JP2018118499A - Light radiation instrument and light radiation device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light radiation instrument which can reduce deterioration caused by heat of wiring connected to light emitting elements, and to provide a light radiation device.SOLUTION: A light radiation instrument 30 includes: a substrate; light emitting elements 31b provided on the surface side of the substrate; wiring parts 35, each of which is provided around the substrate surface side of the light emitting elements 31b and connected with the light emitting elements 31b; a heat radiation part 32 provided at the back side of the light emitting elements 31 and the wiring part 35 of the substrate; and a blower part 33 which blows a gas to the heat radiation part 32 from a direction that the light emitting elements 31b and the wiring part 35 are arranged. A light radiation device includes an outer covering body and a light emitting part disposed in the outer covering body and in which the plurality of light radiation instruments 30 is disposed.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a light irradiation apparatus and a light irradiation apparatus.

  2. Description of the Related Art In a light irradiation apparatus that irradiates light such as ultraviolet rays and performs processing such as printing or resin or adhesive curing, a device using a light emitting element such as a semiconductor light emitting element as a light source is known. Patent Document 1 includes a casing and a plurality of LED wiring boards accommodated in the casing, and the casing is an integrally formed by extrusion or pultrusion, and the back surface of the bottom wall portion includes LED wiring. There is disclosed a light irradiation apparatus in which a plurality of heat radiation fins for releasing heat from a substrate to the outside are provided along the longitudinal direction.

JP 2013-252720 A

  Here, a wiring for supplying electricity from a power source is connected to the light emitting element, but the wiring may be deteriorated depending on the degree of heat generated when the light emitting element emits light. In particular, it is considered that the wiring at the connection portion between the light emitting element and the wiring portion tends to deteriorate.

  The present invention has been made to solve the above-described problems, and an object thereof is to provide a light irradiation apparatus and a light irradiation apparatus that can reduce deterioration due to heat of wiring connected to a light emitting element.

  A light irradiation apparatus according to an aspect of the present invention includes a substrate, a light emitting element provided on a surface side of the substrate, and a wiring provided around the surface side of the substrate of the light emitting element and connected to the light emitting element. And a heat radiating part provided on the back side of the light emitting element and the wiring part of the substrate, and a blower part for blowing gas from the arrangement direction of the light emitting element and the wiring part to the heat radiating part. Prepare.

  The light irradiation apparatus which concerns on 1 aspect of this invention is provided with a housing | casing and the light emission part which is arrange | positioned in the said housing | casing and the said light irradiation instrument is arranged in multiple numbers.

  ADVANTAGE OF THE INVENTION According to this invention, the light irradiation instrument and light irradiation apparatus which can reduce deterioration by the heat | fever of the wiring connected to the light emitting element are provided.

It is a perspective view which shows notionally the structure with which the light irradiation apparatus which concerns on embodiment irradiates light to a workpiece | work. It is a perspective view which shows notionally the structure of the light irradiation apparatus of FIG. It is a perspective view which shows notionally the structure of the light irradiation instrument of the light irradiation apparatus of FIG. It is a perspective view which shows notionally the structure in the state in which the several light irradiation instrument with which the light irradiation apparatus of FIG. 2 is equipped is arranged.

  Hereinafter, a light irradiation apparatus and a light irradiation apparatus according to an embodiment of the present invention will be described with reference to the drawings. The embodiment described below shows a comprehensive or specific example. The numerical values, shapes, materials, constituent elements, arrangement positions and connecting forms of the constituent elements shown in the following embodiments are merely examples, and are not intended to limit the present invention. In addition, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims indicating the highest concept are described as optional constituent elements. Also, the following figures are schematic diagrams and are not necessarily shown strictly.

  Depending on the type of the light emitting element (LED element), self-heating is high, and thus the substrate needs to be cooled so that the heat does not stay on the substrate on which the light emitting element is provided. On the other hand, when the wiring part connected to the light emitting element is provided around the surface side of the substrate of the light emitting element for the purpose of shortening the wiring, the heat stays in the vicinity of the wiring part The present inventors have found that the wiring may be deteriorated depending on the degree of heat, and in particular, the wiring at the connection portion between the light emitting element and the wiring portion has a problem that the deterioration tendency becomes high.

