WO2013145812A1

WO2013145812A1 - Led lighting device

Info

Publication number: WO2013145812A1
Application number: PCT/JP2013/050588
Authority: WO
Inventors: 茂信高橋
Original assignee: シーシーエス株式会社
Priority date: 2012-03-28
Filing date: 2013-01-15
Publication date: 2013-10-03
Also published as: TW201346178A; JP2013206693A

Abstract

The present invention improves LED cooling performance in an LED lighting device without being affected by various restrictions such as wiring restrictions and light distribution restriction. The present invention is provides with a casing (2) for forming an LED storage space for storing an LED (32), and an gas-supply path (S1) for supplying gas to the LED storage space formed in the housing (2). The gas-supply path (S1) includes a nozzle (73) that opens toward the LED (32). The nozzle (73) is positioned further outward than the angle of light distribution (X) of the LED (32), and the rate of flow of gas exiting the nozzle (73) is higher than the rate of flow of gas upstream of the nozzle (73) in the air-supply path (S1).

Description

LED lighting device

The present invention relates to an LED illumination device having a plurality of LEDs, and more particularly to an LED illumination device suitably used for inspection such as the presence or absence of scratches in a predetermined irradiation region of a work (product) and mark reading.

In this type of LED lighting device, in order to increase the light output, it is considered to increase the number of LEDs or the current passed through the LEDs. The output may be reduced, or the life of an electronic component such as an LED may be reduced.

For this reason, conventionally, it has been generally performed to dissipate heat generated by the LED by natural convection to air through a heat dissipating fin by providing a heat dissipating fin in a casing that accommodates the LED.

In addition, in the case of a conventional high light output LED lighting device, it is not sufficient to perform heat radiation by the heat radiation fin, and a method of forcibly cooling the heat radiation fin by a blower fan (forced air cooling) is generally performed. It has been broken.

Furthermore, in order to improve the cooling performance of the LED, as shown in Patent Document 1, a water cooling unit including a water cooling jacket, a radiator, a circulation pump, and a fan is brought into close contact with the radiation fins to cool (water cooling) the radiation fins. Things are also considered.

However, in the above-mentioned forced air cooling system or water cooling system, only the radiation fins are cooled, so that the cooling efficiency of the LED is limited. That is, there is a limit in reducing the temperature difference generated between the LED, the LED mounting substrate on which the LED is mounted, and the heat radiation fin. These temperature differences are calculated by thermal resistance (° C./W), and it is known that the temperature difference (° C.) increases as the heating value (W) of the heating element increases.

Also, it is conceivable to directly blow a plurality of LEDs using a small fan used for cooling an electronic device such as a CPU. However, providing a fan for each LED leads to an increase in the size of the LED lighting device, and cooling a plurality of LEDs with one fan results in variations in the cooling performance of each LED. Furthermore, with such a small fan, the output is very small and it is difficult to sufficiently cool the LED.

Furthermore, as shown in Non-Patent Document 1, a forced cooling device (micro blower) having a nozzle is conceivable, and it is also conceivable to directly blow a plurality of LEDs using the micro blower. However, providing a micro blower for each LED leads to an increase in the size of the LED lighting device, and cooling a plurality of LEDs with one micro blower results in variations in the cooling performance of each LED. In addition, due to the structure of the micro blower, it has a piezoelectric element and a diaphragm to which the piezoelectric element is attached. Therefore, it is difficult to arrange the nozzle of each micro blower in accordance with the position of the LED, and the LED mounting board is close to the LED. If provided, the wiring on the board is restricted, and if it is provided near the LED from the side of the LED, the light distribution angle of light emitted from the LED is restricted. is there.

JP 2010-272440 A

Therefore, the present invention has been made to solve the above problems all at once, and is intended to improve the cooling performance of the LED without being subjected to various restrictions such as wiring restrictions and light distribution restrictions in the LED lighting device. This is the main desired issue.

