of the holder 6, the mounting substrate 7 substantially rectangular are disposed. 実装基板7は、略長方形であり、複数のLED素子1が各実装基板7につき5個、支持部材2の軸に沿って実装されている。 Mounting the substrate 7 is substantially rectangular, five per plurality of LED elements 1 on the mounting substrate 7, are mounted along the axis of the support member 2. また、電源部4から各LED素子1に電力を供給するため、実装基板7と口金3を接続する配線(図示はしない)が、支持部材2内に設けられている。 Moreover, for supplying power from the power source unit 4 to the LED elements 1, wiring connecting the mounting substrate 7 and the base 3 (not shown) is provided in the support member 2.
【0019】 [0019]
バルブ8は、実装基板7を収納するもので、透光性の樹脂材料によりで略球形に形成され、バルブ壁に対向する一対の孔8aを有し、一対の孔8aには、支持部材2が貫通している。 Valve 8 is for accommodating the mounting board 7, the translucent resin material in which a substantially spherical shape, has a pair of holes 8a facing the valve wall, a pair of holes 8a, the support member 2 There has been through. また、支持部材2の先端部2bには、支持部材2内への埃等の浸入を防止するため、フィルタ5を設けている。 Further, the tip portion 2b of the support member 2, in order to prevent the intrusion of dust, etc. into the support member 2 is provided with a filter 5.
【0020】 [0020]
次に本実施形態のLEDランプ100の放熱作用について説明する。 It will be described heat dissipation effect of the LED lamp 100 of this embodiment. LEDランプ100が、支持部材2の先端部2bを垂下させて照明器具のソケット(図示はしない)に装着されることにより、商用電源に電気的に接続されると、電源部4は、商用電源から受けた交流電圧を直流電圧に変換して、各LED素子1に電力を供給し、これにより、各LED素子1は発光する。 LED lamp 100, by being mounted in the socket of the support member 2 of the tip portion 2b of the droop is allowed by the luminaire (not shown), when it is electrically connected to a commercial power supply, the power supply unit 4, a commercial power supply an AC voltage received from into a DC voltage, and supplies power to each LED element 1, whereby each LED element 1 emits light. ここで、LED素子1において光に変換されなかった電力は、熱損失となる。 Here, the power that is not converted to light in the LED element 1, the heat loss. そして、この熱は、実装基板7及びホルダー6を介して支持部材2に流れる。 Then, the heat flows into the support member 2 via a mounting substrate 7 and the holder 6. ここで、支持部材2内に存在する空気は、支持部材2に流れた熱により、暖められることにより浮力が生じ、口金3方向に向かう空気の流れが発生する。 Here, the air present in the support member 2, the flow in the supporting member 2 thermal buoyancy by being warmed occurs, the flow of air towards the mouthpiece 3 directions occur. そしてこの空気の流れは、ガイド2dに突き当たり、ガイド2dの凸部によって、支持部材2の軸方向に直交するように流れの方向を変える。 The flow of air strikes the guide 2d, by the convex portions of the guide 2d, changing the direction of flow so as to be perpendicular to the axial direction of the support member 2. そして、空気の流れは、放熱孔2cを通って、LEDランプ100の外部に放出される。 The air flow through the louvers 2c, is emitted to the outside of the LED lamp 100. また、支持部材2の先端部2bには、外部から新たな空気が流入する。 Further, the tip portion 2b of the support member 2, a new air introduced from the outside. この空気の流れにより、支持部材2内部の熱は、放熱孔2cから放出される。 This flow of air, the interior of the heat support member 2 is released from the heat dissipation hole 2c. これにより、LED素子1が発生する熱は、LEDランプ100の外部に放出されることになり、LED素子1がバルブ8に覆われていても、LED素子1の温度上昇を抑制することができる。 Thus, the heat from the LED element 1 is generated, will be released to the outside of the LED lamp 100, the LED element 1 is also covered by the valve 8, it is possible to suppress the temperature rise of the LED element 1 .
