JPS62235787A - Illuminating device - Google Patents

Illuminating device

Info

Publication number
JPS62235787A
JPS62235787A JP61078342A JP7834286A JPS62235787A JP S62235787 A JPS62235787 A JP S62235787A JP 61078342 A JP61078342 A JP 61078342A JP 7834286 A JP7834286 A JP 7834286A JP S62235787 A JPS62235787 A JP S62235787A
Authority
JP
Japan
Prior art keywords
formed
plurality
layer
recesses
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP61078342A
Other versions
JPH0680841B2 (en
Inventor
Masaru Sasaki
Hiroyuki Serizawa
Original Assignee
Koito Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koito Mfg Co Ltd filed Critical Koito Mfg Co Ltd
Priority to JP61078342A priority Critical patent/JPH0680841B2/en
Publication of JPS62235787A publication Critical patent/JPS62235787A/en
Publication of JPH0680841B2 publication Critical patent/JPH0680841B2/en
Anticipated expiration legal-status Critical
Application status is Expired - Fee Related legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • H01L33/642Heat extraction or cooling elements characterized by the shape
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/49105Connecting at different heights
    • H01L2224/49107Connecting at different heights on the semiconductor or solid-state body
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements

Abstract

PURPOSE:To obtain an illuminating device which does not need to form an insulating layer in an element containing recess formed on a metal substrate and has excellent heat sink effect by arranging an insulating base having excellent thermal conductivity in the recess, and arranging a light emitting element through a conductive layer thereon. CONSTITUTION:A metal substrate 24 made of good conductive conductor covered with an insulating layer 38 on the surface except a plurality of element containing recesses 33 formed on the surface, a plurality of insulating substrates 36 having good conductivity arranged in the recesses 33, a plurality of light emitting elements 25 arranged through a conductive layer 37 on the substrate 36, a plurality of conductors 40 formed on the layer 38 corresponding to the elements 25, and bonding wirings 41 for connecting in series the conductors 40 with the elements 15 through the layer 37 are provided. For example, many tapered element containing recesses 33 are formed on the substrate 24, a reflecting surface 34 for reflecting the lights emitted from LEDs 25 forward is formed on the inner wall, and the substrates 35 made of SiC are respectively arranged on the bottoms of the recesses 33.
JP61078342A 1986-04-07 1986-04-07 Lighting device Expired - Fee Related JPH0680841B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61078342A JPH0680841B2 (en) 1986-04-07 1986-04-07 Lighting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61078342A JPH0680841B2 (en) 1986-04-07 1986-04-07 Lighting device

Publications (2)

Publication Number Publication Date
JPS62235787A true JPS62235787A (en) 1987-10-15
JPH0680841B2 JPH0680841B2 (en) 1994-10-12

Family

ID=13659310

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61078342A Expired - Fee Related JPH0680841B2 (en) 1986-04-07 1986-04-07 Lighting device

Country Status (1)

Country Link
JP (1) JPH0680841B2 (en)