  For this reason, the present inventor has found that the deterioration of the wiring can be reduced by providing the heat dissipating part in the wiring part of the substrate and cooling the heat dissipating part, and has completed the present invention.

  A configuration for realizing this will be specifically described below.

  First, the overall configuration of the light irradiation apparatus 1 according to the present embodiment will be described. FIG. 1 is a perspective view conceptually showing a configuration in which a light irradiation apparatus 1 according to the present embodiment irradiates a work 2 with light. FIG. 2 is a perspective view conceptually showing the configuration of the light irradiation apparatus 1 of FIG. For convenience of explanation, FIG. 2 is shown upside down from FIG.

  As shown in FIG. 1, the light irradiation device 1 is a device that irradiates a work 2 with light such as ultraviolet rays and performs a process such as printing or curing of a resin or an adhesive on the work 2. Further, a work placement space 11 may be formed on the light emitting portion side of the exterior body (housing) 10 of the light irradiating device 1 (the light emitting portion is not shown in FIG. 1). When the work 2 passes through, the work 2 is irradiated with light such as ultraviolet rays.

  Specifically, as illustrated in FIG. 2, the light irradiation device 1 includes a rectangular parallelepiped exterior body 10, a device blower unit 20 that blows gas into the exterior body 10, and a plurality of (internal) 8) in the embodiment, the light irradiation device 30 having a rectangular parallelepiped shape is provided. Each light irradiation instrument 30 includes a rectangular substrate 31, a light emitting element (not shown in FIG. 2), a heat radiating part 32, and an instrument blowing part 33.

  In addition to the workpiece placement space 11 in which the workpiece 2 described above is placed, the exterior body 10 has a circular first shape in which device blowers 20 (two in FIG. 2) are placed at both ends in the Y-axis direction. One exhaust port 12 is provided. Furthermore, a plurality of (eight) slit-shaped second exhaust ports 13 are formed in the exterior body 10 corresponding to the plurality (eight) of light irradiation instruments 30. In addition, the shape and number of the 1st exhaust port 12 and the 2nd exhaust port 13 are not specifically limited.

  That is, a light emitting element 31a (see FIG. 3) to be described later is disposed on the substrate 31 of the light irradiation tool 30, and the light emitting element 31a emits light toward the work 2, whereby the work 2 is heated, The heat of the light emitting element 31 a is transferred to the heat radiating part 32 through the substrate 31. Among these, the gas heated by cooling the work 2 by cooling the work 2 with the gas (air (outside air)) being sucked into the work placement space 11 by the device blower 20 is the heat of the work 2. The air is exhausted from the first exhaust port 12. Further, gas (air (outside air)) is sucked into the heat radiating unit 32 by the appliance blower 33 to cool the heat radiating unit 32, and the gas heated by cooling the heat radiating unit 32 is discharged from the second exhaust port 13. Exhausted. Hereinafter, these configurations will be described in detail.

  2 and subsequent drawings and in the description thereof, the depth direction (short direction) of the light irradiation device 1, the feeding direction of the work 2, the light emitting element group 34 and the wiring portion 35 (light emitting element 31a, wiring 31b and connector 31c). ), The short direction of the light emitting element group 34 and the wiring part 35, the arrangement direction of the heat radiating part 32 and the appliance blower 33, or the direction in which the appliance blower 33 blows gas is defined as the X-axis direction. . Further, the width direction (longitudinal direction) of the light irradiation device 1, the arrangement direction of the light irradiation device 30, the longitudinal direction of the light emitting element group 34 and the wiring portion 35, or the arrangement direction of the device blower portion 20 is defined as the Y-axis direction. To do. Further, the height direction of the light irradiation device 1, the arrangement direction of the substrate 31 and the heat radiating unit 32, the light irradiation direction of the light emitting element 31a, or the vertical direction of the drawing in FIG. These X-axis direction, Y-axis direction, and Z-axis direction are directions that intersect (orthogonal in this embodiment). Although the case where the Z-axis direction does not become the vertical direction may be considered depending on the usage mode, the Z-axis direction will be described below as the vertical direction for convenience of explanation. In the following description, for example, the X axis direction plus side indicates the arrow direction side of the X axis in the figure, and the X axis direction minus side indicates the opposite side to the X axis direction plus side. The same applies to the Y-axis direction and the Z-axis direction.

