JP2000031546A - Led aggregate module - Google Patents

Led aggregate module

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Publication number
JP2000031546A
JP2000031546A JP10193048A JP19304898A JP2000031546A JP 2000031546 A JP2000031546 A JP 2000031546A JP 10193048 A JP10193048 A JP 10193048A JP 19304898 A JP19304898 A JP 19304898A JP 2000031546 A JP2000031546 A JP 2000031546A
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JP
Japan
Prior art keywords
led
base
heat
surface
portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10193048A
Other languages
Japanese (ja)
Inventor
Yasuo Imai
Kenichi Ishii
Takashi Kobayashi
Shigeru Myodo
康雄 今井
小林  孝
成 明道
健一 石井
Original Assignee
Mitsubishi Electric Corp
Mitsubishi Electric Lighting Corp
三菱電機株式会社
三菱電機照明株式会社
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Application filed by Mitsubishi Electric Corp, Mitsubishi Electric Lighting Corp, 三菱電機株式会社, 三菱電機照明株式会社 filed Critical Mitsubishi Electric Corp
Priority to JP10193048A priority Critical patent/JP2000031546A/en
Publication of JP2000031546A publication Critical patent/JP2000031546A/en
Application status is Pending legal-status Critical

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/60Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PROBLEM TO BE SOLVED: To move heat generated from a LED or a LED element efficiently, also release outside, and restrict down a temperature of the LED or the LED element by a method wherein an elastic plate having high heat conductivity is disposed between one face of a stand and the other face of an insulation substrate. SOLUTION: If a current flows in a LED 4, a LED element heats the LED 4 by a Joule heat, and this heat transmits to an insulation substrate 2 by conduction. Furthermore, heat transfers from this insulation substrate 2 to a stand 1 by conduction. The heat transfers is conducted smoothly from this insulation substrate 2 to the stand 1 by close adhesion of a rubber 5 between the stand 1 and the insulation substrate 2, and the heat transferring to the stand 1 diffuses to the stand 1. Thus, the heat conduction to the stand 1 is executed efficiently and also the heat transferred to the stand 1 can be diffused to the entire stand 1 for a short time. Furthermore, the heat released from the LED 4 is released efficiently and externally, and as a result, the temperature of the LED 4 is restricted down.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は長寿命光源であるL The present invention relates is a long life light source L
EDを使用した大光束の面発光光源に関し、特に屋外、 Relates Daiko surface emitting light source bundle using ED, particularly outdoors,
屋内の一般照明用として使用される照明器具や透過形看板の光源としてLEDを使用する場合のLED集合体モジュールの冷却方法に関するものである。 It relates a method of cooling LED assembly module when using an LED as a light source of the luminaire and transmission-type billboards that are used for general lighting indoors.

【0002】 [0002]

【従来の技術】従来、照明器具や透過形看板の光源として白熱電球、蛍光ランプ、HIDランプ(High Intensi Conventionally, incandescent light bulbs as the light source of the luminaire and transmissive signs, fluorescent lamps, HID lamps (High Intensi
ty Discharge Lamp:高圧放電ランプ)が使われている。 ty Discharge Lamp: high-pressure discharge lamps) have been is used.
これらの光源は充分な光束があるが、寿命は白熱電球で1000〜2000時間、蛍光ランプ及びHIDランプで6000〜12000時間程度であるため、寿命のたびに行われる交換の頻度は多い。 These light sources have a sufficient light flux, lifetime 1000 to 2000 hours incandescent lamp, because it is from 6,000 to 12,000 hours about a fluorescent lamp and HID lamps, the frequency of exchange that takes place each time the life often. 一方、他の光源としてLEDがあるが、LEDは寿命は長いものの、光束が低いため照明には適していない。 On the other hand, there is a LED as other light sources, LED although life long, not suitable for illumination because the light beam is low. しかし、電流を増やすことにより光束を増加させることができるため、一般には数mAから20mAの電流であるところを、電流を増やすことにより光束を増加させ、LED集合体を作成することにより充分な光束が得ることが期待できる。 However, it is possible to increase the luminous flux by increasing the current, generally the place is 20mA of current of several mA, increased luminous flux by increasing the current, sufficient light flux by creating a LED aggregate It can be expected to get. しかしながら、電流を増やすと、LED素子部の温度が高くなってしまい、効率と寿命の低下につながるため実際には電流を増加させることはできなかった。 However, increasing the current, it causes the temperature of the LED element portion becomes high, in practice this can reduce the efficiency and lifetime could not be to increase the current.

【0003】ここで、LEDの一例としてパッケージされたLEDの断面図を図13に示す。 [0003] Here, a LED of a cross-sectional view packaged as an example of the LED in FIG. 13. 図13において、 13,
31は基板、32は基板31に形成された配線パターン、12は基板31に載置され、ワイヤ33により配線パターン32に電気的に接続されたベアチップとしてのLED素子、13はLED素子12及びワイヤ33を隙間なく覆うようにして設けられた保護層で、外部から機械的、電気的に保護するための透明なエポキシ樹脂で構成されている。 31 denotes a substrate, 32 is a wiring pattern formed on the substrate 31, 12 is placed on the substrate 31, LED element as a bare chip that is electrically connected to the wiring pattern 32 by a wire 33, 13 LED elements 12 and the wires 33 so as to cover no gap with a protective layer which is provided with, is made of a transparent epoxy resin for mechanically, electrically protected from the outside. 34は保護層13、基板31等を機械的に保持しているモールド部品で、これら基板31、配線パターン32、ワイヤ33、LED素子12及び保護層13によりパッケージされたLED4は構成される。 34 protective layer 13, a substrate 31 such as by a mold part which is mechanically held, the substrates 31, the wiring patterns 32, LED 4 packaged by a wire 33, LED element 12 and the protective layer 13 is formed.

【0004】図14は図13のLEDが縦横に配列されて構成されるLED集合体モジュールで、図14において、35は基板、36はこの基板35に形成された電路で、LED4は電路36にはんだで電気的に接続されている。 [0004] Figure 14 is a LED assembly module configured LED of FIG. 13 is arranged vertically and horizontally, in Fig. 14, 35 denotes a substrate, 36 is a path that is formed on the substrate 35, LED 4 is the path 36 It is electrically connected by soldering.

【0005】そして、このように構成されたLED4に電流を流すと、LED素子12はジュール熱によって発熱し、この熱は伝導の形で保護層13、基板31及び基板35に移動する。 [0005] Then, when an electric current is applied to the LED4 thus constructed, LED element 12 is heated by Joule heat, the heat is transferred to the protective layer 13, the substrate 31 and the substrate 35 in the form of conduction. 更に、保護層13の表面と、基板3 Further, the surface of the protective layer 13, the substrate 3
5の表面より放射、対流により外部に熱が放出される。 5 of the surface from radiation, heat is released to the outside by convection.
この放出量とLED素子12からの発熱量が等しくなるまでLED素子12の温度は上昇する。 Temperature of the LED element 12 to the heat value from the discharge amount and the LED element 12 is equal to rise.