【0021】 [0021]
なお、本実施形態においては、バルブ8に樹脂材料を用いたがガラス等の透光性の材料であればよい。 In the present embodiment, may be a light-transmitting material is a resin material such as glass to the valve 8.
(第2の実施形態) (Second Embodiment)
第2の実施形態を図2に基づいて説明する。 The second embodiment will be described with reference to FIG. 図2(a)は、本実施形態のLEDランプ100の斜視図である。 Figure 2 (a) is a perspective view of the LED lamp 100 of this embodiment. 図2(b)は、本実施形態のLEDランプ100の断面図である。 Figure 2 (b) is a cross-sectional view of the LED lamp 100 of this embodiment.
【0022】 [0022]
本実施形態は、支持部材2の表面に放熱フィン10を設けた点が第1の実施形態と異なり、他は同じである。 This embodiment is the point of providing the heat radiation fins 10 on the surface of the support member 2 is different from the first embodiment, the other is the same. すなわち、支持部材2に設けた放熱孔2cとLED素子1が実装されたのホルダー6の間に、アルミ等の金属からなり、支持部材2の表面から放射状に広がる複数枚の羽を有する放熱フィン10を設けているのである。 That is, between the supporting member 2 to the heat radiation hole 2c and the holder 6 of the LED element 1 is mounted which is provided, heat dissipating fins having a plurality of blades made of a metal such as aluminum, radiating from the surface of the support member 2 10 is of the is provided. この羽の形状は略四辺形であり、その面は支持部材2の軸に平行に位置するように配設されている。 The wing shape is substantially quadrilateral, the surface is arranged to be positioned parallel to the axis of the support member 2.
【0023】 [0023]
この放熱フィン10を設けることにより、第1の実施形態で述べた熱の流れに加え、LED素子1が発生した熱は、実装基板7及びホルダー6を介して支持部材2に流れ、さらに放熱フィン10にまで熱が流れる。 By providing the radiating fin 10, in addition to the flow of heat as described in the first embodiment, the heat LED element 1 occurs, flow to the supporting member 2 through the mounting substrate 7 and the holder 6, further radiating fins heat flows up to 10. そして、放熱フィン10の表面からLEDランプ100の外部に熱が放熱されるのである。 Then, it is from the surface of the heat radiating fins 10 of the heat to the outside of the LED lamp 100 is radiated.
【0024】 [0024]
これにより、第1の実施形態で述べた放熱孔2cからの空気の放出による放熱のみの場合よりも、さらに放熱量を増加させることができることにより、LED素子1の温度上昇を抑制することが可能となる。 Thus, than in the case of the heat dissipation only by the release of air from the heat radiating hole 2c described in the first embodiment, by being able to further increase the heat dissipation, it is possible to suppress the temperature rise of the LED element 1 to become.
【0025】 [0025]
なお、本実施形態においては、放熱孔2cとホルダー6の間に、放熱フィン10を設けたが、放熱孔2cと電源部4との間に放熱フィン10を設けるようにしてもよい。 In the present embodiment, during the heat radiation hole 2c and the holder 6 is provided with the heat radiating fins 10 may be provided with radiation fins 10 between the heat radiation holes 2c and power source unit 4.
(第3の実施形態) (Third Embodiment)
第3の実施形態を図3に基づいて説明する。 The third embodiment will be described with reference to FIG. 図3は、本実施形態のLEDランプ100の断面図である。 Figure 3 is a cross-sectional view of the LED lamp 100 of this embodiment.
【0026】 [0026]
本実施形態は、支持部材としてヒートパイプ30を用いた点が第2の実施形態と異なり、他は同じである。 This embodiment, the point of using the heat pipe 30 as a supporting member is different from the second embodiment, the other is the same. ヒートパイプ30は、両端を封じたパイプに、冷却液が封入されてなるものである。 The heat pipe 30 is a pipe sealed at both ends, in which the cooling fluid is sealed. ここで、LEDランプ100は、口金3を下方向を向けて設置されている。 Here, LED lamp 100 is disposed a die 3 toward a downward direction.
【0027】 [0027]
第1の実施形態と同様に、LED素子1が発生した熱は、ホルダー6を介してヒートパイプ30に流れる。 Like the first embodiment, the heat LED element 1 occurs, flows through the heat pipe 30 via the holder 6. ホルダー6近傍に存在する冷却液は、LED素子1が発生する熱を受けて蒸発し、その蒸気はヒートパイプ30の先端部30bに移動する。 Coolant present near the holder 6 is evaporated by receiving heat from the LED element 1 is generated, the vapor moves to the distal end portion 30b of the heat pipe 30. 先端部30bは、外部の空気により冷却された状態にあるため、先端部30bに移動した蒸気は、その熱を奪われて凝縮され冷却液に戻り、ホルダー6近傍に移動する。 Tip 30b is due to the state of being cooled by the external air, steam which has moved to the distal end portion 30b is condensed deprived of its heat returns to the cooling liquid is moved in the vicinity of the holder 6. このサイクルを繰り返すことにより、LED素子1が発生する熱は、外部に放熱され、これによりLED素子1の温度上昇は抑制される。 By repeating this cycle, heat from the LED element 1 is generated is dissipated to the outside, thereby temperature increase of the LED element 1 is suppressed.
(第4の実施形態) (Fourth Embodiment)
第4の実施形態を図4に基づいて説明する。 The fourth embodiment will be described with reference to FIG. 図4は、本実施形態のLEDランプ100及びその周囲の断面図である。 Figure 4 is a cross-sectional view of the LED lamp 100 and its surroundings in the present embodiment.
【0028】 [0028]
本実施形態は、LEDランプ100の周囲に照明用の反射板40を備え、支持部材2と反射板40をばね状部材41により熱的に接続したものである。 This embodiment includes a reflection plate 40 for illumination around the LED lamp 100, which are connected thermally by a spring-like member 41 a reflecting plate 40 and the support member 2.
【0029】 [0029]
反射板40は、アルミ等の材料を用いて、略回転楕円形に形成されるもので、その内表面は、LED素子1から放射される光が反射するように、鏡面加工が施されている。 Reflective plate 40, using a material such as aluminum, those formed into a substantially spheroidal, its inner surface, as the light emitted from the LED element 1 is reflected, mirror processing is given . また、反射板40の中心軸上には、LEDランプ100が装着されるソケット9が設けられている。 Further, on the central axis of the reflector 40, a socket 9 of the LED lamp 100 is mounted is provided.
【0030】 [0030]
ばね状部材41は、支持部材2と反射板40の間で、口金3方向に湾曲して支持部材2と反射板40を熱的に接続するものである。 Spring-like member 41, between the supporting member 2 and the reflecting plate 40, a die 3 supported by curved in a direction member 2 and the reflecting plate 40 is intended to be connected thermally. また、反射板40の開口部40a近傍には、熱伝導絶縁シートからなるガイド42が設けられている。 Further, in the vicinity of the opening 40a of the reflector 40, the guide 42 made of a thermally conductive insulating sheet is provided.
【0031】 [0031]
この構成において、LED素子1が発生した熱は、実装基板7及びホルダー6を介して支持部材2に流れる。 In this arrangement, the heat LED element 1 occurs, flows into the support member 2 via a mounting substrate 7 and the holder 6. 支持部材2に流れた熱は、ばね状部材41及びガイド42を介して反射板40に流れ、反射板40の表面から外部に放熱される。 Heat flows into the support member 2 flows to the reflection plate 40 via the spring-like member 41 and the guide 42 is radiated to the outside from the surface of the reflector 40.
【0032】 [0032]
以上のようにばね状部材41を介して、LED素子1からの熱が反射板40に伝導して、反射板40で放出されるため、LED素子1の温度上昇を抑制することができるのである。 Through the spring-like member 41 as described above, heat from the LED element 1 is conducted to the reflecting plate 40, to be emitted by the reflector 40, than it is possible to suppress the temperature rise of the LED element 1 .
(第5の実施形態) (Fifth Embodiment)
第5の実施形態を図5に基づいて説明する。 The fifth embodiment will be described with reference to FIG. 図5(a)は、本実施形態の全体斜視図、図5(b)は、本実施形態の断面図である。 5 (a) is an overall perspective view of the embodiment, FIG. 5 (b) is a sectional view of this embodiment.
【0033】 [0033]
本実施形態のLEDランプ100は、複数のLED素子1と、複数のLED素子1が実装される実装基板7と、実装基板7を収納するバルブ8と、を有し、LEDランプ100を支持するガイド51及びベース52を備えるものである。 LED lamp 100 of this embodiment has a plurality of LED elements 1, a plurality of mounting substrates 7 on which the LED element 1 is mounted, the valve 8 for accommodating the mounting substrate 7, and supports the LED lamp 100 those comprising a guide 51 and the base 52.
【0034】 [0034]
具体的には、略長方形の実装基板7に複数のLED素子1が実装され、実装基板7と略同一サイズのホルダー6に密着して設置されている。 Specifically, a plurality of LED elements 1 on the mounting board 7 of a substantially rectangular mounting is installed in close contact with the mounting substrate 7 and the holder 6 of substantially the same size. ホルダー6は、熱伝導率の大きい金属、例えばアルミ、銅等の金属からなるものである。 Holder 6 is greater metal thermal conductivity, for example aluminum, is made of a metal such as copper. また、ホルダー6を実装基板7とで挟むように、ヒートパイプ30が設けられている。 Also, so as to sandwich the holder 6 with the mounting substrate 7, the heat pipe 30 is provided. 更に、LED素子1の前面には、レンズ53が装着されており、LED素子1及びホルダー6の周囲には、レンズ53を一部に含んだバルブ8により、密閉構造を形成している。 Further, on the front surface of the LED element 1, the lens 53 is mounted, around the LED element 1 and the holder 6 and the valve 8 which includes a portion of the lens 53 to form a sealed structure. また、ヒートパイプ30は、バルブ8から突出しており、ヒートパイプ30のバルブ8から突出した部分の表面には、放熱フィン10が設けられている。 Further, the heat pipe 30 protrudes from the valve 8, on the surface of the portion projecting from the valve 8 of the heat pipe 30, the heat radiation fins 10 are provided. さらに放熱フィン10の周囲には放熱孔56が複数設けられている。 Furthermore the periphery of the heat radiating fins 10 are provided plurality of radiation holes 56. 放熱フィン10の端部は、LEDランプ100を支持する樹脂からなる中空のガイド51に結合され、LEDランプ100及びガイド51を保持するベース52が、ガイド51に接続されている。 End of the radiation fin 10 is coupled to a hollow guide 51 made of resin for supporting the LED lamp 100, a base 52 for holding the LED lamp 100 and the guide 51 are connected to the guide 51.
【0035】 [0035]
以上の構成において、LED素子1が発生した熱は、ホルダー6を介してヒートパイプ30に流れる。 In the above configuration, the heat from the LED element 1 occurs, flows through the heat pipe 30 via the holder 6. ホルダー6近傍に存在する冷却液は、LED素子1が発生する熱を受けて蒸発し、その蒸気はヒートパイプ30の先端部30bに移動する。 Coolant present near the holder 6 is evaporated by receiving heat from the LED element 1 is generated, the vapor moves to the distal end portion 30b of the heat pipe 30. 先端部30bは、外部の空気により冷却された状態にあるため、先端部30bに移動した蒸気は、その熱を奪われて凝縮され冷却液に戻り、ホルダー6近傍に移動する。 Tip 30b is due to the state of being cooled by the external air, steam which has moved to the distal end portion 30b is condensed deprived of its heat returns to the cooling liquid is moved in the vicinity of the holder 6. このサイクルを繰り返すことにより、LED素子1が発生する熱は、外部に放熱されるのである。 By repeating this cycle, heat from the LED element 1 is generated, it being radiated to the outside.
