JP2007335561A - Led ultraviolet-ray irradiating apparatus - Google Patents

Led ultraviolet-ray irradiating apparatus Download PDF

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JP2007335561A
JP2007335561A JP2006164436A JP2006164436A JP2007335561A JP 2007335561 A JP2007335561 A JP 2007335561A JP 2006164436 A JP2006164436 A JP 2006164436A JP 2006164436 A JP2006164436 A JP 2006164436A JP 2007335561 A JP2007335561 A JP 2007335561A
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ultraviolet
cooling
led
wiring board
irradiation device
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JP4946190B2 (en
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Kazuhiro Sakai
和宏 坂井
Kenichiro Ono
健一郎 小野
Takashi Ide
崇 井出
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Iwasaki Denki KK
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Iwasaki Denki KK
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED ultraviolet-ray irradiating apparatus which can efficiently and uniformly carry out ultraviolet curing in a desired location, and can easily be cooled. <P>SOLUTION: A plurality of ultraviolet-ray LEDs 2 arranged in a matrix form, a power supply 3 for carrying out the lighting control of the ultraviolet-ray LEDs, and a means for cooling a wiring board 1 are provided on the wiring board 1. Further, a cooling member 5 having a vent 7 and having a cooling plate member on the bottom thereof is arranged on the entire back of the plurality of ultraviolet-ray LEDs, and a blower 8 is arranged on the back of the cooling member 5. The blower is formed in the size of the cooling member except a part of the periphery thereof, and a cooling effect is increased from the end of the wiring board toward the center thereof so that temperature distribution in the wiring board is balanced. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、各種ディスプレイパネルの基板部材を紫外線硬化性接着剤による貼り合せにおける紫外線硬化工程、各種印刷やコーティングにおける紫外線硬化型インキやコーティング材の硬化工程に使用するLED紫外照射装置に関する。   The present invention relates to an LED ultraviolet irradiation device used for an ultraviolet curing process in bonding substrate members of various display panels with an ultraviolet curable adhesive, and an ultraviolet curing ink or coating material curing process in various printing and coating.

各種ディスプレイパネルの基板部材を紫外線硬化性接着剤による貼り合せにおいて、紫外線照射源として例えばメタルハライドランプ等の紫外線ランプが通常用いられる。
(特許文献1参照)
また例えば半導体ウエハの処理装置において、LEDを用いたLED紫外線照射装置が実施されている。(特許文献2参照)
さらに例えば液晶表示セル基板の基板面シールとして、LEDを用いたものが実施されている。(特許文献3参照)
In bonding the display panel substrate members with an ultraviolet curable adhesive, an ultraviolet lamp such as a metal halide lamp is usually used as an ultraviolet irradiation source.
(See Patent Document 1)
Further, for example, in an apparatus for processing a semiconductor wafer, an LED ultraviolet irradiation device using an LED is implemented. (See Patent Document 2)
Further, for example, as a substrate surface seal of a liquid crystal display cell substrate, an LED is used. (See Patent Document 3)

特開2003−295109号公報JP 2003-295109 A 特開2006−40944号公報JP 2006-40944 A 特開2006−30933号公報JP 2006-30933 A

しかしながら、硬化に不必要な(表示基板に悪影響を与える)短波長の紫外線や可視光赤外線も放射されているため、基板と紫外線ランプの間にはマスクを設け、また基板の温度上昇を抑制するため冷却機構を設ける必要がある。
更には、表示板全体に紫外線照射するのに対して、シール剤が塗布されている位置はごく僅かであるため、硬化に利用されない無駄なエネルギーを浪費している。
However, since short-wavelength ultraviolet rays and visible infrared rays that are unnecessary for curing (which adversely affects the display substrate) are also emitted, a mask is provided between the substrate and the ultraviolet lamp, and the temperature rise of the substrate is suppressed. Therefore, it is necessary to provide a cooling mechanism.
Furthermore, since the entire display panel is irradiated with ultraviolet rays, the position where the sealant is applied is very small, and wasteful energy that is not used for curing is wasted.