【0006】図15は金属ベースエポキシモールドLE [0006] Figure 15 is a metal base epoxy mold LE
Dの断面図であり、図15において、41は金属ベース、42は金系のはんだ材で、LED素子12ははんだ材42などで直接金属ベース41にダイボンディングされている。 Is a cross-sectional view and D, 15, 41 metal base, 42 a solder material gold-based, LED element 12 is die-bonded to the metal base 41 directly solder material 42. ワイヤ33はLED素子12の上部電極とリード線43を電気的に接続している。 Wire 33 electrically connects the upper electrode and the lead wire 43 of the LED elements 12. 44はリード線4 44 lead wire 4
3を金属ベース41と絶縁するための絶縁物、45は金属ベース41と導通状態にあるリード線で、これら金属ベース41、はんだ材42、ワイヤ33、リード線4 3 an insulator for insulating the metal base 41, 45 is a lead wire which is in conduction with the metal base 41, the metal base 41, a solder material 42, wire 33, lead wires 4
3,45、絶縁物44、保護層13により金属ベースエポキシモールドLED4は構成されており、はんだで基板35に接続されている。 3,45, insulator 44, a metal base epoxy mold LED4 is constituted by the protective layer 13, and is connected to the substrate 35 by soldering. なお、図13及び図14に示すパッケージされたLED4と図15の金属ベースエポキシモールドLED4は、構成は異なるもののどちらもLED素子12を備えた光源である点から同一符号を付し、以下の実施の形態においてLED4と記す。 The metal-based epoxy mold LED4 of LED4 and 15 packaged shown in FIGS. 13 and 14, the configuration will be denoted by the same reference numerals terms is a light source with an LED element 12 either though different, the following embodiments referred to as the LED4 in the form. 図16 Figure 16
はこの金属ベースエポキシモールドLEDを基板に複数個実装したLED集合体モジュールである。 Is a LED assembly module in which a plurality implement this metal base epoxy mold LED on the substrate.

【0007】図16においてLED素子12に電流を流すと、該LED素子12はジュール熱によって発熱し、 [0007] When a current to the LED element 12 in FIG. 16, the LED elements 12 generates heat by Joule heat,
この熱は金系のはんだ材42に伝導し、更に金属ベース41に伝導する。 This heat is conducted to the soldering material 42 of gold-based, further conducted to the metal base 41. 金属ベース41の熱伝導率は小さいためリード線45も含めてほぼ一様な温度になり、一部は基板35に伝導して基板35の表面から放射、対流の形で外部に熱を放出し、一部は金属ベース41の表面から放射、対流の形で外部に熱を放出する。 Leads 45 for the thermal conductivity is less of the metal base 41 becomes substantially uniform temperature, including some heat release from the surface of the substrate 35 radiation, outside in the form of convection and conduction to the substrate 35 , some radiation from the surface of the metal base 41, releasing heat to the outside in the form of convection. 熱放出のもう一つの経路はLED素子12から直接保護層13に伝導し、この保護層13の表面から放射、対流の形で外部に熱を放出する径路である。 Another path of heat release is conducted directly to the protective layer 13 from the LED element 12, the radiation from the surface of the protective layer 13, a path for releasing the heat to the outside in the form of convection.

【0008】 [0008]

【発明が解決しようとする課題】しかしながら、LED The object of the invention is to, however, LED
から外部へ放出される熱放出量には限界があるという問題点があった。 The heat emission amount emitted to the outside from a problem that there is a limit. このため、LEDに大電流を流すことができなかった。 For this reason, it was not possible to pass a large current to the LED.

【0009】ここで、従来のLED集合体モジュールの熱問題を定量化するために図13を例に熱モデルを作ると図17のようになり、式でまとめるとQ×(R1 +R [0009] Here, when making a thermal model in Examples 13 to quantify the thermal problems of the conventional LED assembly module is shown in Figure 17, summary by the formula Q × (R1 + R
2 +R3 +R4 +R5 +R6 )=△Tとなる。 2 + R3 + R4 + R5 + R6) = △ the T. ここで、 Q:LED素子12の発熱量(W) R1 :金属ベース41の熱抵抗(K/W) R2 :基板35の板厚方向の熱抵抗(K/W) R3 :基板35の長手方向の熱抵抗(K/W) R4 :基板35の端面から外部への熱抵抗(K/W) R5 :基板35の下側外表面から外部への熱抵抗(K/ Here, Q: calorific value of the LED element 12 (W) R1: Thermal resistance (K / W) of the metal base 41 R2: plate thickness direction of the heat resistance of the substrate 35 (K / W) R3: the longitudinal direction of the substrate 35 resistance of heat (K / W) R4: thermal resistance to the outside from the end face of the substrate 35 (K / W) R5: thermal resistance from lower outer surface of the substrate 35 to the outside (K /
W) R6 :保護層13の外表面から外部への熱抵抗(K/ W) R6: thermal resistance from the outer surface of the protective layer 13 to the outside (K /
W) △T:温度上昇値(K) R1 =L1 /(λ1 ×A1 ) R2 =L2 /(λ2 ×A2 ) R3 =L3 /(λ3 ×A3 ) L1 :金属ベース41の代表長さ(m) L2 :基板35の板厚方向代表長さ(m) L3 :基板35の長手方向代表長さ(m) λ1 :金属ベース41の熱伝導率(W/( m・K) ) λ2 、λ3 :基板35の熱伝導率(W/( m・K) ) A1 :基板35の下側外表面面積(m 2 ) A2 :基板35の板厚方向面積(m 2 ) A3 :基板35の長手方向面積(m 2 ) R4 =1 /(h4 ×A2 ×φ) R5 =1 /(h5 ×A1 ×φ) R6 =1 /(h6 ×S6 ×φ) h4 :基板35の端面から外部への熱伝達率(W/( m W) △ T: Temperature rise value (K) R1 = L1 / (λ1 × A1) R2 = L2 / (λ2 × A2) R3 = L3 / (λ3 × A3) L1: representative length of the metal base 41 (m) L2: thickness direction representative length of the substrate 35 (m) L3: longitudinal representative length of the substrate 35 (m) λ1: the thermal conductivity of the metal base 41 (W / (m · K)) λ2, λ3: substrate thermal conductivity of 35 (W / (m · K )) A1: lower outer surface area of the substrate 35 (m 2) A2: thickness direction area of the substrate 35 (m 2) A3: longitudinal area of the substrate 35 ( m 2) R4 = 1 / ( h4 × A2 × φ) R5 = 1 / (h5 × A1 × φ) R6 = 1 / (h6 × S6 × φ) h4: heat transfer rate to the outside from the end face of the substrate 35 ( W / (m
2・K) ) h5 :基板35の下側外表面から外部への熱伝達率(W 2 · K)) h5: heat transfer coefficient from the lower outer surface of the substrate 35 to the outside (W
/( m 2・K) ) h6 :保護層13の外表面から外部への熱伝達率(W/ / (M 2 · K)) h6: heat transfer coefficient from the outer surface to the outside of the protective layer 13 (W /
( m 2・K) ) S6 :保護層13の外表面面積(m 2 ) φ:フィン効率 (M 2 · K)) S6 : the outer surface area of the protective layer 13 (m 2) φ: fin efficiency

【0010】となる。 The [0010]. これよりLED素子12の温度上昇を抑えるためには、LED集合体モジュール外殻への効率的熱移動と外殻から外部への熱放出のし易さを検討すればよいことがわかる。 In order to suppress the temperature rise of the LED element 12 from which it is understood that it is sufficient considering the heat dissipation ease to the outside efficiently from the heat transfer and the outer shell of the LED assembly module shell. すなわち、基板35の熱抵抗を減らし、外殻の表面積を増やし、熱伝達率を増やし、 That reduces the thermal resistance of the substrate 35, increasing the surface area of ​​the outer shell, increasing the heat transfer coefficient,
更にフィン効率を上げればよいことがわかる。 Furthermore it is understood that may be increased fin efficiency.

