TWI716451B - Ultraviolet radiation module and ultraviolet radiation device - Google Patents

Ultraviolet radiation module and ultraviolet radiation device Download PDF

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TWI716451B
TWI716451B TW105130085A TW105130085A TWI716451B TW I716451 B TWI716451 B TW I716451B TW 105130085 A TW105130085 A TW 105130085A TW 105130085 A TW105130085 A TW 105130085A TW I716451 B TWI716451 B TW I716451B
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ultraviolet irradiation
fins
opening
hole
frame
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TW105130085A
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TW201712905A (en
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加藤剛雄
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日商東芝照明技術股份有限公司
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00Point-like light sources

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

本發明提供一種紫外線照射模組以及紫外線照射裝置。紫外線照射模組包括:框體,其中一個端部開口;發光部,在框體之內部靠近開口而設置,且具有基板以及發光元件,發光元件設於基板的開口的一側的面且照射紫外線;以及散熱部,在框體之內部設於基板之與開口一側相反之一側,且具有基部以及多個鰭片,多個鰭片是在基部的與開口的一側為相反側之端部排列設置。框體在與多個鰭片之排列方向正交之方向上的面上,具有沿多個鰭片之排列方向而排列設置之多個孔。孔的開口的一側的端部的位置是位於基部的與開口的一側為相反側的端部的位置附近。The invention provides an ultraviolet radiation module and an ultraviolet radiation device. The ultraviolet irradiation module includes: a frame body, one of which is open at one end; a light-emitting part, which is arranged inside the frame body close to the opening, and has a substrate and a light-emitting element; And a heat sink, which is provided inside the frame on the side of the substrate opposite to the side of the opening, and has a base and a plurality of fins, and the plurality of fins is at the end of the base and the side of the opening on the opposite side Department arrangement. The frame has a plurality of holes arranged along the arrangement direction of the plurality of fins on a surface in a direction orthogonal to the arrangement direction of the plurality of fins. The position of the end of the hole on the side of the opening is near the position of the end of the base on the opposite side to the side of the opening.

Description

紫外線照射模組以及紫外線照射裝置Ultraviolet radiation module and ultraviolet radiation device

本發明是有關於一種紫外線照射模組(module)以及紫外線照射裝置。The invention relates to an ultraviolet irradiation module and an ultraviolet irradiation device.

通過對塗布於工件(work)之樹脂或油墨(ink)等照射紫外線,來進行固化、乾燥、改性等。Curing, drying, modification, etc. are performed by irradiating the resin or ink applied on the work with ultraviolet rays.

作為照射紫外線之光源,使用有高壓汞燈或金屬鹵化物燈(metal halide lamp)等。As a light source for irradiating ultraviolet rays, high-pressure mercury lamps or metal halide lamps are used.

近年來,正逐漸取代高壓汞燈或金屬鹵化物燈等而使用照射紫外線之發光二極體(diode)。In recent years, light-emitting diodes that irradiate ultraviolet rays are gradually replacing high-pressure mercury lamps or metal halide lamps.

若使用發光二極體,則與高壓汞燈等相比,能夠實現長壽命化、低電力化、小型化等。If a light-emitting diode is used, compared with a high-pressure mercury lamp or the like, it is possible to achieve longer life, lower power consumption, and downsizing.

然而,發光二極體之輸出會伴隨溫度上升而下降。而且,發光二極體若超過規定之溫度則壽命會變短。However, the output of light-emitting diodes will decrease with temperature rise. Moreover, if the light-emitting diode exceeds the specified temperature, its life will be shortened.

因此,在使用發光二極體之情況下,需要冷卻部件。Therefore, in the case of using light-emitting diodes, the parts need to be cooled.

此處,若對發光二極體之冷卻使用水冷方式之冷卻部件,則存在需要附屬設備,或者必須採取漏液對策,或者紫外線照射模組會大型化之問題。Here, if a water-cooled cooling component is used for the cooling of the light-emitting diode, there is a problem that auxiliary equipment is required, or liquid leakage measures must be taken, or the ultraviolet radiation module will be enlarged.

與此相對,若對發光二極體之冷卻使用空冷方式之冷卻部件,則能夠解決這些問題。On the other hand, if the cooling part of the air cooling method is used for the cooling of the light emitting diode, these problems can be solved.

但是,空冷方式與水冷方式相比,存在冷卻效率低之問題。而且,在採用具備多個紫外線照射模組之紫外線照射裝置之情況下,有可能會因鄰接之紫外線照射模組之排氣或進氣而導致冷卻效率下降。However, the air cooling method has the problem of lower cooling efficiency compared with the water cooling method. Moreover, in the case of an ultraviolet irradiation device with a plurality of ultraviolet irradiation modules, the cooling efficiency may decrease due to the exhaust or intake of the adjacent ultraviolet irradiation modules.

因此,期望開發出一種即使為空冷方式也能夠提高冷卻效率之技術。Therefore, it is desired to develop a technology that can improve cooling efficiency even with air cooling.

[現有技術文獻][Prior Art Literature]

[專利文獻][Patent Literature]

[專利文獻1]日本本發明登記3194269號公報[Patent Document 1] Japanese Patent Registration No. 3194269 Gazette

[本發明所要解決之問題][Problems to be solved by the present invention]

本發明所要解決之課題在於提供一種能夠提高冷卻效率的紫外線照射模組以及紫外線照射裝置。若使用發光二極體,則與高壓汞燈等相比,能夠實現長壽命化、低電力化、小型化等。The problem to be solved by the present invention is to provide an ultraviolet irradiation module and an ultraviolet irradiation device that can improve cooling efficiency. If a light-emitting diode is used, compared with a high-pressure mercury lamp or the like, it is possible to achieve longer life, lower power consumption, and downsizing.

[解決問題之技術手段][Technical means to solve the problem]

實施方式之紫外線照射模組包括:框體,其中一個端部開口;發光部,在所述框體之內部靠近所述開口而設,且具有基板以及發光元件,所述發光元件設於所述基板之所述開口側之面且照射紫外線;以及散熱部,在所述框體之內部設於所述基板之與所述開口側相反之一側,且具有基部以及多個鰭片,所述多個鰭片是在所述基部之與所述開口側為相反側之端部排列設置。The ultraviolet radiation module of the embodiment includes: a frame body with one end opening; a light-emitting part, which is arranged inside the frame body close to the opening, and has a substrate and a light-emitting element, and the light-emitting element is arranged on the The surface of the substrate on the side of the opening is irradiated with ultraviolet rays; and a heat dissipation portion is provided inside the frame on the side of the substrate opposite to the side of the opening, and has a base and a plurality of fins, the A plurality of fins are arranged side by side at the end of the base portion opposite to the opening side.