一方、この紫外線LEDの発光効率はそのLED素子温度の上昇にともなって効率が悪化するため、素子の冷却が重要である。しかしながら、複数のLEDを配列させる場合には強制冷却してもその基板温度やLED素子の温度が均一でなければ、LED毎に発光のバラツキが出てしまう。特に、紫外線LEDを多数配置すると、中央付近の温度が周辺に比べて高くなる。その結果、硬化ムラが発生する欠点がある。
また、紫外線LED自体の発光部は非常に微小な領域であるため、単純に複数並べて照射しても照度ムラが発生する欠点がある。また照度ムラを抑制するために照射距離を大きくすると得られる紫外線照度が低くなる欠点がある。
On the other hand, the luminous efficiency of the ultraviolet LED deteriorates as the temperature of the LED element increases, so that cooling of the element is important. However, when a plurality of LEDs are arranged, even if forced cooling is performed, if the substrate temperature and the LED element temperature are not uniform, there will be variations in light emission for each LED. In particular, when a large number of ultraviolet LEDs are arranged, the temperature near the center becomes higher than the surroundings. As a result, there is a drawback that uneven curing occurs.
Moreover, since the light emitting part of the ultraviolet LED itself is a very small region, there is a drawback that uneven illumination occurs even if a plurality of light emitting parts are simply arranged side by side. Further, there is a drawback that the ultraviolet illuminance obtained when the irradiation distance is increased in order to suppress the illuminance unevenness is lowered.

そこで本発明は、所望の箇所を効率的に、且つ均一に紫外硬化することができ、さらに
装置を簡単に冷却することができるLED紫外線照射装置を提供することを目的とする。
Therefore, an object of the present invention is to provide an LED ultraviolet irradiation device that can efficiently and uniformly UV cure a desired portion and that can easily cool the device.

本発明は上記課題を解決するために請求項1は、配線基板に、マトリクス状に複数配置された紫外線LEDと、紫外線LEDを点灯制御するための電源装置と、配線基板を冷却する手段を有するLED紫外線照射装置に関する。
また複数の紫外線LEDの背面部全体に、通風孔を有し、底部に冷却板体を設けてなる冷却体を配置し、また同冷却体の背面部に送風機を配置し、同送風機は冷却体の外周一部を除外した大きさで構成してある。
そして、冷却板体の端部より冷却板体の中央に向かって冷却効果を増加させ、冷却板体と対応して配置した配線基板の温度分布のバランスをとるように構成してある。
In order to solve the above problems, the present invention provides a wiring board having a plurality of UV LEDs arranged in a matrix, a power supply device for controlling lighting of the UV LEDs, and a means for cooling the wiring board. It is related with LED ultraviolet irradiation device.
Moreover, the cooling body which has a ventilation hole in the whole back part of several ultraviolet LED, and provides the cooling plate body in the bottom part is arrange | positioned, and the air blower is arrange | positioned in the back part of the cooling body, and the air blower is a cooling body. It is comprised by the magnitude | size which excluded some outer periphery.
Then, the cooling effect is increased from the end of the cooling plate toward the center of the cooling plate, and the temperature distribution of the wiring board disposed corresponding to the cooling plate is balanced.

請求項2は請求項1に記載のLED紫外線照射装置において、マトリクス状に複数配置された紫外線LEDは、被照射物の紫外線硬化箇所に対応して選択点灯し、紫外線硬化物の所望の方向から照射するように構成してある。 Claim 2 is the LED ultraviolet irradiation device according to claim 1, wherein a plurality of ultraviolet LEDs arranged in a matrix are selectively lit corresponding to the ultraviolet curing location of the irradiated object, and from a desired direction of the ultraviolet cured product. It is configured to irradiate.