【0011】本発明は上記のような課題を解消するためになされたもので、LED又はLED素子から発生する熱を効率的に移動させることができ、また、外部へ容易に放出させることができ、LED又はLED素子の温度を低く抑えることが可能なLED集合体モジュールを提供することを目的とする。 [0011] The present invention has been made to solve the above problems, it is possible to transfer heat generated from the LED or the LED element efficiently, also can be easily released to the outside , and to provide a LED assembly module that can reduce the temperature of the LED or LED elements.

【0012】 [0012]

【課題を解決するための手段】本発明の第1発明に係るLED集合体モジュールは、金属製の基台と、絶縁基板と、絶縁基板の一方の面に配置された複数のLEDと、 Means for Solving the Problems] LED assembly module according to a first aspect of the present invention, a metal base, an insulating substrate, a plurality of LED disposed on one surface of the insulating substrate,
基台の一方の面と絶縁基板の他方の面との間に密着するように配置された熱伝導率の高い弾性板とを備えたものである。 Those having a high elastic plate having arranged thermal conductivity so as to seal between the one surface of the base and the other surface of the insulating substrate.

【0013】第2発明に係るLED集合体モジュールは、金属製の基台と、基台の一方の面に一体的に形成され、かつ基台とは反対側の面に電路が形成された絶縁層と、絶縁層に形成された電路に電気的に接続された複数のLED素子と、電路及びLED素子を覆うようにして設けられた保護層とを備えたものである。 [0013] LED assembly module according to the second invention, a metal base, it is integrally formed on one surface of the base, and isolation path is formed on the surface opposite to the base a layer, those having a plurality of LED elements that are electrically connected to the electrical path formed in the insulating layer, and a protective layer provided so as to cover the path and LED elements.

【0014】第3発明に係るLED集合体モジュールは、金属製の基台と、基台の一方の面にダイボンディングされた複数のLED素子と、LED素子を覆うようにして設けられた保護層とを備えたものである。 [0014] LED assembly module according to a third invention, a metallic base, a plurality of LED elements are die-bonded to one surface of the base, a protective layer provided so as to cover the LED element it is those with a door.

【0015】第4発明は、第1乃至第3発明のいずれかのLED集合体モジュールにおいて、基台の他方の面側に、当該面から突出した複数の放熱部を一体的に形成したものである。 [0015] The fourth invention is the first to one of the LED assembly module of the third aspect of the present invention, on the other side of the base, which was formed integrally with a plurality of heat radiating portion projecting from the surface is there.

【0016】第5発明は、第4発明のLED集合体モジュールにおいて、少なくとも一方の対向する端辺の中央部に挟まれる領域から突出した放熱部の高さを端辺の周辺部に挟まれる領域から突出した放熱部より高く形成したものである。 The region fifth invention, in the LED assembly module of the fourth aspect of the present invention, sandwiched between the height of the heat radiating portion projecting from the region between the central portion of the end side at least one face the peripheral portion of the end edge it is obtained higher formed from the heat radiating portion projecting from.

【0017】第6発明は、第1乃至第3発明のいずれかのLED集合体モジュールにおいて、基台は、基台内部に形成され、作動液が封入された中空部を備えたものである。 [0017] The sixth invention is the first to one of the LED assembly module of the third aspect of the present invention, the base is formed inside the base, the hydraulic fluid is one with a hollow portion which is sealed.

【0018】第7発明は、第1乃至第3発明のいずれかのLED集合体モジュールにおいて、基台は、平板部と、平板部の少なくとも一方の対向する端辺から突出した一対の突出部と、平板部と突出部の内部に両者が連通するように形成され、作動液が封入された中空部とを備えたものである。 [0018] The seventh invention is the first to one of the LED assembly module of the third aspect of the present invention, the base includes a flat plate portion, a pair of projecting portions projecting from at least one of the opposite edge of the flat plate portion , both inside the protrusion flat plate portion is formed to communicate hydraulic fluid is one with a hollow portion which is sealed.

【0019】第8発明は、第4発明又は第5発明のLE The eighth invention, LE of the fourth aspect or the fifth invention
D集合体モジュールにおいて、基台は、放熱部の相互に連通するように形成され、作動液が封入された中空部を備えたものである。 In D assembly module, the base is formed to communicate with each other of the heat radiating portion, the hydraulic fluid is one with a hollow portion which is sealed.

【0020】第9発明は、第7発明のLED集合体モジュールにおいて、突出部に近接してファンを配置したものである。 The ninth invention is the LED assembly module of the seventh aspect of the present invention is obtained by placing the fan in close proximity to the projection.

【0021】第10発明は、第1乃至第9発明のいずれかのLED集合体モジュールにおいて、基台の他方の面に、他方の面の放射率を高めるための塗膜を施したものである。 [0021] The tenth invention is the first to one of the LED assembly module of the ninth aspect of the present invention, on the other surface of the base, were subjected to coating to increase the emissivity of the other surface .

【0022】第11発明は、第2乃至第10発明のいずれかのLED集合体モジュールにおいて、保護層を赤外線透過特性を有する樹脂製としたものである。 The eleventh invention is the second to either the LED assembly module of the tenth aspect of the present invention is obtained by a resin having an infrared transmission property of the protective layer.

【0023】 [0023]

【発明の実施の形態】実施の形態1. DETAILED DESCRIPTION OF THE INVENTION Embodiment 1. 図1は本発明の実施の形態1を示す斜視図、図2は図1の断面図である。 Figure 1 is a perspective view showing a first embodiment of the present invention, FIG 2 is a cross-sectional view of FIG.
なお、図1、図2及び後述の図において、従来例と同一のものは同一符号を付し説明を省略する。 Incidentally, in the figures of FIGS. 1, 2 and later, the conventional example same as those not described bear the same reference numerals. 1はヒートシンク(冷却用放熱器)として機能する金属製の基台で、 1 is a metal base which acts as a heat sink (a heat sink),
熱抵抗が非常に小さいものである。 Thermal resistance is very small. 2はこの基台1の一方の面側に配置された4枚の絶縁基板で、一方の面(前記基台1と反対側の面)には電路(図示せず)が形成され、この電路にLED4がはんだで電気的に接続されている。 2 is a four insulating substrate disposed on one surface of the base 1, (not shown) tracks the one surface (surface opposite to the base 1) is formed, the path LED4 are electrically connected by solder. 3は基台1の他方の面側に施され、基台1の熱放射率を高めるための塗膜で、この塗膜3により基台1の素地に比べ数十倍の放熱効果が得られる。 3 is applied to the other surface side of the base 1, with the coating to enhance the thermal emissivity of the base 1, ten times the heat dissipation effect number than the base material of the base 1 is obtained, this coating film 3 . 5は前記基台1の一方の面と絶縁基板2の他方の面との間に密着するように挟持された熱伝導率の高い弾性板としてのラバーで、熱伝導率を0.5(W/(m・K))以上とする。 5 is a rubber as a highly elastic plate of sandwich thermal conductivity so as to be in close contact between the one surface and the other surface of the insulating substrate 2 of the base 1, the thermal conductivity of 0.5 (W / (m · K)) more than that.
6はLED4を含む絶縁基板2全体を覆う透明なプラスチックカバーであり、該プラスチックカバー6の面全体には、光を拡散して面全体の輝度を一様にするためのしぼ加工が施されている。 6 is a transparent plastic cover which covers the entire insulating substrate 2 including the LED 4, the entire surface of the plastic cover 6 is graining for uniform brightness of the entire surface to diffuse the light is applied there. なお、基台1と絶縁基板2の熱膨張係数はほぼ同一であるものとする。 The thermal expansion coefficient of the base 1 and the insulating substrate 2 is assumed to be substantially identical.