(第6の実施形態) (Sixth Embodiment)
第6の実施形態を図6に基づいて説明する。 The sixth embodiment will be described with reference to FIG. 図6(a)は、本実施形態のLEDランプの斜視図、図6(b)は、本実施形態の断面図である。 6 (a) is a perspective view of the LED lamp of this embodiment, FIG. 6 (b) is a sectional view of this embodiment.
【0036】 [0036]
本実施形態は、LEDランプ100とガイド51とを接続するコネクタ54を設け、放熱フィン10を、ガイド51の内部に設けたものである。 This embodiment, the connector 54 for connecting the LED lamp 100 and the guide 51 is provided, the radiating fin 10, but on the inside of the guide 51. さらに、コネクタ54の端部には、LEDランプ100を回転させる回転機構55が設けられている。 Furthermore, the end of the connector 54, the rotation mechanism 55 is provided for rotating the LED lamp 100.
【0037】 [0037]
なお、放熱作用については、第5の実施形態と同じであるが、ガイド51内部に放熱フィン10を内在させたことにより、LEDランプ100がコンパクトになるという効果がある。 Note that the heat radiation effect is the same as the fifth embodiment, by internalized radiation fins 10 inside the guide 51, there is an effect that the LED lamp 100 can be made compact.
【0038】 [0038]
なお、本実施形態においては、放熱フィン10を、ガイド51の内部に設けたが、図7に示すように、ガイド51内部に放熱フィン10を設け、さらにガイド51の両端部に放熱孔56を設けてもよい。 In the present embodiment, the radiating fin 10, is provided inside the guide 51, as shown in FIG. 7, the provided radiating fin 10 inside the guide 51, the heat dissipation holes 56 in both the end portions of the guide 51 it may be provided. この場合には、放熱フィン10が発生する熱により、放熱フィン10近傍の空気に浮力が生じ、この空気が放熱孔56から外部に流出することにより、放熱効果を高めることが可能となる。 In this case, the heat radiation fins 10 is generated, buoyancy is generated in the radiating fin 10 near the air by the air flowing out from the louvers 56, it is possible to enhance the heat dissipation effect.
【0039】 [0039]
【発明の効果】 【Effect of the invention】
請求項1に係る発明は、LED素子と、LED素子が実装される実装基板を支持する支持部材と、実装基板を収納するバルブと、を備えるLEDランプにおいて、バルブ壁に対向する一対の孔を設け、一対の孔にLED素子の熱を放熱させる放熱機能を有する支持部材を貫通させて設けるようにしたので、熱が支持部材を介して流れて放熱されることにより、LED素子の温度を抑制することができる。 The invention according to claim 1, an LED element, a support member for supporting the mounting board on which the LED element is mounted, a valve for accommodating the mounting board, the LED lamps with a pair of holes which faces the valve wall provided, since the provided by penetrating the support member having a heat dissipation function to dissipate the heat of the LED element to the pair of holes, by which heat is dissipated flows through the support member, suppress the temperature of the LED element can do.
【0040】 [0040]
請求項2に係る発明は、請求項1記載の発明において、前記LED素子は、支持部材の軸周りに複数実装されるものであることを特徴とする。 The invention according to claim 2 is the invention of claim 1, wherein the LED element is characterized in that it is intended to be more mounted around the axis of the support member.
【0041】 [0041]
請求項3に係る発明は、請求項1又は請求項2記載の発明において、前記支持部材を筒形状にし、支持部材内に空気の流れを発生させることにより、LED素子の熱を放熱させるようにしたので、LED素子が、発生する熱により空気の流れが発生し、支持部材の一端部から空気が流入し、他端部から空気が流出することにより、LED素子の温度を抑制することができる。 The invention according to claim 3 is the invention of claim 1 or claim 2, wherein the said support member in a tubular shape, by generating a flow of air in the support member, so as to radiate the heat of the LED element since the, LED elements, the flow of air generated by the heat generated, air flows from one end of the support member, by the air flowing out from the other end, it is possible to suppress the temperature of the LED element .