That is, the LED lighting device according to the present invention includes an LED, a casing that forms an LED housing space for housing the LED, and an air supply path that supplies gas to the LED housing space formed in the casing. The air path has a nozzle part that opens toward the LED, the nozzle part is located outside the light distribution angle of the LED, and the flow velocity of the gas exiting the nozzle part is in the air supply path. It is comprised so that it may become faster than the flow velocity of the gas of the upstream of the said nozzle part. The light distribution angle of the LED has an angle inclined from the optical axis by a predetermined angle with respect to the optical axis of the LED, and a luminous flux (radiant flux) or light intensity (radiation) effective for illumination such as inspection use. Strength). The outside of the light distribution angle of the LED is outside the angle having a luminous flux (radiant flux) or light intensity (radiant intensity) effective for illumination such as inspection use.

If this is the case, an air supply path is formed in the casing, and a nozzle portion that opens toward the LED is provided in the air supply path. Since it is configured to be faster than the gas flow rate upstream of the unit, the cooling effect per unit area can be improved while the air volume is small, and the cooling performance of the LED can be improved. it can. Further, if a circulation guide surface for circulating gas is formed on the inner surface constituting the LED housing space, the gas can be circulated inside the LED housing space, so that not only the gas flowing from the nozzle portion but also the LED housing. The gas circulating in the space hits the LED, and the frequency of applying the gas to the LED can be increased to further improve the cooling effect of the LED. Thereby, while improving the cooling efficiency of LED, the thermal resistance in LED can be reduced, the fall of the light output can be prevented, and the LED lighting apparatus of high light output can be implement | achieved. Here, since the air supply path having the nozzle portion is provided in the casing, the wiring on the LED mounting substrate in the LED lighting device is not restricted. Moreover, since the nozzle part is provided outside the light distribution angle of the LED, the light distribution angle of the light emitted from the LED is not restricted, and the nozzle part is made as close as possible to the LED. In addition to being able to accurately apply high-speed gas, it is possible to prevent a decrease in the amount of light due to the light emitted from the LED being blocked by the nozzle portion.

The LED lighting device according to the present invention includes a plurality of LEDs arranged in a line in a predetermined direction, a casing forming an LED housing space for housing the plurality of LEDs, and the plurality of LEDs provided in the casing. A blowing mechanism that supplies gas from a direction perpendicular to the arrangement direction to the plurality of LEDs, and the blowing mechanism opens toward the LEDs and has an opening along the arrangement direction of the plurality of LEDs. It has a slit-like nozzle portion that extends, or a plurality of nozzle portions that open toward the LED and are arranged along the arrangement direction of the plurality of LEDs, and the nozzle portion has a light distribution angle of the plurality of LEDs. It is characterized by being located outside. In addition, in the case of a plurality of LEDs arranged in a plurality of rows, they may be arranged in a matrix so that the LEDs constituting the rows adjacent to each other face each other, or constitute rows adjacent to each other. The LEDs may be arranged in a staggered manner so that the LEDs are staggered.

In such a case, since the gas is supplied from the direction orthogonal to the arrangement direction of the plurality of LEDs toward the plurality of LEDs, the plurality of LEDs can be uniformly and directly cooled. As a result, even if a plurality of LEDs are used, the cooling efficiency of the plurality of LEDs can be improved, the thermal resistance of each LED can be reduced, and the light output can be prevented from being lowered, thereby realizing a high light output LED lighting device. can do. Moreover, since several LED can be cooled uniformly, degradation of several LED can be equalize | homogenized and the light distribution nonuniformity in several LED can be prevented. Further, since the air blowing mechanism is provided in the casing, the wiring on the LED mounting substrate in the LED lighting device is not restricted. Furthermore, since the flow rate of the gas flowing toward the LED can be increased by the nozzle portion, the LED can be cooled more effectively. In addition, since the nozzle portion is positioned outside the light distribution angle of the plurality of LEDs, the light distribution angle of the light emitted from the LEDs is not restricted, and the nozzle portion is made as possible to the LEDs. By approaching, high-speed gas can be accurately applied, and a reduction in the amount of light due to the light emitted from the LED being blocked by the nozzle portion can be prevented.