【0024】次に本実施の形態1の動作を説明する。 [0024] Next will be described the operation of the first embodiment. L
ED4に電流を流すと、LED素子12はジュール熱によってLED4は発熱し、この熱は伝導により絶縁基板2に伝わる。 When an electric current is applied to the ED4, LED element 12 LED4 is heated by Joule heat, the heat is transferred to the insulating substrate 2 by conduction. 更に、この絶縁基板2から基台1に伝導により熱が移動する。 Further, heat is transferred by conduction from the insulating substrate 2 to the base 1. この絶縁基板2から基台1への熱移動は、ラバー5が基台1と絶縁基板2との間に密着していることにより接触熱抵抗が少なくなっているので、円滑に行われ、そして、基台1に移動した熱は、基台1の熱抵抗は非常に小さいため、基台1全体に拡散する。 The insulating heat transfer from the substrate 2 to the base 1, since the rubber 5 is made small thermal contact resistance by being in close contact between the base 1 and the insulating substrate 2, smoothly performed, and , heat transferred to the base 1, the thermal resistance of the base 1 is very small, diffuse across the base 1. この基台1は外表面(上記した基台1の他方の面)がヒートシンクとして働き、放射、外気対流により外部に熱を放出する。 The base 1 serves the outer surface (the other surface of the base 1 described above) as a heat sink, the radiation, releasing heat to the outside by the outside air convection. そして、LED4からの光はしぼ加工された前記プラスチックカバー6により拡散し、面全体の輝度が一様になる。 Light from LED4 is diffused by the plastic cover 6, which is graining, luminance of the entire surface is uniform.

【0025】本実施の形態1によれば、熱伝導率の高いラバー5を基台1と絶縁基板2に密着するように配置して接触熱抵抗を小さくしたので、基台1への熱伝導が効率よく行われ、また、基台1は熱抵抗が非常に小さいものとしたので、基台1に移動した熱を短時間で基台1全体に拡散させることができ、熱移動の効率を高めることができる。 According to the first embodiment, since the small thermal contact resistance arranged so as to be in close contact with high rubber 5 thermal conductivity to the base 1 and the insulating substrate 2, heat conduction to the base 1 There efficiently performed, and because the base 1 is assumed thermal resistance is very small, it is possible in a short time to diffuse across the base 1 the heat transferred to the base 1, the efficiency of heat transfer it is possible to increase. 更に、基台1の外表面には放射率を高めるための塗膜3を施したので、基台1の放射率が高まり外方への熱放射が容易となる。 Furthermore, since the outer surface of the base 1 was subjected to coating film 3 for increasing the emissivity, heat radiation becomes easier for outward increases the emissivity of the base 1. このため、LED4から放出された熱は効率よく外部に放出され、結果としてLED Therefore, the heat emitted from the LED4 is efficiently discharged to the outside, LED as a result
4温度が低く抑えられる。 4 temperature is kept low. また、絶縁基板2は複数に分割したものを使用しているので、ヒートストレスによる絶縁基板2、絶縁基板2上に形成した電路及びはんだなどへの歪みを防止することができる。 The insulating substrate 2 because it uses those divided into a plurality of insulating substrate 2 by heat stress, it is possible to prevent distortion of the like tracks and solder formed on the insulating substrate 2.

【0026】実施の形態2. [0026] Embodiment 2. 図3は本発明の実施の形態2を示す斜視図、図4は図3の断面図、図5は基台へのLED素子配置例1の拡大図を示す図である。 Figure 3 is a perspective view showing a second embodiment of the present invention, FIG. 4 is a cross-sectional view of FIG. 3, FIG. 5 is a diagram showing an enlarged view of an LED element arrangement example 1 of the base. なお、図3〜図5において、上記の図と同一の部分には同じ符号を付し、説明を省略する。 Note that, in FIGS. 3 to 5, the same reference numerals are given to the figure and the same parts described above, the description thereof is omitted. 本実施の形態2は、基台1の一方の面に厚みの薄い絶縁層11を基台1と一体的に形成し、この絶縁層11の基台1とは反対側の面(表面) Second embodiment, a thin insulating layer 11 of thickness integrally formed with the base 1 on one surface of the base 1, the surface opposite to the base 1 of the insulating layer 11 (surface)
に電路36を形成し、この電路36にLED素子12をワイヤボンデイングし、そして、電路36及びLED素子12を隙間無く覆うようにして透明樹脂製の保護層1 The path 36 is formed on the LED element 12 by wire bonding to the path 36 and path 36 and the protective layer 1 of way made of transparent resin of the LED element 12 covers without gaps
3を絶縁層11の表面全体に設け、更に、基台1の他方の面側に、当該面から突出した複数の放熱部14を基台1に一体的に形成したものである。 3 is provided on the entire surface of the insulating layer 11, further, on the other side of the base 1, and is formed integrally with a plurality of heat radiating portion 14 projecting from the surface to the base 1.

【0027】次に本実施の形態2の動作を説明する。 [0027] Next will be described the operation of the second embodiment. このように構成したLED集合体モジュールのLED素子12に電流を流すと、実施の形態1と同様にLED素子12は発熱し、この熱は、絶縁層11を通して伝導により基台1及び放熱部14に移動する。 When a current is applied to the LED element 12 in this way LED assembly module configured similarly LED element 12 generates heat in the first embodiment, this heat, the base 1 and the heat radiating portion 14 by conduction through the insulating layer 11 to move to. この熱移動は、この絶縁層11の厚みが薄いことと、絶縁層11と基台1 The heat transfer, and the thickness of the insulating layer 11 is thin, insulating layer 11 and the base 1
が密着状態になっていることにより容易に行われる。 There is easily done by it is in the close contact state. 基台1は外表面(上記した基台1の他方の面)がヒートシンクとして働き、このとき放熱部14は放熱フィンとして働き、放射、対流により外部に熱を放出する。 Base 1 serves the outer surface (the other surface of the base 1 described above) as a heat sink, this time working heat dissipating unit 14 as a heat dissipation fin, emits radiation heat to the outside by convection.

