JP2000031546A - Led aggregate module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To move heat generated from a LED or a LED element efficiently, also release outside, and restrict down a temperature of the LED or the LED element by a method wherein an elastic plate having high heat conductivity is disposed between one face of a stand and the other face of an insulation substrate. SOLUTION: If a current flows in a LED 4, a LED element heats the LED 4 by a Joule heat, and this heat transmits to an insulation substrate 2 by conduction. Furthermore, heat transfers from this insulation substrate 2 to a stand 1 by conduction. The heat transfers is conducted smoothly from this insulation substrate 2 to the stand 1 by close adhesion of a rubber 5 between the stand 1 and the insulation substrate 2, and the heat transferring to the stand 1 diffuses to the stand 1. Thus, the heat conduction to the stand 1 is executed efficiently and also the heat transferred to the stand 1 can be diffused to the entire stand 1 for a short time. Furthermore, the heat released from the LED 4 is released efficiently and externally, and as a result, the temperature of the LED 4 is restricted down.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a long-life light source L.
Regarding the surface emitting light source of large luminous flux using ED, especially outdoors,
The present invention relates to a method of cooling an LED assembly module when an LED is used as a light source of a lighting fixture used for general indoor lighting or a transparent signboard.

[0002]

2. Description of the Related Art Conventionally, incandescent lamps, fluorescent lamps, HID lamps (High Intensi
ty Discharge Lamp).
These light sources have a sufficient luminous flux, but the life is about 1000 to 2000 hours for incandescent lamps and about 6000 to 12000 hours for fluorescent lamps and HID lamps. On the other hand, there is an LED as another light source. Although the LED has a long life, it is not suitable for illumination because of its low luminous flux. However, since the luminous flux can be increased by increasing the current, the current is generally several mA to 20 mA, but the luminous flux is increased by increasing the current, and a sufficient Can be expected. However, when the current is increased, the temperature of the LED element portion increases, leading to a reduction in efficiency and life. Therefore, the current cannot be actually increased.

FIG. 13 is a cross-sectional view of an LED packaged as an example of the LED. In FIG.
31 is a substrate, 32 is a wiring pattern formed on the substrate 31, 12 is an LED element as a bare chip mounted on the substrate 31 and electrically connected to the wiring pattern 32 by a wire 33, 13 is an LED element 12 and a wire A protective layer provided so as to cover 33 without any gap, and is made of a transparent epoxy resin for mechanical and electrical protection from the outside. Reference numeral 34 denotes a molded part that mechanically holds the protective layer 13, the substrate 31, and the like. The substrate 31, the wiring pattern 32, the wires 33, the LED elements 12, and the LED 4 packaged by the protective layer 13 are configured.

FIG. 14 shows an LED assembly module in which the LEDs of FIG. 13 are arranged vertically and horizontally. In FIG. 14, reference numeral 35 denotes a substrate, 36 denotes an electric path formed on the substrate 35, and LED 4 denotes an electric path formed on the electric circuit 36. They are electrically connected by solder.

When an electric current is applied to the LED 4 configured as described above, the LED element 12 generates heat by Joule heat, and this heat moves to the protective layer 13, the substrate 31, and the substrate 35 in a conductive form. Furthermore, the surface of the protective layer 13 and the substrate 3
Radiation and convection from the surface of 5 release heat to the outside.
The temperature of the LED element 12 rises until the amount of the emitted light and the amount of heat generated from the LED element 12 become equal.

FIG. 15 shows a metal-based epoxy mold LE.
FIG. 15 is a sectional view of D. In FIG. 15, reference numeral 41 denotes a metal base, reference numeral 42 denotes a gold-based solder material, and the LED element 12 is die-bonded directly to the metal base 41 by a solder material 42 or the like. The wire 33 electrically connects the upper electrode of the LED element 12 and the lead wire 43. 44 is the lead wire 4
3 is an insulator for insulating the metal base 41 from the metal base 41, and 45 is a lead wire which is in conduction with the metal base 41.
The metal base epoxy mold LED 4 is constituted by 3, 45, the insulator 44, and the protective layer 13, and is connected to the substrate 35 by solder. Note that the packaged LED 4 shown in FIGS. 13 and 14 and the metal-based epoxy molded LED 4 of FIG. In the form of LED4. FIG.
Is an LED assembly module in which a plurality of such metal-based epoxy molded LEDs are mounted on a substrate.