請求項1に記載のLED紫外線照射装置によると、簡単な装置により、冷却板体を介して配線基板全体を平均化して冷却することができ、配線基板の紫外線LEDは全体的に平均化して、光出力はバランスをとることができ、被照射物を均一に硬化することができる。   According to the LED ultraviolet irradiation device of claim 1, the entire wiring board can be averaged and cooled via the cooling plate body by a simple device, and the ultraviolet LED of the wiring board is averaged overall, The light output can be balanced, and the irradiated object can be uniformly cured.

請求項2に記載のLED紫外線照射装置によると、被照射物の紫外線硬化箇所に対応して選択点灯し、紫外線硬化物の所望の方向から照射するように構成したので、必要な箇所に紫外線を照射し、確実に紫外硬化することができる。   According to the LED ultraviolet irradiation device of claim 2, since it is configured to selectively illuminate corresponding to the ultraviolet curing location of the irradiated object and to irradiate from the desired direction of the ultraviolet cured product, ultraviolet rays are applied to the necessary location. Irradiation and UV curing can be ensured.

以下本発明のLED紫外線照射装置の最良の形態を図1乃至図6について説明する。 The best mode of the LED ultraviolet irradiation device of the present invention will be described below with reference to FIGS.

以下、本発明に係る実施例1を図1乃至図6について説明する。図1は本発明に係るLED紫外線照射装置の概略平面図、図2は本発明に係るLED紫外線照射装置の側面図、図3は本発明に係るLED紫外線照射装置におけるLEDの配置図である。図1乃至図3において、1はLEDを装着する配線基板であって、縦18.5cm、横1.0cm、厚さ2mmに構成してある。2は配線基板1にマトリクス状に複数配置してなる紫外線LEDであって、 例えば一列に14個等間隔で配置し、例えば14行配置して構成してある。また同紫外線LED2は、1〜5Wの365nmのものを196個用いて構成してある。   A first embodiment according to the present invention will be described below with reference to FIGS. FIG. 1 is a schematic plan view of an LED ultraviolet irradiation device according to the present invention, FIG. 2 is a side view of the LED ultraviolet irradiation device according to the present invention, and FIG. 3 is a layout view of LEDs in the LED ultraviolet irradiation device according to the present invention. In FIG. 1 to FIG. 3, reference numeral 1 denotes a wiring board on which an LED is mounted, which has a length of 18.5 cm, a width of 1.0 cm, and a thickness of 2 mm. Reference numeral 2 denotes a plurality of ultraviolet LEDs arranged in a matrix on the wiring board 1, and for example, 14 LEDs are arranged at regular intervals in a row, for example, 14 rows are arranged. The ultraviolet LED 2 is composed of 196 1 to 5 W 365 nm ones.

3はコネクターであって、紫外線LEDを点灯制御すための電源装置に接続してある。各列に配置してなる紫外線LEDを例えば一列ごとに点灯制御するように構成してある。4は紫外線LEDを各列独立して点灯制御するための配線である。   Reference numeral 3 denotes a connector, which is connected to a power supply device for controlling lighting of the ultraviolet LED. For example, the ultraviolet LEDs arranged in each row are controlled to be lit for each row. Reference numeral 4 denotes wiring for controlling the lighting of the ultraviolet LEDs independently in each column.