【0028】ところで、LED素子12から放出される熱は、LED集合体モジュールの中央部で滞留しやすく、周辺部で放熱しやすい。 By the way, heat emitted from the LED element 12 is easily retained in the central portion of the LED assembly modules, easily it releases heat at the periphery. そこで、図3を変形した例を図7に示す。 Therefore, FIG. 7 shows an example which is a modification to FIG. 図8は図7の断面図である。 Figure 8 is a cross-sectional view of FIG. この変形例とは、図7及び図8に示すように図3及び図4の放熱部14の高さを、基台1の少なくとも一方の対向する端辺の中央部に挟まれる領域から突出した放熱部14の方を、前記端辺の周辺部に挟まれる領域から突出した放熱部14より高く形成したものである。 And this modification, the height of the heat radiating portion 14 of FIG. 3 and FIG. 4, as shown in FIGS. 7 and 8, projecting from the region between the central portion of at least one of the opposite of the base 1 to the end side towards the heat radiating portion 14 is obtained by formed higher than the heat radiating portion 14 projecting from the region between the periphery of said end edges. このように、放熱部14の高さを変えることによって、中央部の放熱面積は周辺部の放熱面積に比べて大きくなるため、周辺部よりも多くの熱を放出することができる。 Thus, by changing the height of the heat radiating portion 14, the heat radiation area of ​​the central portion to become larger than the heat dissipation area of ​​the peripheral portion, it is possible to emit more heat than the periphery. これにより、L As a result, L
ED集合体モジュールの温度を均一化することができる。 It is possible to equalize the temperature of the ED assembly module.

【0029】本実施の形態2によれば、基台1に放熱部14を設けて放熱面積を大きくしたので、放熱部14がない場合に比べて放射熱量が増え、結果としてLED素子12の温度上昇を抑えることができる。 According to the second embodiment, since a larger heat dissipation area by the heat radiating portion 14 is provided on the base 1, the radiation heat amount is increased as compared with the case without the heat dissipation unit 14, the temperature of the LED element 12 as a result it is possible to suppress the rise. 更に図7及び図8に示す変形例では、放熱部14の高さを中央部で高く周辺部で低くしたので、中央部の放熱面積が周辺部の放熱面積より大きくなり、中央部では周辺部よりも多くの熱を放出することができる。 In the variant further shown in FIGS. 7 and 8, since the height of the heat radiating portion 14 was low at high peripheral portion at the central portion, the heat radiation area of ​​the central portion is larger than the heat radiating area of ​​the peripheral portion, the peripheral portion in the central portion it can release more heat than. これにより、LED集合体モジュールの温度を均一化できる。 This allows uniform temperature of the LED assembly module. なお、LED素子12からの光放射量はLED素子12の温度と関係があり、温度が高くなると光放射量が少なくなり、温度が低くくなると光放射量が多くなる。 The light emission amount from the LED element 12 has a temperature relationship of the LED element 12, the temperature becomes the light emission amount is reduced high light emission amount increases as the temperature becomes Ku lower. このため、上記したようにLED集合体モジュールの温度を均一にすることができることにより、各LED素子12の発光輝度をほぼ同一にすることができる。 Thus, by being able to equalize the temperature of the LED assembly modules as described above, it is possible to make light emission luminance of the LED elements 12 at substantially the same.

【0030】なお、本実施の形態2では、LED素子1 [0030] In the second embodiment, LED elements 1
2の配置を図5に示すように配置する例を示したが、図6に示すように、LED素子12を直接基台1の一方の面にダイボンディングし、基台1の同じ面に形成した絶縁層11上に設けた電路36と、LED素子12とをワイヤ33で接続するようにしても良い。 Although an example of arrangement 2 of the arrangement as shown in FIG. 5, as shown in FIG. 6, and the die bonding the LED element 12 directly on one surface of the base 1, formed on the same surface of the base 1 a path 36 provided on the insulating layer 11, and an LED element 12 may be connected by wires 33. この場合、図5 In this case, as shown in FIG. 5
の配置例に比べて外部への熱放出径路が短縮されるため、更に効率よく熱を放出することができる。 Since the heat dissipation path to the outside compared to the arrangement example of is shortened, it is possible to further release heat efficiently.

【0031】実施の形態3. [0031] Embodiment 3. 図9は本発明の実施の形態3を示す斜視図、図10は図9の断面図である。 Figure 9 is a perspective view showing a third embodiment of the present invention, FIG 10 is a cross-sectional view of FIG. なお、 It should be noted that,
図9及び図10において、上記の図と同一の部分には同じ符号を付し、説明を省略する。 9 and 10, the same reference numerals are given to the figure and the same parts described above, the description thereof is omitted. 21はヒートシンクとして機能する金属製の基台で、熱抵抗が非常に小さい(すなわち熱伝導率が非常に高い)ものである。 21 is a metal base which acts as a heat sink, (a very high or heat conductivity) The thermal resistance is very small those. この基台21は平板部21aと、この平板部21aの一方の対向する端辺から上方に突出した一対の突出部21bと、 And the base 21 is flat plate portion 21a, a pair of projecting portions 21b projecting upwardly from the end sides one of the opposing of the flat plate portion 21a,
平板部21a及び突出部21bの内部に該両者が連通するように形成された中空部22とから構成され、この中空部22には温度により気化、液化する作動液23が封入されて、重力利用形のサーモサイホンを構成している。 Both said person inside the flat plate portion 21a and the protruding portion 21b is composed of the formed hollow portion 22 which to communicate, this vaporized by temperature in the hollow part 22, hydraulic fluid 23 is sealed to liquefy, gravity- constitute a thermo-siphon of form. そして、この基台21の平板部21aの一方の面に絶縁層11を形成し、該絶縁層11の平板部21aとは反対側の面にLED素子12を配置する。 Then, on one surface to form an insulating layer 11 of the flat plate portion 21a of the base 21, to place the LED elements 12 on the surface opposite to the flat plate portion 21a of the insulating layer 11. なお、この配置方法は図5、図6のどちらの例に従っても良い。 In this arrangement method 5, it may follow either embodiment of FIG.

【0032】次に本実施の形態3の動作を説明する。 [0032] Next will be described the operation of the third embodiment. このように構成したLED集合体モジュールのLED素子12に電流を流すと、上記実施の形態と同様にLED素子12は発熱し、この熱は基台の平板部21aに形成された絶縁層11に伝導によって伝わり、更に、絶縁層1 With such a current flows in the LED elements 12 of the LED aggregate module configured, LED element 12 as in the above embodiment generates heat, this heat insulating layer 11 formed on the base plate portion 21a transmitted by conduction, further, the insulating layer 1
1から基台21へ移動する。 To move from one to the base 21. この熱により、中空部22 This heat, hollow portion 22
の作動液23は気化して中空部22上方(すなわち突出部21bに対応する中空部22)に移動する。 The hydraulic fluid 23 to move into the hollow portion 22 upward vaporized (i.e. hollow portions 22 corresponding to the projecting portion 21b). このとき、突出部21bが外部空気などにより冷却されると、 At this time, the projecting portion 21b is cooled by an external air,
上方に移動した作動液23は、凝縮によって突出部21 Hydraulic fluid 23 that has moved upward, the protruding by condensation section 21
bに熱を伝え、液化する。 Transferring heat to b, to liquefy. そして、突出部21bはヒートシンクとして働き、突出部21bに伝わった熱を放射、外気対流により外部に放出する。 The protrusion 21b acts as a heat sink to emit heat transferred to the protruding portion 21b radiating, by the outside air convection to the outside. そして、突出部2 The protrusions 2
1bで液化した作動液23は再び平板部21aに対応する中空部22に戻っていき、この動作が繰り返し行われる。 Hydraulic fluid 23 which is liquefied at 1b is go back to the hollow portion 22 corresponding to the re-plate portion 21a, the operation is repeated.