所述框體在與所述多個鰭片之排列方向正交之方向上之面上,具有沿所述多個鰭片之排列方向而排列設置之多個孔。The frame body has a plurality of holes arranged along the arrangement direction of the plurality of fins on a surface in a direction orthogonal to the arrangement direction of the plurality of fins.

當從相對於設有所述孔之面而垂直之方向觀察所述面時,所述孔之所述開口側端部之位置是位於所述基部之與所述開口側為相反側之端部之位置附近。When the surface is viewed from a direction perpendicular to the surface on which the hole is provided, the position of the end of the hole on the opening side is located at the end of the base on the opposite side to the opening side The location nearby.

實施方式的紫外線照射裝置包括多個所述紫外線照射模組,且所述多個紫外線照射模組是沿所述多個孔的排列方向、以及與所述多個孔的排列方向正交的方向而排列設置。The ultraviolet irradiation device of the embodiment includes a plurality of the ultraviolet irradiation modules, and the plurality of ultraviolet irradiation modules are along the arrangement direction of the plurality of holes and a direction orthogonal to the arrangement direction of the plurality of holes And arrange the settings.

[本發明之效果][Effects of the invention]

根據本發明之實施方式,可提供一種能夠提高冷卻效率之紫外線照射模組以及紫外線照射裝置。然而,發光二極體之輸出會伴隨溫度上升而下降。而且,發光二極體若超過規定之溫度則壽命會變短。According to the embodiments of the present invention, it is possible to provide an ultraviolet irradiation module and an ultraviolet irradiation device capable of improving cooling efficiency. However, the output of light-emitting diodes will decrease with temperature rise. Moreover, if the light-emitting diode exceeds the specified temperature, its life will be shortened.

實施方式之本發明是一種紫外線照射模組,其包括:框體,其中一個端部開口;發光部,在所述框體之內部靠近所述開口而設,且具有基板以及發光元件,所述發光元件設於所述基板之所述開口側之面且照射紫外線;以及散熱部,在所述框體之內部設於所述基板之與所述開口側相反之一側,且具有基部以及多個鰭片,所述多個鰭片是在所述基部之與所述開口側為相反側之端部排列設置。Embodiments of the present invention is an ultraviolet radiation module, which includes: a frame body with one end opening; a light-emitting part, which is provided inside the frame body close to the opening, and has a substrate and a light-emitting element. A light emitting element is provided on the surface of the substrate on the side of the opening and irradiates ultraviolet rays; and a heat sink is provided inside the frame on the side of the substrate opposite to the side of the opening, and has a base and multiple The plurality of fins are arranged side by side at the end of the base that is opposite to the opening side.

所述框體在與所述多個鰭片之排列方向正交之方向上之面上,具有沿所述多個鰭片之排列方向而排列設置之多個孔。The frame body has a plurality of holes arranged along the arrangement direction of the plurality of fins on a surface in a direction orthogonal to the arrangement direction of the plurality of fins.

當從相對於設有所述孔之面而垂直之方向觀察所述面時,所述孔之所述開口側端部之位置是位於所述基部之與所述開口側為相反側之端部之位置附近。When the surface is viewed from a direction perpendicular to the surface on which the hole is provided, the position of the end of the hole on the opening side is located at the end of the base on the opposite side to the opening side The location nearby.

根據該紫外線照射模組,能夠提高冷卻效率。According to this ultraviolet irradiation module, cooling efficiency can be improved.

而且,當從相對於設有所述孔之面而垂直之方向觀察所述面時,可使所述孔位於所述鰭片彼此之間。Furthermore, when the surface is viewed from a direction perpendicular to the surface on which the hole is provided, the hole can be located between the fins.

這樣,能夠抑制通過了孔之氣體流向鰭片與鰭片之間以外。In this way, it is possible to prevent the gas that has passed through the hole from flowing outside the fin and the space between the fins.

因此,能夠提高冷卻效率。Therefore, the cooling efficiency can be improved.

而且,實施方式之本發明是一種紫外線照射裝置,其具備多個所述紫外線照射模組。Furthermore, the present invention of an embodiment is an ultraviolet irradiation device including a plurality of the ultraviolet irradiation modules.

所述多個紫外線照射模組是沿所述多個孔之排列方向、以及與所述多個孔之排列方向正交之方向而排列設置。The plurality of ultraviolet irradiation modules are arranged along the arrangement direction of the plurality of holes and a direction orthogonal to the arrangement direction of the plurality of holes.

根據該紫外線照射裝置,鄰接之紫外線照射模組不會彼此爭奪吸入之氣體(位於紫外線照射模組彼此之間之氣體),排氣也不會發生干涉,因此能夠穩定地對紫外線照射模組1之內部進行冷卻。According to this ultraviolet irradiation device, adjacent ultraviolet irradiation modules do not compete with each other for the inhaled gas (the gas located between the ultraviolet irradiation modules), and the exhaust does not interfere, so the ultraviolet irradiation module 1 can be stably The inside is cooled.

因此,能夠抑制冷卻效率之下降。Therefore, the decrease in cooling efficiency can be suppressed.

而且,根據該紫外線照射裝置,能夠縮短紫外線照射模組彼此之間之距離,因此能夠實現工件上之照度分佈之均勻化。Moreover, according to the ultraviolet irradiation device, the distance between the ultraviolet irradiation modules can be shortened, so that the illuminance distribution on the workpiece can be uniformized.

以下,參照附圖來例示實施方式。另外,各附圖中,對於同樣之構成要素標注相同之符號並適當省略詳細說明。Hereinafter, embodiments will be illustrated with reference to the drawings. In addition, in the drawings, the same components are denoted by the same symbols, and detailed descriptions are appropriately omitted.

圖1是用於例示本實施方式之紫外線照射模組1之示意立體圖。FIG. 1 is a schematic perspective view for illustrating an ultraviolet irradiation module 1 of this embodiment.

如圖1所示,在紫外線照射模組1中,設有框體2、發光部3、散熱部4、窗部5、通風裝置6及連接器(connector)7。As shown in FIG. 1, in the ultraviolet irradiation module 1, a housing 2, a light-emitting part 3, a heat dissipation part 4, a window part 5, a ventilation device 6 and a connector 7 are provided.

框體2之外觀可採用長方體或立方體。若採用具有此種形態之框體2,則能夠使多個紫外線照射模組1靠近地設置。The appearance of the frame 2 can be a rectangular parallelepiped or a cube. If the frame 2 having such a form is adopted, a plurality of ultraviolet irradiation modules 1 can be installed close to each other.

在框體2之內部設有空間。A space is provided inside the frame 2.

在框體2之其中一個端部,設有開口2b。在框體2之另一個端部,設有頂板部2c。頂板部2c與開口2b對置。At one end of the frame body 2, an opening 2b is provided. At the other end of the frame body 2, a top plate portion 2c is provided. The top plate 2c faces the opening 2b.