As a specific embodiment of the LED lighting device, a casing that forms an LED housing space for housing the plurality of LEDs is provided, and gas is supplied to the LED housing space in the casing. An exhaust path for exhausting gas from the LED housing space is formed by the air supply path and the exhaust means, and the LED housing accommodates the LED from the nozzle portion by setting the LED housing space to a negative pressure by the exhaust means. It is desirable for gas to flow into the space. Here, in order to form the air supply path and the exhaust path in the casing, the air supply path and the exhaust path are integrally formed in the casing by processing the casing, and the air supply is separate from the casing. A member that forms a path (for example, an air supply pipe such as a hose) and a member that forms an exhaust path (for example, an exhaust pipe such as a hose) are attached to an attachment site formed in the casing, whereby an air supply path and an exhaust path are attached to the casing. Forming. Further, in this case, as a configuration in which the nozzle portion is provided in the air supply path, the nozzle portion may be provided on the air supply pipe side, or by providing the nozzle portion on the casing side and attaching the air supply pipe to the casing. You may make it an air supply piping and a nozzle part communicate. The exhaust means may be provided on the exhaust path, or may be provided in contact with or close to the outer opening of the exhaust path.

The LED lighting device includes an LED mounting substrate on which the plurality of LEDs are mounted, and the casing includes a bottom plate on which the LED mounting substrate is mounted and a pair of left and right provided along the arrangement direction on the bottom plate. An air supply path for supplying an external gas to the inside of the casing on one side plate side of the casing; and an interior of the casing on the other side plate side of the casing. It is preferable that an exhaust passage for discharging the gas to the outside of the casing is provided, and an inner opening of the supply passage is the nozzle portion. In this case, by providing the air supply path and the exhaust path inside the casing, there is no need to provide a member that blocks light emitted from the LEDs in the space inside the casing. Moreover, by integrally forming the casing and the nozzle portion, the number of parts can be reduced and the assembling work can be facilitated.

In order to simplify the configuration of the nozzle portion, the nozzle portion is provided on one of the left and right side plate portions and extends along the arrangement direction of the plurality of LEDs, and the upper surface of the LED mounting substrate, It is desirable to be formed by. If this is the case, it is not necessary to form a nozzle portion separately from the LED mounting substrate on one of the left and right side plate portions, and it is only necessary to provide the ridge portion, so that the casing can be easily processed.

In order to improve the cooling performance per unit volume of air by applying a high-speed wind to the LED with a small amount of air, the opening area of the inner opening which is the LED side opening in the nozzle portion is It is desirable that the opening area of the outer opening is smaller than the opening area of the outer opening in the flow path communicating with the outer opening of the nozzle portion.

It is conceivable to provide an air supply fan for introducing a gas outside the air supply path outside the casing, but this would increase the size of the LED illumination device. For this reason, it is desirable that an air supply fan for introducing an external gas into the air supply path or the exhaust path is provided.

Desirably, the exhaust path is provided in the bottom plate portion, and a heat radiating portion is provided on the lower surface of the bottom plate portion. If it is this, the gas discharged | emitted from an exhaust route will pass a thermal radiation part, and the thermal radiation from a thermal radiation part can be accelerated | stimulated.

A heat dissipating unit fan for introducing an external gas into the heat dissipating unit is provided on the lower surface of the heat dissipating unit, and the heat dissipating unit fan supplies the external gas into the air supply path. It is desirable to also serve as a fan. In this case, by driving the heat radiating unit fan, external gas can be introduced from the air supply path, and external gas can also be introduced into the heat radiating unit. Thereby, the heat dissipation efficiency of the LED lighting device can be further improved.

According to the present invention configured as described above, the cooling performance of the LED can be improved without being subjected to various restrictions such as wiring restrictions and light distribution restrictions in the LED lighting device.