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01311501A (en) * 1988-06-10 1989-12-15 Mitsubishi Cable Ind Ltd Light emitting diode lighting fixture
JPH0278102A (en) * 1987-12-24 1990-03-19 Mitsubishi Cable Ind Ltd Light emitting diode lighting unit
US5418384A (en) * 1992-03-11 1995-05-23 Sharp Kabushiki Kaisha Light-source device including a linear array of LEDs
US5504350A (en) * 1992-08-12 1996-04-02 Spectra-Physics Scanning Systems, Inc. Lens configuration
WO1997048134A1 (en) * 1996-06-13 1997-12-18 Gentex Corporation Illuminator assembly incorporating light emitting diodes
US5936353A (en) * 1996-04-03 1999-08-10 Pressco Technology Inc. High-density solid-state lighting array for machine vision applications
GB2361581A (en) * 2000-04-20 2001-10-24 Lite On Electronics Inc A light emitting diode device
EP1072884A3 (en) * 1999-07-28 2002-01-23 KELLY, William, M. Improvements in and relating to ring lighting
WO2002021043A1 (en) * 2000-09-06 2002-03-14 Vossloh-Wustlich Opto Gmbh & Co. Kg Lighting element
WO2002084750A1 (en) * 2001-04-12 2002-10-24 Matsushita Electric Works, Ltd. Light source device using led, and method of producing same
US6509832B1 (en) 1998-09-15 2003-01-21 Gentex Corporation Systems and components for enhancing rear vision from a vehicle
EP1453110A2 (en) * 2003-02-28 2004-09-01 Noritsu Koki Co., Ltd. Light-emitting diode light source unit
US6844570B2 (en) * 2001-04-11 2005-01-18 Nihon Kessho Kogaku Co., Ltd. Component of a radiation detector comprising a substrate with positioning structure for a photoelectric element array
EP1635403A1 (en) * 2004-09-08 2006-03-15 Asetronics AG Metallic substrate with multiple light emitting diodes
WO2006101257A1 (en) * 2005-03-23 2006-09-28 Matsushita Electric Industrial Co., Ltd. Light-emitting module
US7129638B2 (en) * 2000-08-09 2006-10-31 Avago Technologies General Ip (Singapore) Pte. Ltd. Light emitting devices with a phosphor coating having evenly dispersed phosphor particles and constant thickness
JP2007109532A (en) * 2005-10-14 2007-04-26 Stanley Electric Co Ltd Vehicular lighting fixture
JP2007165507A (en) * 2005-12-13 2007-06-28 Fujikura Ltd Substrate for mounting light emitting element and its manufacturing method, and light emitting element module, display device, lighting device, and traffic signal
US7290893B2 (en) 2004-04-07 2007-11-06 Gekko Technology Limited Lighting apparatus
EP2101550A1 (en) * 2008-03-14 2009-09-16 Asetronics AG Insulated metal substrate with an implant
EP1939939A3 (en) * 2002-06-14 2010-03-24 Lednium Technology Pty Limited A lamp and method of producing a lamp
JP2010140878A (en) * 2008-12-15 2010-06-24 Koito Mfg Co Ltd Lighting fixture for vehicle
JP2011090962A (en) * 2009-10-23 2011-05-06 Fuji Heavy Ind Ltd Lighting fixture for vehicle
CN102318092A (en) * 2009-02-17 2012-01-11 端点工程有限公司 Substrate for an optical device, an optical device package comprising the same and a production method for the same
DE10351934B4 (en) * 2003-11-07 2017-07-13 Tridonic Jennersdorf Gmbh Light emitting diode assembly with heat dissipating board

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51150275A (en) * 1975-06-18 1976-12-23 Hitachi Ltd Semiconductor
JPS5443658U (en) * 1977-09-02 1979-03-26
JPS54150478U (en) * 1978-04-10 1979-10-19
JPS55154564U (en) * 1979-04-24 1980-11-07

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51150275A (en) * 1975-06-18 1976-12-23 Hitachi Ltd Semiconductor
JPS5443658U (en) * 1977-09-02 1979-03-26
JPS54150478U (en) * 1978-04-10 1979-10-19
JPS55154564U (en) * 1979-04-24 1980-11-07

