JP2010129834A - Optical semiconductor device and structure for mounting same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical semiconductor device capable of improving heat radiation capability while preventing a manufacturing process of a wiring board from being complicated. <P>SOLUTION: This light emitting device (optical semiconductor device) 1 includes: a semiconductor package 10 with a light emitting element 11 mounted thereon; and the wiring board 30 formed with a wiring pattern 32 for electrically connecting one electrode terminal 23b and the other electrode terminal 23c of the semiconductor package 10 thereto. The semiconductor package 10 is mounted on a metal housing 50 by using a terminal 23a for heat radiation. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an optical semiconductor device and a mounting structure thereof, and particularly to an optical semiconductor device including a semiconductor package including a heat dissipation terminal and a mounting structure thereof.

  Conventionally, an optical semiconductor device including a semiconductor package including a heat radiating terminal is known.

  FIG. 19 is a cross-sectional view showing a mounting structure of a conventional semiconductor package (optical semiconductor device). A light emitting element (optical semiconductor element) (not shown) is mounted on a semiconductor package (optical semiconductor device) 101 according to a conventional example. Further, as shown in FIG. 19, a heat radiation terminal 102 and a pair of external electrode terminals 103 are provided on the surface (lower surface) opposite to the light emitting surface of the semiconductor package 101. The semiconductor package 101 is mounted on the wiring board 110.

  The wiring board 110 includes a metal heat radiating member (heat radiating plate) 111, an insulating layer 112 made of resin or the like formed on the entire surface of the heat radiating member 111, and a heat radiating pattern formed on the insulating layer 112. 113 and a wiring pattern 114.

  The heat dissipation terminal 102 and the external electrode terminal 103 of the semiconductor package 101 are mounted on the heat dissipation pattern 113 and the wiring pattern 114 of the wiring substrate 110 using a solder layer (not shown), respectively.

  When manufacturing the wiring board 110, it is necessary to perform a roughening process or a chemical conversion process on the surface of the heat dissipation member 111 in order to improve the adhesion between the heat dissipation member 111 and the insulating layer 112. For this reason, when manufacturing the wiring board 110 having the above three-layer structure, the manufacturing process becomes complicated. This increases the manufacturing cost of the wiring board 110.

  A mounting structure of the semiconductor package (optical semiconductor device) as described above is disclosed in, for example, Patent Document 1.

  Further, as a specific structure of the semiconductor package 101, the structure shown in FIG. 20, the structure shown in FIG. 21, and the like are known. 20 and 21 are cross-sectional views showing the structure of a conventional semiconductor package.

  As shown in FIG. 20, a conventional semiconductor package 201 includes a light emitting element (optical semiconductor element) 202, a package substrate 210 on which the light emitting element 202 is mounted, and a frame body 203 disposed on the package substrate 210. The transparent resin 204 is filled in the opening 203a of the frame 203.

  The light emitting element 202 is fixed to an element mounting portion 212a (described later) of the package substrate 210 through an adhesive layer (not shown).

  The package substrate 210 includes a base material 211 made of glass epoxy resin and the like, an insulating surface, a main surface side conductive pattern 212 formed on the main surface of the base material 211, and a back surface formed on the back surface of the base material 211. Side conductive pattern 213.

  The main surface side conductive pattern 212 includes an element mounting portion 212a on which the light emitting element 202 is mounted and a pair of electrode portions 212b. The electrode part 212 b is electrically connected to an electrode (not shown) of the light emitting element 202 by a metal wire 205.

  The back surface side conductive pattern 213 includes a heat radiating terminal 213a and a pair of electrode terminals 213b. And the electrode terminal 213b is electrically connected to the electrode part 212b through the metal layer 214 formed in the side surface of the base material 211. FIG.

  The frame 203 is fixed on the package substrate 210 via an insulating adhesive layer (not shown).

  In this semiconductor package 201, since the base material 211 is disposed between the element mounting portion 212a and the heat dissipation terminal 213a, the heat generated in the light emitting element 202 is transferred to the heat dissipation terminal 213a via the base material 211. Communicated. For this reason, it is difficult to efficiently transfer the heat generated in the light emitting element 202 to the heat radiating terminal 213a. Therefore, the heat generated in the light emitting element 202 is efficiently transferred to the wiring board 110 (see FIG. 19). Have difficulty.

  Further, as shown in FIG. 21, in a semiconductor package 301 according to a conventional example, a package substrate 310 is composed of a base material 311 made of glass epoxy resin or the like and having an insulating property, and a main surface formed on the main surface of the base material 311. The front surface side conductive pattern 312 and the back surface side conductive pattern 313 formed on the back surface of the base material 311 are included.

  In this semiconductor package 301, a plurality of through holes 311 a filled with a filler 314 made of metal or the like are formed at predetermined positions of the base material 311.

  The main surface side conductive pattern 312 includes an element mounting portion 312a on which the light emitting element 202 is mounted and a pair of electrode portions 312b.

  The back surface side conductive pattern 313 includes a heat dissipation terminal 313a and a pair of electrode terminals 313b.

  The element mounting portion 312a and the electrode portion 312b are connected to the heat radiation terminal 313a and the electrode terminal 313b through the through hole 311a (filler 314), respectively.

  The structure of the light emitting element 202 and the frame 203 is the same as the structure of the semiconductor package 201 according to the conventional example shown in FIG.

  In this semiconductor package 301, the element mounting portion 312a is connected to the heat radiating terminal 313a through the through hole 311a (filler 314), so that the heat generated in the light emitting element 202 is efficiently supplied to the heat radiating terminal 313a. It is possible to communicate. Thereby, the heat generated in the light emitting element 202 can be efficiently transferred to the wiring board 110 (see FIG. 19).