The perspective view of the LED lighting apparatus in one Embodiment of this invention. Sectional drawing perpendicular | vertical to the longitudinal direction of the LED lighting apparatus in the embodiment. The top view which shows the relationship between the LED mounting board | substrate and slot nozzle part in the embodiment. The partial expanded sectional view which shows the nozzle part of the embodiment. Sectional drawing perpendicular | vertical to the longitudinal direction of the LED lighting apparatus in deformation | transformation embodiment. Sectional drawing perpendicular | vertical to the longitudinal direction of the LED lighting apparatus in deformation | transformation embodiment. Sectional drawing perpendicular | vertical to the longitudinal direction of the LED lighting apparatus in deformation | transformation embodiment. Sectional drawing perpendicular | vertical to the longitudinal direction of the LED lighting apparatus in deformation | transformation embodiment. Sectional drawing perpendicular | vertical to the longitudinal direction of the LED lighting apparatus in deformation | transformation embodiment. The schematic diagram which shows the modification of a nozzle part. The schematic diagram which shows the modification of a nozzle part. The schematic diagram of the LED lighting apparatus in deformation | transformation embodiment. Sectional drawing perpendicular | vertical to the longitudinal direction of the LED lighting apparatus in deformation | transformation embodiment.

DESCRIPTION OF SYMBOLS 100 ... LED lighting apparatus 3 ... LED mounting board 3a ... Upper surface 32 of LED mounting board ... LED
X ... LED light distribution angle P ... arrangement direction Q ... direction orthogonal to arrangement direction 2 ... casing 21 ... bottom plate 22 (22A) ... one side plate 221 ... projection Strip 22 (22B) ... the other side plate 5 ... heat sink (heat dissipation part)
6 ... Heatsink fan (heat sink fan)
7 ... Blower mechanism S1 ... Air supply path S1a ... Outside opening S1b of the air supply path ... Inside opening S2 of the air supply path ... Exhaust path 71 ... Dustproof filter 72 ...・ Air supply fan 73 ... Nozzle 8 ... Water cooling mechanism

Hereinafter, an embodiment of an LED lighting device according to the present invention will be described with reference to the drawings.

As shown in FIGS. 1 and 2, the LED lighting device 100 according to the present embodiment is equipped with one or a plurality of LEDs formed by mounting a plurality of LEDs 32 in a row on a casing 2 and a long wiring board 31. A substrate 3 and an optical member 4 supported by a pair of left and right side plates 22 of the casing 2 are provided. In the following description, the arrangement direction P in which the LEDs 32 are arranged is also referred to as the longitudinal direction, the direction perpendicular to the longitudinal direction and perpendicular to the side plate 22 of the casing 2 is defined as the left-right direction, the direction perpendicular to the longitudinal direction and the bottom plate of the casing 2. The direction orthogonal to 21 will be referred to as the vertical direction for convenience.

Each part will be described in detail below.

As shown in FIGS. 1 and 2, the casing 2 has a rectangular parallelepiped shape made of a long metal, and includes a bottom plate 21, a pair of left and right side plates 22, and an end plate 23.

The bottom plate 21 has the LED mounting substrate 3 mounted on the upper surface thereof, and a heat sink 5 composed of a plurality of heat radiating fins F as a heat radiating portion provided on the lower surface thereof. On the upper surface of the bottom plate 21, a recess 21M for positioning and mounting the LED mounting substrate 3 is formed. By fitting the LED mounting substrate 3 into the recess 21M, the LED mounting substrate 3 is positioned on the bottom plate 21 and positioned relative to a nozzle portion 73 described later. By placing the LED mounting substrate 3 in the recess 21M, the upper surface of the LED mounting substrate 3 and the upper surface of the side plate 22 are flush with each other.

Both ends of the heat sink 5 in the longitudinal direction are open. Further, one or a plurality of heat sink fans 6 are provided on the lower surface of the heat sink 5. In FIG. 1, three heat sink fans 6 are provided, and the two heat sink fans 6 on both sides supply air, which is an external gas, from the outside of the heat sink 5 to the inside of the heat sink 5. The single heat sink fan 6 at the center discharges air from the inside of the heat sink 5 to the outside of the heat sink 5.

A first mounting groove 22a for fixing the rod lens 41 as the optical member 4 is formed on the inner surfaces (opposing surfaces) of the pair of left and right side plates 22. The rod lens 41 is slid and fixed in the mounting groove 22a from the longitudinal direction. The light emitted from the plurality of LEDs 32 is collected by the rod lens 41. Further, on the inner surfaces of the pair of left and right side plates 22, a second mounting groove 22b for fixing the diffusion plate 42, which is the optical member 4, is formed at the upper portion of the mounting groove 22a, in this embodiment, the upper end portion. Yes. A diffusion plate 42 is slid and fixed in the mounting groove 22b from the longitudinal direction. The light collected by the rod lens 41 is diffused by the diffusion plate 42. The pair of left and right side plates 22 configured as described above are fixed to the bottom plate 21 by screws or the like. A substantially rectangular end plate 23 is attached to both longitudinal end surfaces of the pair of left and right side plates 22.

As shown in FIGS. 2 and 3, the LED mounting substrate 3 is mechanically mounted on a surface of a long printed wiring board 31 with a plurality of LEDs 32 aligned substantially in a straight line with the optical axis aligned in a certain direction. It is a thing. The LED 32 is a so-called power LED that can continuously pass a current of 200 mA or more. In this embodiment, the LED 32 is a surface-mounted type in which an LED element is disposed at the center of a thin rectangular plate-like package. Is. For example, the LEDs 32 are arranged such that the LED elements are arranged in a substantially straight line at a predetermined interval.

However, as shown in FIGS. 1 to 3, the LED lighting device 100 of the present embodiment includes a blower mechanism 7 that blows air directly to the plurality of LEDs 32 and cools them directly.

As shown in FIG. 2, the air blowing mechanism 7 has an air supply path S 1 for supplying air, which is an external gas, to the inside of the casing 2 on one side plate 22 (hereinafter, 22 A) side of the casing 2, An exhaust path S2 for discharging air, which is a gas inside the casing 2, to the outside of the casing 2 on the other side plate 22 (hereinafter 22B) side of the casing 2, and a dustproof filter 71 provided in the air supply path S1. And an air supply fan 72 provided in the exhaust path S2. The exhaust path S2 is formed between the bottom plate 21 and the other side plate 22B. One exhaust path S2 may be provided, or a plurality of exhaust paths S2 may be provided.

The air supply path S1 is formed between the bottom plate 21 and one side plate 22A. Specifically, the outer opening S1a of the air supply path S1 opens in the side surface of the one side plate 22A, and the dustproof filter 71 is attached to the outer opening S1a.

Further, as shown in FIG. 3 in particular, the inner opening S1b of the air supply path S1 opens toward the plurality of LEDs 32 and has a slit-like nozzle portion 73 extending along the arrangement direction P of the plurality of LEDs 32. It is said that.

The nozzle portion 73 is provided with an opening extending across the plurality of LEDs 32 along the arrangement direction P of the plurality of LEDs 32 provided in the casing 2, and is orthogonal to the arrangement direction P of the plurality of LEDs 32. Open in the direction Q. Specifically, as shown in FIG. 4, the nozzle portion 73 is provided on the one side plate 22 A and extends along the arrangement direction P of the plurality of LEDs 32, and the LED mounting substrate 3 (printing). The upper surface 3a of the wiring board 31) is formed.

And this nozzle part 73 is comprised so that the distance of the lower surface 221a of the protrusion part 221 and the upper surface 3a of the LED mounting board 3 may reduce gradually as it goes inside opening. As a result, the LED housing space 2H (see FIG. 2) inside the casing 2 is made negative pressure by the air supply fan 72, which is an exhaust means provided in the exhaust path S2, and the outside of the air supply path S1. The external air introduced from the opening S1a is configured to be supplied toward the LED 32 by increasing the flow rate by the nozzle 73. The LED housing space 2H is a space surrounded by the bottom plate 21, the pair of left and right side plates 22, the end plate 23, and the rod lens 41 of the casing 2. Here, the opening area A (see FIG. 4) of the inner opening which is the LED side opening of the nozzle portion 73 is the opening area B (see FIG. 4) of the outer opening of the nozzle portion 73 and / or the outer opening portion of the air supply path S1. The opening area C is configured to be smaller than the opening area C (see FIG. 2) of S1a, that is, the opening area A <the opening area B and / or the opening area C. Thus, the flow velocity of the gas exiting from the nozzle portion 73 is configured to be higher than the flow velocity of the gas upstream of the nozzle portion 73 in the air supply path S1, and high-speed wind is supplied to the LED 32 with a small amount of air. The cooling performance per unit volume of air can be improved.

Further, the nozzle portion 73 configured in this way is located on the LED mounting substrate 3 and is located outside the light distribution angle X of the plurality of LEDs 32. Thereby, while being able to apply air with a high flow velocity to LED32, the said nozzle part 73 (specifically ridge part 221) is comprised so that the light inject | emitted from LED32 may not be interrupted. The light distribution angle X of the present embodiment is an angle having a light beam (radiant flux) or light intensity (radiant intensity) necessary for illumination such as inspection use, and an angle at which the rod lens 41 which is the optical member 4 faces at least from the LED 32. (An angle formed by two tangents in contact with the side peripheral surface of the rod lens 41 from the light emission center of the LED 32). That is, the nozzle portion 73 is located outside the tangent line that contacts the side peripheral surface of the rod lens 41 from the light emission center of the LED 32 and is provided at a position that does not block the light from the LED 32 to the rod lens 41. In addition, when a reflecting member such as a reflector is provided inside the side plate 22 of the casing 2, it is conceivable to provide the nozzle portion 73 at a position where the light from the LED 32 to the reflecting member is not blocked.

According to the LED illumination device 100 according to the present embodiment configured as described above, air is supplied from the direction Q orthogonal to the arrangement direction P of the plurality of LEDs 32 toward the plurality of LEDs 32. It can be directly and uniformly cooled. Thereby, even if it uses several LED32, while improving the cooling efficiency of these several LED32, the thermal resistance in each LED32 can be reduced, the fall of the light output is prevented, and the LED lighting apparatus 100 of high light output is made. Can be realized.

The present invention is not limited to the above embodiment.

For example, as the nozzle part 73, in addition to what is constituted by the ridge part 221 and the LED mounting substrate 3 provided on the one side plate 22A, the ridge part 221 provided on the one side plate 22A and the ridge part provided on the bottom plate 21. 211 may be used. At this time, as shown in FIG. 5, the protrusion 211 provided on the bottom plate 21 has a schematic L formed so as to cover a part of the upper surface 3a of the LED mounting substrate 3 (the upper surface on the side plate 22A side). It can be considered to have a letter shape. Thereby, the nozzle part 73 can be brought as close to the LED 32 as possible.

In addition, as shown in FIG. 6, when a gap is formed between the upper surface of the bottom plate 21 and the lower surface of the one side plate 22 A, and the air supply path S 1 is configured by the gap, the LED mounting substrate 3 is mounted. It is desirable that the inner opening of the air supply path S 1 formed between the upper surface of the bottom plate 21 and the lower surface of the side plate 22 be substantially the same height as the LED 32, by lowering by one step by forming a recess 21 M in the portion to be formed. . In other words, the concave portion 21M is formed in the portion where the LED mounting substrate 3 is mounted, so that the upper surface of the LED mounting substrate 3 and the upper surface of the side plate 22 are flush with each other. In this case, the inner opening S1b of the gap forming the air supply path S1 is a nozzle part that applies gas toward the LED 32 from the direction orthogonal to the arrangement direction P along the arrangement direction P of the LEDs 32. . In this case, the gas supplied from the air supply path S1 can be efficiently applied to the LED 32 by a simple configuration in which a gap is formed between the bottom plate 21 and the side plate 22A.

Further, as shown in FIG. 7, the air supply path S1 may be formed in the side plate 22A as shown in FIG. 7 in addition to the air supply path S1 formed between the side plate 22 and the bottom plate 21 as in the above embodiment. In this case, for example, the air supply path S 1 may be configured by forming slit-like nozzle holes or the like in the side plate 22.