  Next, the configuration of the light irradiation device 30 and the configuration of the light irradiation device 1 in a state where the plurality of light irradiation devices 30 are arranged will be described in detail. FIG. 3 is a perspective view conceptually showing the structure of the light irradiation instrument 30 of the light irradiation apparatus 1 of FIG. FIG. 4 is a perspective view conceptually showing a configuration in a state where a plurality of light irradiation instruments 30 provided in the light irradiation apparatus 1 of FIG. 2 are arranged.

  As shown in FIG. 3, the light irradiation tool 30 includes a substrate 31, light emitting elements 31 a (a plurality in FIG. 3) provided on the surface side (Z-axis direction plus side) of the substrate 31, and the substrate 31 of the light emitting element 31 a. A wiring 31b connected to the light emitting element 31a and a connector 31c connected to the wiring 31b are provided.

  In the present embodiment, the substrate 31 is configured by arranging three substrates elongated in the X-axis direction in the Y-axis direction, and a plurality of light emitting elements 31a are arranged on each substrate, and a plurality of substrates are arranged. A plurality of wires 31b and connectors 31c are arranged on both sides of the light emitting element 31a in the X-axis direction. The substrate 31 may be composed of a single substrate.

  In addition, being provided in the surface side periphery of the board | substrate 31 of the light emitting element 31a means that the wiring 31b is arrange | positioned at the surface side of the board | substrate 31. FIG. That is, the wiring 31b is a wiring arranged on the front surface of the substrate 31 instead of being exposed from the back surface of the substrate 31 by extending from the light emitting element 31a directly below (back side) the substrate 31.

  Moreover, in this embodiment, the light emitting element 31a is a semiconductor light emitting element (UV-LED (Ultraviolet-Light Emitting Diode)) which emits light in the ultraviolet region. Note that the shape and number of the light emitting elements 31a are not particularly limited, but a plurality of light emitting elements 31a form a rectangular light emitting region. In addition, the material of the wiring 31b is not particularly limited, but is formed of a heat-sensitive material such as platinum, copper, or aluminum. Further, although external wiring is connected to the connector 31c, illustration of the external wiring is omitted. Further, the substrate 31 is not particularly limited as long as it is a material having high thermal conductivity (for example, aluminum, aluminum nitride, copper, or the like). For example, a copper substrate is used. The wiring 31b is not particularly limited as long as electricity flows, but for example, a gold wire is used.

  Then, as shown in FIG. 4, by arranging the plurality of light irradiation devices 30 in the Y-axis direction, the light emitting element group 34 provided on the surface side of the substrate 31 of the plurality of light irradiation devices 30, and light emission A wiring portion 35 provided around the surface side of the substrate 31 of the element group 34 and connected to the light emitting element group 34 is configured. The light emitting element group 34 is an aggregate of the light emitting elements 31a provided on each substrate 31 of the plurality of light irradiation instruments 30, and is disposed in a long region in the Y-axis direction. Moreover, the wiring part 35 is an aggregate of the wiring 31b and the connector 31c provided on the substrate 31 of the plurality of light irradiation instruments 30, and is arranged in a long region in the Y-axis direction.

  That is, a plurality of light emitting elements 31a are arranged in a long shape extending in the Y-axis direction to constitute a light emitting element group 34 that forms a long light emitting region. In addition, a plurality of wirings 31b and a plurality of connectors 31c are arranged in a long shape extending in the Y-axis direction to constitute a wiring portion 35 that forms a long wiring region. The “periphery” of the light emitting element group 34 is the side of the light emitting element group 34 in the X-axis direction, and the wiring portion 35 is adjacent to the light emitting element group 34 on the side of the light emitting element group 34 in the X axis direction. (Nearby).