In FIG. 16, when a current is applied to the LED element 12, the LED element 12 generates heat by Joule heat.
This heat is conducted to the gold-based solder material 42 and further to the metal base 41. Since the thermal conductivity of the metal base 41 is small, the temperature becomes substantially uniform including the lead wire 45, and a part of the heat is transmitted to the substrate 35 and radiated from the surface of the substrate 35 to radiate heat to the outside in a convection form. Partially radiates heat from the surface of the metal base 41 to the outside in the form of convection. Another path for heat release is a path for conducting heat directly from the LED element 12 to the protective layer 13 and radiating heat from the surface of the protective layer 13 to the outside in the form of convection.

[0008]

SUMMARY OF THE INVENTION However, LEDs
However, there is a problem that the amount of heat released to the outside is limited. For this reason, a large current could not be passed through the LED.

Here, if a thermal model is created by taking FIG. 13 as an example to quantify the thermal problem of the conventional LED assembly module, it becomes as shown in FIG. 17, which can be summarized by the equation: Q × (R 1 + R
2 + R3 + R4 + R5 + R6) =. DELTA.T. Here, Q: heat value of the LED element 12 (W) R1: thermal resistance of the metal base 41 (K / W) R2: thermal resistance in the thickness direction of the substrate 35 (K / W) R3: longitudinal direction of the substrate 35 R4: Thermal resistance from the end face of the substrate 35 to the outside (K / W) R5: Thermal resistance from the lower outer surface of the substrate 35 to the outside (K / W)
W) R6: Thermal resistance from the outer surface of the protective layer 13 to the outside (K /
W) ΔT: Temperature rise value (K) R1 = L1 / (λ1 × A1) R2 = L2 / (λ2 × A2) R3 = L3 / (λ3 × A3) L1: Representative length of metal base 41 (m) L2: Representative length in the thickness direction of the substrate 35 (m) L3: Representative length in the longitudinal direction of the substrate 35 (m) λ1: Thermal conductivity of the metal base 41 (W / (m · K)) λ2, λ3: Substrate Thermal conductivity (W / (m · K)) of A 35: Lower outer surface area of substrate 35 (m ² ) A 2: Thickness area of substrate 35 (m ² ) A 3: Longitudinal area of substrate 35 ( ^{m 2) R4 = 1 / (} h4 × A2 × φ) R5 = 1 / (h5 × A1 × φ) R6 = 1 / (h6 × S6 × φ) h4: heat transfer rate to the outside from the end face of the substrate 35 ( W / (m
² · K)) h5: Heat transfer coefficient (W from the lower outer surface of the substrate 35 to the outside)
/ (M ² · K)) h6: heat transfer coefficient from the outer surface of the protective layer 13 to the outside (W /
(m ² · K)) S6: Outer surface area of protective layer 13 (m ² ) φ: Fin efficiency

## EQU1 ## From this, it can be seen that in order to suppress the temperature rise of the LED element 12, efficient heat transfer to the LED assembly module outer shell and ease of heat release from the outer shell to the outside should be considered. That is, the thermal resistance of the substrate 35 is reduced, the surface area of the outer shell is increased, the heat transfer coefficient is increased,
It is understood that the fin efficiency should be further increased.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and can efficiently transfer heat generated from an LED or an LED element and can easily discharge the heat to the outside. It is an object of the present invention to provide an LED assembly module capable of keeping the temperature of an LED or an LED element low.

[0012]

An LED assembly module according to a first aspect of the present invention includes a metal base, an insulating substrate, a plurality of LEDs disposed on one surface of the insulating substrate,
An elastic plate having a high thermal conductivity is provided so as to be in close contact between one surface of the base and the other surface of the insulating substrate.

[0013] An LED assembly module according to a second aspect of the present invention comprises a metal base and an insulating member integrally formed on one surface of the base and having an electric path formed on a surface opposite to the base. The semiconductor device includes a layer, a plurality of LED elements electrically connected to an electric path formed in the insulating layer, and a protective layer provided so as to cover the electric path and the LED elements.