【0033】本実施の形態3によれば、熱伝導率が非常に高い基台21内部に作動液23が封入された中空部2 According to the third embodiment, the hollow portion 2 of the thermal conductivity is too high the base 21 inside the hydraulic fluid 23 is sealed
2を設けたので、基台21の平板部21aの熱は作動液23の作用も相俟ってすぐに突出部21bに移動し、そして、突出部21bから直接外部に放出されるため、L Is provided with the 2, because the heat of the flat plate portion 21a of the base 21 is moved immediately to the protruding portion 21b also phase 俟 action of hydraulic fluid 23, and, to be released directly to the outside from the projecting portion 21b, L
ED素子12からの熱をLED集合体モジュール外殻へ円滑に移動させることができると共に、熱移動の効率を高めることができ、結果としてLED素子12の温度を低く抑えることができる。 Heat it is possible to smoothly move the to the LED assembly module shell from ED element 12, it is possible to increase the efficiency of heat transfer, it is possible to reduce the temperature of the LED element 12 as a result.

【0034】なお、本実施の形態3では、重力利用型のサーモサイフォンとしたが、毛細管力を利用したヒートパイプとしてもよい。 [0034] In the third embodiment, although the thermosiphon of gravity-type, may be a heat pipe using a capillary force. この場合、突出部21bの突出方向は任意である。 In this case, the projecting direction of the projecting portion 21b is arbitrary.

【0035】実施の形態4. [0035] Embodiment 4. 図11は本発明の実施の形態4を示す斜視図、図12は図11の断面図であり、本実施の形態4は、図9及び図10に示した実施の形態3 Figure 11 is a perspective view showing a fourth embodiment of the present invention, FIG 12 is a cross-sectional view of FIG. 11, the fourth embodiment, the embodiment shown in FIGS. 9 and 10 3
の突出部21bに近接してファン25を配置し、ファン25により強制対流を発生させ、空気を突出部21bに吹き付けて突出部21bを空冷するようにしたものである。 Place the fan 25 in proximity to the projecting portion 21b, to generate forced convection by the fan 25, in which so as to cool the projecting portion 21b by blowing air to the projecting portion 21b.

【0036】このように構成したことにより、実施の形態3とほぼ同じ作用及び効果が得られるとともに、ファン25から吹き付けられる空気に突出部21bの熱が移動するので、突出部21bから外部への熱伝達率をより高めることができ、また、ファンによって発生する強制対流により放熱効果を更に高めることができる。 [0036] By having such a configuration, substantially with the same operation and effects are obtained as in the third embodiment, since the heat of the air in the projecting portion 21b blown from the fan 25 moves, from the projecting portion 21b to the outside it is possible to increase the heat transfer rate, and can further enhance the heat dissipation effect by forced convection generated by the fan. その結果、実施の形態3より更にLED素子12の温度を低く抑えることができる。 As a result, it is possible to suppress even lower the temperature of the LED element 12 from the third embodiment.

【0037】以上に実施の形態を説明したが、本発明はこれに限定されるものではなく、以下のように適宜変更することができる。 [0037] Having described the embodiments above, the present invention is not limited thereto, it may be appropriately modified as follows.

【0038】(1)実施の形態1において、基台1内部に中空部22を形成し、同様に実施の形態2において、 [0038] (1) In the first embodiment, a hollow portion 22 formed inside the base 1, in the second Likewise embodiment,
放熱部14の相互に連通するように中空部22を形成し、この中空部22に作動液23を封入するようにしても良い。 The hollow portion 22 is formed to communicate with each other of the heat radiating portion 14 may be sealed hydraulic fluid 23 in the hollow portion 22. (2)実施の形態2において、基台1及び放熱部14の外表面に塗膜3を形成し、同様に、実施の形態3、4において、基台1の外表面に塗膜3を形成するようにしても良い。 Forming (2) In the second embodiment, the coating film 3 is formed on the outer surface of the base 1 and the heat radiating portion 14, similarly, in the third and fourth embodiments, a coating film 3 on the outer surface of the base 1 it may be. (3)実施の形態2において、放熱部14を省略してもよい。 (3) In the second embodiment, it may be omitted heat radiating portion 14. (4)上述の各実施の形態において、保護層13を赤外線透過型のものにしてもよい。 (4) In the above-described embodiments, the protective layer 13 may be those of the infrared transmission. この場合、更に放熱効果を高めることができる。 In this case, it is possible to increase further the heat dissipation effect.

【0039】 [0039]

【発明の効果】本発明は、以上説明したように構成されているので、以下に示すような効果を奏する。 According to the present invention, which is configured as described above achieves the following effects.

【0040】本発明の第1発明は以上説明したとおり、 [0040] As the first aspect of the present invention is described above,
金属製の基台と、絶縁基板と、絶縁基板の一方の面に配置された複数のLEDと、基台の一方の面と絶縁基板の他方の面との間に密着するように配置された熱伝導率の高い弾性板とを備えたので、接触熱抵抗が小さくなりL A metal base, an insulating substrate, which is arranged to seal between the plurality of LED disposed on one surface of the insulating substrate, one surface of the base and the other surface of the insulating substrate since a high elastic plate thermal conductivity, the thermal contact resistance decreases L
EDから発生した熱を効率よく基台に移動させることができ、そして、基台に移動した熱を、基台が金属製であるが故に熱抵抗が小さいことが作用して、短時間で基台全体に拡散させることができ、熱移動の効率を高めることができる。 The heat generated from the ED can be moved efficiently to the base, and, the heat transferred to the base, it acts base is but because thermal resistance is small metallic, short time group can be diffused throughout the platform, it is possible to increase the efficiency of heat transfer. その結果、LEDの温度が低く抑えられる。 As a result, the temperature of the LED is kept low.

【0041】第2発明は以上説明したとおり、金属製の基台と、基台の一方の面に一体的に形成され、かつ前記基台とは反対側の面に電路が形成された絶縁層と、絶縁層に形成された電路に電気的に接続された複数のLED [0041] As described second invention above, a metal base, is integrally formed on one surface of the base, and an insulating layer path is formed on the surface opposite to the base and a plurality of LED that is electrically connected to the electrical path formed in the insulating layer
素子と、電路及びLED素子を覆うようにして設けられた保護層とを備えたので、LED素子から発生した熱は電路及び絶縁層を介して基台に伝達し、そして、基台が金属製であるが故に熱抵抗が小さいことが作用して、短時間で基台全体に拡散させることができ、熱移動の効率を高めることができる。 An element, since a protective layer provided so as to cover the path and LED element, heat generated from the LED element through a path and the insulating layer was transferred to the base, and, made the base metal although because act that thermal resistance is small, a short time can be diffused throughout the base, it is possible to increase the efficiency of heat transfer. その結果、LED素子の温度が低く抑えられる。 As a result, the temperature of the LED element is kept low. また、保護層により電路及びLED素子を電気的、機械的に保護することができる。 Also, electrical an electrical path and a LED element by a protective layer, can be mechanically protected.