  Specifically, the wiring part 35 is disposed on both sides of the light emitting element group 34 in the direction in which the light emitting element group 34 and the wiring part 35 are arranged. In addition, since the light emitting element group 34 and the wiring part 35 are arrange | positioned at the surface side of the board | substrate 31, the arrangement direction of the light emitting element group 34 and the wiring part 35 is a direction along the surface of the board | substrate 31, In this embodiment, it is the X-axis direction.

  Thus, since the wiring part 35 is arrange | positioned at the both sides of the light emitting element group 34, since the electric current which flows through the wiring part 35 can be divided, it can suppress that the temperature of the wiring part 35 rises. .

  In addition, on the back side of the substrate 31 (minus side in the Z-axis direction), the light emitting element 31 a and the heat radiating part 32 provided on the back side of the light emitting element 31 a and the wiring part 35 of the substrate 31 and the heat radiating part 32 are provided. An appliance blower 33 that blows gas from the arrangement direction of the wiring portions 35 (X-axis direction in FIGS. 3 and 4) is provided. Specifically, the heat radiating unit 32 and the appliance blowing unit 33 are disposed in contact with the back surface (the surface on the minus side in the Z-axis direction) of the substrate 31.

  The heat dissipating part 32 has a heat sink 32a having a heat dissipating function extending in the rear surface side direction of the substrate 31 (in the drawing, the negative side in the Z-axis direction). The heat sink 32a has heat pipes, fins (both not shown) and the like, and dissipates heat generated by the light emitting elements 31a on the substrate 31. The number and shape of the heat pipes and fins included in the heat sink 32a are not particularly limited, and the heat sink 32a may have a heat dissipation function other than the heat pipes and fins.

  The appliance blower 33 is a fan that blows gas from the arrangement direction (X-axis direction) of the light emitting element group 34 and the wiring part 35, and is arranged in the Z-axis direction on the minus side of the X-axis direction of the heat dissipation part 32. Two appliance blowers 33 are provided. That is, the appliance blower 33 sucks gas (outside air) from the minus side in the X-axis direction of the heat radiating part 32 (heat sink 32a) (gas flow A1 in FIG. 4), and the direction along the back surface of the substrate 31 (the light emitting element) Then, the gas is blown in the direction in which the wiring portions are arranged, and the gas is exhausted from the X axis direction plus side of the heat radiating portion 32 (heat sink 32a) (gas flow A2 in FIG. 4). Further, the gas exhausted from the heat radiating unit 32 is exhausted from the second exhaust port 13 to the outside of the light irradiation device 1.

  The appliance blower 33 is not limited to a fan and may have any structure as long as it can blow gas. The appliance blower 33 may be configured to suck in gas from the X axis direction plus side of the heat radiating unit 32 and exhaust gas from the X axis direction minus side of the heat radiating unit 32. The appliance blower 33 may be provided on the X axis direction plus side of the heat radiating part 32. Moreover, the some instrument ventilation part 33 may be arranged in the Y-axis direction. Furthermore, the number of the instrument air blow parts 33 may be one, and may be three or more.

  In this way, the gas blows around the front surface side of the substrate 31 by blowing air in the direction in which the light emitting element group 34 and the wiring portion 35 are arranged from the side of the back surface side of the substrate 31 by the appliance blower 33. Therefore, the deterioration of the light emitting element 31a can be suppressed, and the light emitting element 31a can be connected to the light emitting element 31a of the substrate 31 and the heat dissipating part 32 (heat sink 32a) provided on the back side of the wiring part 35. And since gas is blown from the arrangement direction of the wiring part 35, the wiring part 35 can be cooled efficiently.

  That is, since the gas passes through the heat radiating part 32 (heat sink 32a) and the heat radiating part 32 is cooled by the appliance blower 33, the light emitting element group 34 and the wiring part 35 can be efficiently cooled. Thereby, the influence which the wiring part 35 (wiring 31b) receives from the heat | fever by the light emitting element group 34 (light emitting element 31a) can be reduced.

  Therefore, deterioration due to heat of the wiring 31b connected to the light emitting element 31a can be reduced. In addition to the heat radiating part 32 of the light emitting element 31a, the heat radiating part 32 of the wiring part 35 is also cooled. Therefore, the wiring at the connection part between the light emitting element 31a and the wiring part 35, which tends to deteriorate in the meantime, is also affected by the heat. Deterioration can be reduced.