An LED assembly module according to a third aspect of the present invention provides a metal base, a plurality of LED elements die-bonded to one surface of the base, and a protective layer provided so as to cover the LED elements. It is provided with.

According to a fourth invention, in the LED assembly module according to any one of the first to third inventions, a plurality of heat radiating portions projecting from the other surface of the base are integrally formed on the other surface of the base. is there.

According to a fifth aspect, in the LED assembly module according to the fourth aspect, the height of the heat radiating portion protruding from the region sandwiched by the center of at least one of the opposing edges is sandwiched by the periphery of the edge. It is formed higher than the heat radiating portion protruding from the fin.

According to a sixth aspect of the present invention, in the LED assembly module according to any one of the first to third aspects, the base has a hollow portion formed inside the base and filled with a working fluid.

According to a seventh aspect of the present invention, in the LED assembly module according to any one of the first to third aspects, the base comprises: a flat plate; and a pair of protruding portions projecting from at least one of opposite ends of the flat plate. And a hollow portion formed inside the flat plate portion and the protruding portion so as to communicate with each other, and filled with a working fluid.

The eighth invention is the LE of the fourth invention or the fifth invention.
In the D-assembly module, the base is formed so as to communicate with the heat radiating portion, and has a hollow portion in which the working fluid is sealed.

According to a ninth aspect, in the LED assembly module of the seventh aspect, a fan is arranged near the protruding portion.

According to a tenth aspect, in the LED assembly module according to any one of the first to ninth aspects, a coating film for increasing the emissivity of the other surface is applied to the other surface of the base. .

According to an eleventh aspect of the present invention, in the LED assembly module according to any one of the second to tenth aspects, the protective layer is made of a resin having infrared transmission characteristics.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 FIG. 1 is a perspective view showing Embodiment 1 of the present invention, and FIG. 2 is a sectional view of FIG.
In FIGS. 1 and 2 and the drawings described later, the same components as those in the conventional example are denoted by the same reference numerals and description thereof will be omitted. 1 is a metal base that functions as a heat sink (radiator for cooling).
Very low thermal resistance. Reference numeral 2 denotes four insulating substrates disposed on one surface side of the base 1. An electric path (not shown) is formed on one surface (the surface opposite to the base 1). The LED 4 is electrically connected with solder. Reference numeral 3 denotes a coating applied to the other surface side of the base 1 to increase the thermal emissivity of the base 1, and the coating 3 provides a heat radiation effect several tens times higher than that of the base 1. . Reference numeral 5 denotes a rubber as an elastic plate having a high thermal conductivity sandwiched between one surface of the base 1 and the other surface of the insulating substrate 2 so as to have a thermal conductivity of 0.5 (W). / (M · K)) or more.
Reference numeral 6 denotes a transparent plastic cover that covers the entire insulating substrate 2 including the LED 4. The entire surface of the plastic cover 6 is subjected to a graining process for diffusing light to make the brightness of the entire surface uniform. I have. The thermal expansion coefficients of the base 1 and the insulating substrate 2 are assumed to be substantially the same.

Next, the operation of the first embodiment will be described. L
When a current flows through the ED 4, the LED element 12 generates heat due to Joule heat, and the heat is transmitted to the insulating substrate 2 by conduction. Further, heat is transferred from the insulating substrate 2 to the base 1 by conduction. The heat transfer from the insulating substrate 2 to the base 1 is performed smoothly because the rubber 5 is in close contact with the base 1 and the insulating substrate 2 so that the contact thermal resistance is reduced. The heat transferred to the base 1 is diffused throughout the base 1 because the thermal resistance of the base 1 is very small. The outer surface of the base 1 (the other surface of the base 1 described above) functions as a heat sink, and emits heat to the outside by radiation and convection of the outside air. Then, the light from the LED 4 is diffused by the plastic cover 6 which has been subjected to the graining process, and the luminance of the entire surface becomes uniform.