5は配線基板1に配置してなる紫外線LEDと対応する面に配置してなる冷却板体であって、例えば熱伝導性の高いアルミニウム材で構成してある。6は冷却板体5の紫外線LEDと反対側の背面部全体に配置してなる冷却体であって、熱伝導性の高いアルミニウム材で構成してある。7は冷却体6を構成する多数の板体であって、例えば等間隔で配置して構成してある。8は板体7によって構成される通風孔であって、各通風孔8の間隔は例えば4mm程度に構成してある。 また同冷却体6の高さは50mmに構成してある。このように構成すると、冷却風は通風孔8を通って、冷却板体5に当たり、配線基板1と共に紫外線LEDを冷却する。また冷却板体5と配線基板1の間にはグリースを塗布すると両者の密着性は向上する。 Reference numeral 5 denotes a cooling plate disposed on a surface corresponding to the ultraviolet LED disposed on the wiring board 1, and is made of, for example, an aluminum material having high thermal conductivity. A cooling body 6 is disposed on the entire back surface of the cooling plate 5 opposite to the ultraviolet LED, and is made of an aluminum material having high thermal conductivity. Reference numeral 7 denotes a large number of plates constituting the cooling body 6, which are arranged, for example, at equal intervals. Reference numeral 8 denotes a ventilation hole constituted by the plate body 7, and the interval between the ventilation holes 8 is, for example, about 4 mm. The height of the cooling body 6 is 50 mm. With this configuration, the cooling air passes through the ventilation holes 8 and strikes the cooling plate 5 to cool the ultraviolet LED together with the wiring board 1. Further, when grease is applied between the cooling plate body 5 and the wiring board 1, the adhesion between them is improved.

10は冷却体6の背面部に配置してなる送風機であって、図6に示すように、冷却体6の外周一部を除外し、中央部と中央部近傍に対応した大きさで構成してある。送風機としては、5〜20Wのプロペラファンを使用し、1.0〜2.0m3/minの送風を行うように構成してある。図1及び図2においては、紫外線LEDを配置してなる配線基板1は角型に構成し、さらに同配線基板1に対応する底部全体に角型に構成してなる冷却板体5を配置し、さらに同冷却体6の背面に噴出口が丸型の送風機10を配置して構成してある。同送風機10の丸型の噴出口は、例えば冷却体6の約55%〜70%の面積に対応して重なり合う大きさで構成してある。同構造のLED紫外線照射装置において、送風機は、図6に示すように、冷却体6の外周一部を除外した大きさで構成してあるので、冷却板体5は全体的に平均化して冷却される。また同冷却板体5は、紫外線LEDを有する配線基板1に対応して配置して構成してあるので、紫外線LEDは配線基板と共に全体的に平均化して冷却される。送風機10の噴出口の占める割合は、紫外線LEDの使用条件等により変化する。 Reference numeral 10 denotes a blower arranged on the back surface of the cooling body 6, as shown in FIG. 6, excluding a part of the outer periphery of the cooling body 6 and having a size corresponding to the central portion and the vicinity of the central portion. It is. As the blower, a propeller fan of 5 to 20 W is used, and the blower is configured to blow 1.0 to 2.0 m 3 / min. In FIG. 1 and FIG. 2, the wiring board 1 on which the ultraviolet LED is arranged is configured in a square shape, and a cooling plate body 5 configured in a square shape is arranged on the entire bottom corresponding to the wiring board 1. Further, a blower 10 having a round outlet is arranged on the back surface of the cooling body 6. The round jet nozzle of the blower 10 is configured to have a size that overlaps with the area of about 55% to 70% of the cooling body 6, for example. In the LED ultraviolet irradiation device having the same structure, as shown in FIG. 6, the blower is configured to have a size excluding a part of the outer periphery of the cooling body 6, so the cooling plate body 5 is averaged and cooled as a whole. Is done. Further, since the cooling plate 5 is arranged corresponding to the wiring board 1 having ultraviolet LEDs, the ultraviolet LEDs are cooled together with the wiring board as a whole. The proportion of the blower 10 occupying the nozzle varies depending on the use conditions of the ultraviolet LED.

冷却体5の大きさは例えば、縦150mm、横216mmに構成した場合、円形に構成した送風機の大きさは、例えば直径Φ150mmに構成してある。 For example, when the cooling body 5 is configured to have a length of 150 mm and a width of 216 mm, the size of the circularly configured blower is configured to have a diameter of Φ150 mm, for example.