  However, in the above-described conventional mounting structure, since the insulating layer 112 is disposed between the heat radiation member 111 and the heat radiation pattern 113 of the wiring board 110, the semiconductor package 101 (201, 301) is connected to the wiring board 110. The heat transferred to the heat dissipation pattern 113 is transferred to the heat dissipation member 111 through the insulating layer 112. Here, the thermal conductivity of the insulating layer 112 made of resin or the like is usually about 4 W / mK to 10 W / mK, and the thermal conductivity (200 W / mK to 400 W / m) of a conductor (metal) used for wiring or the like. mK) is considerably smaller. For this reason, it is difficult to efficiently transfer the heat transferred to the heat dissipation pattern 113 to the heat dissipation member 111, and it is difficult to improve the heat dissipation of the semiconductor package 101 (201, 301).

  Therefore, a semiconductor package mounting structure has been proposed that can efficiently transfer heat generated in a semiconductor package (optical semiconductor element) to a heat dissipation member.

  FIG. 22 is a cross-sectional view showing a mounting structure of a conventional semiconductor package (optical semiconductor device). As shown in FIG. 22, a semiconductor package (optical semiconductor device) 401 according to a conventional example includes a light emitting element (optical semiconductor element) 402, a heat sink 403 on which the light emitting element 402 is mounted, and an electrode (not shown) of the light emitting element 402. A pair of external electrode terminals 405 that are electrically connected to each other by a metal wire 404, an insulating resin portion 406 that covers a part of the heat sink 403 and the external electrode terminals 405, and a transparent resin 407 that covers the light emitting element 402 It is constituted by. A semiconductor package having such a structure is disclosed in, for example, Patent Document 2.

  The wiring board 410 includes a metal heat radiation member (heat radiation plate) 411, an insulating layer 412 formed on the heat radiation member 411, and a wiring pattern 413 formed on the insulating layer 412. In this wiring substrate 410, an opening 412 a is formed in a predetermined region of the insulating layer 412, and a predetermined region on the upper surface of the heat radiation member 411 is exposed.

  The heat sink 403 of the semiconductor package 401 is directly mounted on the heat radiation member 411 using an adhesive layer 420 made of solder or the like disposed in the opening 412a of the insulating layer 412.

In this mounting structure, since the heat sink 403 of the semiconductor package 401 is directly mounted on the heat dissipation member 411 of the wiring substrate 410, the heat generated in the semiconductor package 401 (light emitting element 402) can be efficiently dissipated. 411 can be transmitted.
JP 2007-294847 A JP 2005-183993 A

  However, in the conventional semiconductor package mounting structure shown in FIG. 22, it is necessary to form an opening 412 a in a predetermined region of the insulating layer 412 of the wiring substrate 410. For this reason, since it is necessary to perform machining or the like to remove a part of the insulating layer 412, there is a problem that the manufacturing process of the wiring board 410 becomes complicated. As a result, the manufacturing cost of the wiring board 410 is increased.

  The present invention has been made to solve the above-described problems, and the object of the present invention is to improve heat dissipation while suppressing the complexity of the manufacturing process of the wiring board. An optical semiconductor device and a mounting structure thereof are provided.

  In order to achieve the above object, an optical semiconductor device according to a first aspect of the present invention includes an optical semiconductor element mounted thereon, a semiconductor package including an external electrode terminal and a heat dissipation terminal, and the external electrode terminal of the semiconductor package electrically And a heat dissipation terminal of the semiconductor package is mounted on a heat dissipation member different from the wiring substrate.

  In the optical semiconductor device according to the first aspect, as described above, the external electrode terminals of the semiconductor package are electrically connected to the wiring pattern of the wiring board, and the heat dissipation terminals of the semiconductor package are radiated differently from the wiring board. Unlike the case where the external electrode terminal and the heat dissipation terminal of the semiconductor package are mounted on one wiring board (wiring board on which the heat dissipation member is integrally formed), the insulation on the heat dissipation member is achieved. There is no need to provide a layer. For this reason, since the heat dissipation terminal of the semiconductor package can be directly mounted on the heat dissipation member, the heat generated in the semiconductor package can be efficiently transmitted to the heat dissipation member. As a result, the heat dissipation of the optical semiconductor device can be improved.

  In addition, since it is not necessary to provide an insulating layer on the heat dissipation member, unlike the case where the semiconductor package is mounted on one wiring board (a wiring board on which the heat dissipation member is integrally formed), the heat dissipation member of the wiring board. There is no need to form an opening in the insulating layer formed thereon. Thereby, it can suppress that the manufacturing process of a wiring board becomes complicated. As a result, an increase in the manufacturing cost of the wiring board can be suppressed.

  Moreover, since it is not necessary to provide an insulating layer on the heat radiating member, heat can be easily radiated from the surface of the heat radiating member. Thereby, the heat dissipation of the optical semiconductor device can be further improved.

  In the optical semiconductor device according to the first aspect, as described above, since the heat dissipation terminals of the semiconductor package are mounted on a heat dissipation member different from the wiring substrate, the wiring in which an insulating layer is provided on the heat dissipation member There is no need to use a substrate. Thereby, since it is not necessary to perform a roughening process or a chemical conversion treatment on the surface of the heat dissipation member of the wiring board, it is possible to further suppress the complicated manufacturing process of the wiring board.

  In the optical semiconductor device according to the first aspect, preferably, the wiring board is not disposed at a position directly below the heat radiating terminal of the semiconductor package, but is disposed at a position immediately below the external electrode terminal. If comprised in this way, the terminal for thermal radiation of a semiconductor package can be easily mounted in the member for thermal radiation, electrically connecting the external electrode terminal of a semiconductor package to a wiring board.

  In the optical semiconductor device in which the wiring board is not arranged at a position directly below the heat dissipation terminal of the semiconductor package, the wiring board is preferably formed with a first opening at a position directly below the heat dissipation terminal of the semiconductor package. The heat dissipation terminal of the semiconductor package is mounted on the heat dissipation member through the first opening of the wiring board. If comprised in this way, the thermal radiation terminal of a semiconductor package can be more easily mounted in a thermal radiation member, electrically connecting the external electrode terminal of a semiconductor package to a wiring board. In the state where the insulating layer is not formed on the heat radiating member, the opening (first opening) can be easily formed in the insulating layer of the wiring board by punching or the like.

  In the optical semiconductor device in which the wiring board is not disposed at a position directly below the heat dissipation terminal of the semiconductor package, preferably, the wiring board includes a pair of wiring boards, and the semiconductor package straddles the pair of wiring boards. The heat dissipation terminal of the semiconductor package is mounted on the heat dissipation member via a portion between the pair of wiring boards. If comprised in this way, the thermal radiation terminal of a semiconductor package can be easily mounted in the thermal radiation member, without forming the 1st opening part in a wiring board.

  In the optical semiconductor device in which the semiconductor package is disposed so as to straddle a pair of wiring substrates, preferably, the pair of wiring substrates are formed to extend in a predetermined direction with a predetermined interval therebetween. The semiconductor packages are arranged so as to straddle a pair of wiring boards in a state of being arranged in a predetermined direction. With this configuration, even when the number of semiconductor packages is large, it is not necessary to provide many openings or large openings extending in a predetermined direction in the wiring board.

  In the optical semiconductor device according to the first aspect, preferably, the semiconductor package further includes a package substrate on which the optical semiconductor element is mounted, and the package substrate has an insulating property and a base material on which a through hole is formed; Formed on the main surface of the base material, the element mounting portion on which the optical semiconductor element is mounted, the external electrode terminal and the heat radiating terminal formed on the back surface of the base material, filled in the through hole, from the base material The element mounting portion is connected to the heat radiating terminal through the filler. If comprised in this way, the heat which generate | occur | produces in an optical semiconductor element can be easily transmitted to the terminal for thermal radiation via an element mounting part and a through hole (filler). Thereby, the heat which generate | occur | produces in an optical semiconductor element can be more efficiently transmitted to the member for thermal radiation. As a result, the heat dissipation of the optical semiconductor device can be further improved.

  In the optical semiconductor device in which the semiconductor package includes a package substrate, preferably, the semiconductor package further includes a metal frame having a second opening disposed on the package substrate and in which the optical semiconductor element is disposed. Prepare. If comprised in this way, since the heat | fever which generate | occur | produced in the optical semiconductor element can be radiated also from metal frames, the heat dissipation of an optical semiconductor device can further be improved.

  In the optical semiconductor device according to the first aspect, the external electrode terminal may be configured to include one electrode terminal and the other electrode terminal.

  In the optical semiconductor device in which the external electrode terminal includes one electrode terminal and the other electrode terminal, preferably, the one electrode terminal, the other electrode terminal, and the heat dissipation terminal are electrically independent from each other. With this configuration, unlike the case where one of the one electrode terminal and the other electrode terminal is electrically connected to the heat dissipation terminal, either one of the one electrode terminal or the other electrode terminal has a common potential (ground). Etc.) can be suppressed. Thereby, it can suppress that the circuit structure of a wiring board is restrict | limited. Specifically, for example, when there are a plurality of optical semiconductor elements and semiconductor packages, it is possible to suppress the plurality of optical semiconductor elements and the plurality of semiconductor packages from becoming parallel circuits. As described above, when a plurality of optical semiconductor elements and a plurality of semiconductor packages are configured in parallel circuits, for example, if the same current is supplied to all the optical semiconductor elements, the circuit configuration becomes complicated. Occurs.

  In the optical semiconductor device in which the external electrode terminal includes one electrode terminal and the other electrode terminal, one of the one electrode terminal and the other electrode terminal may be electrically connected to the heat radiating terminal.

  In the optical semiconductor device according to the first aspect, preferably, the thickness of the wiring board is smaller than the distance between the external electrode terminal of the semiconductor package and the heat dissipation member. If comprised in this way, since it can suppress that a wiring board contacts the surface of the heat radiating member, it can suppress that it becomes difficult to radiate heat from the surface of the heat radiating member.

  In the optical semiconductor device according to the first aspect, the optical semiconductor element preferably includes a light emitting element. If comprised in this way, since the heat dissipation of a light emitting element can be improved, the luminous efficiency of an optical semiconductor device can be improved.

  In the optical semiconductor device according to the first aspect, preferably, the heat radiating member includes a metal plate, a metal tube, a metal rod, a screw, or a metal detachable member attachable to and detachable from them. If comprised in this way, the heat | fever generate | occur | produced in the semiconductor package can be thermally radiated easily and efficiently from a metal plate, a metal tube, a metal bar, a screw, or a metal attachment / detachment member. Further, if the semiconductor package is mounted on a metal plate, a metal tube, a metal bar, or a screw, there is no need to separately provide a member for mounting the semiconductor package. Further, if the semiconductor package is mounted on a detachable member that can be attached to and detached from a metal plate, metal tube, metal rod, or screw, the semiconductor package can be easily detached from the metal plate, metal tube, metal rod, or screw. Thereby, replacement | exchange, movement of a semiconductor package, a change of an attachment angle, etc. can be performed easily.

  An optical semiconductor device mounting structure according to a second aspect of the present invention includes the optical semiconductor device according to any one of claims 1 to 13 and a heat dissipation member on which the optical semiconductor device is mounted. If comprised in this way, the mounting structure of the optical semiconductor device which can improve heat dissipation can be comprised, suppressing that the manufacturing process of a wiring board becomes complicated.

  As described above, according to the present invention, it is possible to easily obtain an optical semiconductor device capable of improving heat dissipation and a mounting structure thereof while suppressing the complicated manufacturing process of the wiring board.

Embodiments of the present invention will be described below with reference to the drawings.
(First embodiment)
FIG. 1 is a perspective view showing a light emitting device mounting structure according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view showing a mounting structure of the light emitting device according to the first embodiment shown in FIG. FIG. 3 is a perspective view showing the structure of the wiring board of the light emitting device according to the first embodiment shown in FIG. With reference to FIGS. 1-3, the mounting structure of the light-emitting device 1 by 1st Embodiment of this invention is demonstrated.

  As shown in FIGS. 1 and 2, the light emitting device 1 according to the first embodiment of the present invention includes a semiconductor package 10 on which a plurality of light emitting elements 11 are mounted, and a wiring board 30 electrically connected to the semiconductor package 10. And is composed of. The light emitting device 1 is an example of the “optical semiconductor device” in the present invention, and the light emitting element 11 is an example of the “optical semiconductor element” in the present invention.

  As shown in FIG. 2, the semiconductor package 10 includes a plurality of light emitting elements 11, a package substrate 20 on which the plurality of light emitting elements 11 are mounted on a predetermined region, and a metal reflection frame disposed on the package substrate 20. 12 and a transparent resin 13 disposed in the opening 12 a of the reflection frame 12. The reflection frame 12 is an example of the “frame” in the present invention, and the opening 12a is an example of the “second opening” in the present invention.

  In addition, the semiconductor package 10 has a light emission surface (main surface) 10 a that emits light emitted by the plurality of light emitting elements 11.

  The plurality (three) of the light emitting elements 11 are, for example, LEDs that emit red, green, and blue light, respectively. The plurality of light emitting elements 11 may all be LEDs that emit light of the same color, or may be LEDs that emit light other than red, green, and blue.

  In addition, one electrode and the other electrode (not shown) are formed on the upper surface of the light emitting element 11. The light emitting element 11 is fixed to an element mounting portion 22a (described later) of the package substrate 20 using a conductive or insulating die bonding material (not shown).

  The package substrate 20 is formed on an insulating base material 21 made of glass epoxy resin, a main surface side conductive pattern 22 made of metal formed on the main surface of the base material 21, and a back surface of the base material 21. And a back side conductive pattern 23 made of a metal.

  Here, in the first embodiment, a plurality of through holes 21 a are formed at predetermined positions of the base material 21. The through hole 21 a is filled with a filler 24 made of a metal having conductivity and a thermal conductivity higher than that of the base material 21.

  The main surface side conductive pattern 22 includes an element mounting portion 22a on which a plurality of light emitting elements 11 are mounted, a plurality of one electrode portions 22b, and a plurality of other electrode portions 22c. The surfaces of the element mounting portion 22a, the one electrode portion 22b, and the other electrode portion 22c are subjected to silver plating or the like.

  In the first embodiment, the element mounting portion 22a, the one electrode portion 22b, and the other electrode portion 22c are formed so as to be electrically independent from each other. For example, the element mounting portion 22a becomes a neutral pole (non-polar), the one electrode portion 22b functions as a positive electrode, and the other electrode portion 22c functions as a negative electrode.

  The one electrode portion 22b is electrically connected to one electrode (not shown) of the light emitting element 11 by a metal wire 14, and the other electrode portion 22c is electrically connected to the other electrode of the light emitting element 11 by a metal wire 14. (Not shown) is electrically connected.

  The element mounting portion 22a, the one electrode portion 22b, and the other electrode portion 22c are disposed so as to cover the upper portion of the through hole 21a and are connected to the filler 24.

  The back surface side conductive pattern 23 is formed on the surface (lower surface) opposite to the light emitting surface 10a of the semiconductor package 10, and includes a heat radiating terminal 23a, a plurality of one electrode terminals 23b, and a plurality of other electrode terminals. 23c. The one electrode terminal 23b and the other electrode terminal 23c are examples of the “external electrode terminal” in the present invention.

  The heat dissipation terminal 23a, the one electrode terminal 23b, and the other electrode terminal 23c are formed so as to be electrically independent from each other.

  The heat radiating terminal 23a, the one electrode terminal 23b, and the other electrode terminal 23c are arranged so as to cover the lower part of the through hole 21a and are connected to the filler 24. That is, the heat dissipation terminal 23a, the one electrode terminal 23b, and the other electrode terminal 23c are electrically connected to the element mounting portion 22a, the one electrode portion 22b, and the other electrode portion 22c through the through hole 21a (filler 24), respectively. Has been. For example, the heat radiating terminal 23a becomes a neutral pole (non-polar), the one electrode terminal 23b functions as a positive electrode, and the other electrode terminal 23c functions as a negative electrode.

  The reflection frame 12 is fixed on the package substrate 20 using an adhesive layer (not shown) having no conductivity. Further, the reflection frame 12 is formed with an opening 12a in which a plurality of light emitting elements 11 are arranged. The opening 12a is formed by an inclined surface, and the reflection frame 12 has a function of guiding light emitted from the plurality of light emitting elements 11 upward. The reflective frame 12 also has a function of radiating a part of heat generated in the light emitting element 11 to the outside. Moreover, the transparent resin 13 which has translucency is filled in the opening part 12a so that the light emitting element 11 may be covered.

  In the first embodiment, as shown in FIG. 3, an opening 30 a is formed at the center of the wiring board 30. As shown in FIG. 2, the opening 30 a is formed at a position directly below the heat dissipation terminal 23 a of the semiconductor package 10. The opening 30 a is formed larger than the heat dissipation terminal 23 a of the semiconductor package 10. That is, the wiring board 30 is not disposed at a position directly below the heat dissipation terminal 23 a of the semiconductor package 10, but is disposed at a position immediately below the one electrode terminal 23 b and the other electrode terminal 23 c of the semiconductor package 10. The opening 30a is an example of the “first opening” in the present invention.

  As shown in FIG. 3, the wiring board 30 includes a base material 31 made of glass epoxy resin or the like and having an insulating property, and a wiring pattern 32 made of metal formed on the main surface of the base material 31. Yes.

  The wiring pattern 32 includes a plurality of one electrode wirings 32a and a plurality of other electrode wirings 32b. As shown in FIG. 2, the one electrode wiring 32a and the other electrode wiring 32b are electrically connected to the one electrode terminal 23b and the other electrode terminal 23c of the semiconductor package 10 through a solder layer (not shown), respectively. Has been.

  Here, in the first embodiment, the light emitting device 1 is mounted on a flat metal casing 50. Specifically, the heat radiating terminal 23 a of the semiconductor package 10 is directly mounted on the metal casing 50 using the solder layer 40 through the opening 30 a of the wiring board 30. In FIG. 2, the upper surface of the metal housing 50 is formed in a flat surface, but a protrusion (not shown) is provided on the upper surface of the metal housing 50, and the heat dissipation terminal 23 a of the semiconductor package 10 is You may mount on the convex part of the metal housing | casing 50 using the solder layer 40. FIG. The metal casing 50 is an example of the “heat dissipating member” and the “metal plate” in the present invention.

  In addition, the metal housing 50 is disposed at a predetermined distance from the wiring board 30. That is, the thickness of the wiring board 30 is smaller than the distance between the one electrode terminal 23 b and the other electrode terminal 23 c of the semiconductor package 10 and the metal housing 50.

  In the first embodiment, as described above, the one electrode terminal 23 b and the other electrode terminal 23 c of the semiconductor package 10 are electrically connected to the wiring board 30, and the heat dissipation terminal 23 a of the semiconductor package 10 is connected to the metal housing 50. Is implemented. Thus, unlike the case where the heat radiating terminal 23a, the one electrode terminal 23b, and the other electrode terminal 23c of the semiconductor package 10 are mounted on one wiring board (wiring board on which a heat radiating member is integrally formed), the metal housing There is no need to provide an insulating layer on 50 (heat dissipation member). For this reason, since the heat dissipation terminal 23a of the semiconductor package 10 can be directly mounted on the metal casing 50, the heat generated in the semiconductor package 10 can be efficiently transmitted to the metal casing 50. As a result, the heat dissipation of the light emitting device 1 can be improved, and the light emission efficiency of the light emitting device 1 can be improved.

  Further, since it is not necessary to provide an insulating layer on the heat radiating member (metal housing 50), unlike the case where the semiconductor package 10 is mounted on one wiring board (wiring board on which the heat radiating member is integrally formed). There is no need to form an opening in the insulating layer formed on the heat dissipation member of the wiring board. Thereby, it can suppress that the manufacturing process of the wiring board 30 becomes complicated. As a result, an increase in the manufacturing cost of the wiring board 30 can be suppressed.

  In addition, since it is not necessary to provide an insulating layer on the metal casing 50, heat can be easily radiated from the surface of the metal casing 50. Thereby, the heat dissipation of the light-emitting device 1 can be improved more.

  In addition, since the heat radiating terminal 23a of the semiconductor package 10 is mounted on the metal casing 50, it is not necessary to use a wiring board in which an insulating layer is provided on the heat radiating member. Thereby, since it is not necessary to perform a roughening process or a chemical conversion treatment on the surface of the heat dissipation member of the wiring board, it is possible to further suppress the manufacturing process of the wiring board 30 from becoming complicated.

  In the first embodiment, as described above, the opening 30 a is formed in the wiring substrate 30, and the heat radiating terminal 23 a of the semiconductor package 10 is connected to the metal housing 50 via the opening 30 a of the wiring substrate 30. Implemented. Thereby, the heat radiating terminal 23 a of the semiconductor package 10 can be easily mounted on the metal housing 50 while the one electrode terminal 23 b and the other electrode terminal 23 c of the semiconductor package 10 are electrically connected to the wiring board 30. . Note that the opening 30a can be easily formed in the wiring board 30 by punching or the like.

  In the first embodiment, as described above, the element mounting portion 22a is connected to the heat radiating terminal 23a via the filler 24, so that the heat generated in the light emitting element 11 is transmitted to the element mounting portion 22a and the through hole. It can be easily transmitted to the heat radiating terminal 23a through the hole 21a (filler 24). Thereby, since the heat generated in the light emitting element 11 can be more efficiently transmitted to the metal housing 50, the heat dissipation of the light emitting device 1 can be further improved.

  Further, in the first embodiment, as described above, by providing the metal reflection frame 12 on the package substrate 20, the heat generated in the light emitting element 11 can be dissipated from the reflection frame 12, too. The heat dissipation of the light emitting device 1 can be further improved.

  In the first embodiment, as described above, the heat radiating terminal 23a, the one electrode terminal 23b, and the other electrode terminal 23c are formed so as to be electrically independent from each other. Thereby, unlike the case where one of the one electrode terminal 23b and the other electrode terminal 23c is electrically connected to the heat dissipation terminal 23a, one of the one electrode terminal 23b and the other electrode terminal 23c has a common potential ( It can be suppressed to become a ground. Thereby, it can suppress that the circuit structure of the wiring board 30 is restrict | limited. Specifically, it can suppress that the some light emitting element 11 becomes a parallel circuit. As described above, when the plurality of light emitting elements 11 are configured in parallel circuits, for example, if the same current is supplied to all the light emitting elements 11, there is a disadvantage that the circuit configuration becomes complicated. According to the embodiment, such inconvenience can be solved.

  In the first embodiment, as described above, by making the thickness of the wiring board 30 smaller than the distance between the one electrode terminal 23 b and the other electrode terminal 23 c of the semiconductor package 10 and the metal housing 50, The wiring board 30 can be prevented from contacting the surface of the metal housing 50. Thereby, it can suppress that heat becomes difficult to radiate | emit from the surface of the metal housing | casing 50. FIG.

In the first embodiment, as described above, since the semiconductor package 10 (light emitting device 1) is mounted on the metal casing 50, a member for mounting the semiconductor package 10 (light emitting device 1) is separately provided. There is no need.
(Second Embodiment)
FIG. 4 is a perspective view illustrating a mounting structure of a light emitting device according to the second embodiment of the present invention. FIG. 5 is a sectional view showing a mounting structure of the light emitting device according to the second embodiment of the present invention shown in FIG.

  In the second embodiment of the present invention, as shown in FIGS. 4 and 5, the light emitting device 1 is directly mounted on the metal tube 60 using the solder layer 40 (see FIG. 5). The metal tube 60 is formed in a circular tube having a predetermined diameter, and is configured such that water (liquid), air (gas), or the like flows through the inside 60a. The metal pipe 60 is an example of the “heat dissipating member” in the present invention.

  As the metal tube 60, for example, a copper tube for cooling a refrigerator can be applied. When the light-emitting device 1 is mounted on a copper pipe for cooling a refrigerator or the like, it is desirable to perform a drip-proof treatment such as coating the entire light-emitting device 1 with a transparent resin as a countermeasure against condensation.