Further, the exhaust path S2 may be formed between the other side plate 22B and the bottom plate 21 or in the bottom plate 21 in addition to being formed in the other side plate 22B. FIG. 8 shows an example in which the exhaust path S2 is formed in the bottom plate 21. Specifically, the exhaust path S2 has an inner opening S1b formed in a portion where the LED mounting substrate 3 is not mounted on the upper surface of the bottom plate 21, and an outer opening between the radiating fins F on the lower surface of the bottom plate 21. It is configured by forming a part. If comprised in this way, the exhaust path S2 and the inside of the casing 2 can be made into a negative pressure with the heat sink fan 6 provided in the lower surface of the heat sink 5, and external air can be introduce | transduced from the air supply path S1. .

Furthermore, in the above-described embodiment, the form in which the air supply fan 72 is provided in the exhaust path S2 has been described. However, it may be provided in the air supply path S1, or both the exhaust path S2 and the air supply path S1. May be provided. By providing an air supply fan in both the exhaust path S2 and the air supply path S1, the wind speed of the air supplied to the LED can be increased, and the cooling performance of the LED can be improved.

In addition, in the above embodiment, the heat sink 5 is provided on the bottom surface of the bottom plate 21, but a water cooling mechanism 8 may be provided as shown in FIG. The water cooling mechanism 8 includes a plurality of linear flow path portions 81 extending in the longitudinal direction of the bottom plate 21, and cools the bottom plate 21 and the LEDs 32 by flowing a coolant through the flow path portions 81. In this case, since the LED 32 is directly air-cooled and water-cooled, the LED 32 can be further cooled.

In addition, in the above-described embodiment, gas is blown to the plurality of LEDs 32 by the single slit-like nozzle portion 73. However, as shown in FIG. 10, a plurality of air supply paths S1 are provided. Each of the plurality of nozzle portions 73 may be configured to blow gas to the plurality of LEDs 32. Moreover, as shown in FIG. 11, you may arrange | position the several nozzle part 73 along the arrangement direction of several LED32, and it is provided corresponding to 1 to 1 for every LED.

Moreover, although the said embodiment demonstrated the LED illuminating device which has the elongate LED mounting board | substrate with which several LED was arrange | positioned at linear form, as shown in FIG. 12, on the wiring board 31 which makes | forms an annular | circular shape. A plurality of LEDs 32 may be arranged in the circumferential direction. In this case, the arrangement direction P of the plurality of LEDs 32 is a circumferential direction, and the blower mechanism 7 is configured to supply gas toward the LEDs from the inside or outside of the radial direction Q orthogonal to the arrangement direction P. In addition, FIG. 12 has shown about the case where gas is applied to several LED32 from the outer side of radial direction Q. FIG.

Further, as shown in FIG. 13, if a circulation guide surface GM for circulating gas is formed on the inner surface (specifically, the inner surfaces of the pair of left and right side plates 22 of the casing 2) constituting the LED housing space 2H, the nozzle Not only the gas flowing in from the portion 73 but also the gas circulating in the LED housing space 2H hits the LED 32, and the frequency of applying the gas to the LED 32 can be increased to further improve the cooling effect of the LED 32. In addition, the temperature distribution in the LED housing space 2H can be made uniform. The circulation guide surface GM causes gas to circulate in the upper space of the LED 32 in the LED housing space 2H, and is formed over the entire inner surface of the pair of left and right side plates 22 in, for example, the longitudinal direction. As shown in FIG. 13, the shape of the circulation guide surface GM may be an inclined surface having a linear cross-sectional shape or a concave surface having a curved cross-sectional shape. The circulation guide surface GM may be formed integrally with the pair of left and right side plates 22, or may be formed by attaching another member to the pair of left and right side plates 22.

In the above embodiment, the case where the heat sink is used as the heat radiating portion has been described. However, a Peltier element may be used.