11は冷却板体6の下面の外周近傍の複数箇所に配置してなるスペーサであって、紫外線LEDが直接被照射面等に接触しないように構成してある。   Reference numeral 11 denotes a spacer formed at a plurality of locations near the outer periphery of the lower surface of the cooling plate body 6, and is configured so that the ultraviolet LED does not directly contact the surface to be irradiated.

また紫外線LED2は、被照射物の紫外線硬化箇所に対応して選択点灯し、紫外線硬化物の所望の方向から照射するように構成してある。
紫外線LED2の選択点灯は例えば14個配置してなる紫外線LED2を各列独立して点灯制御する。このように構成すると、必要な箇所を効率よく紫外線により硬化することができる。また紫外線LED2により、紫外線硬化物の斜め方向から照射するように構成したので、必要な箇所に紫外線を効率よく照射し、確実に紫外硬化することができる。
Further, the ultraviolet LED 2 is selectively lit corresponding to the ultraviolet curing portion of the irradiated object, and is irradiated from a desired direction of the ultraviolet cured product.
For selective lighting of the ultraviolet LEDs 2, for example, 14 ultraviolet LEDs 2 arranged are controlled to be lit independently for each column. If comprised in this way, a required location can be hardened | cured efficiently with an ultraviolet-ray. Moreover, since it comprised so that it might irradiate from the diagonal direction of an ultraviolet-ray hardened | cured material by ultraviolet LED2, it can irradiate a ultraviolet-ray efficiently to a required location and can be reliably ultraviolet-cured.

また複数配置された紫外線LEDと、被照射物の大きさや形状等に応じて、被照射面との距離を選択するように構成してあるので、必要な箇所に紫外線を効率よく照射し、確実に紫外硬化することができる。例えば液晶ガラスの場合は、紫外線LEDから硬化樹脂までの距離は10mm程度に構成してある。紫外線LEDから硬化樹脂までの距離が短いと照度分布が不均一になり、長いと紫外線強度が不十分となる。
このように硬化する対象物により、紫外線LED2と被照射物との間隔を調整すると、被照射物の必要な箇所に紫外線を効率よく照射し、確実に紫外硬化することができる。
In addition, since it is configured to select the distance between the plurality of ultraviolet LEDs and the surface to be irradiated according to the size and shape of the object to be irradiated, it is possible to efficiently irradiate the necessary places with ultraviolet rays and ensure Can be UV-cured. For example, in the case of liquid crystal glass, the distance from the ultraviolet LED to the cured resin is about 10 mm. If the distance from the ultraviolet LED to the cured resin is short, the illuminance distribution is non-uniform, and if it is long, the ultraviolet intensity is insufficient.
By adjusting the distance between the ultraviolet LED 2 and the object to be irradiated by the object to be cured in this way, it is possible to efficiently irradiate the necessary part of the object to be irradiated with the ultraviolet ray and reliably cure the ultraviolet ray.

次に上記したLED紫外線照射装置の温度の分布を図4及び図5ついて説明する。冷却用の送風機を用いた構造によると、表1に示す温度分布となる。これに対して、送風機を用いない構造によると、表2に示す温度分布となる。   Next, the temperature distribution of the LED ultraviolet irradiation device described above will be described with reference to FIGS. According to the structure using the cooling fan, the temperature distribution shown in Table 1 is obtained. On the other hand, according to the structure not using the blower, the temperature distribution shown in Table 2 is obtained.