而且,在框體2之側面2a,設有多個孔21。In addition, a plurality of holes 21 are provided on the side surface 2a of the frame 2.

另外,與孔21相關之詳細情況將後述。In addition, the details of the hole 21 will be described later.

框體2之材料並無特別限定,但優選由導熱率高之材料所形成。The material of the frame 2 is not particularly limited, but it is preferably formed of a material with high thermal conductivity.

例如,框體2之材料可採用金屬等。For example, the material of the frame 2 can be metal or the like.

若由導熱率高之材料來形成框體2,則能夠將在發光部3中產生之熱效率良好地放出至紫外線照射模組1之外部。If the frame 2 is formed of a material with high thermal conductivity, the heat generated in the light-emitting portion 3 can be efficiently discharged to the outside of the ultraviolet irradiation module 1.

發光部3被設於框體2之內部。發光部3是靠近框體2之開口2b而設。The light emitting unit 3 is provided inside the housing 2. The light emitting part 3 is provided close to the opening 2b of the housing 2.

發光部3具有基板31及發光元件32。The light emitting unit 3 has a substrate 31 and a light emitting element 32.

基板31被設在框體2之內部。基板31例如可螺固於框體2之內部。The substrate 31 is provided inside the frame 2. The substrate 31 can be screwed to the inside of the frame 2, for example.

基板31呈板狀。The substrate 31 has a plate shape.

基板31之材料可為適合於散熱的材料。例如,基板31可由氧化鋁或氮化鋁等無機材料(陶瓷(ceramics))、酚醛紙(paper phenol)或環氧玻璃(glass epoxy)等有機材料、銅等金屬等所形成。而且,基板31也可由以絕緣材料包覆金屬板表面所得之材質而形成。另外,在以絕緣材料來包覆金屬板表面之情況下,絕緣材料既可包含有機材料,也可包含無機材料。The material of the substrate 31 may be a material suitable for heat dissipation. For example, the substrate 31 may be formed of inorganic materials (ceramics) such as alumina or aluminum nitride, organic materials such as paper phenol or glass epoxy, metals such as copper, and the like. Moreover, the substrate 31 may also be formed of a material obtained by covering the surface of a metal plate with an insulating material. In addition, in the case of covering the surface of the metal plate with an insulating material, the insulating material may include organic materials or inorganic materials.

在發光元件32之發熱量大之情況下,考慮到散熱之觀點,優選使用導熱率高之材料來形成基板31。作為導熱率高之材料,例如可例示氧化鋁或氮化鋁等陶瓷、高導熱性樹脂、以絕緣材料包覆金屬板表面所得之材質等。In the case where the amount of heat generated by the light emitting element 32 is large, it is preferable to use a material with high thermal conductivity to form the substrate 31 from the viewpoint of heat dissipation. Examples of materials with high thermal conductivity include ceramics such as alumina or aluminum nitride, highly thermally conductive resins, and materials obtained by covering the surface of a metal plate with an insulating material.

另外,高導熱性樹脂例如可採用使包含氧化鋁等之纖維或粒子混合於聚對苯二甲酸乙二醇酯(polyethylene terephthalate,PET)或尼龍(nylon)等樹脂中所得之材質。In addition, the highly thermally conductive resin may be a material obtained by mixing fibers or particles containing alumina and the like with a resin such as polyethylene terephthalate (PET) or nylon (nylon).

而且,基板31既可為單層,也可為多層。Furthermore, the substrate 31 may be a single layer or multiple layers.

而且,在基板31之表面,設有未圖示之配線圖案(pattern)。配線圖案例如可由銀合金或銅合金等金屬而形成。Furthermore, on the surface of the substrate 31, a wiring pattern (not shown) is provided. The wiring pattern can be formed of, for example, a metal such as silver alloy or copper alloy.

發光元件32在基板31之、框體2之開口2b側(窗部5側)之表面設有多個。A plurality of light-emitting elements 32 are provided on the surface of the substrate 31 on the side of the opening 2 b of the frame 2 (side of the window 5 ).

發光元件32之光之出射面朝向框體2之開口2b,從而能夠從框體2之開口2b朝向外部照射紫外線。The light emitting surface of the light emitting element 32 faces the opening 2b of the frame 2 so that ultraviolet rays can be irradiated from the opening 2b of the frame 2 to the outside.

發光元件32之數量或配設形態並不限定於例示者,可根據紫外線照射模組1之大小、形狀、用途等來適當變更。The number or arrangement form of the light-emitting elements 32 are not limited to those illustrated, and can be appropriately changed according to the size, shape, and use of the ultraviolet irradiation module 1.

發光元件32只要是能夠照射紫外線者,則無特別限定。The light-emitting element 32 is not particularly limited as long as it can irradiate ultraviolet rays.

發光元件32例如可採用發光二極體、鐳射二極體(laser diode)等。The light-emitting element 32 can be, for example, a light-emitting diode, a laser diode, or the like.

發光元件32電性連接於配線圖案。The light emitting element 32 is electrically connected to the wiring pattern.

發光元件32例如可使用板上晶片(Chip On Board,COB)法來與配線圖案電性連接。The light-emitting element 32 may be electrically connected to the wiring pattern using, for example, a chip on board (COB) method.

此時,設置在發光元件32下表面之未圖示之電極可經由銀膏(paste)等導電性之熱固化材而與配線圖案電性連接。設置在發光元件32上表面之未圖示之電極可經由配線而與配線圖案電性連接。At this time, the electrode (not shown) provided on the lower surface of the light-emitting element 32 can be electrically connected to the wiring pattern via a conductive thermosetting material such as silver paste. The electrode (not shown) provided on the upper surface of the light-emitting element 32 can be electrically connected to the wiring pattern via wiring.

另外,可設置覆蓋發光元件32及配線之密封部。密封部例如可由使紫外線透射之樹脂而形成。密封部例如可使用分配器(dispenser)等而形成。In addition, a sealing portion covering the light-emitting element 32 and wiring may be provided. The sealing part may be formed of, for example, a resin that transmits ultraviolet rays. The sealing part can be formed using a dispenser etc., for example.

而且,發光元件32例如可採用表面安裝型之發光元件。在表面安裝型之發光元件32之情況下,可經由露出於封裝(package)外部之引線(lead)來與配線圖案電性連接。Furthermore, as the light-emitting element 32, for example, a surface-mounted light-emitting element can be used. In the case of the surface-mounted light-emitting element 32, it can be electrically connected to the wiring pattern through leads exposed outside the package.