Moreover, in the said embodiment, although the casing 2 made | formed the rectangular parallelepiped shape made from a long metal, the nozzle part 73 employ | adopts a member whose heat conductivity is smaller than the heat sink 5 which is a thermal radiation part, for example, resin. It is preferable to do this. If this is the case, it is possible to prevent the heat from the heat sink 5 from being transmitted to the nozzle portion 73 and increasing the temperature of the gas supplied to the LED accommodation space through the nozzle portion 73 and reducing the heat dissipation effect of the LED 32.

Considering the embodiment, since the heat sink 5 that is a heat radiating portion is formed integrally with the bottom plate 21, the pair of left and right side plates 22 of the casing 2 are made of resin, and the nozzle portion 73 is made more than the heat sink 5. It may be possible to form with a member having a low thermal conductivity. In particular, it is desirable that the members forming the air supply path S1 and the nozzle portion 73 are made of resin.

In addition, it goes without saying that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

According to the present invention, the cooling performance of the LED can be improved without being subjected to various restrictions such as wiring restrictions and light distribution restrictions in the LED lighting device.

Claims

LED,
A casing forming an LED housing space for housing the LED;
An air supply path for supplying gas to the LED housing space formed in the casing,
The air supply path has a nozzle portion that opens toward the LED;
The nozzle part is located outside the light distribution angle of the LED,
The LED lighting device configured such that the flow velocity of the gas exiting the nozzle portion is higher than the flow velocity of the gas upstream of the nozzle portion in the air supply path.
A plurality of LEDs arranged in a row in a predetermined direction;
A casing forming an LED housing space for housing the plurality of LEDs;
A blower mechanism that is provided in the casing and supplies gas toward the plurality of LEDs from a direction orthogonal to the arrangement direction of the plurality of LEDs;
The air blowing mechanism opens toward the LEDs and the slit-like nozzle portion that extends along the arrangement direction of the plurality of LEDs, or opens toward the LEDs and along the arrangement direction of the plurality of LEDs. Having a plurality of nozzle portions arranged
The LED illuminating device in which the nozzle part is located outside a light distribution angle of the plurality of LEDs.
In the casing, a gas is supplied to the LED housing space, an air supply path having the nozzle portion, and an exhaust path for discharging the gas from the LED housing space by an exhaust unit are formed,
The LED lighting device according to claim 2, wherein gas is caused to flow into the LED housing space from the nozzle portion by setting the LED housing space to a negative pressure by the exhaust unit.
An LED mounting board on which the plurality of LEDs are mounted;
The casing has a bottom plate on which the LED mounting substrate is mounted and a pair of left and right side plates provided along the arrangement direction in the bottom plate,
An air supply path for supplying an external gas to the inside of the casing on one side plate side of the casing, and an air inside the casing on the other side plate side of the casing to the outside of the casing. An exhaust path for discharging,
The LED illumination device according to claim 2, wherein an inner opening portion of the air supply path is the nozzle portion.
The LED illumination device according to claim 4, wherein the nozzle portion is formed by a ridge portion provided on the one side plate and extending along an arrangement direction of the plurality of LEDs, and an upper surface of the LED mounting substrate.
The opening area of the inner opening which is the LED side opening in the nozzle part is smaller than the opening area of the outer opening in the nozzle part or the opening area of the outer opening in the flow path communicating with the outer opening of the nozzle part. LED lighting apparatus of description.
The LED lighting device according to claim 4, wherein an air supply fan for introducing an external gas into the air supply path is provided in the air supply path or the exhaust path.
The LED lighting device according to claim 4, wherein the exhaust path is open to a lower surface of the bottom plate, and a heat radiating portion is provided on the lower surface of the bottom plate.
The LED illumination device according to claim 8, wherein the nozzle portion is formed of a member having a lower thermal conductivity than the heat dissipation portion.
A heat dissipating unit fan for introducing an external gas into the heat dissipating unit is provided on the lower surface of the heat dissipating unit, and the heat dissipating unit fan supplies the external gas into the air supply path. The LED lighting device according to claim 8, which also serves as a fan for a vehicle.