  As described above, in the present embodiment, the light emitting element group 34 includes the light emitting element 31a that is a semiconductor light emitting element that emits ultraviolet rays. However, the semiconductor light emitting element that emits ultraviolet rays easily generates heat. For this reason, the effect by cooling the above-mentioned heat radiation part 32 efficiently is large. In particular, the wiring part 35 is easily affected by heat generated from the light emitting element group 34, but by efficiently cooling the wiring part 35, deterioration of the wiring due to the heat can be reduced.

  Moreover, it is preferable that the instrument air blower 33 blows gas toward the short direction of the wiring part 35. As described above, the appliance blower 33 blows gas in the short direction of the wiring part 35, so that the cooling efficiency of the wiring part 35 can be improved as compared with blowing gas in the longitudinal direction of the wiring part 35.

  Moreover, since the wiring part 35 is arrange | positioned on the both sides of the light emitting element group 34 in the arrangement direction of the light emitting element group 34 and the wiring part 35, the heat radiating part 32 of the said wiring part 35 of the said both sides is carried out by the instrument ventilation part 33. Gas becomes easy to flow. Accordingly, the wiring portions 35 on both sides can be efficiently cooled.

  Moreover, the heat radiating part 32 is arrange | positioned directly under the light emitting element 31a, the wiring 31b, and the connector 31c, and the instrument ventilation part 33 ventilates gas directly under the light emitting element 31a, the wiring 31b, and the connector 31c. That is, the heat radiating part 32 is disposed directly under the light emitting element group 34 and the wiring part 35, and the appliance blowing part 33 blows gas directly under the light emitting element group 34 and the wiring part 35.

  Note that “arranged immediately below” means that the substrate 31 is disposed at a position where at least a part thereof overlaps in a plan view of the substrate 31 (when the substrate 31 is viewed from the Z-axis direction). That is, the heat radiation part 32 is arranged at a position where at least a part thereof overlaps with the light emitting element group 34 and the wiring part 35 (the light emitting element 31a, the wiring 31b, and the connector 31c) in a plan view of the substrate 31. Note that, as described above, depending on the usage mode of the light irradiation device 1, the Z-axis direction minus side may not be downward, but the expression “arranged immediately below” can be appropriately read depending on the usage mode. For example, in the case of the usage mode shown in FIG. 1, “arranged immediately below” can be read as “arranged immediately above”.

  As described above, the heat radiating part 32 is arranged directly under the wiring part 35, and the gas flows directly under the wiring part 35 by the appliance blower 33, whereby the cooling efficiency of the wiring part 35 can be further improved.

  Here, in addition to the heat sink 32a, the heat radiating section 32 is provided in the periphery of the heat radiating section 32 on the back surface side of the substrate 31, and a rectifying plate 32b that rectifies gas in the alignment direction, and a bottom surface side (Z axis) And a bottom plate 32c disposed on the negative side. The rectifying plate 32 b is a plate-like member that is orthogonal to the substrate 31 and arranged in parallel with the direction in which the light emitting element group 34 and the wiring portion 35 are arranged in the gas flow path. The bottom plate 32 c is a plate-like member that is arranged in parallel with the substrate 31 and in parallel with the arrangement direction of the light emitting element group 34 and the wiring portion 35 in the gas flow path.

  Thus, the cooling efficiency of the wiring part 35 can further be improved by rectifying the flow of the gas blown by the appliance blower 33 by the rectifying plate 32b.

  In this embodiment, the rectifying plate 32b and the bottom plate 32c are integrally formed, but the rectifying plate 32b and the bottom plate 32c may be configured separately. Moreover, the structure which does not have the baseplate 32c may be sufficient as the thermal radiation part 32. FIG. Moreover, although the heat radiation part 32 has the baffle plate 32b on the both sides of the heat sink 32a, the structure which has the baffle plate 32b only in the said both sides may be sufficient. Even in this case, if the rectifying plate 32b is arranged in the heat radiation part 32 of the light irradiation instrument 30 adjacent to the side where the rectifying plate 32b is not arranged, the gas flow path can be partitioned on both sides of the heat sink 32a. .