【0042】 [0042]
請求項4に係る発明は、請求項1又は請求項2記載の発明において、前記支持部材はヒートパイプからなり、ヒートパイプで伝熱させることにより、LED素子の熱を放熱させるようにしたので、ヒートパイプ内の冷却液が、ヒートパイプ端部で冷却されることにより、LED素子の温度を抑制することができる。 The invention according to claim 4, in the invention of claim 1 or claim 2, wherein said support member is made of the heat pipe, whereby heat is transferred by the heat pipe, since the heat of the LED element so as to heat radiation, coolant in the heat pipe, by being cooled by a heat pipe end portion, it is possible to suppress the temperature of the LED element.
【0043】 [0043]
請求項5に係る発明は、請求項3又は請求項4記載の発明において、前記支持部材は、バルブから突出した部分に放熱フィンを有するものであるようにしたので、放熱フィンからの放熱量が増加するため、請求項1に比して、更に冷却効果を高めることができる。 The invention according to claim 5 is the invention of claim 3 or claim 4, wherein said support member. Thus those having a heat radiating fin portion protruding from the valve, the amount of heat released from the heat radiation fins to increase, compared to claim 1, it is possible to further enhance the cooling effect.
【0044】 [0044]
請求項6に係る発明は、請求項1乃至請求項5記載の発明において、周囲に照明用の反射板を備え、前記支持部材と反射板を熱的に接続したので、接続部材を介して、LED素子からの熱が反射板に伝導して、反射板で放出されるため、一層冷却効果を高めることができる。 The invention according to claim 6, in the invention of claims 1 to 5, further comprising a reflector for lighting the surroundings, since the supporting member and the reflecting plate is thermally connected to, via a connecting member, since the heat from the LED element is conducted to the reflector is released in the reflective plate, it is possible to further enhance a cooling effect.
【0045】 [0045]
請求項7に係る発明は、複数のLED素子と、複数のLED素子が実装される実装基板を支持する支持部材と、実装基板を収納するバルブと、を備えるLEDランプにおいて、ヒートパイプを実装基板に沿わすとともに、ヒートパイプをバルブから突出させることにより、LED素子が発生する熱をヒートパイプを介して伝熱させ、外部に放熱させるようにしたので、LEDランプをコンパクトにすることができる。 The invention according to claim 7, a plurality of LED elements, and a support member having a plurality of LED elements to support the mounting substrate is mounted, a valve for accommodating the mounting board, the LED lamps with mounting board a heat pipe together be along the, by protruding a heat pipe from the valve, the heat LED element generates via the heat pipe is a heat transfer. Thus is released to the outside, it can be a LED lamp compact.
【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS
【図1】(a)は、第1の実施形態のLEDランプ100の斜視図、(b)は、同LEDランプ100の断面図である。 1 (a) is a perspective view of the LED lamp 100 of the first embodiment, (b) is a cross-sectional view of the LED lamp 100.
【図2】(a)は、第2の実施形態のLEDランプ100の斜視図、(b)は、同LEDランプ100の断面図である。 2 (a) is a perspective view of the LED lamp 100 of the second embodiment, (b) is a cross-sectional view of the LED lamp 100.
【図3】第3の実施形態のLEDランプ100の断面図である。 3 is a cross-sectional view of the LED lamp 100 of the third embodiment.
【図4】第4の実施形態のLEDランプ100及びその周囲の断面図である。 4 is a cross-sectional view of the LED lamp 100 and around the fourth embodiment.
【図5】(a)は、第5の実施形態の斜視図、(b)は、同断面図である。 5 (a) is a perspective view of a fifth embodiment, (b) are the same sectional view.