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0278102A (en) * 1987-12-24 1990-03-19 Mitsubishi Cable Ind Ltd Light emitting diode lighting unit
JPH01311501A (en) * 1988-06-10 1989-12-15 Mitsubishi Cable Ind Ltd Light emitting diode lighting fixture
US5418384A (en) * 1992-03-11 1995-05-23 Sharp Kabushiki Kaisha Light-source device including a linear array of LEDs
US5504350A (en) * 1992-08-12 1996-04-02 Spectra-Physics Scanning Systems, Inc. Lens configuration
US5936353A (en) * 1996-04-03 1999-08-10 Pressco Technology Inc. High-density solid-state lighting array for machine vision applications
US5803579A (en) * 1996-06-13 1998-09-08 Gentex Corporation Illuminator assembly incorporating light emitting diodes
US7524097B2 (en) 1996-06-13 2009-04-28 Gentex Corporation Light emitting assembly
US6132072A (en) * 1996-06-13 2000-10-17 Gentex Corporation Led assembly
US6550949B1 (en) 1996-06-13 2003-04-22 Gentex Corporation Systems and components for enhancing rear vision from a vehicle
US6523976B1 (en) 1996-06-13 2003-02-25 Gentex Corporation Led assembly
WO1997048134A1 (en) * 1996-06-13 1997-12-18 Gentex Corporation Illuminator assembly incorporating light emitting diodes
US6672745B1 (en) 1998-09-15 2004-01-06 Gentex Corporation Systems and components for enhancing rear vision from a vehicle
US6509832B1 (en) 1998-09-15 2003-01-21 Gentex Corporation Systems and components for enhancing rear vision from a vehicle
US6454437B1 (en) 1999-07-28 2002-09-24 William Kelly Ring lighting
EP1072884A3 (en) * 1999-07-28 2002-01-23 KELLY, William, M. Improvements in and relating to ring lighting
GB2361581A (en) * 2000-04-20 2001-10-24 Lite On Electronics Inc A light emitting diode device
US7129638B2 (en) * 2000-08-09 2006-10-31 Avago Technologies General Ip (Singapore) Pte. Ltd. Light emitting devices with a phosphor coating having evenly dispersed phosphor particles and constant thickness
WO2002021043A1 (en) * 2000-09-06 2002-03-14 Vossloh-Wustlich Opto Gmbh & Co. Kg Lighting element
US6844570B2 (en) * 2001-04-11 2005-01-18 Nihon Kessho Kogaku Co., Ltd. Component of a radiation detector comprising a substrate with positioning structure for a photoelectric element array
WO2002084750A1 (en) * 2001-04-12 2002-10-24 Matsushita Electric Works, Ltd. Light source device using led, and method of producing same
US6874910B2 (en) 2001-04-12 2005-04-05 Matsushita Electric Works, Ltd. Light source device using LED, and method of producing same
EP1939939A3 (en) * 2002-06-14 2010-03-24 Lednium Technology Pty Limited A lamp and method of producing a lamp
EP1453110A3 (en) * 2003-02-28 2009-05-27 Noritsu Koki Co., Ltd. Light-emitting diode light source unit
EP1453110A2 (en) * 2003-02-28 2004-09-01 Noritsu Koki Co., Ltd. Light-emitting diode light source unit
DE10351934B4 (en) * 2003-11-07 2017-07-13 Tridonic Jennersdorf Gmbh Light emitting diode assembly with heat dissipating board
US7690801B2 (en) 2004-04-07 2010-04-06 Gekko Technology Limited Lighting apparatus
US7290893B2 (en) 2004-04-07 2007-11-06 Gekko Technology Limited Lighting apparatus
US7303308B2 (en) 2004-04-07 2007-12-04 Gekko Technology Limited Lighting apparatus
EP1635403A1 (en) * 2004-09-08 2006-03-15 Asetronics AG Metallic substrate with multiple light emitting diodes
US7847307B2 (en) 2005-03-23 2010-12-07 Panasonic Corporation Light-emitting module
WO2006101257A1 (en) * 2005-03-23 2006-09-28 Matsushita Electric Industrial Co., Ltd. Light-emitting module
JP4514052B2 (en) * 2005-10-14 2010-07-28 スタンレー電気株式会社 The vehicle lamp
JP2007109532A (en) * 2005-10-14 2007-04-26 Stanley Electric Co Ltd Vehicular lighting fixture
JP2007165507A (en) * 2005-12-13 2007-06-28 Fujikura Ltd Substrate for mounting light emitting element and its manufacturing method, and light emitting element module, display device, lighting device, and traffic signal
EP2101550A1 (en) * 2008-03-14 2009-09-16 Asetronics AG Insulated metal substrate with an implant
JP2010140878A (en) * 2008-12-15 2010-06-24 Koito Mfg Co Ltd Lighting fixture for vehicle
CN102318092A (en) * 2009-02-17 2012-01-11 端点工程有限公司 Substrate for an optical device, an optical device package comprising the same and a production method for the same
JP2011090962A (en) * 2009-10-23 2011-05-06 Fuji Heavy Ind Ltd Lighting fixture for vehicle

Also Published As

Publication number Publication date
JPH0680841B2 (en) 1994-10-12

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees