WO2013145812A1 - Dispositif d'éclairage à diode électroluminescente - Google Patents

Dispositif d'éclairage à diode électroluminescente Download PDF

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Publication number
WO2013145812A1
WO2013145812A1 PCT/JP2013/050588 JP2013050588W WO2013145812A1 WO 2013145812 A1 WO2013145812 A1 WO 2013145812A1 JP 2013050588 W JP2013050588 W JP 2013050588W WO 2013145812 A1 WO2013145812 A1 WO 2013145812A1
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WO
WIPO (PCT)
Prior art keywords
led
leds
casing
air supply
gas
Prior art date
Application number
PCT/JP2013/050588
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English (en)
Japanese (ja)
Inventor
茂信 高橋
Original Assignee
シーシーエス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シーシーエス株式会社 filed Critical シーシーエス株式会社
Publication of WO2013145812A1 publication Critical patent/WO2013145812A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8812—Diffuse illumination, e.g. "sky"
    • G01N2021/8816—Diffuse illumination, e.g. "sky" by using multiple sources, e.g. LEDs

Definitions

  • the present invention relates to an LED illumination device having a plurality of LEDs, and more particularly to an LED illumination device suitably used for inspection such as the presence or absence of scratches in a predetermined irradiation region of a work (product) and mark reading.
  • LED lighting device in order to increase the light output, it is considered to increase the number of LEDs or the current passed through the LEDs.
  • the output may be reduced, or the life of an electronic component such as an LED may be reduced.
  • a water cooling unit including a water cooling jacket, a radiator, a circulation pump, and a fan is brought into close contact with the radiation fins to cool (water cooling) the radiation fins. Things are also considered.
  • Non-Patent Document 1 a forced cooling device (micro blower) having a nozzle is conceivable, and it is also conceivable to directly blow a plurality of LEDs using the micro blower.
  • a micro blower for each LED leads to an increase in the size of the LED lighting device, and cooling a plurality of LEDs with one micro blower results in variations in the cooling performance of each LED.
  • the micro blower due to the structure of the micro blower, it has a piezoelectric element and a diaphragm to which the piezoelectric element is attached. Therefore, it is difficult to arrange the nozzle of each micro blower in accordance with the position of the LED, and the LED mounting board is close to the LED. If provided, the wiring on the board is restricted, and if it is provided near the LED from the side of the LED, the light distribution angle of light emitted from the LED is restricted. is there.
  • the present invention has been made to solve the above problems all at once, and is intended to improve the cooling performance of the LED without being subjected to various restrictions such as wiring restrictions and light distribution restrictions in the LED lighting device. This is the main desired issue.
  • the LED lighting device includes an LED, a casing that forms an LED housing space for housing the LED, and an air supply path that supplies gas to the LED housing space formed in the casing.
  • the air path has a nozzle part that opens toward the LED, the nozzle part is located outside the light distribution angle of the LED, and the flow velocity of the gas exiting the nozzle part is in the air supply path. It is comprised so that it may become faster than the flow velocity of the gas of the upstream of the said nozzle part.
  • the light distribution angle of the LED has an angle inclined from the optical axis by a predetermined angle with respect to the optical axis of the LED, and a luminous flux (radiant flux) or light intensity (radiation) effective for illumination such as inspection use. Strength).
  • the outside of the light distribution angle of the LED is outside the angle having a luminous flux (radiant flux) or light intensity (radiant intensity) effective for illumination such as inspection use.
  • an air supply path is formed in the casing, and a nozzle portion that opens toward the LED is provided in the air supply path. Since it is configured to be faster than the gas flow rate upstream of the unit, the cooling effect per unit area can be improved while the air volume is small, and the cooling performance of the LED can be improved. it can. Further, if a circulation guide surface for circulating gas is formed on the inner surface constituting the LED housing space, the gas can be circulated inside the LED housing space, so that not only the gas flowing from the nozzle portion but also the LED housing. The gas circulating in the space hits the LED, and the frequency of applying the gas to the LED can be increased to further improve the cooling effect of the LED.
  • the thermal resistance in LED can be reduced, the fall of the light output can be prevented, and the LED lighting apparatus of high light output can be implement
  • the air supply path having the nozzle portion is provided in the casing, the wiring on the LED mounting substrate in the LED lighting device is not restricted.
  • the nozzle part is provided outside the light distribution angle of the LED, the light distribution angle of the light emitted from the LED is not restricted, and the nozzle part is made as close as possible to the LED. In addition to being able to accurately apply high-speed gas, it is possible to prevent a decrease in the amount of light due to the light emitted from the LED being blocked by the nozzle portion.
  • the LED lighting device includes a plurality of LEDs arranged in a line in a predetermined direction, a casing forming an LED housing space for housing the plurality of LEDs, and the plurality of LEDs provided in the casing.
  • a blowing mechanism that supplies gas from a direction perpendicular to the arrangement direction to the plurality of LEDs, and the blowing mechanism opens toward the LEDs and has an opening along the arrangement direction of the plurality of LEDs. It has a slit-like nozzle portion that extends, or a plurality of nozzle portions that open toward the LED and are arranged along the arrangement direction of the plurality of LEDs, and the nozzle portion has a light distribution angle of the plurality of LEDs. It is characterized by being located outside.
  • LEDs in the case of a plurality of LEDs arranged in a plurality of rows, they may be arranged in a matrix so that the LEDs constituting the rows adjacent to each other face each other, or constitute rows adjacent to each other.
  • the LEDs may be arranged in a staggered manner so that the LEDs are staggered.
  • the plurality of LEDs can be uniformly and directly cooled.
  • the cooling efficiency of the plurality of LEDs can be improved, the thermal resistance of each LED can be reduced, and the light output can be prevented from being lowered, thereby realizing a high light output LED lighting device. can do.
  • several LED can be cooled uniformly, degradation of several LED can be equalize
  • the air blowing mechanism is provided in the casing, the wiring on the LED mounting substrate in the LED lighting device is not restricted. Furthermore, since the flow rate of the gas flowing toward the LED can be increased by the nozzle portion, the LED can be cooled more effectively. In addition, since the nozzle portion is positioned outside the light distribution angle of the plurality of LEDs, the light distribution angle of the light emitted from the LEDs is not restricted, and the nozzle portion is made as possible to the LEDs. By approaching, high-speed gas can be accurately applied, and a reduction in the amount of light due to the light emitted from the LED being blocked by the nozzle portion can be prevented.
  • a casing that forms an LED housing space for housing the plurality of LEDs is provided, and gas is supplied to the LED housing space in the casing.
  • An exhaust path for exhausting gas from the LED housing space is formed by the air supply path and the exhaust means, and the LED housing accommodates the LED from the nozzle portion by setting the LED housing space to a negative pressure by the exhaust means. It is desirable for gas to flow into the space.
  • the air supply path and the exhaust path in the casing are integrally formed in the casing by processing the casing, and the air supply is separate from the casing.
  • a member that forms a path for example, an air supply pipe such as a hose
  • a member that forms an exhaust path for example, an exhaust pipe such as a hose
  • an air supply path and an exhaust path are attached to the casing.
  • the nozzle portion may be provided on the air supply pipe side, or by providing the nozzle portion on the casing side and attaching the air supply pipe to the casing. You may make it an air supply piping and a nozzle part communicate.
  • the exhaust means may be provided on the exhaust path, or may be provided in contact with or close to the outer opening of the exhaust path.
  • the LED lighting device includes an LED mounting substrate on which the plurality of LEDs are mounted, and the casing includes a bottom plate on which the LED mounting substrate is mounted and a pair of left and right provided along the arrangement direction on the bottom plate.
  • an exhaust passage for discharging the gas to the outside of the casing is provided, and an inner opening of the supply passage is the nozzle portion.
  • the nozzle portion is provided on one of the left and right side plate portions and extends along the arrangement direction of the plurality of LEDs, and the upper surface of the LED mounting substrate, It is desirable to be formed by. If this is the case, it is not necessary to form a nozzle portion separately from the LED mounting substrate on one of the left and right side plate portions, and it is only necessary to provide the ridge portion, so that the casing can be easily processed.
  • the opening area of the inner opening which is the LED side opening in the nozzle portion is It is desirable that the opening area of the outer opening is smaller than the opening area of the outer opening in the flow path communicating with the outer opening of the nozzle portion.
  • the exhaust path is provided in the bottom plate portion, and a heat radiating portion is provided on the lower surface of the bottom plate portion. If it is this, the gas discharged
  • a heat dissipating unit fan for introducing an external gas into the heat dissipating unit is provided on the lower surface of the heat dissipating unit, and the heat dissipating unit fan supplies the external gas into the air supply path. It is desirable to also serve as a fan. In this case, by driving the heat radiating unit fan, external gas can be introduced from the air supply path, and external gas can also be introduced into the heat radiating unit. Thereby, the heat dissipation efficiency of the LED lighting device can be further improved.
  • the cooling performance of the LED can be improved without being subjected to various restrictions such as wiring restrictions and light distribution restrictions in the LED lighting device.
  • the perspective view of the LED lighting apparatus in one Embodiment of this invention Sectional drawing perpendicular
  • the top view which shows the relationship between the LED mounting board
  • transformation embodiment Sectional drawing perpendicular
  • transformation embodiment The schematic diagram which shows the modification of a nozzle part.
  • transformation embodiment The schematic diagram of the LED lighting apparatus in deformation
  • the LED lighting device 100 is equipped with one or a plurality of LEDs formed by mounting a plurality of LEDs 32 in a row on a casing 2 and a long wiring board 31.
  • a substrate 3 and an optical member 4 supported by a pair of left and right side plates 22 of the casing 2 are provided.
  • the arrangement direction P in which the LEDs 32 are arranged is also referred to as the longitudinal direction
  • the direction perpendicular to the longitudinal direction and perpendicular to the side plate 22 of the casing 2 is defined as the left-right direction
  • the direction orthogonal to 21 will be referred to as the vertical direction for convenience.
  • the casing 2 has a rectangular parallelepiped shape made of a long metal, and includes a bottom plate 21, a pair of left and right side plates 22, and an end plate 23.
  • the bottom plate 21 has the LED mounting substrate 3 mounted on the upper surface thereof, and a heat sink 5 composed of a plurality of heat radiating fins F as a heat radiating portion provided on the lower surface thereof.
  • a recess 21M for positioning and mounting the LED mounting substrate 3 is formed on the upper surface of the bottom plate 21, a recess 21M for positioning and mounting the LED mounting substrate 3 is formed. By fitting the LED mounting substrate 3 into the recess 21M, the LED mounting substrate 3 is positioned on the bottom plate 21 and positioned relative to a nozzle portion 73 described later. By placing the LED mounting substrate 3 in the recess 21M, the upper surface of the LED mounting substrate 3 and the upper surface of the side plate 22 are flush with each other.
  • Both ends of the heat sink 5 in the longitudinal direction are open. Further, one or a plurality of heat sink fans 6 are provided on the lower surface of the heat sink 5. In FIG. 1, three heat sink fans 6 are provided, and the two heat sink fans 6 on both sides supply air, which is an external gas, from the outside of the heat sink 5 to the inside of the heat sink 5. The single heat sink fan 6 at the center discharges air from the inside of the heat sink 5 to the outside of the heat sink 5.
  • a first mounting groove 22a for fixing the rod lens 41 as the optical member 4 is formed on the inner surfaces (opposing surfaces) of the pair of left and right side plates 22.
  • the rod lens 41 is slid and fixed in the mounting groove 22a from the longitudinal direction.
  • the light emitted from the plurality of LEDs 32 is collected by the rod lens 41.
  • a second mounting groove 22b for fixing the diffusion plate 42, which is the optical member 4 is formed at the upper portion of the mounting groove 22a, in this embodiment, the upper end portion. Yes.
  • a diffusion plate 42 is slid and fixed in the mounting groove 22b from the longitudinal direction.
  • the light collected by the rod lens 41 is diffused by the diffusion plate 42.
  • the pair of left and right side plates 22 configured as described above are fixed to the bottom plate 21 by screws or the like.
  • a substantially rectangular end plate 23 is attached to both longitudinal end surfaces of the pair of left and right side plates 22.
  • the LED mounting substrate 3 is mechanically mounted on a surface of a long printed wiring board 31 with a plurality of LEDs 32 aligned substantially in a straight line with the optical axis aligned in a certain direction. It is a thing.
  • the LED 32 is a so-called power LED that can continuously pass a current of 200 mA or more.
  • the LED 32 is a surface-mounted type in which an LED element is disposed at the center of a thin rectangular plate-like package. Is.
  • the LEDs 32 are arranged such that the LED elements are arranged in a substantially straight line at a predetermined interval.
  • the LED lighting device 100 of the present embodiment includes a blower mechanism 7 that blows air directly to the plurality of LEDs 32 and cools them directly.
  • the air blowing mechanism 7 has an air supply path S ⁇ b> 1 for supplying air, which is an external gas, to the inside of the casing 2 on one side plate 22 (hereinafter, 22 ⁇ / b> A) side of the casing 2,
  • an air supply fan 72 provided in the exhaust path S2.
  • the exhaust path S2 is formed between the bottom plate 21 and the other side plate 22B.
  • One exhaust path S2 may be provided, or a plurality of exhaust paths S2 may be provided.
  • the air supply path S1 is formed between the bottom plate 21 and one side plate 22A. Specifically, the outer opening S1a of the air supply path S1 opens in the side surface of the one side plate 22A, and the dustproof filter 71 is attached to the outer opening S1a.
  • the inner opening S1b of the air supply path S1 opens toward the plurality of LEDs 32 and has a slit-like nozzle portion 73 extending along the arrangement direction P of the plurality of LEDs 32. It is said that.
  • the nozzle portion 73 is provided with an opening extending across the plurality of LEDs 32 along the arrangement direction P of the plurality of LEDs 32 provided in the casing 2, and is orthogonal to the arrangement direction P of the plurality of LEDs 32. Open in the direction Q. Specifically, as shown in FIG. 4, the nozzle portion 73 is provided on the one side plate 22 ⁇ / b> A and extends along the arrangement direction P of the plurality of LEDs 32, and the LED mounting substrate 3 (printing). The upper surface 3a of the wiring board 31) is formed.
  • this nozzle part 73 is comprised so that the distance of the lower surface 221a of the protrusion part 221 and the upper surface 3a of the LED mounting board 3 may reduce gradually as it goes inside opening.
  • the LED housing space 2H (see FIG. 2) inside the casing 2 is made negative pressure by the air supply fan 72, which is an exhaust means provided in the exhaust path S2, and the outside of the air supply path S1.
  • the external air introduced from the opening S1a is configured to be supplied toward the LED 32 by increasing the flow rate by the nozzle 73.
  • the LED housing space 2H is a space surrounded by the bottom plate 21, the pair of left and right side plates 22, the end plate 23, and the rod lens 41 of the casing 2.
  • the opening area A (see FIG.
  • the opening area B (see FIG. 4) of the inner opening which is the LED side opening of the nozzle portion 73 is the opening area B (see FIG. 4) of the outer opening of the nozzle portion 73 and / or the outer opening portion of the air supply path S1.
  • the opening area C is configured to be smaller than the opening area C (see FIG. 2) of S1a, that is, the opening area A ⁇ the opening area B and / or the opening area C.
  • the flow velocity of the gas exiting from the nozzle portion 73 is configured to be higher than the flow velocity of the gas upstream of the nozzle portion 73 in the air supply path S1, and high-speed wind is supplied to the LED 32 with a small amount of air.
  • the cooling performance per unit volume of air can be improved.
  • the nozzle portion 73 configured in this way is located on the LED mounting substrate 3 and is located outside the light distribution angle X of the plurality of LEDs 32.
  • the said nozzle part 73 (specifically ridge part 221) is comprised so that the light inject
  • the light distribution angle X of the present embodiment is an angle having a light beam (radiant flux) or light intensity (radiant intensity) necessary for illumination such as inspection use, and an angle at which the rod lens 41 which is the optical member 4 faces at least from the LED 32. (An angle formed by two tangents in contact with the side peripheral surface of the rod lens 41 from the light emission center of the LED 32).
  • the nozzle portion 73 is located outside the tangent line that contacts the side peripheral surface of the rod lens 41 from the light emission center of the LED 32 and is provided at a position that does not block the light from the LED 32 to the rod lens 41.
  • a reflecting member such as a reflector
  • air is supplied from the direction Q orthogonal to the arrangement direction P of the plurality of LEDs 32 toward the plurality of LEDs 32. It can be directly and uniformly cooled. Thereby, even if it uses several LED32, while improving the cooling efficiency of these several LED32, the thermal resistance in each LED32 can be reduced, the fall of the light output is prevented, and the LED lighting apparatus 100 of high light output is made. Can be realized.
  • the present invention is not limited to the above embodiment.
  • the nozzle part 73 in addition to what is constituted by the ridge part 221 and the LED mounting substrate 3 provided on the one side plate 22A, the ridge part 221 provided on the one side plate 22A and the ridge part provided on the bottom plate 21. 211 may be used.
  • the protrusion 211 provided on the bottom plate 21 has a schematic L formed so as to cover a part of the upper surface 3a of the LED mounting substrate 3 (the upper surface on the side plate 22A side). It can be considered to have a letter shape. Thereby, the nozzle part 73 can be brought as close to the LED 32 as possible.
  • the LED mounting substrate 3 is mounted. It is desirable that the inner opening of the air supply path S ⁇ b> 1 formed between the upper surface of the bottom plate 21 and the lower surface of the side plate 22 be substantially the same height as the LED 32, by lowering by one step by forming a recess 21 ⁇ / b> M in the portion to be formed. .
  • the concave portion 21M is formed in the portion where the LED mounting substrate 3 is mounted, so that the upper surface of the LED mounting substrate 3 and the upper surface of the side plate 22 are flush with each other.
  • the inner opening S1b of the gap forming the air supply path S1 is a nozzle part that applies gas toward the LED 32 from the direction orthogonal to the arrangement direction P along the arrangement direction P of the LEDs 32. .
  • the gas supplied from the air supply path S1 can be efficiently applied to the LED 32 by a simple configuration in which a gap is formed between the bottom plate 21 and the side plate 22A.
  • the air supply path S1 may be formed in the side plate 22A as shown in FIG. 7 in addition to the air supply path S1 formed between the side plate 22 and the bottom plate 21 as in the above embodiment.
  • the air supply path S ⁇ b> 1 may be configured by forming slit-like nozzle holes or the like in the side plate 22.
  • the exhaust path S2 may be formed between the other side plate 22B and the bottom plate 21 or in the bottom plate 21 in addition to being formed in the other side plate 22B.
  • FIG. 8 shows an example in which the exhaust path S2 is formed in the bottom plate 21.
  • the exhaust path S2 has an inner opening S1b formed in a portion where the LED mounting substrate 3 is not mounted on the upper surface of the bottom plate 21, and an outer opening between the radiating fins F on the lower surface of the bottom plate 21. It is configured by forming a part. If comprised in this way, the exhaust path S2 and the inside of the casing 2 can be made into a negative pressure with the heat sink fan 6 provided in the lower surface of the heat sink 5, and external air can be introduce
  • the air supply fan 72 is provided in the exhaust path S2 .
  • it may be provided in the air supply path S1, or both the exhaust path S2 and the air supply path S1. May be provided.
  • the heat sink 5 is provided on the bottom surface of the bottom plate 21, but a water cooling mechanism 8 may be provided as shown in FIG.
  • the water cooling mechanism 8 includes a plurality of linear flow path portions 81 extending in the longitudinal direction of the bottom plate 21, and cools the bottom plate 21 and the LEDs 32 by flowing a coolant through the flow path portions 81.
  • the LED 32 since the LED 32 is directly air-cooled and water-cooled, the LED 32 can be further cooled.
  • gas is blown to the plurality of LEDs 32 by the single slit-like nozzle portion 73.
  • a plurality of air supply paths S1 are provided.
  • Each of the plurality of nozzle portions 73 may be configured to blow gas to the plurality of LEDs 32.
  • the said embodiment demonstrated the LED illuminating device which has the elongate LED mounting board
  • a plurality of LEDs 32 may be arranged in the circumferential direction.
  • the arrangement direction P of the plurality of LEDs 32 is a circumferential direction
  • the blower mechanism 7 is configured to supply gas toward the LEDs from the inside or outside of the radial direction Q orthogonal to the arrangement direction P.
  • FIG. 12 has shown about the case where gas is applied to several LED32 from the outer side of radial direction Q.
  • a circulation guide surface GM for circulating gas is formed on the inner surface (specifically, the inner surfaces of the pair of left and right side plates 22 of the casing 2) constituting the LED housing space 2H, the nozzle Not only the gas flowing in from the portion 73 but also the gas circulating in the LED housing space 2H hits the LED 32, and the frequency of applying the gas to the LED 32 can be increased to further improve the cooling effect of the LED 32.
  • the temperature distribution in the LED housing space 2H can be made uniform.
  • the circulation guide surface GM causes gas to circulate in the upper space of the LED 32 in the LED housing space 2H, and is formed over the entire inner surface of the pair of left and right side plates 22 in, for example, the longitudinal direction. As shown in FIG.
  • the shape of the circulation guide surface GM may be an inclined surface having a linear cross-sectional shape or a concave surface having a curved cross-sectional shape.
  • the circulation guide surface GM may be formed integrally with the pair of left and right side plates 22, or may be formed by attaching another member to the pair of left and right side plates 22.
  • the nozzle part 73 employ
  • the heat sink 5 that is a heat radiating portion is formed integrally with the bottom plate 21, the pair of left and right side plates 22 of the casing 2 are made of resin, and the nozzle portion 73 is made more than the heat sink 5. It may be possible to form with a member having a low thermal conductivity. In particular, it is desirable that the members forming the air supply path S1 and the nozzle portion 73 are made of resin.
  • the cooling performance of the LED can be improved without being subjected to various restrictions such as wiring restrictions and light distribution restrictions in the LED lighting device.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

La présente invention vise à améliorer les performances de refroidissement de diode électroluminescente dans un dispositif d'éclairage à diode électroluminescente sans que celles-ci ne soient affectées par différentes restrictions, telles que des restrictions de câblage et une restriction de distribution de lumière. A cet effet, la présente invention comporte un boîtier (2) pour former un espace de stockage de diode électroluminescente pour stocker une diode électroluminescente (32), et un trajet d'alimentation en gaz (S1) pour fournir un gaz à l'espace de stockage de diode électroluminescente formé dans le boîtier (2). Le trajet d'alimentation en gaz (S1) comprend une buse (73) qui s'ouvre vers la diode électroluminescente (32). La buse (73) est positionnée davantage vers l'extérieur que l'angle de distribution de lumière (X) de la diode électroluminescente (32), et le débit d'écoulement de gaz sortant de la buse (73) est supérieur au débit d'écoulement de gaz en amont de la buse (73) dans le trajet d'alimentation en air (S1).
PCT/JP2013/050588 2012-03-28 2013-01-15 Dispositif d'éclairage à diode électroluminescente WO2013145812A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-074050 2012-03-28
JP2012074050A JP2013206693A (ja) 2012-03-28 2012-03-28 Ｌｅｄ照明装置

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Publication Number Publication Date
WO2013145812A1 true WO2013145812A1 (fr) 2013-10-03

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TW (1) TW201346178A (fr)
WO (1) WO2013145812A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7362409B2 (ja) 2019-10-17 2023-10-17 キヤノン株式会社 照明装置およびカメラシステム
CN114166862B (zh) * 2022-02-14 2022-04-19 常州海图电子科技有限公司 基于机器视觉的高速首尾绳智能检测系统

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005056653A (ja) * 2003-08-01 2005-03-03 Fuji Photo Film Co Ltd 光源装置
JP2007250276A (ja) * 2006-03-14 2007-09-27 Sony Corp 照明装置及び液晶表示装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005056653A (ja) * 2003-08-01 2005-03-03 Fuji Photo Film Co Ltd 光源装置
JP2007250276A (ja) * 2006-03-14 2007-09-27 Sony Corp 照明装置及び液晶表示装置

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JP2013206693A (ja) 2013-10-07

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