【0042】第3発明は以上説明したとおり、金属製の基台と、基台の一方の面にダイボンディングされた複数のLED素子と、LED素子を覆うようにして設けられた保護層とを備えたので、LED素子からの熱を直ちに基台に移動させることができるとともに、基台が金属製であるが故に熱抵抗が小さいことが作用して、短時間で基台全体に拡散させることができるので、熱移動の効率を高くすることができる。 [0042] As described third invention described above, a metallic base, a plurality of LED elements are die-bonded to one surface of the base, and a protective layer provided so as to cover the LED element so equipped, that it is possible to transfer heat from the LED element immediately to the base, it acts base is but because thermal resistance is small is made of metal, in a short time to diffuse across the base since it is, it is possible to increase the efficiency of heat transfer. その結果、LED素子の温度が低く抑えられる。 As a result, the temperature of the LED element is kept low. また、保護層によりLED素子を電気的、機械的に保護することができる。 Also, electrical LED element by the protective layer, can be mechanically protected.

【0043】第4発明は以上説明したとおり、第1乃至第3発明のいずれかの基台の他方の面側に、当該面から突出した複数の放熱部を一体的に形成したので、放熱面積が大きくなり、放熱部がない場合に比べて放射熱量を増やすことができ、放射効率を更に高めることができる。 [0043] As described fourth invention above, on the other side one of the base of the first to third inventions, since a plurality of heat radiating portion projecting from the surface and integrally formed dissipation area increases, as compared to the case without the heat radiating portion can increase the amount of heat radiated, it is possible to further enhance the radiation efficiency. その結果、LED素子の温度上昇を抑えることができる。 As a result, it is possible to suppress the temperature rise of the LED elements.

【0044】第5発明は以上説明したとおり、第4発明において、少なくとも一方の対向する端辺の中央部に挟まれる領域から突出した放熱部の高さを端辺の周辺部に挟まれる領域から突出した放熱部より高く形成したので、中央部の放熱面積が周辺部の放熱面積より大きくなり、中央部では周辺部よりも多くの熱を放出することができる。 [0044] As described fifth invention above, in the fourth invention, the height of the heat radiating portion projecting from the region between the central portion of the end side of at least one of the opposite from a region between the peripheral portion of the end edge Having formed higher than protruding heat radiating portion, the heat radiation area of ​​the central portion is larger than the heat radiating area of ​​the peripheral portion, it is possible to emit more heat than the peripheral portions at the central portion. これにより、LED集合体モジュールの温度を均一化でき、温度が均一であるが故に、各LED素子の発光輝度をほぼ同一にすることができる。 Thus, LED can equalize the temperature of the assembly module, the temperature is uniform because it is possible to the emission luminance of the LED elements substantially the same.

【0045】第6発明は以上説明したとおり、第1乃至第3発明のいずれかの基台は、基台内部に形成され、作動液が封入された中空部を備え、あるいはLED素子からの熱を基台外殻へ円滑に移動させることができる。 [0045] As described sixth invention above, any of the base of the first to third invention is formed inside the base, a hollow portion which hydraulic fluid is sealed, or heat from the LED element can be smoothly moved to the base shell.

【0046】第7発明は以上説明したとおり、第1乃至第3発明のいずれかの基台は、平板部と、平板部の少なくとも一方の対向する端辺から突出した一対の突出部と、水平部と突出部の内部に該両者が連通するように形成され、作動液が封入された中空部とを備えたので、L [0046] As described seventh invention or any of the base of the first to third invention, a flat plate portion, a pair of projecting portions projecting from at least one of the opposite edge of the flat plate portion, the horizontal parts and the both have the inside of the projecting portion is formed so as to communicate, because hydraulic fluid and a hollow portion which is sealed, L
ED素子からの熱を上記第6発明に比べ更に円滑に基台外殻へ移動させることができる。 The heat from the ED element can be moved to a more smooth base shell compared to the sixth aspect.

【0047】第8発明は以上説明したとおり、第4発明又は第5発明の基台は、前記放熱部の相互に連通するように形成され、作動液が封入された中空部を備えたので、LED素子からの熱を上記第7発明に比べ更に円滑に基台外殻へ移動させることができる。 [0047] As described eighth invention above, a base of the fourth invention or the fifth invention is formed so as to communicate with each other of the heat radiating portion, the hydraulic fluid with a hollow portion which is sealed, the heat from the LED element can be moved to a more smooth base shell compared to the seventh aspect.

【0048】第9発明は以上説明したとおり、第7発明の突出部に近接してファンを配置したので、ファンにより発生される強制対流によって突出部の放熱効果を更に高めることができる。 [0048] As described ninth invention above, since close to the protrusion of the seventh aspect of the present invention to place the fan, by forced convection generated by the fan can be further enhanced heat radiation effect of the protrusion.

【0049】第10発明は以上説明したとおり、第1乃至第9発明のいずれかの基台の他方の面に、他方の面の放射率を高めるための塗膜を施したので、基台の放射率を高めることができ、また、外部への熱放射量を増やすことができるので、熱を効率よく外部に放出することができる。 [0049] As described tenth invention above, in any of the base the other surface of the first through ninth invention, since subjected to coating to increase the emissivity of the other surface, of the base it is possible to increase the emissivity, also, it is possible to increase the heat radiation amount to the outside, it is possible to release heat efficiently to the outside.

【0050】第11発明は以上説明したとおり、第2乃至第10発明のいずれかの保護層を赤外線透過特性を有する樹脂製としたので、LED素子から放射される赤外成分を直接外部に放射させることができ、更に放熱効果を高めることができる。 [0050] As described eleventh invention or radiation because one of the protective layer of the second to tenth invention is made of a resin having an infrared transmission properties, outside the infrared component emitted from the LED element directly is to be able, it is possible to further enhance the heat dissipation effect.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】 本発明の実施の形態1を示す斜視図である。 1 is a perspective view showing a first embodiment of the present invention.

【図2】 図1の断面図である。 It is a cross-sectional view of FIG. 1. FIG.

【図3】 本発明の実施の形態2を示す斜視図である。 3 is a perspective view showing a second embodiment of the present invention.

【図4】 図3の断面図である。 It is a cross-sectional view of FIG. 3. FIG.

【図5】 LED素子配置例1の拡大図を示す図である。 5 is a diagram showing an enlarged view of an LED element arrangement example 1.

【図6】 LED素子配置例2の拡大図を示す図である。 6 is a diagram showing an enlarged view of an LED element arrangement example 2.

【図7】 本発明の実施の形態2の変形例を示す斜視図である。 7 is a perspective view showing a modification of the second embodiment of the present invention.

【図8】 図7の断面図である。 FIG. 8 is a cross-sectional view of FIG. 7.

【図9】 本発明の実施の形態3を示す斜視図である。 9 is a perspective view showing a third embodiment of the present invention.

【図10】 図9の断面図である。 10 is a cross-sectional view of FIG.

【図11】 本発明の実施の形態4を示す斜視図である。 11 is a perspective view showing a fourth embodiment of the present invention.

【図12】 図11の断面図である。 It is a cross-sectional view of FIG. 12 FIG. 11.

【図13】 パッケージされたLEDの断面図である。 13 is a cross-sectional view of a packaged LED.