而且,發光元件32之封裝形式例如可採用晶片級封裝(Chip Size Package,CSP)。此時,發光元件32可以倒裝晶片(flip chip)之方式安裝於配線圖案上。Moreover, the packaging form of the light-emitting element 32 may be, for example, a chip size package (CSP). At this time, the light-emitting element 32 may be mounted on the wiring pattern in a flip chip manner.

散熱部4被設在框體2之內部。散熱部4是設於基板31之與開口2b側相反之一側。The heat sink 4 is provided inside the frame 2. The heat sink 4 is provided on the side of the substrate 31 opposite to the opening 2b side.

散熱部4具有基部41及鰭片42。The heat sink 4 has a base 41 and fins 42.

基部41呈板狀。基部41接觸至基板31之與發光元件32側為相反側之面。The base 41 has a plate shape. The base 41 is in contact with the surface of the substrate 31 on the opposite side to the light-emitting element 32 side.

另外,在基部41與基板31之間,也可設有包含矽脂(silicone grease)之層8(參照圖2)。若設置包含矽脂之層8,則能夠提高基部41與基板31之密接性,因此能夠提高發光部3與散熱部4之間之導熱。因此,能夠提高散熱部4之冷卻效果。In addition, a layer 8 containing silicone grease may be provided between the base 41 and the substrate 31 (refer to FIG. 2). If the layer 8 containing silicone grease is provided, the adhesion between the base portion 41 and the substrate 31 can be improved, and therefore the heat conduction between the light emitting portion 3 and the heat dissipation portion 4 can be improved. Therefore, the cooling effect of the heat sink 4 can be improved.

基部41之平面形狀可設為與基板31之平面形狀相同。俯視時之基部41之大小可設為與基板31之大小相同或稍大。The planar shape of the base 41 can be the same as the planar shape of the substrate 31. The size of the base 41 in a plan view can be the same as or slightly larger than the size of the substrate 31.

鰭片42是在基部41之與開口2b側為相反側之端部41a排列設置。The fins 42 are arranged side by side at the end 41a of the base 41 on the side opposite to the opening 2b side.

鰭片42在框體2之內部朝向頂板部2c延伸。The fin 42 extends toward the top plate portion 2c inside the frame 2.

鰭片42沿著基部41之邊而設有多個。在基部41之平面形狀為長方形之情況下,多個鰭片42可沿著基部41之長邊而排列設置。A plurality of fins 42 are provided along the side of the base 41. In the case where the planar shape of the base 41 is rectangular, a plurality of fins 42 may be arranged along the long side of the base 41.

此時,若鰭片42與鰭片42之間過窄,則有可能阻礙通風而導致冷卻效果降低。At this time, if the gap between the fin 42 and the fin 42 is too narrow, the ventilation may be hindered and the cooling effect may decrease.

若鰭片42與鰭片42之間過寬,則氣體之流速有可能變慢而導致冷卻效果降低。另外,“氣體”一般是指空氣。If the gap between the fin 42 and the fin 42 is too wide, the flow rate of the gas may slow down, resulting in reduced cooling effect. In addition, "gas" generally refers to air.

根據本發明人獲得之見解,若將鰭片42與鰭片42之間設為3 mm以上且10 mm以下,則能夠提高冷卻效果。According to the findings obtained by the inventors, if the space between the fin 42 and the fin 42 is 3 mm or more and 10 mm or less, the cooling effect can be improved.

多個鰭片42既可等間隔地設置,也可根據部位而以間隔不同之方式設置。The plurality of fins 42 may be arranged at equal intervals, or may be arranged at different intervals according to the location.

例如,根據發光元件32之配設形態等,在不會產生溫度變高之區域之情況下,也可縮窄該區域中所設之鰭片42之間隔。For example, depending on the arrangement form of the light-emitting element 32, etc., the interval between the fins 42 provided in the area can be narrowed without generating a high temperature area.

只要可保證必要之剛性,則鰭片42之厚度並無特別限定。As long as the necessary rigidity can be ensured, the thickness of the fin 42 is not particularly limited.

例如,在鰭片42之材料為鋁之情況下,鰭片42之厚度可設為1 mm左右。For example, when the material of the fin 42 is aluminum, the thickness of the fin 42 can be set to about 1 mm.

鰭片42之高度尺寸可根據發光元件32之發熱量、紫外線照射模組1之大小或用途等來適當變更。The height dimension of the fin 42 can be appropriately changed according to the calorific value of the light emitting element 32, the size or use of the ultraviolet radiation module 1, and the like.

鰭片42之高度尺寸例如可設為30 mm左右。The height dimension of the fin 42 can be set to about 30 mm, for example.

基部41及鰭片42既可一體地形成,也可將獨立形成者予以接合。The base 41 and the fin 42 may be integrally formed, or independently formed ones may be joined.

基部41及鰭片42之材料只要導熱率高,則並無特別限定。The materials of the base 41 and the fins 42 are not particularly limited as long as the thermal conductivity is high.

基部41及鰭片42之材料例如可採用鋁、鋁合金、銅、銅合金等金屬、氧化鋁或氮化鋁等陶瓷、高導熱性樹脂等。The materials of the base 41 and the fins 42 can be, for example, metals such as aluminum, aluminum alloys, copper, and copper alloys, ceramics such as aluminum oxide or aluminum nitride, and high thermal conductivity resins.

另外,在基部41及鰭片42獨立形成之情況下,基部41與鰭片42既可由相同之材料形成,也可由不同之材料形成。In addition, when the base 41 and the fins 42 are formed independently, the base 41 and the fins 42 may be formed of the same material or different materials.

窗部5封閉框體2之開口2b。窗部5例如可螺固於框體2之開口2b。The window 5 closes the opening 2b of the frame 2. The window 5 can be screwed to the opening 2b of the frame 2, for example.

窗部5呈板狀。The window 5 has a plate shape.

窗部5之材料只要為從發光元件32照射之紫外線可透射者,則並無特別限定。The material of the window 5 is not particularly limited as long as it is transparent to ultraviolet rays irradiated from the light-emitting element 32.

窗部5之材料例如可採用紫外線透射玻璃(ultraviolet transmitting glass)、丙烯酸樹脂等。The material of the window 5 can be, for example, ultraviolet transmitting glass (ultraviolet transmitting glass), acrylic resin, or the like.

另外,窗部5之固定方法並不限定於所述。例如,窗部5也可通過下述方式來固定,即,在基部41設置未圖示之間隔件(spacer),由間隔件與框體2夾著窗部5。In addition, the fixing method of the window part 5 is not limited to the above. For example, the window 5 may be fixed by providing a spacer (not shown) on the base 41 and sandwiching the window 5 between the spacer and the frame 2.