According to the first embodiment, the rubber 5 having a high thermal conductivity is arranged in close contact with the base 1 and the insulating substrate 2 to reduce the contact thermal resistance. Is efficiently performed, and the base 1 has a very small thermal resistance, so that the heat transferred to the base 1 can be diffused to the entire base 1 in a short time, and the efficiency of the heat transfer can be reduced. Can be enhanced. Further, since the coating film 3 for increasing the emissivity is applied to the outer surface of the base 1, the emissivity of the base 1 is increased, and heat radiation to the outside is facilitated. Therefore, the heat released from the LED 4 is efficiently released to the outside, and as a result, the LED 4
4 The temperature can be kept low. Further, since the insulating substrate 2 is divided into a plurality of parts, it is possible to prevent the insulating substrate 2, the electric circuit formed on the insulating substrate 2, and the solder from being distorted due to heat stress.

Embodiment 2 FIG. FIG. 3 is a perspective view showing Embodiment 2 of the present invention, FIG. 4 is a cross-sectional view of FIG. 3, and FIG. 5 is an enlarged view of LED device arrangement example 1 on a base. 3 to 5, the same parts as those in the above-described figures are denoted by the same reference numerals, and description thereof will be omitted. In the second embodiment, a thin insulating layer 11 is formed integrally with the base 1 on one surface of the base 1, and a surface (front surface) of the insulating layer 11 on the side opposite to the base 1.
An electric circuit 36 is formed on the electric circuit 36, the LED element 12 is wire-bonded to the electric circuit 36, and the protective layer 1 made of a transparent resin is formed so as to cover the electric circuit 36 and the LED element 12 without gaps.
3 is provided on the entire surface of the insulating layer 11, and further, on the other surface side of the base 1, a plurality of heat radiating portions 14 protruding from the surface are formed integrally with the base 1.

Next, the operation of the second embodiment will be described. When a current is applied to the LED element 12 of the LED assembly module configured as described above, the LED element 12 generates heat as in the first embodiment, and this heat is transmitted through the insulating layer 11 and the base 1 and the heat radiating section 14. Go to This heat transfer is caused by the fact that the thickness of the insulating layer 11 is small,
Can be easily performed by the contact state. The outer surface of the base 1 (the other surface of the base 1 described above) functions as a heat sink. At this time, the heat radiating portion 14 functions as a heat radiating fin, and radiates heat to the outside by radiation and convection.

Incidentally, the heat released from the LED element 12 tends to stay in the central portion of the LED assembly module and to radiate heat in the peripheral portion. FIG. 7 shows a modified example of FIG. FIG. 8 is a sectional view of FIG. This modified example means that the height of the heat radiating portion 14 shown in FIGS. 3 and 4 protrudes from a region sandwiched between the central portions of at least one opposing end sides of the base 1 as shown in FIGS. 7 and 8. The heat radiating portion 14 is formed higher than the heat radiating portion 14 protruding from a region sandwiched between the peripheral portions of the end sides. As described above, by changing the height of the heat radiating portion 14, the heat radiating area in the central portion becomes larger than the heat radiating area in the peripheral portion, so that more heat can be released than in the peripheral portion. Thus, L
The temperature of the ED assembly module can be made uniform.

According to the second embodiment, since the heat radiating portion 14 is provided on the base 1 to increase the heat radiating area, the amount of radiated heat is increased as compared with the case where the heat radiating portion 14 is not provided. The rise can be suppressed. Further, in the modified examples shown in FIGS. 7 and 8, the height of the heat radiating portion 14 is higher at the central portion and lower at the peripheral portion, so that the heat radiating area at the central portion is larger than the peripheral portion. More heat can be released. Thereby, the temperature of the LED assembly module can be made uniform. Note that the amount of light emitted from the LED element 12 is related to the temperature of the LED element 12, and the higher the temperature, the smaller the amount of light emitted, and the lower the temperature, the greater the amount of light emitted. For this reason, since the temperature of the LED assembly module can be made uniform as described above, the light emission luminance of each LED element 12 can be made substantially the same.

In the second embodiment, the LED element 1
5, the LED elements 12 are directly die-bonded to one surface of the base 1 and formed on the same surface of the base 1 as shown in FIG. The electric circuit 36 provided on the insulating layer 11 and the LED element 12 may be connected by a wire 33. In this case, FIG.
Since the heat radiation path to the outside is shortened as compared with the arrangement example, heat can be released more efficiently.