  The structure of the light emitting device 1 is the same as that of the first embodiment.

  In the second embodiment, as described above, the light emitting device 1 (semiconductor package 10) is mounted on the metal tube 60, thereby flowing cooling water (liquid) or the like into the interior 60a of the metal tube 60. The heat generated in 10 can be radiated more efficiently.

The remaining effects of the second embodiment are similar to those of the aforementioned first embodiment.
(Third embodiment)
FIG. 6 is a perspective view illustrating a mounting structure of a light emitting device according to a third embodiment of the present invention. FIG. 7 is a cross-sectional view showing a mounting structure of the light emitting device according to the third embodiment of the present invention shown in FIG. FIG. 8 is a perspective view illustrating a structure of a clip on which the light emitting device according to the third embodiment of the present invention illustrated in FIG. 6 is mounted. In the third embodiment, a case where the light emitting device 1 is fixed to the metal tube 60 using a clip 61 will be described with reference to FIGS. 6 to 8, unlike the second embodiment.

  In the third embodiment of the present invention, as shown in FIGS. 6 and 7, the light emitting device 1 is mounted on a metal clip 61. As shown in FIGS. 7 and 8, the clip 61 includes a mounting part 61a on which the light emitting device 1 (see FIG. 7) is mounted, and a clamping part 61b formed so as to extend from both ends of the mounting part 61a. It is out. The clip 61 is an example of the “heat dissipating member” and the “detachable member” in the present invention.

  As shown in FIG. 7, the clamping part 61b is configured to have a spring property, and sandwiches the metal tube 60 from both sides. In this way, the light emitting device 1 is fixed to the metal tube 60.

  The remaining structure of the third embodiment is similar to that of the aforementioned second embodiment.

  In the third embodiment, as described above, the light emitting device 1 can be easily detached from the metal tube 60 by fixing the light emitting device 1 to the metal tube 60 using the clip 61. Thereby, replacement | exchange of the light-emitting device 1, a movement, a change of an attachment angle, etc. can be performed easily.

The remaining effects of the third embodiment are similar to those of the aforementioned second embodiment.
(Fourth embodiment)
FIG. 9 is a perspective view illustrating a mounting structure of a light emitting device according to a fourth embodiment of the present invention. FIG. 10 is a cross-sectional view illustrating a mounting structure of the light emitting device according to the fourth embodiment of the present invention illustrated in FIG. In the fourth embodiment, referring to FIGS. 9 and 10, unlike the first to third embodiments, the semiconductor package 10 is mounted on the wiring boards 30b and 30c in which no opening is provided. Will be described.

  As shown in FIGS. 9 and 10, the light emitting device 1 a according to the fourth embodiment of the present invention includes a semiconductor package 10 and a pair of wiring boards 30 b and 30 c on which the semiconductor package 10 is mounted. The light emitting device 1a is an example of the “optical semiconductor device” in the present invention.

  The pair of wiring boards 30b and 30c are arranged at a predetermined interval in a direction orthogonal to the extending direction of the metal tube 60, and the semiconductor package 10 is arranged to straddle the pair of wiring boards 30b and 30c. Yes. Similarly to the first to third embodiments, the pair of wiring boards 30b and 30c is not disposed at a position directly below the heat dissipation terminal 23a (see FIG. 2) of the semiconductor package 10, and the semiconductor package 10 The one electrode terminal 23b and the other electrode terminal 23c (see FIG. 2) are disposed at positions immediately below.

  Further, as shown in FIG. 9, a plurality of one-electrode wirings 32c are formed on the wiring board 30b, and a plurality of other electrode wirings 32d are formed on the wiring board 30c. Similarly to the first to third embodiments, the one electrode wiring 32c and the other electrode wiring 32d are respectively connected to the one electrode terminal 23b and the other electrode terminal 23c of the semiconductor package 10 by using a solder layer (not shown). Electrically connected.

  As shown in FIG. 10, the heat dissipation terminal 23a (see FIG. 2) of the semiconductor package 10 is directly mounted on the metal tube 60 via a portion between the pair of wiring boards 30b and 30c. .

  The remaining structure of the fourth embodiment is similar to that of the aforementioned second embodiment.

  In the fourth embodiment, as described above, the semiconductor package 10 is disposed so as to straddle the pair of wiring substrates 30b and 30c, and the heat dissipation terminals 23a of the semiconductor package 10 are disposed between the pair of wiring substrates 30b and 30c. It is mounted on the metal tube 60 via the part. Thereby, the heat radiating terminal 23a of the semiconductor package 10 can be easily mounted on the metal tube 60 without forming openings in the wiring boards 30b and 30c.

The remaining effects of the fourth embodiment are similar to those of the aforementioned second embodiment.
(Fifth embodiment)
FIG. 11 is a perspective view illustrating a light emitting device mounting structure according to a fifth embodiment of the present invention. FIG. 12 is a sectional view showing a mounting structure of the light emitting device according to the fifth embodiment of the present invention shown in FIG.

  In the fifth embodiment of the present invention, as shown in FIGS. 11 and 12, the light emitting device 1 is directly mounted on the bolt 70 using the solder layer 40 (see FIG. 12). The bolt 70 is fixed to a metal plate 80 or the like using a nut 71 (see FIG. 12). The bolt 70 is an example of the “screw” in the present invention.

  The effect of the fifth embodiment is the same as that of the first embodiment.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the above-described embodiment, an example in which a light emitting element (LED) is used as an optical semiconductor element has been described. However, the present invention is not limited thereto, and an optical semiconductor element other than a light emitting element such as a photodiode may be used. Good.

  In the above embodiment, an example in which three light emitting elements are mounted on a semiconductor package has been described. However, the present invention is not limited to this, and one, two, or four or more light emitting elements are mounted on a semiconductor package. May be.

  In the above embodiment, an example in which the semiconductor package is formed using a package substrate made of glass epoxy resin or the like has been shown. However, the present invention is not limited to this, and the semiconductor package is made of, for example, a lead frame made of copper or the like. May be used.