通風裝置6被設於框體2之頂板部2c。通風裝置6可螺固於頂板部2c。在頂板部2c之安裝通風裝置6之位置設有孔,可經由孔來進行通風。The ventilation device 6 is provided on the top plate portion 2c of the frame 2. The ventilation device 6 can be screwed to the top plate portion 2c. A hole is provided in the top plate portion 2c where the ventilation device 6 is installed, and ventilation can be performed through the hole.

通風裝置6之形式並無特別限定,若採用軸流式風扇(fan),則能夠實現紫外線照射模組1之小型化。The form of the ventilator 6 is not particularly limited. If an axial fan (fan) is used, the size of the ultraviolet irradiation module 1 can be reduced.

軸流式風扇從軸向吸入氣體,並沿軸向排出氣體。The axial flow fan sucks gas in the axial direction and discharges the gas in the axial direction.

通風裝置6之數量並無特別限定,可根據通風裝置6之能力、紫外線照射模組1之大小或用途等來適當變更。The number of the ventilating device 6 is not particularly limited, and can be appropriately changed according to the capacity of the ventilating device 6 and the size or use of the ultraviolet irradiation module 1.

即,通風裝置6只要設置一個以上即可。In other words, one or more ventilation devices 6 may be installed.

在設置多個通風裝置6之情況下,通風裝置6既可等間隔地設置,也可根據部位而以間隔不同之方式來設置。When a plurality of ventilating devices 6 are provided, the ventilating devices 6 may be installed at equal intervals, or may be installed at different intervals according to the location.

例如,根據發光元件32之配設形態等,在不會產生溫度變高之區域之情況下,也可縮窄該區域中所設之通風裝置6之間隔。For example, depending on the arrangement form of the light-emitting elements 32, etc., the interval between the ventilation devices 6 provided in the area can be narrowed without generating a high temperature area.

而且,在通風裝置6中,可設置過濾網(filter)6a。Furthermore, in the ventilation device 6, a filter 6a may be provided.

此時,過濾網6a可設於通風裝置6之進氣口及排氣口中之至少任一處。At this time, the filter 6a can be provided at at least any of the air inlet and the air outlet of the ventilation device 6.

若設置過濾網6a,則能夠製成即使在受到污染之環境下也能使用之紫外線照射模組1。If the filter 6a is provided, it can be made into an ultraviolet radiation module 1 that can be used even in a contaminated environment.

由於通風裝置6對框體2之內部進行排氣,因此可借助過濾網6a來抑制位於框體2內部之塵埃擴散到外部。Since the ventilation device 6 exhausts the inside of the frame 2, the filter 6a can prevent the dust located inside the frame 2 from spreading to the outside.

因此,能夠製成即使在無塵室(clean room)等潔淨之環境下也能使用之紫外線照射模組1。Therefore, it is possible to manufacture the ultraviolet irradiation module 1 that can be used even in a clean environment such as a clean room.

而且,若將通風裝置6設置於頂板部2c,則可使多個紫外線照射模組1靠近地設置。Moreover, if the ventilation device 6 is installed in the top plate part 2c, the some ultraviolet irradiation module 1 can be installed close.

而且,例示了將通風裝置6直接設於頂板部2c之情況,但也可經由導管(duct)或軟管(hose)等來連接通風裝置6與框體2。Furthermore, although the case where the ventilation device 6 is directly provided in the top plate part 2c is exemplified, the ventilation device 6 and the frame 2 may be connected via a duct, a hose, or the like.

此時,也可相對於多個紫外線照射模組1來設置共用之通風裝置6。At this time, a common ventilation device 6 can also be provided for a plurality of ultraviolet irradiation modules 1.

連接器7被設於框體2之頂板部2c。The connector 7 is provided on the top plate portion 2c of the housing 2.

發光元件32及通風裝置6經由未圖示之配線而電性連接於連接器7。未圖示之配線被設於框體2之內部。The light emitting element 32 and the ventilating device 6 are electrically connected to the connector 7 via wiring not shown. The wiring not shown in the figure is provided inside the frame 2.

而且,設在紫外線照射模組1外部之未圖示之電源或控制裝置等電性連接於連接器7。Furthermore, a power supply or a control device (not shown) provided outside the ultraviolet irradiation module 1 is electrically connected to the connector 7.

另外,例示了連接器7被設於頂板部2c之情況,但連接器7之安裝位置可適當變更。In addition, although the case where the connector 7 is provided in the top plate part 2c is illustrated, the attachment position of the connector 7 can be changed suitably.

例如,連接器7也可設於框體2之側面2a等。For example, the connector 7 may be provided on the side surface 2a of the frame 2 or the like.

但是,若將連接器7設於頂板部2c,則能夠使多個紫外線照射模組1靠近地設置。However, if the connector 7 is provided in the top plate portion 2c, the plurality of ultraviolet irradiation modules 1 can be installed close to each other.

接下來,進一步說明設於框體2之孔21。Next, the hole 21 provided in the frame 2 is further explained.

圖2是用於例示孔21之示意圖。FIG. 2 is a schematic diagram for illustrating the hole 21.

另外,圖2是圖1中之A部之示意放大圖。In addition, FIG. 2 is a schematic enlarged view of part A in FIG. 1.

如圖2所示,多個孔21被設在框體2之、與多個鰭片42之排列方向正交之方向上之側面2a。As shown in FIG. 2, the plurality of holes 21 are provided on the side surface 2a of the frame 2 in the direction orthogonal to the arrangement direction of the plurality of fins 42.

多個孔21是沿多個鰭片42之排列方向而排列地設置。The plurality of holes 21 are arranged along the arrangement direction of the plurality of fins 42.

另外,孔21既可設於框體2兩側之側面2a,也可設於框體2單側之側面2a。In addition, the hole 21 may be provided on the side surface 2a on both sides of the frame 2 or on the side surface 2a of one side of the frame 2.

孔21朝向框體2之頂板部2c延伸。The hole 21 extends toward the top plate portion 2c of the frame 2.

孔21之形狀並無特別限定。孔21之形狀例如可採用長方形。The shape of the hole 21 is not particularly limited. The shape of the hole 21 may be rectangular, for example.

位於框體2外部之氣體經由孔21而供給至框體2之內部。The gas located outside the frame 2 is supplied to the inside of the frame 2 through the hole 21.

即,孔21為通氣孔。That is, the hole 21 is a vent hole.

此時,孔21被設在框體2之、與多個鰭片42之排列方向正交之方向上之側面2a,因此流經鰭片42與鰭片42之間之氣體之流動變得順暢。因此,能夠提高冷卻性。At this time, the hole 21 is provided on the side surface 2a of the frame 2 in the direction orthogonal to the arrangement direction of the plurality of fins 42, so the flow of gas flowing between the fins 42 and the fins 42 becomes smooth . Therefore, the cooling performance can be improved.