Embodiment 3 FIG. 9 is a perspective view showing Embodiment 3 of the present invention, and FIG. 10 is a sectional view of FIG. In addition,
9 and 10, the same portions as those in the above-mentioned drawings are denoted by the same reference numerals, and description thereof will be omitted. Reference numeral 21 denotes a metal base that functions as a heat sink, and has a very small thermal resistance (that is, a very high thermal conductivity). The base 21 includes a flat plate portion 21a, a pair of protruding portions 21b protruding upward from one opposite end side of the flat plate portion 21a,
A hollow portion 22 is formed inside the flat plate portion 21a and the protruding portion 21b so as to communicate with each other. A working fluid 23 which is vaporized and liquefied by temperature is sealed in the hollow portion 22 to utilize gravity. The shape of the thermosiphon. Then, the insulating layer 11 is formed on one surface of the flat plate portion 21a of the base 21, and the LED element 12 is arranged on the surface of the insulating layer 11 opposite to the flat plate portion 21a. Note that this arrangement method may follow either of the examples shown in FIGS.

Next, the operation of the third embodiment will be described. When a current is applied to the LED element 12 of the LED assembly module configured as described above, the LED element 12 generates heat in the same manner as in the above embodiment, and this heat is transmitted to the insulating layer 11 formed on the flat plate portion 21a of the base. It is transmitted by conduction, and furthermore the insulating layer 1
Move from 1 to the base 21. This heat causes the hollow portion 22
The working fluid 23 is vaporized and moves above the hollow portion 22 (that is, the hollow portion 22 corresponding to the protruding portion 21b). At this time, when the protrusion 21b is cooled by external air or the like,
The working fluid 23 that has moved upwards is condensed,
Conduct heat to b and liquefy. The projecting portion 21b functions as a heat sink, and radiates the heat transmitted to the projecting portion 21b and radiates the heat to the outside by external convection. And the protrusion 2
The working fluid 23 liquefied in 1b returns to the hollow portion 22 corresponding to the flat plate portion 21a again, and this operation is repeatedly performed.

According to the third embodiment, the hollow portion 2 in which the working fluid 23 is sealed inside the base 21 having a very high thermal conductivity.
2, the heat of the flat plate portion 21a of the base 21 immediately moves to the protruding portion 21b due to the action of the hydraulic fluid 23, and is discharged directly to the outside from the protruding portion 21b.
The heat from the ED element 12 can be smoothly transferred to the outer shell of the LED assembly module, and the efficiency of heat transfer can be increased. As a result, the temperature of the LED element 12 can be kept low.

In the third embodiment, a thermosiphon utilizing gravity is used. However, a heat pipe utilizing capillary force may be used. In this case, the projecting direction of the projecting portion 21b is arbitrary.

Embodiment 4 FIG. 11 is a perspective view showing Embodiment 4 of the present invention, FIG. 12 is a cross-sectional view of FIG. 11, and Embodiment 4 is Embodiment 3 shown in FIG. 9 and FIG.
The fan 25 is arranged in the vicinity of the projection 21b, forced convection is generated by the fan 25, and air is blown to the projection 21b to cool the projection 21b.

With this configuration, substantially the same operation and effect as those of the third embodiment can be obtained, and the heat of the protruding portion 21b moves to the air blown from the fan 25. The heat transfer coefficient can be further increased, and the heat radiation effect can be further enhanced by forced convection generated by the fan. As a result, the temperature of the LED element 12 can be further reduced as compared with the third embodiment.

Although the embodiment has been described above, the present invention is not limited to this, and can be appropriately modified as follows.

(1) In the first embodiment, the hollow portion 22 is formed inside the base 1.
The hollow portion 22 may be formed so as to communicate with the heat radiating portion 14, and the working fluid 23 may be sealed in the hollow portion 22. (2) In the second embodiment, the coating film 3 is formed on the outer surfaces of the base 1 and the heat radiating unit 14. Similarly, in the third and fourth embodiments, the coating film 3 is formed on the outer surface of the base 1. You may do it. (3) In the second embodiment, the radiator 14 may be omitted. (4) In each of the above embodiments, the protective layer 13 may be of an infrared transmission type. In this case, the heat radiation effect can be further enhanced.