[表1] 送風機を用いた場合の特定位置の温度分布

Figure 2007335561
〔単位:℃〕 [Table 1] Temperature distribution at a specific position when using a blower
Figure 2007335561
[Unit: ° C]

[表2] 送風機を用いない場合の特定位置の温度分布

Figure 2007335561
〔単位:℃〕 [Table 2] Temperature distribution at a specific position when no blower is used
Figure 2007335561
[Unit: ° C]

上記した表1と表2の温度分布を図で示すと、冷却風を送風すると、図4に示すとおりとなる。また冷却風を送風しない構造によると、図5に示すとおりとなる。
同図4と図5から明らかなように、本発明にLED紫外線照射装置によると、基板面における温度は、4.9度以内となる。本発明にLED紫外線照射装置に対して送風機を用いない構造によると基板面における温度は、10.2度と大きい差が生じる。また本発明に示す構造によると、基板面における温度は、高い箇所で19度程度低下する。
このように本発明によると、全体的に温度は低下し、さらに基板面における温度差が少ないので、紫外線LEDの発光効率にほとんど差が生じることがなく、発光効率は一定となり、シール材を均一に硬化することができる。
また基板面における温度差が少ないので、紫外線LEDは全体的に当初の寿命を維持することができる。
When the temperature distribution of Table 1 and Table 2 described above is shown in the figure, when the cooling air is blown, it becomes as shown in FIG. Moreover, according to the structure which does not blow cooling air, it will become as shown in FIG.
As apparent from FIGS. 4 and 5, according to the LED ultraviolet irradiation device of the present invention, the temperature on the substrate surface is within 4.9 degrees. According to the structure of the present invention in which a blower is not used for the LED ultraviolet irradiation device, the temperature on the substrate surface has a large difference of 10.2 degrees. Further, according to the structure shown in the present invention, the temperature on the substrate surface is reduced by about 19 degrees at a high place.
As described above, according to the present invention, the temperature generally decreases, and further, the temperature difference on the substrate surface is small, so there is almost no difference in the luminous efficiency of the ultraviolet LED, the luminous efficiency is constant, and the sealing material is uniform. Can be cured.
Further, since the temperature difference on the substrate surface is small, the ultraviolet LED can maintain the initial life as a whole.

本発明に係るLED紫外線照射装置の概略平面図。The schematic plan view of the LED ultraviolet irradiation device which concerns on this invention. 図1に示すLED紫外線照射装置の側面図。The side view of the LED ultraviolet irradiation device shown in FIG. 図1に示すLED紫外線照射装置のLEDの配置図。The arrangement | positioning drawing of LED of the LED ultraviolet irradiation device shown in FIG. 図1に示すLED紫外線照射装置の温度分布図。The temperature distribution map of the LED ultraviolet irradiation device shown in FIG. 冷却機構を設けないときの温度分布図。The temperature distribution figure when not providing a cooling mechanism. 図1の冷却体と送風機の大きさの関係を示す平面図。The top view which shows the relationship between the size of the cooling body of FIG. 1, and an air blower.

符号の説明Explanation of symbols

1 配線基板
2 紫外線LED
3 コネクター
5 冷却板体
6 冷却体
7 板体
8 通風孔
10 送風機
11 スペーサ
1 Wiring board 2 UV LED
3 Connector 5 Cooling plate body 6 Cooling body 7 Plate body 8 Ventilation hole 10 Blower 11 Spacer

Claims (2)