此處,若加大孔21,則通過孔21之氣體之流速將變慢。若通過孔21之氣體之流速變慢,則流經鰭片42與鰭片42之間之氣體之流速將變慢,從而冷卻效果有可能降低。Here, if the hole 21 is enlarged, the flow rate of the gas passing through the hole 21 will become slower. If the flow rate of the gas passing through the hole 21 becomes slower, the flow rate of the gas flowing between the fin 42 and the fin 42 will become slower, and the cooling effect may be reduced.

例如,若沿多個鰭片42之排列方向設置大之孔,則流經鰭片42與鰭片42之間之氣體之流速將變慢,冷卻效果會降低。For example, if a large hole is provided along the arrangement direction of the plurality of fins 42, the flow rate of the gas flowing between the fins 42 and the fins 42 will be slower, and the cooling effect will be reduced.

因此,在本實施方式之紫外線照射模組1中,通過設置多個孔21,來確保通氣孔之面積與確保規定之流速。Therefore, in the ultraviolet irradiation module 1 of this embodiment, by providing a plurality of holes 21, the area of the vent hole and the predetermined flow velocity are ensured.

此處,若通過了孔21之氣體碰撞到鰭片42之端面,則流經鰭片42與鰭片42之間之氣體之流動將會紊亂,甚而,流經鰭片42與鰭片42之間之氣體之流速將變慢。若流經鰭片42與鰭片42之間之氣體之流速變慢,則冷卻效果會降低。Here, if the gas passing through the hole 21 collides with the end surface of the fin 42, the flow of the gas flowing between the fin 42 and the fin 42 will be turbulent, and even between the fin 42 and the fin 42 The flow rate of the gas will slow down. If the velocity of the gas flowing between the fin 42 and the fin 42 becomes slower, the cooling effect will be reduced.

因此,當從相對於設有孔21之側面2a而垂直之方向來觀察側面2a時,孔21位於鰭片42彼此之間。Therefore, when the side surface 2a is viewed from a direction perpendicular to the side surface 2a provided with the hole 21, the hole 21 is located between the fins 42.

這樣,能夠抑制通過了孔21之氣體碰撞到鰭片42之端面。In this way, the gas passing through the hole 21 can be prevented from colliding with the end surface of the fin 42.

因此,能夠提高冷卻效率。Therefore, the cooling efficiency can be improved.

進而,在將孔21之寬度尺寸設為W、鰭片42與鰭片42之間之距離設為L之情況下,優選為成為“寬度尺寸W<距離L”。Furthermore, when the width dimension of the hole 21 is W and the distance between the fin 42 and the fin 42 is L, it is preferable to become "width dimension W<distance L".

這樣,能夠進一步抑制通過了孔21之氣體碰撞到鰭片42之端面。In this way, it is possible to further prevent the gas passing through the hole 21 from colliding with the end surface of the fin 42.

而且,散熱部4之散熱主要是在鰭片42中進行。Moreover, the heat dissipation of the heat dissipation portion 4 is mainly performed in the fin 42.

鰭片42之溫度及流經鰭片42與鰭片42之間之氣體之溫度之差越大,則散熱量越大。The greater the difference between the temperature of the fin 42 and the temperature of the gas flowing between the fin 42 and the fin 42, the greater the heat dissipation.

然而,鰭片42存在溫度分佈。However, the fin 42 has a temperature distribution.

即,鰭片42之溫度在靠近發熱體即發光部3之基部41側變高,隨著朝向前端而漸減。That is, the temperature of the fin 42 becomes higher on the side closer to the base 41 of the light emitting part 3 which is the heating element, and gradually decreases toward the tip.

因此,孔21優選設置在靠近基部41之位置。Therefore, the hole 21 is preferably provided at a position close to the base 41.

此時,當從相對於設有孔21之側面2a而垂直之方向來觀察側面2a時,孔21之開口2b側之端部21a之位置只要位於基部41之與開口2b側為相反側之端部41a之位置附近即可。At this time, when viewing the side surface 2a from a direction perpendicular to the side surface 2a provided with the hole 21, the position of the end 21a on the side of the opening 2b of the hole 21 should be located at the end of the base 41 on the opposite side to the side of the opening 2b. The location of the portion 41a may be nearby.

例如,孔21之端部21a之位置只要夾著基部41之端部41a之位置而位於±3 mm之範圍內即可。For example, the position of the end 21a of the hole 21 only needs to be within ±3 mm between the position of the end 41a of the base 41.

另一方面,孔21之端部21b之位置並無特別限定。On the other hand, the position of the end 21b of the hole 21 is not particularly limited.

但是,若端部21a與端部21b之間之距離變長,則孔21將變大。若孔21變得過大,則通過孔21之氣體之流速有可能變慢。However, if the distance between the end 21a and the end 21b becomes longer, the hole 21 will become larger. If the hole 21 becomes too large, the flow rate of the gas passing through the hole 21 may become slow.

而且,鰭片42之前端側由於溫度低,因此設置孔21之意義低。Moreover, since the temperature of the front end side of the fin 42 is low, the significance of providing the hole 21 is low.

例如,孔21之端部21b之位置可較鰭片42之高度方向之中心位置而位於端部21a側。For example, the position of the end 21b of the hole 21 may be on the side of the end 21a relative to the center position of the fin 42 in the height direction.

此處,根據本發明人獲得之見解,若通過孔21之氣體之流速為3 m/sec以上,則能夠有效抑制發光元件32之溫度上升。Here, according to the findings obtained by the present inventors, if the flow rate of the gas passing through the hole 21 is 3 m/sec or more, the temperature rise of the light-emitting element 32 can be effectively suppressed.

此時,通過孔21之氣體之流速受到孔21之尺寸、孔21之數量、通風裝置6之能力、通風裝置6之數量等之影響。At this time, the flow rate of the gas passing through the holes 21 is affected by the size of the holes 21, the number of the holes 21, the capacity of the ventilation device 6, the number of the ventilation device 6, and so on.

因此,孔21之尺寸及孔21之數量優選以通過孔21之氣體之流速達到3 m/sec以上之方式來進行實驗或模擬(simulation)而求出。Therefore, the size of the holes 21 and the number of the holes 21 are preferably determined by experiments or simulations such that the flow rate of the gas passing through the holes 21 reaches 3 m/sec or more.

接下來,對本實施方式之紫外線照射裝置100進行例示。Next, the ultraviolet irradiation device 100 of this embodiment is illustrated.

圖3(a)、圖3(b)是用於例示紫外線照射裝置100之示意圖。3(a) and 3(b) are schematic diagrams for illustrating the ultraviolet irradiation device 100. FIG.

另外,圖3(a)為正面圖,圖3(b)為側面圖。In addition, Fig. 3(a) is a front view, and Fig. 3(b) is a side view.