  Moreover, in the said embodiment, although the example which formed the wiring board using the base material which consists of glass epoxy resin was shown, this invention is not restricted to this, For example, LCP (liquid crystal polymer), ceramics Or you may form using the base material which consists of polyimide resins.

  Further, in the above-described embodiment, the example in which the heat dissipation terminal of the semiconductor package (light emitting device) is mounted on the heat dissipation member using the solder layer is shown, but the present invention is not limited to this, and the heat dissipation terminal of the semiconductor package is used. The terminal may be mounted in direct contact with the heat dissipation member without using an adhesive layer such as a solder layer.

  In the above embodiment, an example in which the light emitting device is mounted on a metal heat radiating member (a metal housing, a metal tube, a metal clip, and a bolt) has been described. You may mount an apparatus in the member for thermal radiation which consists of ceramics other than a metal, for example, high thermal conductivity.

  In the first embodiment, the light emitting device is mounted on a metal casing. However, the present invention is not limited to this, and the light emitting device is mounted on a metal plate or the like, and the metal plate is mounted on the metal casing. You may attach to.

  Moreover, in the said 2nd-4th embodiment, although shown about the example which fixed the light-emitting device to the metal tube, this invention is not restricted to this, You may fix a light-emitting device to a metal rod. Moreover, you may fix to members other than a metal housing | casing, a metal pipe, a metal rod, and a screw.

  In the above embodiment, an example in which one semiconductor package is attached to the wiring board has been described. However, the present invention is not limited to this, and a plurality of semiconductor packages may be attached to the wiring board. In this case, the wiring board 30d according to the first modification of the present invention shown in FIG. 13, the wiring board 30e according to the second modification of the present invention shown in FIG. 14, and the third modification of the present invention shown in FIG. A pair of wiring boards 30g and 30h according to an example may be used. That is, as shown in FIG. 13, a wiring substrate 30d having a plurality of openings 30a may be used. Further, as shown in FIG. 14, a wiring board 30e in which one elongated opening (first opening) 30f is formed may be used. Further, as shown in FIG. 15, the pair of wiring boards 30g and 30h are arranged so as to extend in a predetermined direction with a predetermined interval therebetween, and a plurality of semiconductor packages 10 are arranged in a predetermined direction. Thus, they may be arranged so as to straddle the pair of wiring boards 30g and 30h. As described above, when the pair of wiring boards 30g and 30h are used, even when the number of the semiconductor packages 10 is large, it is necessary to provide the wiring board with many openings 30a and large openings 30f extending in a predetermined direction. Absent. Thereby, it can suppress more that the manufacturing process of a wiring board becomes complicated.

  Further, in the above embodiment, when the light emitting device is configured by using one wiring board, an example in which the opening is formed in the wiring board has been described. However, the present invention is not limited to this, and the present invention illustrated in FIG. You may comprise like the light-emitting device (optical semiconductor device) 1b by the 4th modification of this. That is, as shown in FIG. 16, one electrode wiring and the other electrode wiring (not shown) are provided at both ends of the wiring board 30i, and the semiconductor package 10 is provided at both ends (one electrode wiring and the other electrode wiring) of the wiring board 30i. The one electrode terminal 23b and the other electrode terminal 23c may be connected. In this case, the wiring board 30 i may be arranged so as to cover the periphery of the metal tube 60.

  In the above embodiment, an example using a light-emitting element in which one electrode and the other electrode are provided on the upper surface has been described. However, the present invention is not limited thereto, and one electrode is provided on the upper surface and on the lower surface. A light emitting element provided with the other electrode may be used. In this case, the light emitting device is a light emitting device (optical semiconductor device) 1c according to the fifth modification of the present invention shown in FIG. 17, or a light emitting device (optical semiconductor device) according to the sixth modification of the present invention shown in FIG. You may comprise like 1d. Specifically, as shown in FIG. 17, in the light emitting device 1c according to the fifth modified example of the present invention, one electrode (not shown) is formed on the upper surface of the light emitting element (optical semiconductor element) 11a. The other electrode (not shown) is formed on the lower surface. A submount 15 made of a material having high thermal conductivity such as silicon, ceramics, aluminum oxide, or aluminum nitride is fixed on the element mounting portion 22a. An electrode layer 15a is formed on the upper surface of the submount 15, and the light emitting element 11a is mounted on the electrode layer 15a. One electrode (not shown) of the light emitting element 11 a is electrically connected to one electrode portion 22 b of the package substrate 20 by a metal wire 14. The other electrode (not shown) of the light emitting element 11 a is electrically connected to the electrode layer 15 a of the submount 15. Further, the electrode layer 15 a is electrically connected to the other electrode portion 22 c of the package substrate 20 by the metal wire 14. That is, the other electrode (not shown) of the light emitting element 11 a is electrically connected to the other electrode portion 22 c of the package substrate 20 through the electrode layer 15 a of the submount 15 and the metal wire 14. If comprised in this way, the light emitting element 11a by which one electrode (not shown) was provided in the upper surface and the other electrode (not shown) was provided in the lower surface can be used easily.

  As shown in FIG. 18, in the light emitting device 1d according to the sixth modification of the present invention, the element mounting portion 22d of the package substrate 20a is formed to be continuous with the other electrode portion 22e. That is, the other electrode terminal 23c is electrically connected to the heat dissipation terminal 23a. One electrode (not shown) of the light emitting element 11a is electrically connected to the one electrode portion 22b of the package substrate 20a by the metal wire 14. The other electrode (not shown) of the light emitting element 11 a is electrically connected to the element mounting portion 22 d and the other electrode portion 22 e of the package substrate 20. Even if comprised in this way, the light emitting element 11a by which one electrode (not shown) was provided in the upper surface and the other electrode (not shown) was provided in the lower surface can be used easily.