[0039]

Since the present invention is configured as described above, it has the following effects.

The first invention of the present invention, as described above,
A metal base, an insulating substrate, a plurality of LEDs arranged on one surface of the insulating substrate, and arranged so as to be in close contact between one surface of the base and the other surface of the insulating substrate. With the elastic plate having high thermal conductivity, the contact thermal resistance is reduced and L
The heat generated from the ED can be efficiently transferred to the base, and the heat transferred to the base can be transferred to the base in a short time due to the fact that the base is made of metal and has low thermal resistance. The heat can be diffused to the entire table, and the efficiency of heat transfer can be increased. As a result, the temperature of the LED can be kept low.

As described above, the second invention provides a metal base and an insulating layer integrally formed on one surface of the base and having an electric path formed on a surface opposite to the base. And a plurality of LEDs electrically connected to an electric path formed in the insulating layer
Since the device and the protective layer provided so as to cover the electric circuit and the LED element are provided, heat generated from the LED element is transmitted to the base via the electric circuit and the insulating layer, and the base is made of metal. Therefore, the low thermal resistance acts to diffuse the entire base in a short time, thereby increasing the efficiency of heat transfer. As a result, the temperature of the LED element can be kept low. Further, the electric circuit and the LED element can be electrically and mechanically protected by the protective layer.

As described above, the third invention comprises a metal base, a plurality of LED elements die-bonded to one surface of the base, and a protective layer provided to cover the LED elements. With this, heat from the LED element can be transferred to the base immediately, and because the base is made of metal, the heat resistance is small, and it can be spread over the entire base in a short time. Therefore, the efficiency of heat transfer can be increased. As a result, the temperature of the LED element can be kept low. Further, the LED element can be electrically and mechanically protected by the protective layer.

As described above, in the fourth invention, a plurality of heat radiating portions projecting from the other surface of the base of any of the first to third inventions are integrally formed on the other surface of the base. And the amount of radiated heat can be increased as compared with the case where there is no heat radiating portion, and the radiation efficiency can be further increased. As a result, the temperature rise of the LED element can be suppressed.

As described above, in the fifth invention, in the fourth invention, the height of the heat radiating portion protruding from the region sandwiched by the center portion of at least one of the opposing edges is increased from the region sandwiched by the peripheral portion of the edge. Since the heat radiating portion is formed higher than the projecting heat radiating portion, the heat radiating area in the central portion is larger than the heat radiating area in the peripheral portion, and more heat can be radiated in the central portion than in the peripheral portion. Thereby, the temperature of the LED assembly module can be made uniform, and since the temperature is uniform, the light emission luminance of each LED element can be made substantially the same.

As described above, in the sixth invention, the base of any of the first to third inventions has a hollow portion formed inside the base and filled with a working fluid, or heat generated from the LED element. Can be smoothly moved to the base shell.

According to the seventh aspect of the present invention, as described above, the base of any of the first to third aspects comprises a flat plate, a pair of protruding portions projecting from at least one opposing edge of the flat plate, And a hollow portion in which the working fluid is sealed and formed inside the protruding portion so that the two communicate with each other.
The heat from the ED element can be transferred to the base shell more smoothly than in the sixth aspect.

As described above, in the eighth invention, the base of the fourth invention or the fifth invention has the hollow portion formed so as to communicate with the heat radiating portion and filled with the working fluid. The heat from the LED element can be more smoothly transferred to the base shell than in the seventh aspect.

As described above, in the ninth aspect of the present invention, since the fan is arranged close to the projection of the seventh aspect, the heat radiation effect of the projection can be further enhanced by forced convection generated by the fan.

According to the tenth invention, as described above, a coating for increasing the emissivity of the other surface is applied to the other surface of the base of any of the first to ninth inventions. Since the emissivity can be increased and the amount of heat radiation to the outside can be increased, heat can be efficiently released to the outside.

As described above, in the eleventh invention, since the protective layer according to any one of the second to tenth inventions is made of a resin having infrared transmission properties, the infrared component radiated from the LED element is directly radiated to the outside. And the heat radiation effect can be further enhanced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a first embodiment of the present invention.