如圖3(a)、圖3(b)所示,在紫外線照射裝置100中設有多個紫外線照射模組1。As shown in FIG. 3(a) and FIG. 3(b), a plurality of ultraviolet radiation modules 1 are provided in the ultraviolet radiation device 100.

多個紫外線照射模組1是沿多個孔21之排列方向而排列。The plurality of ultraviolet irradiation modules 1 are arranged along the arrangement direction of the plurality of holes 21.

這樣,能夠抑制鄰接之紫外線照射模組彼此爭奪吸入之氣體(位於紫外線照射模組彼此之間之氣體)。而且,能夠抑制排氣發生干涉。因此,能夠穩定地對紫外線照射模組之內部進行冷卻。In this way, it is possible to prevent adjacent ultraviolet irradiation modules from competing with each other for inhaled gas (the gas located between the ultraviolet irradiation modules). Furthermore, interference of exhaust gas can be suppressed. Therefore, the inside of the ultraviolet irradiation module can be cooled stably.

其結果,能夠抑制冷卻效率之下降。As a result, the decrease in cooling efficiency can be suppressed.

此時,即使縮短紫外線照射模組1彼此之間之距離,也能夠抑制鄰接之紫外線照射模組1之進氣/排氣之影響。At this time, even if the distance between the ultraviolet irradiation modules 1 is shortened, the influence of the intake/exhaust of the adjacent ultraviolet irradiation modules 1 can be suppressed.

因此,能夠縮短紫外線照射模組1彼此之間之距離,因此能夠實現工件上之照度分佈之均勻化。Therefore, the distance between the ultraviolet irradiation modules 1 can be shortened, and therefore, the uniformity of the illuminance distribution on the workpiece can be achieved.

另外,紫外線照射模組1之數量並不限定於例示者。In addition, the number of ultraviolet irradiation modules 1 is not limited to the exemplified ones.

圖4(a)、圖4(b)是用於例示另一實施方式之紫外線照射裝置200之示意圖。4(a) and 4(b) are schematic diagrams for illustrating an ultraviolet irradiation device 200 according to another embodiment.

另外,圖4(a)為正面圖,圖4(b)為側面圖。In addition, Fig. 4(a) is a front view, and Fig. 4(b) is a side view.

如圖4(a)、圖4(b)所示,在紫外線照射裝置200中,設有多個紫外線照射模組1。As shown in FIG. 4(a) and FIG. 4(b), in the ultraviolet irradiation device 200, a plurality of ultraviolet irradiation modules 1 are provided.

多個紫外線照射模組1是沿著與多個孔21之排列方向正交之方向而排列。The plurality of ultraviolet irradiation modules 1 are arranged along a direction orthogonal to the arrangement direction of the plurality of holes 21.

本實施方式中,孔21僅設於框體2單側之側面2a。In this embodiment, the hole 21 is provided only on the side surface 2a of one side of the frame 2.

而且,設有孔21之側面2a朝向相同方向。Moreover, the side faces 2a provided with the holes 21 face the same direction.

即,在側面2a彼此相向之情況下,在其中一個紫外線照射模組1之側面2a設置孔21,而在另一個紫外線照射模組1之側面2a不設置孔21。That is, when the side surfaces 2a face each other, the hole 21 is provided on the side surface 2a of one of the ultraviolet irradiation modules 1 and the hole 21 is not provided on the side surface 2a of the other ultraviolet irradiation module 1.

這樣,鄰接之紫外線照射模組1不會彼此爭奪吸入之氣體(位於紫外線照射模組彼此之間之氣體),排氣也不會發生干涉,因此能夠穩定地對紫外線照射模組1之內部進行冷卻。In this way, the adjacent ultraviolet irradiation modules 1 will not compete with each other for the inhaled gas (the gas between the ultraviolet irradiation modules), and the exhaust will not interfere, so the inside of the ultraviolet irradiation module 1 can be stably performed cool down.

因此,能夠抑制冷卻效率之下降。Therefore, the decrease in cooling efficiency can be suppressed.

此時,即使縮短紫外線照射模組1彼此之間之距離,也能夠抑制鄰接之紫外線照射模組1之進氣/排氣之影響。At this time, even if the distance between the ultraviolet irradiation modules 1 is shortened, the influence of the intake/exhaust of the adjacent ultraviolet irradiation modules 1 can be suppressed.

因此,能夠縮短紫外線照射模組1彼此之間之距離,因此能夠實現工件上之照度分佈之均勻化。Therefore, the distance between the ultraviolet irradiation modules 1 can be shortened, and thus the uniformity of the illuminance distribution on the workpiece can be achieved.

另外,紫外線照射模組1之數量並不限定於例示者。In addition, the number of ultraviolet irradiation modules 1 is not limited to the exemplified ones.

圖5是用於例示另一實施方式之紫外線照射裝置300之示意立體圖。FIG. 5 is a schematic perspective view for illustrating an ultraviolet irradiation device 300 according to another embodiment.

如圖5所示,在紫外線照射裝置300中,設有多個紫外線照射模組1。As shown in FIG. 5, in the ultraviolet irradiation device 300, a plurality of ultraviolet irradiation modules 1 are provided.

多個紫外線照射模組1是沿多個孔21之排列方向、以及與多個孔21之排列方向正交之方向而排列。The plurality of ultraviolet irradiation modules 1 are arranged along the arrangement direction of the plurality of holes 21 and a direction orthogonal to the arrangement direction of the plurality of holes 21.

即,多個紫外線照射模組1排列成矩陣(matrix)狀。That is, the plurality of ultraviolet irradiation modules 1 are arranged in a matrix.

本實施方式中,孔21僅設於框體2單側之側面2a。In this embodiment, the hole 21 is provided only on the side surface 2a of one side of the frame 2.

而且,設有孔21之側面2a朝向相同方向。Moreover, the side faces 2a provided with the holes 21 face the same direction.

即,在側面2a彼此相向之情況下,在其中一個紫外線照射模組1之側面2a設置孔21,而在另一個紫外線照射模組1之側面2a不設置孔21。That is, when the side surfaces 2a face each other, the hole 21 is provided on the side surface 2a of one of the ultraviolet irradiation modules 1 and the hole 21 is not provided on the side surface 2a of the other ultraviolet irradiation module 1.

這樣,鄰接之紫外線照射模組1不會彼此爭奪吸入之氣體(位於紫外線照射模組彼此之間之氣體),排氣也不會發生干涉,因此能夠穩定地對紫外線照射模組1之內部進行冷卻。In this way, the adjacent ultraviolet irradiation modules 1 will not compete with each other for the inhaled gas (the gas between the ultraviolet irradiation modules), and the exhaust will not interfere, so the inside of the ultraviolet irradiation module 1 can be stably performed cool down.