It is the perspective view which showed the mounting structure of the light-emitting device by 1st Embodiment of this invention. It is sectional drawing which showed the mounting structure of the light-emitting device by 1st Embodiment shown in FIG. FIG. 2 is a perspective view showing a structure of a wiring board of the light emitting device according to the first embodiment shown in FIG. 1. It is the perspective view which showed the mounting structure of the light-emitting device by 2nd Embodiment of this invention. FIG. 5 is a cross-sectional view illustrating a mounting structure of a light emitting device according to a second embodiment of the present invention illustrated in FIG. 4. It is the perspective view which showed the mounting structure of the light-emitting device by 3rd Embodiment of this invention. FIG. 7 is a cross-sectional view illustrating a mounting structure of a light emitting device according to a third embodiment of the present invention illustrated in FIG. 6. FIG. 7 is a perspective view illustrating a structure of a clip on which the light emitting device according to the third embodiment of the present invention illustrated in FIG. 6 is mounted. It is the perspective view which showed the mounting structure of the light-emitting device by 4th Embodiment of this invention. FIG. 10 is a cross-sectional view illustrating a mounting structure of a light emitting device according to a fourth embodiment of the present invention illustrated in FIG. 9. It is the perspective view which showed the mounting structure of the light-emitting device by 5th Embodiment of this invention. FIG. 12 is a cross-sectional view illustrating a light emitting device mounting structure according to a fifth embodiment of the present invention illustrated in FIG. 11. It is the perspective view which showed the structure of the wiring board by the 1st modification of this invention. It is the perspective view which showed the structure of the wiring board by the 2nd modification of this invention. It is the perspective view which showed the mounting structure of the light-emitting device by the 3rd modification of this invention. It is sectional drawing which showed the mounting structure of the light-emitting device by the 4th modification of this invention. It is sectional drawing which showed the structure of the light-emitting device by the 5th modification of this invention. It is sectional drawing which showed the structure of the light-emitting device by the 6th modification of this invention. It is sectional drawing which showed the mounting structure of the semiconductor package by an example of the past. It is sectional drawing which showed the structure of the semiconductor package by an example of the past. It is sectional drawing which showed the structure of the semiconductor package by an example of the past. It is sectional drawing which showed the mounting structure of the semiconductor package by an example of the past.

Explanation of symbols

1, 1a, 1b, 1c, 1d Light emitting device (optical semiconductor device)
DESCRIPTION OF SYMBOLS 10 Semiconductor package 10a Light emission surface 11, 11a Light emitting element (optical semiconductor element)
12 Reflective frame (frame)
12a Opening (second opening)
20, 20a Package substrate 21 Base material 21a Through hole 22a, 22d Element mounting portion 23a Heat dissipation terminal 23b One electrode terminal (external electrode terminal)
23c The other electrode terminal (external electrode terminal)
24 Filler 30, 30b, 30c, 30d, 30e, 30g, 30h, 30i Wiring board 30a, 30f Opening (first opening)
32 Wiring pattern 50 Metal casing (Heat dissipation member, Metal plate)
60 Metal tube (Heat dissipation member)
61 Clip (Heat dissipation member, Detachable member)
70 bolts (heat dissipation member, screw)

Claims (14)

A semiconductor package including an optical semiconductor element and including an external electrode terminal and a heat dissipation terminal;
A wiring board on which a wiring pattern to which external electrode terminals of the semiconductor package are electrically connected is formed,
An optical semiconductor device, wherein the heat dissipation terminal of the semiconductor package is mounted on a heat dissipation member different from the wiring board.   2. The optical semiconductor according to claim 1, wherein the wiring substrate is not disposed at a position directly below the heat dissipation terminal of the semiconductor package, but is disposed at a position immediately below the external electrode terminal. apparatus. A first opening is formed in the wiring board at a position directly below the heat dissipation terminal of the semiconductor package,
The optical semiconductor device according to claim 2, wherein the heat dissipation terminal of the semiconductor package is mounted on the heat dissipation member through the first opening of the wiring board. The wiring board includes a pair of wiring boards,
The semiconductor package is disposed so as to straddle the pair of wiring boards,
The optical semiconductor device according to claim 2, wherein the heat dissipation terminal of the semiconductor package is mounted on the heat dissipation member via a portion between the pair of wiring boards. The pair of wiring boards are formed to extend in a predetermined direction at a predetermined interval from each other,
5. The optical semiconductor device according to claim 4, wherein the plurality of semiconductor packages are arranged so as to straddle the pair of wiring boards in a state of being arranged in the predetermined direction. 6. The semiconductor package further includes a package substrate on which the optical semiconductor element is mounted,
The package substrate is
A base material having an insulating property and a through hole formed thereon;
An element mounting portion formed on the main surface of the substrate, on which the optical semiconductor element is mounted;
The external electrode terminal and the heat radiating terminal formed on the back surface of the substrate;
A filler filled in the through hole and having a thermal conductivity larger than that of the base material,
The optical semiconductor device according to claim 1, wherein the element mounting portion is connected to the heat radiating terminal via the filler.   The light according to claim 6, wherein the semiconductor package further comprises a metal frame having a second opening disposed on the package substrate and in which the optical semiconductor element is disposed. Semiconductor device.   The optical semiconductor device according to claim 1, wherein the external electrode terminal includes one electrode terminal and the other electrode terminal.   The optical semiconductor device according to claim 8, wherein the one electrode terminal, the other electrode terminal, and the heat dissipation terminal are electrically independent from each other.   9. The optical semiconductor device according to claim 8, wherein one of the one electrode terminal and the other electrode terminal is electrically connected to the heat dissipation terminal.   The optical semiconductor device according to claim 1, wherein a thickness of the wiring board is smaller than a distance between an external electrode terminal of the semiconductor package and the heat radiating member.   The optical semiconductor device according to claim 1, wherein the optical semiconductor element includes a light emitting element.   The light according to claim 1, wherein the heat radiating member includes a metal plate, a metal tube, a metal rod, a screw, or a metal detachable member that is detachable from the metal plate. Semiconductor device. An optical semiconductor device according to any one of claims 1 to 13,
An optical semiconductor device mounting structure comprising: a heat dissipation member on which the optical semiconductor device is mounted.

Images