FIG. 2 is a sectional view of FIG.

FIG. 3 is a perspective view showing Embodiment 2 of the present invention.

FIG. 4 is a sectional view of FIG. 3;

FIG. 5 is an enlarged view of LED element arrangement example 1.

FIG. 6 is an enlarged view of LED element arrangement example 2.

FIG. 7 is a perspective view showing a modification of the second embodiment of the present invention.

FIG. 8 is a sectional view of FIG. 7;

FIG. 9 is a perspective view showing a third embodiment of the present invention.

FIG. 10 is a sectional view of FIG. 9;

FIG. 11 is a perspective view showing a fourth embodiment of the present invention.

FIG. 12 is a sectional view of FIG.

FIG. 13 is a cross-sectional view of a packaged LED.

FIG. 14 is a view showing an LED assembly module including the LEDs of FIG. 11;

FIG. 15 is a cross-sectional view of a metal-based epoxy mold LED.

FIG. 16 is a view showing an LED assembly module including the LEDs of FIG. 15;

FIG. 17 is a diagram showing the thermal model of FIG.

[Explanation of symbols]

1, 21 base, 2 insulating substrates, 3 coatings, 4 LE
D, 5 rubber (elastic plate), 11 insulating layers, 12 LE
D element, 13 protective layer, 14 radiator, 36 electrical circuit, 2
1a flat plate part, 21b projecting part, 22 hollow part, 23
Hydraulic fluid, 25 fans.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Akimichi Sei 5-1-1, Ofuna, Kamakura-shi, Kanagawa Prefecture Inside Mitsubishi Electric Lighting Co., Ltd. (72) Inventor Yasuo Imai 5-1-1, Ofuna, Kamakura-shi, Kanagawa Mitsubishi Inside Electric Lighting Co., Ltd. (72) Inventor Takashi Kobayashi 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Mitsubishi Electric Corporation F-term (reference) 3K014 AA01 LA01 LB04 MA02 MA03 MA04 MA08 5F041 AA33 DA34 DA43 DA82 DB08 DC26 DC48 DC58 FF11 FF16

Claims (11)

[Claims] 1. A metal base, an insulating substrate, a plurality of LEDs arranged on one surface of the insulating substrate, and a space between one surface of the base and the other surface of the insulating substrate. An elastic plate having a high thermal conductivity disposed so as to be in close contact with the LED assembly module. 2. A metal base, an insulating layer integrally formed on one surface of the base and having an electric path formed on a surface opposite to the base, An LED assembly module comprising: a plurality of LED elements electrically connected to a formed electric path; and a protective layer provided so as to cover the electric path and the LED elements. 3. A semiconductor device comprising: a metal base; a plurality of LED elements die-bonded to one surface of the base; and a protective layer provided to cover the LED elements. LED assembly module 4. The LED assembly according to claim 1, wherein a plurality of heat radiating portions protruding from the other surface of the base are integrally formed. Body module. 5. The heat radiating portion protruding from a region sandwiched by a central portion of at least one of the opposed edges is formed to be higher than a heat radiating portion projecting from a region sandwiched by a peripheral portion of the edge. The LED assembly module according to claim 4, wherein: 6. The LED assembly according to claim 1, wherein the base has a hollow portion formed inside the base and filled with a working fluid. module. 7. The base includes a flat plate portion, a pair of protruding portions protruding from at least one opposing end sides of the flat plate portion, and both communicating with the inside of the flat plate portion and the protruding portion. The LED assembly module according to any one of claims 1 to 3, further comprising: a hollow portion formed in the second member and filled with a working fluid. 8. The LED assembly according to claim 4, wherein the base is formed so as to communicate with the heat radiating portion, and includes a hollow portion filled with a working fluid. Body module. 9. The LED assembly module according to claim 7, wherein a fan is arranged near the projecting portion. 10. The LED assembly according to claim 1, wherein a coating film for increasing the emissivity of the other surface is applied to the other surface of the base. Body module. 11. The apparatus according to claim 2, wherein said protective layer is made of a resin having an infrared transmission characteristic.
The LED assembly module according to any one of the above.