【図6】(a)は、第6の実施形態の斜視図、(b)は、同断面図である。 6 (a) is a perspective view of an embodiment of the 6, (b) is a similar cross-sectional view.
【図7】(a)は、第6の実施形態の別例の斜視図、(b)は、同別例の断面図である。 7 (a) is a perspective view of another example embodiment of the 6, (b) is a cross-sectional view of the alternative embodiment.
【符号の説明】 DESCRIPTION OF SYMBOLS
1 LED素子2 支持部材2a 基端部2b 先端部2c 放熱孔2d ガイド3 口金4 電源部6 ホルダー7 実装基板8 バルブ8a 孔 1 LED element 2 supporting member 2a proximal end 2b tip 2c heat radiation holes 2d guide 3 mouthpiece 4 power unit 6 holder 7 mounted board 8 valve 8a hole

Claims (7)

  1. LED素子と、LED素子が実装される実装基板を支持する支持部材と、実装基板を収納するバルブと、を備えるLEDランプにおいて、バルブ壁に対向する一対の孔を設け、一対の孔にLED素子の熱を放熱させる放熱機能を有する支持部材を貫通させて設けたことを特徴とするLEDランプ。 And LED element, a support member for supporting the mounting board on which the LED element is mounted, a valve for accommodating the mounting board, the LED lamps with a pair of holes which faces the valve wall is provided, the LED element to the pair of holes LED lamp supporting member to penetrate, characterized in that provided with a heat radiation function to dissipate the heat.
  2. 前記LED素子は、支持部材の軸周りに複数実装されるものであることを特徴とする請求項1記載のLEDランプ。 The LED device of claim 1, wherein the LED lamp, characterized in that the shaft around the support member is intended to be more implemented.
  3. 前記支持部材を筒形状にし、支持部材内に空気の流れを発生させることにより、LED素子の熱を放熱させるようにしたことを特徴とする請求項1又は請求項2記載のLEDランプ。 Wherein the support member is in a cylindrical shape, by generating a flow of air in the support member, according to claim 1 or claim 2, wherein the LED lamp is characterized in that the heat of the LED element so as to heat radiation.
  4. 前記支持部材はヒートパイプからなり、ヒートパイプで伝熱させることにより、LED素子の熱を放熱させるようにしたことを特徴とする請求項1又は請求項2記載のLEDランプ。 Said support member is made of the heat pipe, whereby heat is transferred by the heat pipe, according to claim 1 or claim 2, wherein the LED lamp is characterized in that the heat of the LED element so as to heat radiation.
  5. 前記支持部材は、バルブから突出した部分に放熱フィンを有するものであることを特徴とする請求項3又は請求項4記載のLEDランプ。 Wherein the support member, according to claim 3 or claim 4, wherein the LED lamp is characterized in that those having a heat dissipating fin portion protruding from the valve.
  6. 周囲に照明用の反射板を備え、前記支持部材と反射板を熱的に接続したことを特徴とする請求項1乃至請求項5記載のLEDランプ。 A reflecting plate for illumination around, claims 1 to 5, wherein the LED lamp, characterized in that the supporting member and the reflector are connected thermally.
  7. 複数のLED素子と、複数のLED素子が実装される実装基板を支持する支持部材と、実装基板を収納するバルブと、を備えるLEDランプにおいて、ヒートパイプを実装基板に沿わすとともに、ヒートパイプをバルブから突出させることにより、LED素子が発生する熱をヒートパイプを介して伝熱させ、外部に放熱させるようにしたことを特徴とするLEDランプ。 A plurality of LED elements, and a support member having a plurality of LED elements to support the mounting substrate is mounted, a valve for accommodating the mounting board, the LED lamps with, together to extend along the heat pipe to the mounting substrate, a heat pipe by protruding from the valve, the heat LED element generates via the heat pipe is a heat transfer, LED lamp is characterized in that so as to be radiated to the outside.
JP2003086485A 2003-03-26 2003-03-26 Led lamp Pending JP2004296245A (en)

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