【図14】 図11のLEDによるLED集合体モジュールを示す図である。 14 is a diagram showing an LED assembly module by LED of FIG.

【図15】 金属ベースエポキシモールドLEDの断面図である。 15 is a sectional view of the metal base epoxy mold LED.

【図16】 図15のLEDによるLED集合体モジュールを示す図である。 16 is a diagram showing an LED assembly module by LED of FIG.

【図17】 図15の熱モデルを示す図である。 17 is a diagram showing a thermal model of Figure 15.

【符号の説明】 DESCRIPTION OF SYMBOLS

1、21 基台、2 絶縁基板、3 塗膜、4 LE 1,21 base plate, 2 an insulating substrate, 3 a coating film, 4 LE
D、5 ラバー(弾性板)、11 絶縁層、12 LE D, 5 rubber (elastic plate), 11 an insulating layer, 12 LE
D素子、13 保護層、14 放熱部、36 電路、2 D elements, 13 protective layer, 14 radiating portion, 36 paths, 2
1a 平板部、21b 突出部、22 中空部、23 1a flat portion, 21b protrusion 22 hollow portion 23
作動液、25 ファン。 Hydraulic fluid, 25 fan.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 明道 成 神奈川県鎌倉市大船五丁目1番1号 三菱 電機照明株式会社内 (72)発明者 今井 康雄 神奈川県鎌倉市大船五丁目1番1号 三菱 電機照明株式会社内 (72)発明者 小林 孝 東京都千代田区丸の内二丁目2番3号 三 菱電機株式会社内 Fターム(参考) 3K014 AA01 LA01 LB04 MA02 MA03 MA04 MA08 5F041 AA33 DA34 DA43 DA82 DB08 DC26 DC48 DC58 FF11 FF16 ────────────────────────────────────────────────── ─── of the front page continued (72) inventor of Adventure formed Kamakura, Kanagawa Prefecture Ofuna chome No. 1 No. 1 Mitsubishi electric lighting Co., Ltd. in the (72) inventor Yasuo Imai Kamakura, Kanagawa Prefecture Ofuna chome No. 1 No. 1 Mitsubishi electric lighting within Co., Ltd. (72) inventor Takashi Kobayashi, Chiyoda-ku, tokyo Marunouchi 2-chome No. 2 No. 3 Mitsubishi electric Co., Ltd. in the F-term (reference) 3K014 AA01 LA01 LB04 MA02 MA03 MA04 MA08 5F041 AA33 DA34 DA43 DA82 DB08 DC26 DC48 DC58 FF11 FF16

Claims (11)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 金属製の基台と、絶縁基板と、該絶縁基板の一方の面に配置された複数のLEDと、前記基台の一方の面と前記絶縁基板の他方の面との間に密着するように配置された熱伝導率の高い弾性板とを備えたことを特徴とするLED集合体モジュール。 And 1. A metal base, between the insulating substrate, one a plurality of LED disposed on the surface of the insulating substrate, the other surface of the insulating substrate and the one surface of the base LED assembly module characterized by comprising a high elastic plate having arranged thermal conductivity so as to be in close contact with.
  2. 【請求項2】 金属製の基台と、該基台の一方の面に一体的に形成され、かつ前記基台とは反対側の面に電路が形成された絶縁層と、該絶縁層に形成された電路に電気的に接続された複数のLED素子と、前記電路及び前記LED素子を覆うようにして設けられた保護層とを備えたことを特徴とするLED集合体モジュール。 2. A metal base, is integrally formed on one surface of the base board, and an insulating layer path on the opposite side is formed with the base, the insulating layer LED assembly module characterized by comprising: a plurality of LED elements which are electrically connected to the formed path, and a protective layer provided so as to cover the path and the LED element.
  3. 【請求項3】 金属製の基台と、該基台の一方の面にダイボンディングされた複数のLED素子と、該LED素子を覆うようにして設けられた保護層とを備えたことを特徴とするLED集合体モジュール It characterized 3. A metal base, a plurality of LED elements are die-bonded to one surface of the base stand, further comprising a protective layer provided so as to cover the LED element LED assembly module to
  4. 【請求項4】 前記基台の他方の面側に、当該面から突出した複数の放熱部を一体的に形成したことを特徴とする請求項1乃至請求項3のいずれかに記載のLED集合体モジュール。 4. A second surface side of the base, LED set according to any one of claims 1 to 3, characterized in that integrally formed a plurality of heat radiating portion projecting from the surface body module.
  5. 【請求項5】 少なくとも一方の対向する端辺の中央部に挟まれる領域から突出した前記放熱部の高さを前記端辺の周辺部に挟まれる領域から突出した放熱部より高く形成したことを特徴とする請求項4記載のLED集合体モジュール。 That wherein the formation of the height of the heat radiating portion projecting from the region between the central portion of the end side of at least one of the opposing higher than the heat radiating portion projecting from the region between the periphery of said end edges LED assembly module according to claim 4, wherein.
  6. 【請求項6】 前記基台は、該基台内部に形成され、作動液が封入された中空部を備えたことを特徴とする請求項1乃至請求項3のいずれかに記載のLED集合体モジュール。 Wherein said base is formed inside the base stand, LED assembly according to any one of claims 1 to 3 working liquid characterized by comprising a hollow portion which is sealed module.
  7. 【請求項7】 前記基台は、平板部と、前記平板部の少なくとも一方の対向する端辺から突出した一対の突出部と、前記平板部と前記突出部の内部に該両者が連通するように形成され、作動液が封入された中空部とを備えたことを特徴とする請求項1乃至請求項3のいずれかに記載のLED集合体モジュール。 Wherein said base includes a flat plate portion, a pair of projecting portions projecting from at least one of the opposite edge of said plate, so that the both who are communicating with the interior of the projecting portion and the flat portion LED assembly module according to any one of claims 1 to 3 is formed, hydraulic fluid, characterized in that a hollow portion which is sealed in.
  8. 【請求項8】 前記基台は、前記放熱部の相互に連通するように形成され、作動液が封入された中空部を備えたことを特徴とする請求項4又は請求項5記載のLED集合体モジュール。 Wherein said base, said formed so as to communicate with each other of the heat radiating portion, LED set according to claim 4 or claim 5, wherein hydraulic fluid is characterized by comprising a hollow portion which is sealed body module.
  9. 【請求項9】 前記突出部に近接してファンを配置したことを特徴とする請求項7記載のLED集合体モジュール。 9. LED assembly module according to claim 7, characterized in that a fan proximate to the protuberant portion.
  10. 【請求項10】 前記基台の他方の面に、該他方の面の放射率を高めるための塗膜を施したことを特徴とする請求項1乃至請求項9のいずれかに記載のLED集合体モジュール。 10. A second surface of the base, LED set according to any one of claims 1 to 9, characterized in that subjected to coating to increase the emissivity of the surface of said other body module.
  11. 【請求項11】 前記保護層を赤外線透過特性を有する樹脂製としたことを特徴とする請求項2乃至請求項10 11. The method of claim 2 through claim, characterized in that the resin having an infrared transmission property of the protective layer 10
    のいずれかに記載のLED集合体モジュール。 LED assembly module according to any one of.
JP10193048A 1998-07-08 1998-07-08 Led aggregate module Pending JP2000031546A (en)

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