  In the above embodiment, the light emitting element 31a is a semiconductor light emitting element (UV-LED) that emits ultraviolet light. However, the light emitted by the light emitting element 31a does not have to be ultraviolet light. The light may be, for example, visible light. The light emitting element 31a may not be a semiconductor light emitting element (LED) as long as it is a light source that emits light to generate heat.

  Moreover, in the said embodiment, the some light emitting element 31a and the some wiring 31b and the connector 31c which were connected to the said some light emitting element 31a are provided in the surface side of the board | substrate 31, and several light emitting element is provided. A rectangular light emitting region is formed by 31a. However, a light emitting region having a shape other than the rectangular shape may be formed by the plurality of light emitting elements 31a. Further, only one light emitting element 31a and one wiring 31b and connector 31c connected to the one light emitting element 31a may be provided on the surface side of the substrate 31. Further, the connector 31 c may not be provided on the surface side of the substrate 31.

  Moreover, in the said embodiment, although the one connector 31c was arrange | positioned with respect to the one side of the light emitting element 31a in one board | substrate, the several connector 31c may be arrange | positioned at the said one side. Further, one connector 31c may be arranged on the one side of the plurality of substrates. Further, the wiring 31b and the connector 31c may be arranged only on one side (X-axis direction plus side or minus side) instead of on both sides of the light emitting element 31a.

  When the wiring 31b is arranged only on one side of the light emitting element 31a (that is, the wiring part 35 is arranged only on one side of the light emitting element group 34), the wiring part 35 is located upstream of the gas from the light emitting element group 34. Preferably it is arranged. Thus, since the wiring part 35 is arrange | positioned in the upstream of gas, the gas before it heats by the instrument ventilation part 33 flows under the wiring part 35, Therefore The cooling efficiency of the wiring part 35 is improved. Can do.

  Moreover, in the said embodiment, the light irradiation apparatus 1 was provided with the rectangular parallelepiped exterior body 10, the apparatus ventilation part 20, and the several rectangular parallelepiped light irradiation instrument 30. In FIG. However, the shape of the exterior body 10 may be any shape, and the light irradiation apparatus 1 may be configured without the exterior body 10. Further, the light irradiation device 1 may be configured not to include the device blower 20. That is, the light irradiation device 1 may be configured by only the light irradiation tool 30. The light irradiation device 30 may have a shape other than a rectangular parallelepiped shape.

DESCRIPTION OF SYMBOLS 1 Light irradiation apparatus 2 Work 10 Exterior body 11 Work arrangement | positioning space 12 1st exhaust port 13 2nd exhaust port 20 Apparatus ventilation part 30 Light irradiation instrument 31 Substrate 31a Light emitting element 31b Wiring 31c Connector 32 Heat radiation part 32a Heat sink 32b Rectifier plate 32c Bottom plate 33 Appliance blower 34 Light emitting element group 35 Wiring part

Claims (7)

A substrate,
A light emitting element provided on the surface side of the substrate;
A wiring portion provided around the surface side of the substrate of the light emitting element and connected to the light emitting element;
A heat dissipating part provided on the back side of the light emitting element and the wiring part of the substrate;
A light irradiator comprising: a blower that blows gas from the arrangement direction of the light emitting element and the wiring part with respect to the heat dissipation part. The light irradiation instrument according to claim 1, wherein the blower blows the gas toward a short direction of the wiring part. The light irradiation instrument according to claim 1, wherein the wiring portion is disposed upstream of the gas from the light emitting element. The light irradiation tool according to claim 1, wherein the wiring portion is disposed on both sides of the light emitting element in the arrangement direction. The light irradiation instrument according to claim 1, further comprising a rectifying plate that is provided around the heat dissipating part on the back surface side of the substrate and rectifies the gas in the arrangement direction. The light emitting device according to claim 1, wherein the light emitting element emits ultraviolet light. A housing,
A light emitting unit arranged in the housing, wherein a plurality of the light irradiation instruments according to claim 1 are arranged,
A light irradiation apparatus comprising:

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