因此,能夠抑制冷卻效率之下降。Therefore, the decrease in cooling efficiency can be suppressed.

而且,根據紫外線照射裝置300,與前述之紫外線照射裝置100、200之情況同樣地,能夠實現工件上之照度分佈之均勻化。Furthermore, according to the ultraviolet irradiation device 300, as in the case of the aforementioned ultraviolet irradiation devices 100 and 200, the illuminance distribution on the workpiece can be uniformized.

進而,在將多個孔21之排列方向上之紫外線照射模組1彼此之間之距離設為X,與多個孔21之排列方向正交之方向上之紫外線照射模組1彼此之間之距離設為Y之情況下,優選為成為“Y>X”。Furthermore, the distance between the ultraviolet irradiation modules 1 in the arrangement direction of the plurality of holes 21 is X, and the distance between the ultraviolet irradiation modules 1 in the direction orthogonal to the arrangement direction of the plurality of holes 21 When the distance is Y, it is preferably "Y>X".

另外,紫外線照射模組1之數量並不限定於例示者。In addition, the number of ultraviolet irradiation modules 1 is not limited to the exemplified ones.

100‧‧‧紫外線照射模組 2‧‧‧框體 2a‧‧‧側面 2b‧‧‧開口 2c‧‧‧頂板部 3‧‧‧發光部 4‧‧‧散熱部 5‧‧‧窗部 6‧‧‧通風裝置 6a‧‧‧過濾網 7‧‧‧連接器 8‧‧‧層 21‧‧‧孔 21a、21b、41a‧‧‧端部 31‧‧‧基板 32‧‧‧發光元件 41‧‧‧基部 42‧‧‧鰭片 100、200、300‧‧‧紫外線照射裝置 L、X、Y‧‧‧距離 W‧‧‧寬度尺寸100‧‧‧UV Irradiation Module 2‧‧‧Frame 2a‧‧‧ side 2b‧‧‧Open 2c‧‧‧Top plate 3‧‧‧Lighting part 4‧‧‧Radiator 5‧‧‧Window 6‧‧‧Ventilation device 6a‧‧‧Filter 7‧‧‧Connector 8‧‧‧ floor 21‧‧‧Hole 21a, 21b, 41a‧‧‧end 31‧‧‧Substrate 32‧‧‧Light-emitting element 41‧‧‧Base 42‧‧‧Fins 100, 200, 300‧‧‧UV irradiation device L, X, Y‧‧‧Distance W‧‧‧Width size

圖1是用於例示本實施方式之紫外線照射模組1之示意立體圖。 圖2是用於例示孔21之示意圖。 圖3(a)、圖3(b)是用於例示紫外線照射裝置100之示意圖。 圖4(a)、圖4(b)是用於例示另一實施方式之紫外線照射裝置200之示意圖。 圖5是用於例示另一實施方式之紫外線照射裝置300之示意立體圖。FIG. 1 is a schematic perspective view for illustrating an ultraviolet irradiation module 1 of this embodiment. FIG. 2 is a schematic diagram for illustrating the hole 21. 3(a) and 3(b) are schematic diagrams for illustrating the ultraviolet irradiation device 100. FIG. 4(a) and 4(b) are schematic diagrams for illustrating an ultraviolet irradiation device 200 according to another embodiment. FIG. 5 is a schematic perspective view for illustrating an ultraviolet irradiation device 300 according to another embodiment.

1‧‧‧紫外線照射模組 1‧‧‧Ultraviolet radiation module

2‧‧‧框體 2‧‧‧Frame

2a‧‧‧側面 2a‧‧‧ side

2b‧‧‧開口 2b‧‧‧Open

2c‧‧‧頂板部 2c‧‧‧Top plate

3‧‧‧發光部 3‧‧‧Lighting part

4‧‧‧散熱部 4‧‧‧Radiator

5‧‧‧窗部 5‧‧‧Window

6‧‧‧通風裝置 6‧‧‧Ventilation device

6a‧‧‧過濾網 6a‧‧‧Filter

7‧‧‧連接器 7‧‧‧Connector

21‧‧‧孔 21‧‧‧Hole

31‧‧‧基板 31‧‧‧Substrate

32‧‧‧發光元件 32‧‧‧Light-emitting element

41‧‧‧基部 41‧‧‧Base

42‧‧‧鰭片 42‧‧‧Fins

Claims (2)

一種紫外線照射模組,包括:框體,其中一個端部開口;發光部,在所述框體的內部靠近所述開口而設置,且具有基板以及發光元件,所述發光元件設於所述基板的所述開口的一側的面且照射紫外線;以及散熱部,在所述框體的內部設於所述基板的與所述開口的一側相反的一側,且具有基部以及多個鰭片,所述多個鰭片是在所述基部的與所述開口的一側為相反側的端部排列設置,所述框體在與所述多個鰭片的排列方向正交的方向上的面上,具有沿所述多個鰭片的排列方向而排列設置的多個孔,當從相對於設有所述多個孔的面而垂直的方向觀察所述面時,所述多個孔各自位於所述多個鰭片彼此之間,所述孔的所述開口的一側的端部的位置是位於所述基部的與所述開口的一側為相反側的端部的位置附近,當從相對於設有所述多個孔的面而垂直的方向觀察所述面時,所述多個孔各自的內部未露出所述鰭片。 An ultraviolet irradiation module includes: a frame body, one of which is open at one end; a light emitting part, which is arranged in the interior of the frame body close to the opening, and has a substrate and a light emitting element; The surface on one side of the opening is irradiated with ultraviolet rays; and a heat sink is provided inside the frame on the side of the substrate opposite to the side of the opening, and has a base and a plurality of fins The plurality of fins are arranged at the end of the base on the opposite side to the side of the opening, and the frame body is arranged in a direction orthogonal to the arrangement direction of the plurality of fins The surface has a plurality of holes arranged along the arrangement direction of the plurality of fins, and when the surface is viewed from a direction perpendicular to the surface on which the plurality of holes are provided, the plurality of holes Each is located between the plurality of fins, and the position of the end of the hole on the side of the opening is near the position of the end of the base on the side opposite to the side of the opening, When the surface is viewed from a direction perpendicular to the surface provided with the plurality of holes, the fins are not exposed inside each of the plurality of holes. 一種紫外線照射裝置,包括多個如申請專利範圍第1項所述的紫外線照射模組,所述多個紫外線照射模組是沿所述多個孔的排列方向、以及與所述多個孔的排列方向正交的方向而排列設置。 An ultraviolet irradiation device includes a plurality of ultraviolet irradiation modules as described in item 1 of the scope of patent application, and the plurality of ultraviolet irradiation modules are arranged along the arrangement direction of the plurality of holes and are connected to the plurality of holes. The arrangement direction is perpendicular to the arrangement.
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