配線基板に、マトリクス状に複数配置された紫外線LEDと、紫外線LEDを点灯制御するための電源装置と、配線基板を冷却する手段を有するLED紫外線照射装置において、
複数の紫外線LEDの背面部全体に、通風孔を有し、底部に冷却板体を設けてなる冷却体を配置し、また同冷却体の背面部に送風機を配置し、同送風機は冷却体の外周一部を除外した大きさで構成し、冷却板体の端部より冷却板体の中央に向かって冷却効果を増加させ、冷却板体と対応して配置した配線基板の温度分布のバランスをとるように構成したことを特徴とするLED紫外線照射装置。
In the LED ultraviolet irradiation device having a plurality of ultraviolet LEDs arranged in a matrix on the wiring board, a power supply device for controlling the lighting of the ultraviolet LEDs, and means for cooling the wiring board,
A cooling body having ventilation holes and a cooling plate body provided at the bottom is disposed on the entire back surface of the plurality of ultraviolet LEDs, and a blower is disposed on the back surface of the cooling body. Consists of a size excluding a part of the outer periphery, increasing the cooling effect from the end of the cooling plate toward the center of the cooling plate, and balancing the temperature distribution of the wiring board arranged corresponding to the cooling plate An LED ultraviolet irradiation device characterized by being configured to take.
マトリクス状に複数配置された紫外線LEDは、被照射物の紫外線硬化箇所に対応して選択点灯し、紫外線硬化物の所望の方向から照射するように構成したことを特徴とする請求項1記載のLED紫外線照射装置。
The plurality of ultraviolet LEDs arranged in a matrix form are selectively lit corresponding to the ultraviolet curing locations of the irradiated object, and are configured to irradiate from a desired direction of the ultraviolet cured product. LED ultraviolet irradiation device.
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008033056A (en) * 2006-07-28 2008-02-14 Shibaura Mechatronics Corp Sealing agent hardening device and substrate manufacturing apparatus
WO2016052471A1 (en) * 2014-10-02 2016-04-07 ウシオ電機株式会社 Light emitting module
KR20160115646A (en) 2015-03-27 2016-10-06 도시바 라이텍쿠 가부시키가이샤 Light emitting module and lighting apparatus
KR101787405B1 (en) * 2010-12-01 2017-10-19 주식회사 탑 엔지니어링 Apparatus for additionally sealing flat panel display cell using the same
KR101847455B1 (en) * 2010-11-26 2018-04-11 주식회사 탑 엔지니어링 Apparatus for curing sealant in flat panel display cell and apparatus for additionally sealing Organic Light Emitting Diode display cell with the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10247712A (en) * 1998-04-17 1998-09-14 Pfu Ltd Fan integrated heating element cooling system
JP2000031546A (en) * 1998-07-08 2000-01-28 Mitsubishi Electric Corp Led aggregate module
JP2005209865A (en) * 2004-01-22 2005-08-04 Keyence Corp Surface emitting type uv irradiation apparatus
JP2005251892A (en) * 2004-03-03 2005-09-15 Nippon Light Metal Co Ltd Heatsink member and heat sink

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10247712A (en) * 1998-04-17 1998-09-14 Pfu Ltd Fan integrated heating element cooling system
JP2000031546A (en) * 1998-07-08 2000-01-28 Mitsubishi Electric Corp Led aggregate module
JP2005209865A (en) * 2004-01-22 2005-08-04 Keyence Corp Surface emitting type uv irradiation apparatus
JP2005251892A (en) * 2004-03-03 2005-09-15 Nippon Light Metal Co Ltd Heatsink member and heat sink

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008033056A (en) * 2006-07-28 2008-02-14 Shibaura Mechatronics Corp Sealing agent hardening device and substrate manufacturing apparatus
KR101847455B1 (en) * 2010-11-26 2018-04-11 주식회사 탑 엔지니어링 Apparatus for curing sealant in flat panel display cell and apparatus for additionally sealing Organic Light Emitting Diode display cell with the same
KR101787405B1 (en) * 2010-12-01 2017-10-19 주식회사 탑 엔지니어링 Apparatus for additionally sealing flat panel display cell using the same
WO2016052471A1 (en) * 2014-10-02 2016-04-07 ウシオ電機株式会社 Light emitting module
KR20160115646A (en) 2015-03-27 2016-10-06 도시바 라이텍쿠 가부시키가이샤 Light emitting module and lighting apparatus
JP2016187017A (en) * 2015-03-27 2016-10-27 東芝ライテック株式会社 Light emission module and luminaire
TWI650885B (en) * 2015-03-27 2019-02-11 日商東芝照明技術股份有限公司 Light-emitting module and lighting device
KR102310610B1 (en) * 2015-03-27 2021-10-08 도시바 라이텍쿠 가부시키가이샤 Light emitting module and lighting apparatus

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